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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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32 records · Page 2

Microstructurally-Inspired Strategies to Print Tantalum and Tantalum-Tungsten Alloys

The goal of this project is to investigate strategies to print tantalum and tantalumtungsten alloys, which are notoriously difficult to print with consistent results because of the sensitivity of the properties to small concentrations of interstitial impurities (particularly oxygen) and microstructure, and hence to processing conditions. In direct metal laser sintering (DMLS) Ta, a strong dependence of porosity, grain morphology and texture on processing conditions was found.

36 MATERIALS SCIENCE↗

Microstructurally-Inspired Strategies to Print Tantalum and Tantalum-Tungsten Alloys

The goal of this project is to investigate strategies to print tantalum and tantalum- tungsten alloys, which are notoriously difficult to print with consistent results because of the sensitivity of the properties to small concentrations of interstitial impurities (particularly oxygen) and microstructure, and hence to processing conditions. The ultimate tensile stress (UTS) for non-additively manufactured Ta as a function of temperature shows a stunning variation. In direct metal laser sintering (DMLS) Ta, a strong dependence of porosity, grain morphology and texture on processing conditions was found.

36 MATERIALS SCIENCE↗

Thermal Frequency Drift of 3D Printed Microwave Components

Fabrication of microwave slot array antennas and waveguide bandpass and notch filters using 3D printing has significant advantages in terms of speed and cost even for parts with high mechanical complexity. One disadvantage of Stereolithography (SLA) 3D printed, copper plated microwave components is that some SLA resins have a high Coefficient of Thermal Expansion (CTE), quoted in micrometers per meter per degree or 10 -6 per degree. Compared to typically used metals such as aluminum (CTE 24 × 10 -6 ·K -1 ) and copper (CTE 17 × 10 -6 ·K -1 ), SLA resin can have CTE above 100 × 10 -6 ·K -1 . Resonant structures experience significant frequency drift with temperature changes on the order of 10–50 °C. The issue of 3D printed microwave structures changing frequency characteristics significantly with temperature shift has not been addressed or reviewed in current literature. We measured and simulated the effect of temperature change on a slot array, cavity notch filters, and post loaded waveguide bandpass filters. We tested several types of SLA resin, different plating techniques, and also Direct Metal Laser Sintering (DMLS) and Binder Infusion metal 3D printing. Performance as a function of temperature is presented for these alternatives.

three-dimensional printing↗

Applications for Gradient Metal Alloys Fabricated Using Additive Manufacturing

Recently, additive manufacturing (AM) techniques have been developed that may shift the paradigm of traditional metal production by allowing complex net-shaped hardware to be built up layer-by-layer, rather than being machined from a billet. The AM process is ubiquitous with polymers due to their low melting temperatures, fast curing, and controllable viscosity, and 3D printers are widely available as commercial or consumer products. 3D printing with metals is inherently more complicated than with polymers due to their higher melting temperatures and reactivity with air, particularly when heated or molten. The process generally requires a high-power laser or other focused heat source, like an electron beam, for precise melting and deposition. Several promising metal AM techniques have been developed, including laser deposition (also called laser engineered net shaping or LENS® and laser deposition technology (LDT)), direct metal laser sintering (DMLS), and electron beam free-form (EBF). These machines typically use powders or wire feedstock that are melted and deposited using a laser or electron beam. Complex net-shape parts have been widely demonstrated using these (and other) AM techniques and the process appears to be a promising alternative to machining in some cases. Rather than simply competing with traditional machining for cost and time savings, the true advantage of AM involves the fabrication of hardware that cannot be produced using other techniques. This could include parts with "blind" features (like foams or trusses), parts that are difficult to machine conventionally, or parts made from materials that do not exist in bulk forms. In this work, the inventors identify that several AM techniques can be used to develop metal parts that change composition from one location in the part to another, allowing for complete control over the mechanical or physical properties. This changes the paradigm for conventional metal fabrication, which relies on an assortment of "post-processing" methods to locally alter properties (such as coating, heat treating, work hardening, shot peening, etching, anodizing, among others). Building the final part in an additive process allows for the development of an entirely new class of metals, so-called "functionally graded metals" or "gradient alloys." By carefully blending feedstock materials with different properties in an AM process, hardware can be developed with properties that cannot be obtained using other techniques but with the added benefit of the net-shaped fabrication that AM allows.

