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At least 37 records · Page 2

Conductor-backed coplanar waveguide resonators of Y-Ba-Cu-O and Tl-Ba-Ca-Cu-O on LaAlO3

Conductor-backed coplanar waveguide (CBCPW) resonators operating at 10.8 GHz have been fabricated from Tl-Ba-Ca-O (TBCCO) and Y-Ba-Cu-O (YBCO) thin films on LaAlO3. The resonators consist of a coplanar waveguide (CPW) patterned on the superconducting film side of the LaAlO3 substrate with a gold ground plane coated on the opposite side. These resonators were tested in the temperature range from 14 to 106 K. At 77 K, the best of our TBCCO and YBCO resonators have an unloaded quality factor (Qo) 7 and 4 times, respectively, larger than that of a similar all-gold resonator. In this study, the Qo's of the TBCCO resonators were larger than those of their YBCO counterparts throughout the aforementioned temperature range.

Miranda, F. A.↗

Solution chemistry effects on the stress corrosion cracking behavior of alloy 2090 (Al-Li-Cu) and alloy 2024 (Al-Cu-Mg)

The SCC initiation behavior of alloys 2090 and 2024 is examined in various NaCl-based environments. The pre-exposure and bulk/local solution chemistry effects discovered by Holroyd et al. (1986) are investigated, with emphasis on the effect of bulk solution chemistries and atmospheric CO2 on the occluded cell environment and the role of the occluded environment in the crack initiation and early-stage propagation processes. It was found that constant immersion in NaCl does not promote SCC in alloy 2090 or alloy 2024. Upon removal from NaCl, SCC is quickly facilitated, but only in the presence of atmospheric CO2. The need for CO2 is attributed to an increase in carbonate concentrations, eventually allowing passivation of blunted fissures by precipitation of Li2CO3. It is inferred that any effects due to aging are small in magnitude, relative to the effects of subtle changes in the bulk/local solution chemistries.

Moran, James P.↗

Comparing the results of an analytical model of the no-vent fill process with no-vent fill test results for a 4.96 cu m (175 cu ft) tank

NASA-Lewis has been investigating a no-vent fill method for refilling cryogenic storage tanks in low gravity. Analytical modeling based on analyzing the heat transfer of a droplet has successfully represented the process in 0.034 and 0.142 sq m commercial dewars using liquid nitrogen and hydrogen. Recently a large tank (4.96 sq m) was tested with hydrogen. This lightweight tank is representative of spacecraft construction. This paper presents efforts to model the large tank test data. The droplet heat transfer model is found to overpredict the tank pressure level when compared to the large tank data. A new model based on equilibrium thermodynamics has been formulated. This new model is compared to the published large scale tank's test results as well as some additional test runs with the same equipment. The results are shown to match the test results within the measurement uncertainty of the test data except for the initial transient wall cooldown where it is conservative (i.e., overpredicts the initial pressure spike found in this time frame).

Taylor, William J.↗

In-simulator assessment of trade-offs arising from mixture of color cuing and monocular, binoptic, and stereopsis cuing information

The use of monochrome Helmet Mounted Display (HMD) systems is becoming prevalent in today's complex flight mission environment. These HMD systems can provide stereopsis cueing as an almost natural byproduct for binocular helmet systems of an additional image generation source is provided. The addition of color cueing capability is much more difficult. The application of stereopsis cueing to advanced HMD and heads-down flight display concepts has demonstrated gains in pilot situation awareness and improved task performance. To provide stereopsis, binocular HMD systems must trade some of the total field-of-view (FOV) available from their two monocular fields to obtain a partial overlap region. The visual field then provides a mixture of cues, with monocular regions on both peripheries, and, in the overlapped center, a binoptic (the same image to both eyes) or, if lateral disparity is introduced to produce two images, a stereo region. The goal of this research was to assess the trade-offs arising from the mixture of color cueing and monocular, biocular, and stereopsis cueing information in peripheral monitoring displays as encountered in HMD systems. The accompanying effect of stereopsis cueing in the foveal display of tracking information was also assessed.

