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At least 37 records · Page 2

High temperature, low cycle fatigue of copper-base alloys in argon. Part 3: Zirconium-copper; thermal-mechanical strain cycling, hold-time and notch fatigue results

The low-cycle fatigue characteristics of smooth bar and notched bar specimens (hourglass shape) of zirconium-copper, 1/2 Hard, material (R-2 Series) were evaluated at room temperature in axial strain control. Over the fatigue life range from about 300 to 3000 cycles the ratio of fatigue life for smooth bar to fatigue life for notched bar remained constant at a value of about 6.0. Some additional hold-time data for the R-2 alloy tested in argon at 538 C are reported. An analysis of the relaxation data obtained in these hold-time tests is also reported and it is shown that these data yield a fairly consistent correlation in terms of instantaneous stress rate divided by instantaneous stress. Two thermal-mechanical strain cycling tests were also performed using a cyclic frequency of 4.5 cycles per hour and a temperature cycling interval from 260 to 538 C. The fatigue life values in these tests were noticeably lower than that observed in isothermal tests at 538 C.

Conway, J. B.↗

High-temperature, low-cycle fatigue of advanced copper-base alloys for rocket nozzles. Part 2: NASA 1.1, Glidcop, and sputtered copper alloys

Short-term tensile and low-cycle fatigue data are reported for five advance copper-base alloys: Sputtered Zr-Cu as received, sputtered Zr-Cu heat-treated, Glidcop AL-10, and NASA alloys 1-1A and 1-1B. Tensile tests were performed in argon at 538 C using an axial strain rate of 0.002/sec. Yield strength and ultimate tensile strength data are reported along with reduction in area values. Axial strain controlled low-cycle fatigue tests were performed in argon at 538C using an axial strain rate of 0.002/sec to define the fatigue life over the range from 100 to 3000 cycles for the five materials studied. It was found that the fatigue characteristics of the NASA 1-1A and NASA 1-1B compositions are identical and represent fatique life values which are much greater than those for the other materials tested. The effect of temperature on NASA 1-1B alloy at a strain rate of 0.002/sec was evaluated along with the effect of strain rates of 0.0004 and 0.01/sec at 538 C. Hold-time data are reported for the NASA 1-1B alloy at 538 C using 5 minute hold periods in tension only and compression only at two different strain range values. Hold periods in tension were much more detrimental than hold periods in compression.

Conway, J. B.↗

Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bonds have replaced gold wire bonds in the majority of commercial semiconductor devices for the latest technology nodes. Although economics has been the driving mechanism to lower semiconductor packaging costs for a savings of about 20% by replacing gold wire bonds with copper, copper also has materials property advantages over gold. When compared to gold, copper has approximately: 25% lower electrical resistivity, 30% higher thermal conductivity, 75% higher tensile strength and 45% higher modulus of elasticity. Copper wire bonds on aluminum bond pads are also more mechanically robust over time and elevated temperature due to the slower intermetallic formation rate - approximately 1/100th that of the gold to aluminum intermetallic formation rate. However, there are significant tradeoffs with copper wire bonding - copper has twice the hardness of gold which results in a narrower bonding manufacturing process window and requires that the semiconductor companies design more mechanically rigid bonding pads to prevent cratering to both the bond pad and underlying chip structure. Furthermore, copper is significantly more prone to corrosion issues. The semiconductor packaging industry has responded to this corrosion concern by creating a palladium coated copper bonding wire, which is more corrosion resistant than pure copper bonding wire. Also, the selection of the device molding compound is critical because use of environmentally friendly green compounds can result in internal CTE (Coefficient of Thermal Expansion) mismatches with the copper wire bonds that can eventually lead to device failures during thermal cycling. Despite the difficult problems associated with the changeover to copper bonding wire, there are billions of copper wire bonded devices delivered annually to customers. It is noteworthy that Texas Instruments announced in October of 2014 that they are shipping microcircuits containing copper wire bonds for safety critical automotive applications. An evaluation of copper wire bond technology for applicability to spaceflight hardware may be warranted along with concurrently compiling a comprehensive understanding of the failure mechanisms involved with copper wire bonded semiconductor devices.