Hofmann, Douglas C.↗

Additive Manufacturing of Low Cost Upper Stage Propulsion Components

NASA is currently developing Additive Manufacturing (AM) technologies and design tools aimed at reducing the costs and manufacturing time of regeneratively cooled rocket engine components. These Low Cost Upper Stage Propulsion (LCUSP) tasks are funded through NASA's Game Changing Development Program in the Space Technology Mission Directorate. The LCUSP project will develop a copper alloy additive manufacturing design process and develop and optimize the Electron Beam Freeform Fabrication (EBF3) manufacturing process to direct deposit a nickel alloy structural jacket and manifolds onto an SLM manufactured GRCop chamber and Ni-alloy nozzle. In order to develop these processes, the project will characterize both the microstructural and mechanical properties of the SLMproduced GRCop-84, and will explore and document novel design techniques specific to AM combustion devices components. These manufacturing technologies will be used to build a 25K-class regenerative chamber and nozzle (to be used with tested DMLS injectors) that will be tested individually and as a system in hot fire tests to demonstrate the applicability of the technologies. These tasks are expected to bring costs and manufacturing time down as spacecraft propulsion systems typically comprise more than 70% of the total vehicle cost and account for a significant portion of the development schedule. Additionally, high pressure/high temperature combustion chambers and nozzles must be regeneratively cooled to survive their operating environment, causing their design to be time consuming and costly to build. LCUSP presents an opportunity to develop and demonstrate a process that can infuse these technologies into industry, build competition, and drive down costs of future engines.

Protz, Christopher↗

Computational Process Modeling for Additive Manufacturing (OSU)

Powder-Bed Additive Manufacturing (AM) through Direct Metal Laser Sintering (DMLS) or Selective Laser Melting (SLM) is being used by NASA and the Aerospace industry to "print" parts that traditionally are very complex, high cost, or long schedule lead items. The process spreads a thin layer of metal powder over a build platform, then melts the powder in a series of welds in a desired shape. The next layer of powder is applied, and the process is repeated until layer-by-layer, a very complex part can be built. This reduces cost and schedule by eliminating very complex tooling and processes traditionally used in aerospace component manufacturing. To use the process to print end-use items, NASA seeks to understand SLM material well enough to develop a method of qualifying parts for space flight operation. Traditionally, a new material process takes many years and high investment to generate statistical databases and experiential knowledge, but computational modeling can truncate the schedule and cost -many experiments can be run quickly in a model, which would take years and a high material cost to run empirically. This project seeks to optimize material build parameters with reduced time and cost through modeling.

Bagg, Stacey↗

Hybrid Additive Manufacturing Deposition and Selective Laser Melting Techniques Applied to Copper-Alloy Liquid Rocket Engine Combustion Chambers

Virgin Orbit and the NASA Marshall Space Flight Center have partnered to fabricate a small, multi-metallic, regeneratively cooled thrust chamber by leveraging the strengths of two different types of additive manufacturing: Direct Metal Laser Sintering (DMLS) for the copper alloy liner and blown powder Directed Energy Deposition (DED) for the Inconel structural jacket. The DED is being developed using Virgin Orbit's DMG Mori Seiki hybrid additive/subtractive machining center to further enable unique processing and further cost savings. The materials chosen are preferred for high performance thrust chamber applications, representing a significant advancement from the compromises typically made in the production of metal 3D printed thrust chambers for rocket engines. The 1.2K-lbf thrust article is a 16" tall, 3" diameter design modified for this effort to be regeneratively cooled with water and hot fired using a RP-1/LOX pintle-style development injector from Virgin Orbit's NewtonFour upper stage engine. The thrust chamber was tested at Virgin Orbit's Necker test site in Mojave, California. Results from this test campaign are reported in addition to information characterizing the liner, jacket, and bimetallic diffusion layer materials. This paper will also highlight some of the future bimetallic thrust chamber developments that MSFC and Virgin Orbit will complete under a recently awarded NASA contract.