Williams, Steven P.↗

Mechanical and Thermal Properties of Two Cu-Cr-Nb Alloys and NARloy-Z

A series of creep tests were conducted on Cu-8 Cr-4 Nb (Cu-8 at.% Cr-4 at.% Nb), Cu-4 Cr-2 Nb (Cu-4 at.% Cr-2 at% Nb), and NARloy-Z (Cu-3 wt.% Ag-0.5 wt.% Zr) samples to determine their creep properties. In addition, a limited number of low cycle fatigue and thermal conductivity tests were conducted. The Cu-Cr-Nb alloys showed a clear advantage in creep life and sustainable load over the currently used NARloy-Z. Increases in life at a given stress were between 100% and 250% greater for the Cu-Cr-Nb alloys depending on the stress and temperature. For a given life, the Cu-Cr-Nb alloys could support a stress between 60% and 160% greater than NARloy-Z. Low cycle fatigue lives of the Cu-8 Cr-4 Nb alloy were equivalent to NARloy-Z at room temperature. At elevated temperatures (538 C and 650 C), the fatigue lives were 50% to 200% longer than NARloy-Z samples tested at 538 C. The thermal conductivities of the Cu-Cr-Nb alloys remained high, but were lower than NARloy-Z and pure Cu. The Cu-Cr-Nb thermal conductivities were between 72% and 96% that of pure Cu with the Cu-4 Cr-2 Nb alloy having a significant advantage in thermal conductivity over Cu-8 Cr4 Nb. In comparison, stainless steels with equivalent strengths would have thermal conductivities less than 25% the thermal conductivity of pure Cu. The combined results indicate that the Cu-Cr-Nb alloys offer an attractive alternative to current high temperature Cu-based alloys such as NARloy-Z.

Ellis, David L.↗

Creep Testing of High-Temperature Cu-8 Cr-4 Nb Alloy Completed

A Cu-8 at.% Cr-4 at.% Nb (Cu-8 Cr-4 Nb) alloy is under development for high-temperature, high heatflux applications, such as actively cooled, hypersonic vehicle heat exchangers and rocket engine combustion chambers. Cu-8 Cr-4 Nb offers a superior combination of strength and conductivity. It has also shown exceptional low-cycle fatigue properties. Following preliminary testing to determine the best processing route, a more detailed testing program was initiated to determine the creep lives and creep rates of Cu-8 Cr-4 Nb alloy specimens produced by extrusion. Testing was conducted at the NASA Lewis Research Center with constant-load vacuum creep units. Considering expected operating temperatures and mission lives, we developed a test matrix to accurately determine the creep properties of Cu-8 Cr-4 Nb between 500 and 800 C. Six bars of Cu-8 Cr-4 Nb were extruded. From these bars, 54 creep samples were machined and tested. The figure on the left shows the steady-state, or second-stage, creep rates for the samples. Comparison data for NARloy-Z (Cu-3 wt % Ag-0.5 wt % Zr), the alloy currently used in combustion chamber liners, were not unavailable. Therefore the steady-state creep rates for Cu at similar temperatures are presented. As expected, in comparison to pure Cu, the creep rates for Cu-8 Cr-4 Nb are much lower. The lives of the samples are presented in the figure on the right. As shown, Cu-8 Cr-4 Nb at 800 C is comparable to NARloy-Z at 648 C. At equivalent temperatures, Cu-8 Cr-4 Nb enjoys a 20 to 50 percent advantage in stress for a given life and 1 to 3 orders of magnitude greater life at a given stress. The improved properties allow for design tradeoffs and improvements in new and existing heat exchangers such as the next generation of combustion chamber liners. Average creep rates for Cu-8 Cr-4 Nb and pure Cu are shown. Average creep lives for Cu-8 Cr- 4 Nb and NARloy-Z are also shown. Currently, two companies are interested in the commercial usage of the Cu-8 Cr-4 Nb alloy. The Rocketdyne Division of Rockwell International is conducting independent testing to analyze the properties for their projected needs in advanced rocket engine applications. Metallamics, a company based in Traverse City, Michigan, is entering into a Space Act Agreement to evaluate and test Cu-Cr-Nb alloys as materials for welding electrodes that are used in robotic welding operations. Creep rate is one of the alloy properties that determines the degree to which a welding electrode will mushroom or expand at the tip. A material with a low creep rate will resist mushrooming and give the electrode a longer life, minimizing downtime. This application holds the potential for large-scale usage of the alloy in the automotive and other industries. Success here would dramatically decrease the cost of the alloy and increase availability for aerospace applications.

