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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

Using Diffusion Bonding in Making Piezoelectric Actuators

A technique for the fabrication of piezoelectric actuators that generate acceptably large forces and deflections at relatively low applied voltages involves the stacking and diffusion bonding of multiple thin piezoelectric layers coated with film electrodes. The present technique stands in contrast to an older technique in which the layers are bonded chemically, by use of urethane or epoxy agents. The older chemical-bonding technique entails several disadvantages, including the following: It is difficult to apply the bonding agents to the piezoelectric layers. It is difficult to position the layers accurately and without making mistakes. There is a problem of disposal of hazardous urethane and epoxy wastes. The urethane and epoxy agents are nonpiezoelectric materials. As such, they contribute to the thickness of a piezoelectric laminate without contributing to its performance; conversely, for a given total thickness, the performance of the laminate is below that of a unitary piezoelectric plate of the same thickness. The figure depicts some aspects of the fabrication of a laminated piezoelectric actuator by the present diffusion- bonding technique. First, stock sheets of the piezoelectric material are inspected and tested. Next, the hole pattern shown in the figure is punched into the sheets. Alternatively, if the piezoelectric material is not a polymer, then the holes are punched in thermoplastic films. Then both faces of each punched piezoelectric sheet or thermoplastic film are coated with a silver-ink electrode material by use of a silkscreen printer. The electrode and hole patterns are designed for minimal complexity and minimal waste of material. After a final electrical test, all the coated piezoelectric layers (or piezoelectric layers and coated thermoplastic films) are stacked in an alignment jig, which, in turn, is placed in a curved press for the diffusion-bonding process. In this process, the stack is pressed and heated at a specified curing temperature and pressure for a specified curing time. The pressure, temperature, and time depend on the piezoelectric material selected. At the end of the diffusion-bonding process, the resulting laminated piezoelectric actuator is tested to verify the adequacy of the mechanical output as a function of an applied DC voltage.

Sager, Frank E.↗
NASA NTRS2017

TEM Analysis of Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers

Silicon Carbide (SiC) is a promising material for thermostructural applications due to its excellent high-temperature mechanical properties, oxidation resistance, and thermal stability. However, joining and integration technologies are indispensable for this material in order to fabricate large size and complex shape components with desired functionalities. Although diffusion bonding techniques using metallic interlayers have been commonly utilized to bond various SiC ceramics, detailed microstructural observation by Transmission Electron Microscopy (TEM) of the bonded area has not been carried out due to difficulty in preparing TEM samples. In this study, we tried to prepare TEM samples from joints of diffusion bonded SiC ceramics by Focused Ion Beam (FIB) system and carefully investigated the interfacial microstructure by TEM analysis. The samples used in this study were SiC fiber bonded ceramics (SA-Tyrannohex: SA-THX) diffusion bonded with metallic interlayers such as Ti, TiMo, Mo-B and TiCu. In this presentation, we report the microstructure of diffusion bonded SA-THX mainly with TiCu interlayers obtained by TEM observations, and the influence of metallic interlayers on the joint microstructure and microhardness will be discussed.

Ceramics↗
NASA NTRS1972

Diffusion bonding of IN 718 to VM 350 grade maraging steel

Diffusion bonding studies have been conducted on IN 718, VM 350 and the dissimilar alloy couple, IN 718 to maraging steel. The experimental processing parameters critical to obtaining consistently good diffusion bonds between IN 718 and VM 350 were determined. Interrelationships between temperature, pressure and surface preparation were explored for short bending intervals under vacuum conditions. Successful joining was achieved for a range of bonding cycle temperatures, pressures and surface preparations. The strength of the weaker parent material was used as a criterion for a successful tensile test of the heat treated bond. Studies of VM-350/VM-350 couples in the as-bonded condition showed a greater yielding and failure outside the bond region.