Body of Knowledge (BOK)↗

High temperature, low-cycle fatigue of copper-base alloys in argon. Part 1: Preliminary results for 12 alloys at 1000 F (538 C)

Short-term tensile evaluations at room temperature and 538 C and low-cycle fatigue evaluations at 538 C are presented for the following materials: Zirconium copper-annealed, Zirconium copper-1/4 hard, Zirconium copper-1/2 hard, Tellurium copper-1/2 hard, Chromium copper-SA and aged, OFHC copper-hard, OFHC copper-1/4 hard, OFHC copper-annealed, Silver-as drawn, Zr-Cr-Mg copper-SA, CW and aged, Electroformed copper-30-35 ksi, and Co-Be-Zr- copper-SA, aged. A total of 50 tensile tests and 76 low-cycle fatigue tests were performed using a strain rate of 0.2 percent per second.

Conway, J. B.↗

Corrosion Prevention in Copper Combustion Chamber Liners of Liquid Oxygen/Methane Booster Engines

Prior research conducted by United Technologies Research Center and Rockwell International Rocketdyne Division encountered severe copper corrosion while flowing hydrocarbon fuels through copper cooling tubes. These experimental results have very important implications for the development of low-cost, regeneratively cooled, oxygen/hydrocarbon bipropellant booster engines. Aerojet TechSystems undertook a program sponsored by NASA/Lewis Research Center in 1986 with two objectives: (1) to define the corrosive interaction process that occurs between hydrocarbon fuels and copper combustion chamber liner materials, using both static and dynamic test methods, and (2) to identify and demonstrate protective measures against this corrosive process. The results of the first program task demonstrated that the most damaging corrosive process was caused by trace amounts of sulfur-containing impurities in the hydrocarbon fuel which react with the copper chamber liner material to form cuprous sulfide (Cu2S), as reported in Paper No. AlAA 88-3215. Experiments were conducted which demonstrated this corrosive process with Mil-Spec RP-1, propane, and methane fuels in contact with OFHC, NASA-Z, and ZrCu coppers. The preliminary results of the second program task demonstrated that electrodeposited gold and platinum coatings held promise of preventing corrosion of copper chamber liners by methane contaminated with sulfur-containing impurities, as reported in Paper No. AIAA 89-2738. Experiments were conducted which demonstrated greatly reduced corrosion of copper by hydrogen sulfide (H2S) and methyl mercaptan (CH3SH) as measured impurities in methane. This paper presents the concluding, confirmatory results from the second program task. The efficacy of a protective gold coating on NASA-Z copper cooling channel walls was conclusively demonstrated. Tests were conducted in the Aerojet Carbothermal Test Facility which provide realistic simulations of booster engine cooling channel conditions such as temperature, pressure, flow velocity, and heat flux. Dynamic test series were performed with methane containing 5 and 10 ppm (by volume) hydrogen sulfide. Gold-plated and unplated copper alloy specimens were evaluated. The tests demonstrated that gold coatings were effective in preventing corrosion of the copper. Posttest metallographic examinations of the unplated specimens showed severe corrosion as a result of reaction with the sulfur containing contaminant in the fuel. In contrast, posttest metallographic examination of the gold-coated specimens showed no corrosion under similar operating conditions. The findings from metallurgical and chemical analyses of the copper specimens, chemical analysis of the methane, and description of all test conditions are provided. Conclusions are reached as to the efficacy of the plating methods and the effectiveness of the metal coatings in the prevention of corrosion in hydrocarbon-fueled booster engine combustion chamber liners.

S D Rosenberg↗

Kinetics of copper ion absorption by cross-linked calcium polyacrylate membranes

The absorption of copper ions from aqueous copper acetate solutions by cross-linked calcium acrylate membranes was found to obey parabolic kinetics similar to that found for oxidation of metals that form protective oxide layers. For pure calcium polyacrylate membranes the rate constant was essentially independent of copper acetate concentration and film thickness. For a cross-linked copolymer film of polyvinyl alcohol and calcium polyacrylate, the rate constant was much greater and dependent on the concentration of copper acetate. The proposed mechanism in each case involves the formation of a copper polyacrylate phase on the surface of the membrane. The diffusion of the copper ion through this phase appears to be the rate controlling step for the copolymer film. The diffusion of the calcium ion is apparently the rate controlling step for the calcium polyacrylate. At low pH, the copper polyacrylate phase consists of the normal copper salt; at higher pH, the phase appears to be the basic copper salt.

