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At least 37 records · Page 2

Materials Data on U(Al2Cu)4 by Materials Project

UCu4Al8 crystallizes in the tetragonal I4/mmm space group. The structure is three-dimensional. U is bonded in a distorted square co-planar geometry to four equivalent Cu and sixteen Al atoms. All U–Cu bond lengths are 3.04 Å. There are eight shorter (3.33 Å) and eight longer (3.36 Å) U–Al bond lengths. Cu is bonded in a 10-coordinate geometry to one U, one Cu, and eight Al atoms. The Cu–Cu bond length is 2.62 Å. There are a spread of Cu–Al bond distances ranging from 2.70–2.91 Å. There are two inequivalent Al sites. In the first Al site, Al is bonded in a 12-coordinate geometry to two equivalent U, four equivalent Cu, and six Al atoms. There are four shorter (2.57 Å) and two longer (2.70 Å) Al–Al bond lengths. In the second Al site, Al is bonded in a 12-coordinate geometry to two equivalent U, four equivalent Cu, and six Al atoms. Both Al–Al bond lengths are 2.75 Å.

36 MATERIALS SCIENCE↗

Materials Data on Yb(Al2Cu)4 by Materials Project

YbCu4Al8 crystallizes in the tetragonal I4/mmm space group. The structure is three-dimensional. Yb is bonded in a 12-coordinate geometry to eight equivalent Cu and twelve Al atoms. All Yb–Cu bond lengths are 3.38 Å. There are four shorter (3.07 Å) and eight longer (3.21 Å) Yb–Al bond lengths. Cu is bonded to two equivalent Yb, two equivalent Cu, and eight Al atoms to form a mixture of distorted edge, corner, and face-sharing CuYb2Al8Cu2 cuboctahedra. Both Cu–Cu bond lengths are 2.56 Å. There are four shorter (2.57 Å) and four longer (2.70 Å) Cu–Al bond lengths. There are two inequivalent Al sites. In the first Al site, Al is bonded in a 10-coordinate geometry to one Yb, four equivalent Cu, and five Al atoms. There are a spread of Al–Al bond distances ranging from 2.70–2.83 Å. In the second Al site, Al is bonded in a 12-coordinate geometry to two equivalent Yb, four equivalent Cu, and six Al atoms. Both Al–Al bond lengths are 2.74 Å.

36 MATERIALS SCIENCE↗

Dislocation-θ' (Al2Cu) interactions during creep deformation of an Al-Cu alloy

While precipitate-dislocation interactions are well-understood for Al-Cu alloys in tension, creep behavior has seen far less study. New, thermally-stabilized Al-Cu alloys have θ' (Al 2 Cu) as strengthening precipitates that remain stable up to 300 °C (~60% of the melting temperature) and higher, where creep becomes essential to the mechanical behavior. This investigation identifies the precipitate-dislocation interactions in such an Al-Cu alloy using in-situ neutron diffraction and scanning transmission electron microscopy. Significant load transfer to the θ' precipitates occurs, which can be attributed to dislocation loops on the interfaces of θ' and the Al matrix. Thus, Orowan looping is identified to be the primary activity for precipitate-dislocation interactions. As Orowan looping and load transfer are associated with significant strain hardening, these results explain the excellent creep resistance seen in this alloy, and provide insights into the design of precipitation strengthened alloys with superior creep performance.

36 MATERIALS SCIENCE↗

Short-Transverse Tensile Fracture Behavior of Thick AA2219 Plate - Effects of Theta (Al2Cu) Particle Size and Distribution

An investigation was conducted to obtain a better understanding on the microstructural characteristics of 5-inch-thick AA2219-T87 plate material and the mechanism that led to the unexpected low ductility in the short-transverse (ST) orientation. Materials characterization techniques were utilized to observe the microstructure of fractured tensile specimens and remnant plate material. The mechanism and cause of low ST ductility in the thick plate material is presented and discussed in this report.