Source record↗

Comparison of GRCop-84 to Other Cu Alloys with High Thermal Conductivities

The mechanical properties of six highly conductive copper alloys, GRCop-84, AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z were compared. Tests were done on as-received hard drawn material, and after a heat treatment designed to simulate a brazing operation at 935 C. In the as-received condition AMZIRC, GlidCop Al-15, Cu- 1Cr-0.1Zr and Cu-0.9Cr had excellent strengths at temperatures below 500 C. However, the brazing heat treatment substantially decreased the mechanical properties of AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z. The properties of GlidCop Al-15 and GRCop-84 were not significantly affected by the heat treatment. Thus there appear to be advantages to GRCop-84 over AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z if use or processing temperatures greater than 500 C are expected. Ductility was lowest in GlidCop Al-15 and Cu-0.9Cr; reduction in area was particularly low in GlidCop Al-15 above 500 C, and as- received Cu-0.9Cr was brittle between 500 and 650 C. Tensile creep tests were done at 500 and 650 C; the creep properties of GRCop-84 were superior to those of brazed AMZIRC, Cu-1Cr- 0.1Zr, Cu-0.9Cr, and NARloy-Z. In the brazed condition, GRCop-84 was superior to the other alloys due to its greater strength and creep resistance (compared to AMZIRC, Cu-1Cr-0.1Zr, Cu-0.9Cr, and NARloy-Z) and ductility (compared to GlidCop Al-15).

deGroh, Henry C., III↗

Effects of Thermal and Mechanical Processing on Microstructures and Desired Properties of Particle-Strengthened Cu-Cr-Nb Alloys

Ternary Cu-Cr-Nb alloys, particularly Cu-8 Cr-4 Nb (in at.%), have demonstrated good thermal stability as well as high strength and conductivity at elevated temperatures. The initial powder material has a bimodal size distribution of Cr2Nb precipitates. Primary Cr2Nb precipitates are approx. 1 micron, and secondary Cr2Nb particles are 30-200 nm. The particle coarsening was analyzed and found to follow LSW-type behavior, This study provides a detailed examination of the stability and strengthening effects of Cr2Nb particles. This investigation also revealed that the primary particles provide direct grain boundary pinning and indirect grain boundary strengthening but virtually no Orowan strengthening. The secondary particles found within grains do provide Orowan strengthening. For extruded material, grain bound-ary strengthening (Hall-Petch effect) accounts for two-thirds of the strength with Orowan effects contributing the remainder. The proven advantages of Cu-Cr-Nb were the motivation to improve these attributes via microstructural refinement. Mechanical milling (MM) of Cu- 4 Cr-2 Nb and Cu-8 Cr-2 Nb produced an increase in hot pressed Vickers hardness of 122% and 96%, respectively. The increase in hardness was more due to Cu grain-size refinement than to Cr,,Nb refinement. This study also demonstrated enhanced stability of MM Cu-4 Cr-2 Nb. Hot pressed 4 h milled Cu-4 Cr-2 Nb experienced only a 22% drop in hardness when annealed at 1273 K for 50 h versus a 30% drop for extruded Cu-8 Cr-4 Nb. The goal of improving the strength and stability of Cu-4 Cr-2 Nb to better than such properties for as- extruded Cu-8 Cr-4 Nb has been met. In addition, a figure-of-merit (FOM) coupling hardness and thermal conductivity was maximized for the case of 4 h milled Cu-4 Cr-2 Nb material. Overall, Cu-Cr-Nb alloys not only possess high strength, conductivity and thermal stability but also can be further developed to improve strength and stability.

Anderson, Kenneth Reed↗

Precipitation strengthened high strength, high conductivity Cu-Cr-Nb alloys produced by chill block melt spinning

A series of Cu-based alloys containing 2 to 10 a/o Cr and 1 to 5 a/o Nb were produced by chill block melt spinning (CBMS). The melt spun ribbons were consolidated and hot rolled to sheet to produce a supersaturated Cu-Cr-Nb solid solution from which the high melting point intermetallic compound Cr2Nb could be precipitated to strengthen the Cu matrix. The results show that the materials possess electrical conductivities in excess of 90 percent that of pure Cu at 200 C and above. The strengths of the Cu-Cr-Nb alloys were much greater than Cu, Cu-0.6 Cr, NARloy-A, and NARloy-Z in the as-melt spun condition. The strengths of the consolidated materials were less than Cu-Cr and Cu-Cr-Zr below 500 C and 600 C respectively, but were significantly better above these temperatures. The strengths of the consolidated materials were greater than NARloy-Z, at all temperatures. The GLIDCOP possessed similar strength levels up to 750 C when the strength of the Cu-Cr-Nb alloys begins to degrade. The long term stability of the Cu-Cr-Nb alloys was measured by the microhardness of aged samples and the growth of precipitates. The microhardness measurements indicate that the alloys overage rapidly, but do not suffer much loss in strength between 10 and 100 hours which confirms the results of the electrical resistivity measurements taken during the aging of the alloys at 500 C. The loss in strength from peak strength levels is significant, but the strength remains exceptionally good. Transmission electron microscopy (TEM) of the as-melt spun samples revealed that Cr2Nb precipitates formed in the liquid Cu during the chill block melt spinning, indicating a very strong driving force for the formation of the precipitates. The TEM of the aged and consolidated materials indicates that the precipitates coarsen considerably, but remain in the submicron range.

