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Results for “Diffusion Bonding”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

Joint design for improved fatigue life of diffusion-bonded box-stiffened panels

Simple photoelastic models were used to identify a cross-section geometry that would eliminate the severe stress concentrations at the bond line between box stiffeners diffusion bonded to a panel skin. Experimental fatigue-test data from titanium test specimens quantified the allowable stress in terms of cycle life for various joint geometries. It is shown that the effect of stress concentration is reduced and an acceptable fatigue life is achieved.

Davis, R. C.↗
NASA NTRSDate not supplied

Use of Diffusion Bonded Cu Strap and Integrated MLI for Thermal Control of 100 K IR Detector on L’Ralph Instrument

Passive cooling of cryogenic instruments is one of the most challenging aspects of spaceflight thermal control systems. They are highly sensitive to parasitic heat leaks from their warmer environment, especially the spacecraft components. The L’Ralph instrument on the Lucy mission is an example of such a system, with its LEISA detector requiring passive cooling to temperatures below 112 K. MLI performance can be measured in terms of estar, and analysts apply bias between a high and low estar value. This approach works well for conventional MLI at room temperature, however, it can be dangerous when a mission goes through a wide range of temperatures during its lifetime, with estar values increasing exponentially as temperatures get colder. Various estar correlations are presented as well as how L’Ralph is approaching the MLI problem with the use of IMLI. IMLI uses discrete spacers to isolate each layer, and doesn’t require intermediate layers such as dacron netting. This results in estar performance that can be more precisely estimated, and yields valuesaround 0.004 at the 112K operating temperature. L’Ralph is using IMLI on the backside of the radiator, which permits a more effective use of increased radiator area, by minimizing the area dependent heat leak impact from the instrument backloading. The detector is thermally coupled to the radiator via a diffusion bonded Cu strap. The diffusion bonding process chemically bonds the Cu foil ends in order to maximize heat transfer effectiveness across the multiple foils used. Employing a pressure compensation design via the use of Ti blocks and a clamp at the strap ends ensures that as temperatures go colder, pre-load is maintained in order to minimize resistance at the strap ends. The use of both of these technologies, and how they work together are crucial to the success of the L’Ralph thermal control system.

Thermal↗
NASA NTRS1973

Application of diffusion bonding to electronic interconnection of flatpack leads

Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.

Korb, R. W.↗
NASA NTRS2006

Diffusion Bonding of Silicon Carbide for a Micro-Electro-Mechanical Systems Lean Direct Injector

Robust approaches for joining silicon carbide (SiC) to silicon carbide sub-elements have been developed for a micro-electro-mechanical systems lean direct injector (MEMS LDI) application. The objective is to join SiC sub-elements to form a leak-free injector that has complex internal passages for the flow and mixing of fuel and air. Previous bonding technology relied upon silicate glass interlayers that were not uniform or leak free. In a newly developed joining approach, titanium foils and physically vapor deposited titanium coatings were used to form diffusion bonds between SiC materials during hot pressing. Microscopy results show the formation of well adhered diffusion bonds. Initial tests show that the bond strength is much higher than required for the component system. Benefits of the joining technology are fabrication of leak free joints with high temperature and mechanical capability.

Halbig, Michael C.↗
NASA NTRS1982

Metal honeycomb to porous wireform substrate diffusion bond evaluation

Two nondestructive techniques were used to evaluate diffusion bond quality between a metal foil honeycomb and porous wireform substrate. The two techniques, cryographics and acousto-ultrasonics, are complementary in revealing variations of bond integrity and quality in shroud segments from an experimental aircraft turbine engine.

Vary, A.↗
NASA NTRS1983

Metal honeycomb to porous wireform substrate diffusion bond evaluation

Two nondestructive techniques were used to evaluate diffusion bond quality between a metal fail honeycomb and porous wireform substrate. The two techniques, cryographics and acousto-ultrasonics, are complementary in revealing variations of bond integrity and quality in shroud segments from an experimental aircraft turbine engine. Previously announced in STAR as N82-18612

Vary, A.↗
NASA NTRS1989

Superplastic forming and diffusion bonding of rapidly solidified, dispersion strengthened aluminum alloys for elevated temperature structural applications

Rapidly solidified alloys, based upon the Al-Fe-V-Si system and designed for elevated temperature applications, were evaluated for superplasticity and diffusion bonding behavior. Alloys with 8, 16, 27, and 36 volume percent silicide dispersoids were produced; dispersoid condition was varied by rolling at 300, 400, and 500 C (572, 752, and 932 F). Superplastic behavior was evaluated at strain rates from 1 x 10(exp -6)/s to 8.5/s at elevated temperatures. The results indicate that there was a significant increase in elongation at higher strain rates and at temperatures above 600 C (1112 F). However, the exposure of the alloys to temperatures greater than 600 C (1112 F) resulted in the coarsening of the strengthening dispersoid and the degradation of mechanical properties. Diffusion bonding was possible using low gas pressure at temperatures greater than 600 C (1112 F) which also resulted in degraded properties. The bonding of Al-Fe-V-Si alloys to 7475 aluminum alloy was performed at 516 C (960 F) without significant degradation in microstructure. Bond strengths equal to 90 percent that of the base metal shear strength were achieved. The mechanical properties and microstructural characteristics of the alloys were investigated.