Crosby, S. R.↗
NASA NTRS1968

Roll diffusion bonding of titanium alloy panels

Roll diffusion bonding technique is used for fabricating T-stiffened panel assemblies from titanium alloy. The single unit fabrication exhibits excellent strength characteristics under tensile and compressive loads. This program is applied to structures in which weight/strength ratio and integral construction are important considerations.

Bennett, J.↗
DOE OSTI2025

Micro-tensile testing of neutron-irradiated Al/Zr and Zr/U-Mo diffusion bonds

This study focuses on micro-tensile testing of neutron-irradiated Al/Zr and Zr/U-Mo diffusion bonds, which are integral to the structure and performance of nuclear fuel plates used in the fuel being developed for U.S. high-power research reactors. During fabrication, two distinct diffusion bonds occur—one at the Zr/U-10Mo interface via roll bonding, and the Zr/Al interface via hot isostatic pressing at 833 K. This work utilizes micro-tensile testing specimens approximately 7 × 7 × 18 μm 3 , which are sufficiently large to encompass the identified diffusion zones to evaluate the failure strength and identify the failure location. For the Zr/Al interface, all failures occurred in the bulk aluminum. The average yield strength, ultimate strength, and strain at failure for the two parent samples were: 125 ± 10 MPa, 139 ± 24 MPa, 156 ± 21 MPa, 185 ± 14 MPa, 37.9 ± 5.6 %, and 29.7 ± 3.4 %, respectively. For specimens across the Zr/U-Mo interface, failures occurred either in the bulk Zr or U-Mo, with no failures observed in the diffusion region. For specimens that failed in the bulk Zr the failure strength and strain for the two parent samples were 570 MPa, 710 ± 131 MPa, and 43.3 %, 27.3 ± 6.6 % respectively. The specimens that failed in the bulk U-Mo had failure strengths and strains of 596 ± 32 MPa, 548 ± 124 MPa, and 2.2 ± 1.3 %, 1.5 ± 0.6 % respectively. In conclusion, these findings support the development of accurate thermo-mechanical models for irradiated fuel performance by identifying the mechanical limits and failure locations within the bonded regions.

11 - NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
NASA NTRS2006

Diffusion Bonding of Silicon Carbide Ceramics using Titanium Interlayers

Robust joining approaches for silicon carbide ceramics are critically needed to fabricate leak free joints with high temperature mechanical capability. In this study, titanium foils and physical vapor deposited (PVD) titanium coatings were used to form diffusion bonds between SiC ceramics using hot pressing. Silicon carbide substrate materials used for bonding include sintered SiC and two types of CVD SiC. Microscopy results show the formation of well adhered diffusion bonds. The bond strengths as determined from pull tests are on the order of several ksi, which is much higher than required for a proposed application. Microprobe results show the distribution of silicon, carbon, titanium, and other minor elements across the diffusion bond. Compositions of several phases formed in the joint region were identified. Potential issues of material compatibility and optimal bond formation will also be discussed.

Halbig, Michael C.↗
NASA NTRS2016

TEM Analysis of Interfaces in Diffusion-Bonded Silicon Carbide Ceramics Joined Using Metallic Interlayers

Silicon Carbide (SiC) is a promising material for thermo-structural applications due to its excellent high-temperature mechanical properties, oxidation resistance, and thermal stability. However, joining and integration technologies are indispensable for this material in order to fabricate large size and complex shape components with desired functionalities. Although diffusion bonding techniques using metallic interlayers have been commonly utilized to bond various SiC ceramics, detailed microstructural observation by Transmission Electron Microscopy (TEM) of the bonded area has not been carried out due to difficulty in preparing TEM samples. In this study, we tried to prepare TEM samples from joints of diffusion bonded SiC ceramics by Focused Ion Beam (FIB) system and carefully investigated the interfacial microstructure by TEM analysis. The samples used in this study were SiC fiber bonded ceramics (SA-Tyrannohex: SA-THX) diffusion bonded with metallic interlayers such as Ti, TiMo, and Mo-B. In this presentation, the result of microstructural analysis obtained by TEM observations and the influence of metallic interlayers and fiber orientation of SA-THX on the joint microstructure will be discussed.