Short-Transverse Orientation↗

Cavitation-resistant intergranular precipitates enhance creep performance of θ'-strengthened Al-Cu based alloys

Tensile and compressive creep properties of a quaternary Al-Cu-Mn-Zr (ACMZ) alloy and its commercial counterpart (Al-Cu-Mn-Zr with Ni, Co and Sb additions, RR350) are investigated at 300°C. At low stresses up to 30 MPa where diffusional creep dominates, creep resistance is the same in tension and compression and RR350 deforms more slowly than ACMZ, consistent with RR350 alloy's larger linear fraction of intergranular precipitates (Al7Cu2(NiFe) and Al9FeNi for RR350 vs. θ-Al2Cu for ACMZ) and a reduced fraction of precipitate-free zones near grain boundaries. At stresses between 30 and 80 MPa, dislocation creep with a stress exponent n ~ 3 becomes rate-limiting in compression, which is expected to be controlled by θ' precipitates within the grain bulk. By contrast, in tension, enhanced creep rate and higher apparent stress exponents are measured, consistent with cavitation at intergranular precipitates becoming increasingly dominant as the stress increases. In the dislocation creep regime, RR350 alloy is again more creep resistant than ACMZ alloy, which is related to three mechanisms (i) a reduced fraction of softer precipitate-free zones, (ii) more effective load transfer to intergranular precipitates, and (iii) reduced cavitation. A model for cavitation is applied to calculate tensile creep rates from compressive creep rates and the model successfully predicts the improved tensile creep resistance of the RR350 alloy. Overall, the present investigation underscores the importance of intergranular grain boundary precipitates, in addition to strengthening θ' precipitates, in enhancing the creep resistance of Al-Cu alloys.

36 MATERIALS SCIENCE↗

Creep deformation and cavitation in an additively manufactured Al-8.6Cu-0.4Mn-0.9Zr (wt%) alloy

Creep deformation and cavitation were investigated at 300 ºC in both tension and compression for an additively manufactured Al-8.6Cu-0.5Mn-0.9Zr (wt%) alloy in the as-fabricated state and after various aging treatments (aging at 300 °C/200 h or 350 °C/24 h and overaging at 400 °C/200 h). Creep mechanisms at 300 °C were determined by relating the measured creep response to corresponding microstructural and X-ray computed tomography observations. In compression, alloys in the as-fabricated and two aging conditions exhibited similarly high creep resistance. Overaging (400 °C/200 h) led to substantial coarsening of intragranular θ-Al2Cu precipitates and an expected drop in their Orowan strengthening contribution. In tension, minimum strain rates comparable to those in compression were obtained at any given stress; however, upon accumulation of some plastic strain in the matrix, creep cavities started to form, leading to accelerated tertiary stage creep deformation and rupture. Cavitation occurred exclusively along melt pool boundaries due to locally enhanced diffusion enabled by (i) large grain-boundary area in adjacent fine-grained zones and (ii) localization of creep strain in nearby heat-affected zones. Although cavity growth was initially diffusion-controlled, its rate was determined by matrix creep rate, consistent with constrained cavity growth mechanisms. This study reveals how microstructural complexities induced by the additive manufacturing process affect the creep and cavitation behavior of Al-Cu-Mn-Zr alloys. The underlying creep and cavitation mechanisms uncovered in this study point to pathways that improve the high-temperature properties of additively manufactured alloys.

36 MATERIALS SCIENCE↗

Characterization of electromigration-induced short-range stress development in Al(0.25 at. % Cu) conductor line

Scanning x-ray microbeam topography and fluorescence experiments were conducted in situ to study the electromigration behavior of a 0.5 μm thick, 10 μm wide, and 200 μm long Al(0.25 at. % Cu) conductor line with 1.5 μm-thick SiO2 passivation on a single crystal Si substrate. The strain sensitivity of x-ray topography measurement allowed detailed examination of the electromigration-induced stress distribution and evolution in the conductor line in response to the depletion of Cu solute early in the electromigration process. Upon electromigration at 0.4 MA/cm2 and 303 °C, a short-range stress gradient was quickly induced by Al migration in the Cu-depleted cathode region to counteract further Al flow. The stress gradient was fully developed during the 5.3 h incubation time, extending over the critical Blech length of about 66 μm from the cathode end. Plastic deformation then occurred at the downstream end of the Cu-depleted region. The preferential electromigration of Cu did not cause detectable stress change outside the Cu-depleted region, except for the significant stress development from the Al2Cu precipitation at the anode end which appeared to initiate the fracture in the passivation. Preliminary finite difference modeling was undertaken to simulate the experimental observations, from which important parameters dictating electromigration in Al(Cu) line were extracted: an apparent effective valence of −5.6 and −1.9 for Cu and Al in Al(Cu), respectively, and a critical Cu concentration of 0.16 at. % above which Al grain boundary diffusion is effectively blocked.