Ellis, David L.↗

The General Isothermal Oxidation Behavior of Cu-8Cr-4Nb

Oxidation kinetics of Cu-8Cr-4Nb was investigated by TGA (thermogravimetric) exposures between 500 and 900-C (at 25-50 C intervals) and the oxide scale morphologies examined by microscopy and micro-analysis. Because Cu-8Cr-4Nb is comprised of fine Cr2Nb precipitates in a Cu matrix, the results were interpreted by comparison with the behavior of copper (OFHC) and 'NARloy-Z' (a rival candidate material for thrust cell liner applications in advanced rocket engines) under the same conditions. While NARloy-Z and Cu exhibited identical oxidation behavior, Cu-8Cr-4Nb differed markedly in several respects: below approx. 700 C its oxidation rates were significantly lower than those of Cu; At higher temperatures its oxidation rates fell into two categories: an initial rate exceeding that of Cu, and a terminal rate comparable to that of Cu. Differences in oxide morphologies paralleled the kinetic differences at higher temperature: While NARloy-Z and Cu produced a uniform oxide scale of Cu2O inner layer and CuO outer layer, the inner (Cu2O) layer on Cu-8Cr-4Nb was stratified, with a highly porous/spongy inner stratum (responsible for the fast initial kinetics) and a dense/blocky outer stratum (corresponding to the slow terminal kinetics). Single and spinel oxides of Nb and Cr were found at the interface between the oxide scale and Cu-8Cr-4Nb substrate and it appears that these oxides were responsible for its suppressed oxidation rates at the intermediate temperatures. No difference was found between Cu-8Cr-4Nb oxidation in air and in oxygen at 1.0 atm.

Thomas-Ogbuji, L. U.↗

Comparison of GRCop-84 to Other High Thermal Conductive Cu Alloys

The mechanical properties of five copper alloys (GRCop-84, AMZIRC, GlidCop Al-15, Cu-1Cr-0.1Zr, Cu-0.9Cr) competing in high temperature, high heat flux applications such as rocket nozzles, were compared. Tensile, creep, thermal expansion, and compression tests are presented. Tests were done on as-received material, and on material which received a simulated brazing heat treatment at 935 C. The 935 C heat treatment weakened AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr, and the strength of as-received AMZIRC dropped precipitously as test temperatures exceeded 500 C. The properties of GlidCop Al-15 and GRCop-84 were not significantly affected by the 935 C heat treatment. Thus GRCop-84 is better than AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr at temperatures greater than 500 C. Ductility was lowest in GlidCop Al-15 and Cu-0.9Cr. The creep properties of GRCop-84 were superior to those of brazed AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr. At equivalent rupture life and stress, GRCop-84 had a 150 C temperature advantage over brazed AMZIRC; for equivalent rupture life and temperature GRCop-84 was two times stronger. The advantages of GRCop-84 over GlidCop Al-15 associated with ease of processing were confirmed by GlidCop s marginal ductility. In the post brazed condition, GRCop-84 was found to be superior to the other alloys due to its greater strength and creep resistance (compared to AMZIRC, Cu-1Cr-0.1Zr, and Cu-0.9Cr) and ductility (compared to GlidCop Al-15)

deGroh, Henry C., III↗

On reversion phenomena in Cu-Zr-Cr alloys

Reversion phenomena in aged Cu-0.12% Zr-0.28% Cr alloy were investigated by means of resistivity measurement and transmission electron microscopy and compared with those of Cu-0.30% Zr and Cu-0.26% Cr alloys. Specimens in the form of a 0.5 mm sheet were solution-treated at 950 F for 1 hr water-quenched, aged, and finally reversed. The reversion phenomena were confirmed to exist in Cu-Zr and Cu-Zr-Cr alloys as well as Cu-Cr alloys, at aging temperatures of 300 to 500 F. The critical aging temperature for the reversion was not observed in all the alloys. Split aging increased the amount of reversion, particularly in Cu-Zr and Cu-Zr-Cr alloys, compared with that by conventional aging. The amount of reversion in Cu-Zr-Cr alloy was greatly affected by the resolution of Cr precipitate formed by preaging. Structural changes in Cu-Zr-Cr alloy due to the reversion were hardly observed by transmission electron microscopy.