Zagorski, Kevin↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Aquirre, Fernando↗

Metal Fused Filament Fabrication of Titanium Alloy for In Space Manufacturing

NASA is developing materials and processes for the in-space manufacturing of many items for the International Space Station (ISS) and future exploration platforms. These new manufacturing processes will require the further development of current 3D printing processes to achieve high-performance metal parts within the power and space constraints of the ISS. Manufacturing Ti-6Al-4V alloy parts with 3D printing using a metal fused filament fabrication (MF3) process is an alternative process to the Direct Metal Laser Sintering (DMLS) of the metal powders additive manufacturing process. Our initial work fabricating Ti-6Al-4V parts from Ti-6Al-4V powder-binder feedstock and processed with the MF3 process has resulted in 95-97% sintered densities. The current development work of optimized sintered properties investigates the effects of variation in sintering time, temperature, and vacuum on the sintered properties of Ti-6Al-4V MF3 printed tensile bars. Sintered properties such as density, hardness, and tensile properties were characterized followed by microstructural and chemical (O/C/N) analysis to understand the role of sintering process on the ensuing material properties. Future development of the MF3 process will also involve investigation of the effects of micro-milling the Ti-64Al-4V powder to nanometer particle sizes and the investigation of laser sintering of the 3D printed devices. This new micro-milling technique will have broad application to other areas that require particle size reduction of hard metallic materials, such as Nuclear Thermal Propulsion and other NASA technologies. Laser sintering in lieu of high temperature thermal sintering should allow for significant power reduction and improved processing speeds.

sintering, alloys, 3D printing↗

High Density Packaging Technologies for RF Electronics in Small Spacecraft

This paper will describe a few high density packaging technologies which we are currently exploring for use in current and future small spacecraft applications. The three categories of technologies include organic multichip modules (MCMs), ceramic leadless surface mount technology (SMT) and 3D printed waveguide structures. There are many other packaging technologies that currently exist but these three were selected in part due to their long heritage in various commercial, military and space applications along with each having a relatively clear path to flight. For each of these technologies, detailed examples will be included in which hardware has been fabricated and tested for use in RF electronics for spacecraft transponders. The organic MCM example will be described in most detail and it utilizes a packaging technology by the name of CoreEZ which is a trademark of i3 Electronics. This MCM has shrunk a portion of our electronics down to 1/8th of its previous area. The CoreEZ technology has been shown to be rad hard beyond a total ionizing dose (TID) of 300kRad and the MCM which was fabricated has gone through thermal cycling and shown to have no degradation in performance. The ceramic leadless package examples include packages from high reliability manufactures by the name of KCB solutions and Barry Industries. In the case of KCB solutions, we have multiple products that will be described including a hermetic ceramic carrier which houses three microwave monolithic integrated circuits (MMICs) along with small discrete components. Finally, we will discuss the results of our search for a 3D printing process that allows us to reduce the cost and volume of our waveguide filters and diplexers for low cost small satellite applications. We have fabricated a few prototypes using direct metal laser sintering (DMLS) and metal coated plastics. Each of these packaging technology discussions will have a brief overview of its current and future use.

Schatzel, Donald↗

Experimental Characterization of Additively Manufactured Nickel-Titanium Shape Memory Alloy Heat Pipes