Ting, E. Y.↗
NASA NTRS1967

Silver plating ensures reliable diffusion bonding of dissimilar metals

Dissimilar metals are reliably joined by diffusion bonding when the surfaces are electroplated with silver. The process involves cleaning and etching, anodization, silver striking, and silver plating with a conventional plating bath. It minimizes the formation of detrimental intermetallic phases and provides greater tolerance of processing parameters.

Source record↗
NASA NTRS2007

Mo/Ti Diffusion Bonding for Making Thermoelectric Devices

An all-solid-state diffusion bonding process that exploits the eutectoid reaction between molybdenum and titanium has been developed for use in fabricating thermoelectric devices based on skutterudite compounds. In essence, the process is one of heating a flat piece of pure titanium in contact with a flat piece of pure molybdenum to a temperature of about 700 C while pushing the pieces together with a slight pressure [a few psi (of the order of 10 kPa)]. The process exploits the energy of mixing of these two metals to form a strong bond between them. These two metals were selected partly because the bonds formed between them are free of brittle intermetallic phases and are mechanically and chemically stable at high temperatures. The process is a solution of the problem of bonding hot-side metallic interconnections (denoted hot shoes in thermoelectric jargon) to titanium-terminated skutterudite n and p legs during the course of fabrication of a unicouple, which is the basic unit cell of a thermoelectric device (see figure). The hot-side operating temperature required for a skutterudite thermoelectric device is 700 C. This temperature precludes the use of brazing to attach the hot shoe; because brazing compounds melt at lower temperatures, the hot shoe would become detached during operation. Moreover, the decomposition temperature of one of the skutterudite compounds is 762 C; this places an upper limit on the temperature used in bonding the hot shoe. Molybdenum was selected as the interconnection metal because the eutectoid reaction between it and the titanium at the ends of the p and n legs has characteristics that are well suited for this application. In addition to being suitable for use in the present bonding process, molybdenum has high electrical and thermal conductivity and excellent thermal stability - characteristics that are desired for hot shoes of thermoelectric devices. The process takes advantage of the chemical potential energy of mixing between molybdenum and titanium. These metals have a strong affinity for each other. They are almost completely soluble in each other and remain in the solid state at temperatures above the eutectoid temperature of 695 C. As a result, bonds formed by interdiffusion of molybdenum and titanium are mechanically stable at and well above the original bonding temperature of about 700 C. Inasmuch as the bonds are made at approximately the operating temperature, thermomechanical stresses associated with differences in thermal expansion are minimized.

Sakamoto, Jeffrey↗
NASA NTRS1965

Thermoelectric elements diffusion-bonded to tungsten electrodes

Solid-state diffusion process bonds lead telluride and lead telluride-tin telluride thermoelectric elements to tungsten electrodes. The resulting bond is nonmagnetic and has high strength and low electrical and thermal resistance. This method is also used with tantalum electrodes.

Source record↗
NASA NTRS1989

Fabrication and evaluation of enhanced diffusion bonded titanium honeycomb core sandwich panels with titanium aluminide face sheets

A joining process was developed for fabricating lightweight, high temperature sandwich panels for aerospace applications using Ti-14Al-21Nb face sheets and Ti-3Al-2.5V honeycomb core. The process, termed Enhanced Diffusion Bonding (EDB), relies on the formation of a eutectic liquid through solid-state diffusion at elevated temperatures and isothermal solidification to produce joints in thin-gage titanium and titanium aluminide structural components. A technique employing a maskant on the honeycomb core was developed which permitted electroplating a controlled amount of EDB material only on the edges of the honeycomb core in order to minimize the structural weight and metallurgical interaction effects. Metallurgical analyses were conducted to determine the interaction effects between the EDB materials and the constituents of the sandwich structure following EDB processing. The initial mechanical evaluation was conducted with butt joint specimens tested at temperatures from 1400 - 1700 F. Further mechanical evaluation was conducted with EDB sandwich specimens using flatwise tension tests at temperatures from 70 - 1100 F and edgewise compression tests at ambient temperature.

Hoffmann, E. K.↗
NASA NTRS1966

Diffusion bonding makes strong seal at flanged connector

Copper strip seals a high pressure fluid system connector so that it is insensitive to relaxation of the bolt loads. The copper strip is diffusion bonded to the surfaces of the connector flange by application of high pressure and temperature.

Gitzendanner, L. G.↗