Suzuki, H.↗

Characterization of Al-Cu-Mg-Ag Alloy RX226-T8 Plate

Aluminum-copper-magnesium-silver (Al-Cu-Mg-Ag) alloys that were developed for thermal stability also offer attractive ambient temperature strength-toughness combinations, and therefore, can be considered for a broad range of airframe structural applications. The current study evaluated Al-Cu-Mg-Ag alloy RX226-T8 in plate gages and compared performance with sheet gage alloys of similar composition. Uniaxial tensile properties, plane strain initiation fracture toughness, and plane stress tearing resistance of RX226-T8 were examined at ambient temperature as a function of orientation and thickness location in the plate. Properties were measured near the surface and at the mid-plane of the plate. Tensile strengths were essentially isotropic, with variations in yield and ultimate tensile strengths of less than 2% as a function of orientation and through-thickness location. However, ductility varied by more than 15% with orientation. Fracture toughness was generally higher at the mid-plane and greater for the L-T orientation, although the differences were small near the surface of the plate. Metallurgical analysis indicated that the microstructure was primarily recrystallized with weak texture and was uniform through the plate with the exception of a fine-grained layer near the surface of the plate. Scanning electron microscope analysis revealed Al-Cu-Mg second phase particles which varied in composition and were primarily located on grain boundaries parallel to the rolling direction. Fractography of toughness specimens for both plate locations and orientations revealed that fracture occurred predominantly by transgranular microvoid coalescence. Introduction High-strength, low-density Al-Cu-Mg-Ag alloys were initially developed to replace conventional 2000 (Al-Cu-Mg) and 7000 (Al-Zn-Cu-Mg) series aluminum alloys for aircraft structural applications [1]. During the High Speed Civil Transport (HSCT) program, improvements in thermal stability were demonstrated for candidate aircraft wing and fuselage skin materials through the addition of silver to Al-Cu-Mg alloys based on Al 2519 chemistry [2]. Thermal stability of the resulting Al-Cu-Mg-Ag alloys, C415-T8 and C416-T8, was due to co-precipitation of the thermally stable . (AlCu) and ' (Al2Cu) strengthening phases [1-4]. The strength and toughness behavior was investigated for these alloys produced as 0.090-inch thick rolled sheet in the T8 condition and after various thermal exposures. The mechanical properties were shown to be competitive with conventional aircraft alloys, 2519-T8 and 2618-T8 [2]. During the Integral Airframe Structure (IAS) program, advanced aluminum alloys were examined for use in an integrally stiffened airframe structure where the skin and stiffeners would be machined from plate and extruded frames would be mechanically attached (see Figure 1) [5]. Advantages of integrally stiffened structure include reduced part count, and reduced assembly times compared to conventional built-up airframe structure. The near-surface properties of a thick plate are of significance for a machined integrally stiffened airframe structure since this represents the skin location. Properties measured at the mid-plane of the plate are more representative of the stiffener web. RX226 was developed to exploit strength-toughness improvements and thermal stability benefits of Al-Cu-Mg-Ag alloys in plate gages. This study evaluated the microstructure and properties of three gages of plate produced in the T8 condition.

Lach, Cynthia L.↗

Interactions of amorphous Ta(x)Cu(1-x) (x = 0.93 and 0.80) alloy films with Au overlayers and GaAs substrates

Amorphous Ta(93)Cu(7) and Ta(80)Cu(20) alloy films are prepared by cosputtering of pure Ta and pure Cu targets with a rotating sample holder table. To investigate the possible application of these materials as diffusion barriers for the Au-GaAs system, vacuum annealings are made in the temperature range from 200 to 800 C. Resistivity change, X-ray diffraction, and Auger electron spectroscopy measurements are performed to find the chemical and metallurgical stabilities of these materials in this system. The reaction temperature for Ta(x)Cu(1-x) in contact with GaAs lies between 500 and 700 C. For Au in contact with Ta(x)Cu(1-x) the reaction occurs at about 600 C. Amorphous Ta(93)Cu(7) shows different interdiffusion characteristics with surrounding elements than does Ta(80)Cu(20).

Oh, Jae E.↗