Shape memory alloys (SMA) have been identified for use in spacecraft components as replacement for conventional deployment mechanisms. They may be used in thermal management components such as radiators to create self-deploying radiators. One SMA, NiTi, has also been developed for additive manufacturing processes. Heat pipes are a common way to create highly effective and lightweight spaceflight radiators, and heat pipes can also be made from NiTi and related alloys. The wick is the critical element of a functioning heat pipe, and recent progress over the past years has led to the development of additively manufactured heat pipe wicks in various materials. The combination of these efforts is the focus of this project: creating an additively manufactured, shape memory alloy self-deploying heat pipe radiator. This paper will focus on the experimental characterization of these additively manufactured NiTi heat pipes. The heat pipe coupons were additively manufactured by direct metal laser sintering (DMLS), with an integral liquid cooled condenser. Heat is input to the heat pipe via a thin film heater. Thermocouples were spot welded to the heat pipes to measure temperature at several axial locations. The heat pipes were tested with two working fluids: water and ethanol. Ethanol is not an ideal working fluid for heat pipes but is useful in characterizing them because it wets well to a wide variety of surfaces. Water is in general a superior working fluid for heat pipes, but its contact angle and therefore wicking performance strongly depends on the surface chemistry of the surface it is in contact with. A particular measurement of interest in this test is the evaporator to condenser thermal conductance, which will be compared in the full paper to recently published correlations for additively manufactured heat pipes. Experimental results for two straight geometry and one bellows geometry heat pipe will be presented. The bellows geometry is of interest for condenser of the self-deploying radiator design.

Additive manufacturing↗

Process optimization of complex geometries using feed forward control for laser powder bed fusion additive manufacturing

Additive manufacturing (AM) enables the fabrication of complex designs that are difficult to create by other means. Metal parts manufactured by laser powder bed fusion (LPBF) can incorporate intricate design features and demonstrate desirable mechanical properties. However, printing a part that is qualified for its intended application often involves reprinting and discarding many parts to eliminate defects, improve dimensional accuracy, and increase repeatability. The process of iteratively converging on the appropriate build parameters increases the time and cost of creating functional LPBF manufactured parts. This work describes a fast, scalable method for part-scale process optimization of arbitrary geometries. Additionally, the computational approach uses feature extraction to identify scan vectors in need of parameter adaptation and applies results from simulation-based feed forward control models. This method provides a framework to quickly optimize complex parts through the targeted application of models with a range of fidelity and by automating the transfer of optimization strategies to new part designs. The computational approach and algorithmic framework are described, a software package is implemented, the method is applied to parts with complex features, and parts are printed on a customized open architecture LPBF machine.

3D printing↗

Effect of nitriding on mechanical and microstructural properties of Direct Metal Laser Sintered 17-4PH stainless steel

In this work, the effect of the nitriding process on microstructure and mechanical properties of additively manufactured (AM) 17-4PH stainless steel is investigated. The nitriding was performed at 530 °C, 560 °C, and 580 °C for 2 h. The nitriding process improves the hardness and surface roughness of the AM 17-4PH steel. Detailed microstructural characterizations of both as-built and nitride samples are performed using an optical microscope, scanning electron microscope (SEM) equipped with energy-dispersive X-ray spectroscopy (EDS), and X-ray diffraction technique. It reveals that the nitride layer thickness increases with nitriding temperature. A distinct transition layer between the substrate and nitride layer is observed in the 560 °C and 580 °C nitride samples. The nitriding process develops almost equiaxed grain microstructure with new secondary phase precipitates, whereas in the as-built material, the grains are primarily columnar along the AM process build direction. Specifically, the nitriding process introduces γ-Fe4N, ε-Fe3N, CrN, and Ni3N precipitates. The increase in Ni- and Cu-rich precipitates with the nitriding temperature explains the observed improvement in the hardness and surface roughness. Furthermore, the nitriding process does not alter the substrate's initial weak crystallographic texture.

17-4PH steel↗

Radio Frequency Properties of a 3D Printed Klystron Circuit

The manufacturing of active RF devices like klystrons is dominated by expensive and time-consuming cycles of machining and brazing. In this article, we characterize the RF properties of X-band klystron cavities and an integrated circuit manufactured with a novel additive manufacturing process. Parts are 3D printed in 316 L stainless steel with direct metal laser sintering, electroplated in copper, and brazed in one simple braze cycle. Stand-alone test cavities and integrated circuit cavities were measured throughout the manufacturing process. The un-tuned cavity frequency varies by less than 5% of the intended frequency, and Q factors reach above 1200. A tuning study was performed, and unoptimized tuning pins achieved a tuning range of 138 MHz without compromising Q. Klystron system performance was simulated with as-built cavity parameters and realistic tuning. Together, these results show promise that this process can be used to cheaply and quickly manufacture a new generation of highly integrated high power vacuum devices.

3D printing↗