Silicon Carbide↗
DOE OSTI2021

Diffusion Bonded Hydrogen Pre-Cooler Pressure Testing

Diffusion bonded heat exchangers, also known as printed circuit heat exchangers (PCHEs), have numerous benefits over traditional shell and tube heat exchangers including high pressure containment, a compact size with 1000 to 5000 m 2 of surface area per unit volume, and lower costs. One emerging application is in hydrogen vehicle fueling stations as a hydrogen pre-cooler (H2PC™) where the hydrogen is cooled at pressures up to 900 bar. These pre-coolers must be able to withstand pressure cycling over 10 5 cycles during the fueling station lifetime without degradation of their pressure vessel integrity that could result in hydrogen leakage.

08 HYDROGEN↗
NASA NTRS1985

Joint design for improved fatigue life of diffusion-bonded box-stiffened panels

Simple photoelastic models were used to identify a cross-section geometry that would eliminate the severe stress concentrations at the bond line between box stiffeners diffusion bonded to a panel skin. Experimental fatigue-test data from titanium test specimens quantified the allowable stress in terms of cycle life for various joint geometries. It is shown that the effect of stress concentration is reduced and an acceptable fatigue life is achieved.

Davis, R. C.↗
DOE OSTI2022

Pressure drop and heat transfer characteristics of nitrate salt and supercritical CO 2 in a diffusion-bonded heat exchanger

A lab-scale 316/L stainless steel diffusion-bonded heat exchanger was examined within a coupled high-temperature test facility consisting of an atmospheric-pressure nitrate salt loop and a supercritical carbon dioxide (sCO 2 ) loop operating between 10 and 16 MPa. Pressure loss measurements collected for flow rates up to 0.55 kg/s of Solar Salt and up to 0.6 kg/s of carbon dioxide were used to generate friction factor correlations for the respective circular and semicircular zig-zag flow passages. Heat transfer measurements were also performed over a wide range of conditions to produce Nusselt correlations for the CO 2 and nitrate salt geometries. The Nusselt number is deduced from a heat transfer resistance network and overall conductance measurements collected across the operating envelope of the coupled sCO 2 – nitrate salt test facility. The CO 2 side correlation showed excellent agreement with existing correlations in the literature. Further, the salt side, having nearly circular channels with a different zig-zag angle and hydraulic diameter, yielded a new correlation applicable to the laminar flow regime. To examine the similitude of the friction correlations, pressure drop testing with water was performed on both sides of the component as well. Finally, results from non-destructive examination are discussed to provide insights regarding inspection methods and draining performance of high-temperature liquids in compact heat exchangers.

36 MATERIALS SCIENCE↗
NASA NTRSDate not supplied

Use of Diffusion Bonded Cu Strap and Integrated MLI for Thermal Control of 100 K IR Detector on L’Ralph Instrument

Passive cooling of cryogenic instruments is one of the most challenging aspects of spaceflight thermal control systems. They are highly sensitive to parasitic heat leaks from their warmer environment, especially the spacecraft components. The L’Ralph instrument on the Lucy mission is an example of such a system, with its LEISA detector requiring passive cooling to temperatures below 112 K. MLI performance can be measured in terms of estar, and analysts apply bias between a high and low estar value. This approach works well for conventional MLI at room temperature, however, it can be dangerous when a mission goes through a wide range of temperatures during its lifetime, with estar values increasing exponentially as temperatures get colder. Various estar correlations are presented as well as how L’Ralph is approaching the MLI problem with the use of IMLI. IMLI uses discrete spacers to isolate each layer, and doesn’t require intermediate layers such as dacron netting. This results in estar performance that can be more precisely estimated, and yields valuesaround 0.004 at the 112K operating temperature. L’Ralph is using IMLI on the backside of the radiator, which permits a more effective use of increased radiator area, by minimizing the area dependent heat leak impact from the instrument backloading. The detector is thermally coupled to the radiator via a diffusion bonded Cu strap. The diffusion bonding process chemically bonds the Cu foil ends in order to maximize heat transfer effectiveness across the multiple foils used. Employing a pressure compensation design via the use of Ti blocks and a clamp at the strap ends ensures that as temperatures go colder, pre-load is maintained in order to minimize resistance at the strap ends. The use of both of these technologies, and how they work together are crucial to the success of the L’Ralph thermal control system.

