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Current Paths in an Atomic Precision Advanced Manufactured Device Imaged by Nitrogen Vacancy Diamond Magnetic Microscopy.
Abstract not provided.
Atomic Precision Advanced Manufacturing for Ultraprecise 2D Bipolar Devices.
Abstract not provided.
Modeling and Design of Atomic Precision Advanced Manufacturing (APAM) Enabled Bipolar Devices.
Abstract not provided.
Understanding the Impact of Incorporation Kinetics Towards Placing Single to Few Donor Atoms through Atomic Precision Advanced Manufacturing
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Pathfinding Process Development for the Realization of Atomic Precision Advanced Manufacturing (APAM)-Based Vertical Tunneling Field Effect Transistors for Enhanced Energy Efficiency
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Atomic Precision Advanced Manufacturing (APAM) devices for quantum sensing
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Middle-of-line Integration of Atomic Precision Advanced Manufacturing
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Middle-of-line Integration of Atomic Precision Advanced Manufacturing
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Modeling Assisted Room Temperature Operation of Atomic Precision Advanced Manufacturing Devices.
Abstract not provided.
Development of a high-k gate stack for atomic-precision advanced manufacturing.
Abstract not provided.
Atomic precision advanced manufacturing for electronic devices.
Abstract not provided.
Modeling Assisted Room Temperature Operation of Atomic Precision Advanced Manufacturing Devices.
Abstract not provided.
Middle-of-line Integration of Atomic Precision Advanced Manufacturing
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Bottom-up fabrication of scalable room-temperature diamond quantum computing and sensing technologies
The nitrogen-vacancy (NV) centre in diamond is a premier solid-state defect for quantum information processing and metrology. An integrated diamond quantum device harnesses the collective properties of multiple NV centres, enabling room-temperature quantum computing and sensing. While large-scale devices are poised to fill an important gap in the burgeoning quantum technology landscape, their practical realisation has not been achieved using current top-down fabrication techniques such as ion implantation. Consequently, this necessitates the development of a bottom-up fabrication technique, which is scalable, deterministic, and possesses atomic-scale precision. Informed by existing methods for fabricating phosphorous defect qubits in silicon, we envision a hydrogen depassivation lithography technique for atomically-precise manufacturing of nitrogen-vacancy centres in diamond. This perspective article outlines a viable multi-step procedure for realising scalable fabrication of diamond quantum devices and identifies the key challenges in its development.
Electric current paths in a Si:P delta-doped device imaged by nitrogen-vacancy diamond magnetic microscopy
The recently-developed ability to control phosphorous-doping of silicon at an atomic level using scanning tunneling microscopy, a technique known as atomic precision advanced manufacturing (APAM), has allowed us to tailor electronic devices with atomic precision, and thus has emerged as a way to explore new possibilities in Si electronics. In these applications, critical questions include where current flow is actually occurring in or near APAM structures as well as whether leakage currents are present. In general, detection and mapping of current flow in APAM structures are valuable diagnostic tools to obtain reliable devices in digital-enhanced applications. In this report, we used nitrogen-vacancy (NV) centers in diamond for wide-field magnetic imaging (with a few-mm field of view and micron-scale resolution) of magnetic fields from surface currents flowing in an APAM test device made of a P delta-doped layer on a Si substrate, a standard APAM witness material. We integrated a diamond having a surface NV ensemble with the device (patterned in two parallel mm-sized ribbons), then mapped the magnetic field from the DC current injected in the APAM device in a home-built NV wide-field microscope. The 2D magnetic field maps were used to reconstruct the surface current densities, allowing us to obtain information on current paths, device failures such as choke points where current flow is impeded, and current leakages outside the APAM-defined P-doped regions. Analysis on the current density reconstructed map showed a projected sensitivity of ~0.03 A m -1 , corresponding to a smallest-detectable current in the 200 μm wide APAM ribbon of ~6 μA. These results demonstrate the failure analysis capability of NV wide-field magnetometry for APAM materials, opening the possibility to investigate other cutting-edge microelectronic devices.
Photolithography of atomic layer resist
In a method of atomic precision advanced manufacturing (APAM), an atomic or molecular resist layer on a substrate surface is selectively depassivated by locally exciting the substrate surface with an optical beam effective to eject adsorbed atoms or molecules from the substrate surface. The substrate surface is further processed by exposing it to a precursor gas, decomposing the precursor gas to release a dopant, and incorporating the dopant into the substrate surface.
Revealing conductivity of p-type delta layer systems for novel computing applications
This project uses a quantum simulation technique to reveal the true conducting properties of novel atomic precision advanced manufacturing materials. With Moore's law approaching the limit of scaling for the CMOS technology, it is crucial to provide the best computing power and resources to National Security missions. Atomic precision advanced manufacturing-based computing systems can become the key to the design, use, and security of modern weapon systems, critical infrastructure, and communications. We will utilize the state-of-the-art computational methodology to create a predictive simulator for p-type atomic precision advanced manufacturing systems, which may also find applications in counterfeit detection and anti-tamper.