Rapid qualification of area array package assemblies by increase of ramp rates and temperature ranges
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Chip scale package CSP area array package microvia↗
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Results for “CSP Solder Joint Reliability”
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Long-life reliability of CSP assemblies with and without underfill
The test results for numerous chip scale package assembly performed under MicrotypeBGA Consortium led by the Jet Propulsion Laboratory have been published previously.
solder joint reliability thermal cycle accelerated↗
Lead free and lead reliability for advanced electronic assemblies
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lead free Pb free solder joint reliability thermal↗
CSP Assembly Reliability Challenges
This paper will compare three different CSP concepts as well as their assembly reliability.
Wiring Board) microvia↗
SM Package Miniaturization Trends and Assembly Reliability Challenges
Different aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
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CSPs Assembly Reliability
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
Reliability↗
CSP and BGA assembly reliability in a fast ramp rate thermal cycle environment
Inspection results along with SEM and optical cross-sectional photos revealing damage and failure mechanisms will also be presented.
scale package FPBGA FCBGA↗
Reliability of CCGA and PBGA assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of the choice for commercial applications; they are now started to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic BGA (PBGA) and CSP assemblies, because of their wide usage for commercial applications, have been extensively reported in literature. Thermal cycling represents the on-off environmental condition for most electronic products and therefore is a key factor that defines reliability.
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Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges
Team members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package solder joint reliability BGA th↗
Mechanical Properties and Microstructure Investigation of Lead Free Solder
While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a eutectic region of Sn with moderately dispersed Ag3Sn intermetallic, surrounded by a dendritic Sn-rich phase. The SEM images of the fracture surface indicated the presence of a tough shear surface at the initial cavity break area and a break line in the middle of specimen along the failure direction. A hyperbolic-sine creep model was adopted and used to fit the creep experiment data. The effect on the mechanical properties by adding the quaternary element bismuth to the Sn-3.5Ag-0.8Cu alloy was measured and compared with the mechanical properties of the ternary alloys. The results of this research study provide necessary data for the modeling of solder joint reliability for a range of Sn-Ag-Cu compositions and a baseline for evaluating the effects of subsequent quaternary additions.
Wang, Qing↗