Thermal↗
NASA NTRS1973

Application of diffusion bonding to electronic interconnection of flatpack leads

Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.

Korb, R. W.↗
DOE OSTI2023

Enhanced diffusion bonding of alloy 617 using electric field-assisted sintering

The development of compact heat exchangers (CHXs) has gained increasing interest in many industries owing to their high thermal efficiency and reduced size. Diffusion bonding (DB) is an advantageous technique for fabricating CHXs. Alloy 617 is a candidate for manufacturing CHXs for high-temperature advanced nuclear reactors due to its elevated-temperature properties. Previous endeavors in DB of Alloy 617 were conducted by hot pressing (HP), which reported precipitates at the diffusion-bond interface, limited grain boundary (GB) migration, and significantly reduced high-temperature mechanical properties. To overcome these challenges, this study investigated DB of Alloy 617 using electric field-assisted sintering (EFAS). Stacks composed of three sheets were bonded with EFAS using different temperatures, pressures, and hold times. DB using HP as the zero-current analog of EFAS was also performed for comparison. The result shows that Cr- and Mo-rich precipitates were formed at the interface of the hot-pressed samples. The electric current and temperature in EFAS play a significant role in precipitation and GB migration. The electric current coupled with correct temperatures can effectively prevent precipitate formation at the interface and achieve excellent GB migration. Nanoscale Al-rich oxide was formed at the interface of the samples made by both HP and EFAS, but grain boundaries can ignore the nanoscale Al-oxide and migrate across the interface. The temperature, pressure, and hold time also affected diffusion. The temperature is a prerequisite for a successful GB migration, and GB migration can be enhanced by increasing pressure and hold time.

36 MATERIALS SCIENCE↗
NASA NTRS2006

Diffusion Bonding of Silicon Carbide for a Micro-Electro-Mechanical Systems Lean Direct Injector

Robust approaches for joining silicon carbide (SiC) to silicon carbide sub-elements have been developed for a micro-electro-mechanical systems lean direct injector (MEMS LDI) application. The objective is to join SiC sub-elements to form a leak-free injector that has complex internal passages for the flow and mixing of fuel and air. Previous bonding technology relied upon silicate glass interlayers that were not uniform or leak free. In a newly developed joining approach, titanium foils and physically vapor deposited titanium coatings were used to form diffusion bonds between SiC materials during hot pressing. Microscopy results show the formation of well adhered diffusion bonds. Initial tests show that the bond strength is much higher than required for the component system. Benefits of the joining technology are fabrication of leak free joints with high temperature and mechanical capability.

Halbig, Michael C.↗
NASA NTRS1982

Metal honeycomb to porous wireform substrate diffusion bond evaluation

Two nondestructive techniques were used to evaluate diffusion bond quality between a metal foil honeycomb and porous wireform substrate. The two techniques, cryographics and acousto-ultrasonics, are complementary in revealing variations of bond integrity and quality in shroud segments from an experimental aircraft turbine engine.

Vary, A.↗
NASA NTRS1983

Metal honeycomb to porous wireform substrate diffusion bond evaluation

Two nondestructive techniques were used to evaluate diffusion bond quality between a metal fail honeycomb and porous wireform substrate. The two techniques, cryographics and acousto-ultrasonics, are complementary in revealing variations of bond integrity and quality in shroud segments from an experimental aircraft turbine engine. Previously announced in STAR as N82-18612

Vary, A.↗