Philipp, W. H.↗

Thermotransport in liquid aluminum-copper alloys

A thermotransport study was made on a series of liquid aluminum-copper alloys which contained from trace amounts to 33 weight percent copper. The samples in the form of narrow capillaries were held in known temperature gradient of thermotransport apparatus until the stationary state was reached. The samples were analyzed for the concentration of copper along the length. Copper was observed to migrate to the colder regions in all the samples. The heat of transport, Q*, was determined for each composition from a plot of concentration of copper versus reciprocal absolute temperature. The value of Q* is the highest at trace amounts of copper (4850 cal/gm-atom), but decreases with increasing concentration of copper and levels off to 2550 cal/gm-atom at about 25 weight percent copper. The results are explained on the basis of electron-solute interaction and a gas model of diffusion.

Bhat, B. N.↗

Effect of oxygen, methyl mercaptan, and methyl chloride on friction behavior of copper-iron contacts

Sliding friction experiments were conducted with an iron rider on a copper disk and a copper rider on an iron disk. The sputter cleaned iron and copper disk surfaces were saturated with oxygen, methyl mercaptan, and methyl chloride at atmospheric pressure. Auger emission spectroscopy was used to monitor the surfaces. Lower friction was obtained in all experiments with the copper rider sliding on the iron disk than when the couple was reversed. For both iron and copper disks, methyl mercaptan gave the best surface coverage and was most effective in reducing friction. For both iron and copper disks, methyl chloride was the least effective in reducing friction. With sliding, copper transferred to iron and iron to copper.

Buckley, D. H.↗

Effect of copper impurity on polycrystalline silicon solar cells

The presence of copper impurity, up to 10 to the 15th atoms/cc, in single crystal silicon has been shown to have no deleterious effect on the p-n junction solar cell performance. However, in polycrystalline silicon, copper atoms tend to migrate to the defect sites because of the structural sensitive properties of copper. This study was undertaken to investigate the influence of this behavior of copper impurity on the performance of p-n junction solar cells fabricated from structurally imperfect silicon. Two sets of polycrystalline silicon substrates containing copper were examined. In one set of samples, copper was incorporated during growth, whereas in the other, copper was diffused. Solar cells were fabricated on both the sets of substrates by a standard process. Dark and light I-V and spectral response characteristics of the cells were measured and compared with copper-free polycrystalline silicon solar cells. The results and the model are discussed.

Daud, T.↗

Textured carbon on copper: A novel surface with extremely low secondary electron emission characteristics

Experimentally determined values of true secondary electron emission and relative values of reflected primary electron yield for a range of primary electron beam energies and beam impingement angles are presented for a series of novel textured carbon surfaces on copper substrates. (All copper surfaces used in this study were oxygen-free, high-conductivity grade). The purpose of this investigation is to provide information necessary to develop high-efficiency multistage depressed collectors (MDC's) for microwave amplifier traveling-wave tubes (TWT's) for communications and aircraft applications. To attain the highest TWT signal quality and overall efficiency, the MDC electrode surface must have low secondary electron emission characteristics. While copper is the material most commonly used for MDC electrodes, it exhibits relatively high levels of secondary electron emission unless its surface is treated for emission control. The textured carbon surface on copper substrate described in this report is a particularly promising candidate for the MDC electrode application. Samples of textured carbon surfaces on copper substrates typical of three different levels of treatment are prepared and tested for this study. The materials are tested at primary electron beam energies of 200 to 2000 eV and at direct (0 deg) to near-grazing (85 deg) beam impingement angles. True secondary electron emission and relative reflected primary electron yield characteristics of the textured surfaces are compared with each other and with those of untreated copper. All the textured carbon surfaces on copper substrate tested exhibited sharply lower secondary electron emission characteristics than those of an untreated copper surface.

Curren, A. N.↗

Secondary electron emission characteristics of molybdenum-masked, ion-textured OFHC copper

A method for producing a uniform, highly textured surface on oxygen-free, high conductivity (OFHC) copper by ion bombardment using sputtered molybdenum as a texture-inducing masking film was developed and used to provide samples for study. The purpose was to develop a basically OFHC copper surface having very low secondary electron emission characteristics. Surfaces having low secondary electron emission are a requirement for the electrodes of very high efficiency multistage depressed collectors (MDC's). Such MDC's are used in microwave amplifier traveling wave tubes for space communications and other applications. OFHC copper is the material most commonly used for MDC electrodes because it has high thermal conductivity, it is easy to machine, and its fabrication and brazing procedures are well established. However, its untreated surface displays relatively very high levels of secondary electron emissions. Textured OFHC copper samples were tested for true secondary electron emission and relative reflected primary electron yield at primary electron beam energy levels from 200 to 2000 eV and at direct (0 deg) to oblique (60 deg) beam impingement angles. The test results for three of the samples, each of which was processed in a slightly different way, are compared with each other and with test results for a machined OFHC copper sample. Although the textured samples are not represented here as having been processed optimally, their measured secondary electron emission characteristics are significantly lower than those of the untreated OFHC copper sample over the range of conditions studied. Importantly, the relative reflected primary electron yield of one of the textured samples is conspicuously lower than that of the others. Clearly, with further development, the molybdenum-masked ion-textured OFHC copper surface will be a promising material for high-efficiency MDC electrodes.

Curren, Arthur N.↗

Oxidation Behavior of GRCop-84 Copper Alloy Assessed

NASA's goal of safe, affordable space transportation calls for increased reliability and lifetimes of launch vehicles, and significant reductions of launch costs. The areas targeted for enhanced performance in the next generation of reusable launch vehicles include combustion chambers and nozzle ramps; therefore, the search is on for suitable liner materials for these components. GRCop-84 (Cu-8Cr-4Nb), an advanced copper alloy developed at the NASA Glenn Research Center in conjunction with Case Western Reserve University, is a candidate. The current liner of the Space Shuttle Main Engine is another copper alloy, NARloy-Z (Cu-3Ag-0.1Zr). It provides a benchmark against which to compare the properties of candidate successors. The thermomechanical properties of GRCop-84 have been shown to be superior, and its physical properties comparable, to those of NARloy-Z. However, environmental durability issues control longevity in this application: because copper oxide scales are not highly protective, most copper alloys are quickly consumed in oxygen environments at elevated temperatures. In consequence, NARloy-Z and most other copper alloys are prone to blanching, a degradation process that occurs through cycles of oxidation-reduction as the oxide is repeatedly formed and removed because of microscale fluctuations in the oxygen-hydrogen fuel systems of rocket engines. The Space Shuttle Main Engine lining typically degraded by blanching-induced hot spots that lead to surface roughening, pore formation, and coolant leakage. Therefore, resistance to oxidation and blanching are key requirements for second-generation reusable launch vehicle liners. The rocket engine ambient includes H2 (fuel) and H2O (combustion product) and is, hence, under reduced oxygen partial pressures. Accordingly, our studies were expanded to include oxygen partial pressures as low as 322 parts per million (ppm) at the temperatures likely to be experienced in service. A comparison of 10-hr weight gains of GRCop-84, NARloy-Z, and pure copper in 0.032, 2.2, and 100 percent oxygen from 550 to 750 C is shown. In 2.2 vol% and higher oxygen content, GRCop-84 oxidation was slower than that of NARloy-Z or Cu, but that advantage was lost or diminished in 322-ppm O2. Over longer (50-hr) exposures in 1.0 atm O2, however, the advantage of GRCop-84 increased significantly, its oxidation rate becoming approximately 10 times slower than those of Cu and NARloy-Z from 500 to 700 C. Weight gains were moderate and the kinetics parabolic for all three materials in 2.2 vol% and higher oxygen content; however, in 322-ppm O2, the scales were nonprotective below about 650 C, as reflected in linear kinetics and large weight gains. The superior oxidation resistance of GRCop-84 is likely related to the kinetics of extra oxygen consumption to form the additional oxides of Cr and Nb detected beneath the GRCop-84 oxide layer. While we continue to evaluate the blanching resistance of GRCop-84 in other tests, these oxidation results indicate that GRCop-84 is suitable as a reusable launch vehicle liner, and in applications where it is desired to use a copper alloy but without the risk of oxidative failure. Three bar charts comparing overall specific weight gains by each of the three materials studied. The top chart is for oxidation in 1.0 atm of oxygen, the middle is for 2.2% oxygen (balance argon), and the bottom is for 0.0322% oxygen. GRCop-84 outperforms the other two materials, showing the least weight gain in nearly all cases.

Thomas-Ogbuji, Linus U.↗

Fabricating Copper Nanotubes by Electrodeposition

Copper tubes having diameters between about 100 and about 200 nm have been fabricated by electrodeposition of copper into the pores of alumina nanopore membranes. Copper nanotubes are under consideration as alternatives to copper nanorods and nanowires for applications involving thermal and/or electrical contacts, wherein the greater specific areas of nanotubes could afford lower effective thermal and/or electrical resistivities. Heretofore, copper nanorods and nanowires have been fabricated by a combination of electrodeposition and a conventional expensive lithographic process. The present electrodeposition-based process for fabricating copper nanotubes costs less and enables production of copper nanotubes at greater rate.

Yang, E. H.↗