Physics↗

Research study on materials processing in space, M566 experiment

Specimens of the aluminum-33 wt% copper eutectic partially melted and resolidified in the low effective gravity of the orbiting Skylab were examined and characterized with respect to microstructural defects and thermal conductivity values. The results obtained were compared with similar evaluations of ground-based simulation melt-resolidification experiments and as-prepared unidirectionally solidified specimens. Thermal conductivity data and electrical resistivity data at temperatures from 25 C to 400 C did not show significant differences between ground and space processed specimens. A methology of evaluating the defects in the Al-Al2Cu structure was implemented. A specimen from Skylab 3 showed signs of instability in growth and several grains were found in the ingot. The specimen from Skylab 4 did not show such marked instability in growth and was found to contain fewer defects than the ground-processed specimens. This agrees with data from Georgia Institute of Technology which showed that there were fewer defects in both their Skylab 3 and 4 specimens than in ground processed specimens.

Douglas, F. C.↗

The electrical properties of low-g processed immiscible alloys

When dispersed or mixed immiscibles are solidified on earth, a large amount of separation of the constituents takes place due to differences in densities. However, when the immiscibles are dispersed and solidified in zero-gravity, density separation does not occur, and unique composite solids can be formed with many new and promising electrical properties. By measuring the electrical resistivity and superconducting critical temperature of zero-g processed Ga-Bi samples, it has been found that the electrical properties of such materials are entirely different from the basic constituents and the ground control samples. The finest dispersions are obtained only in a low-gravity environment. Our results indicate that space-processed immiscible materials may form an entirely new class of electronic materials. The interesting electrical properties of directionally solidified Al-Cu eutectic, a two-component alloy consisting of Al and Al2Cu which was processed on Skylab (M566) are briefly reviewed. The electrical resistivity of directionally solidified eutectics with a lamellar structure are highly anisotropic and have been studied both experimentally and theoretically. The local resistivity of the space-processed samples are compared to a ground control sample and to the expected theoretical results.

Otto, G. H.↗

Development of powder metallurgy 2XXX series Al alloys for high temperature aircraft structural applications

The objective of the present investigation was to improve the strength and fracture toughness combination of P/M 2124 Al alloys in accordance with NASA program goals for damage tolerance and fatigue resistance. Two (2) P/M compositions based on Al-3.70 Cu-1.85 Mg-0.20 Mn with 0.12 and 0.60 wt. pct. Zr were selected for investigation. The rapid solidification rates produced by atomization were observed to prohibit the precipitation of coarse, primary Al3Zr in both alloys. A major portion of the Zr precipitated as finely distributed, coherent Al3Zr phases during vacuum preheating and solution heat treatment. The proper balance between Cu and Mg contents eliminated undissolved, soluble constituents such as Al2CuMg and Al2Cu during atomization. The resultant extruded microstructures produced a unique combination of strength and fracture toughness. An increase in the volume fraction of coherent Al3Zr, unlike incoherent Al20Cu2Mn3 dispersoids, strengthened the P/M Al base alloy either directly by dislocation-precipitate interactions, indirectly by a retardation of recrystallization, or a combination of both mechanisms. Furthermore, coherent Al3Zr does not appear to degrade toughness to the extent that incoherent Al20Cu2Mn3 does. Consequently, the addition of 0.60 wt. pct. Zr to the base alloy, incorporated with a 774K (935 F) solution heat treatment temperature, produces an alloy which exceeds all tensile property and fracture toughness goals for damage tolerant and fatigue resistant applications in the naturally aged condition.

Chellman, D. J.↗

Evaluation of the microstructure of Al-Cu-Li-Ag-Mg Weldalite (tm) alloys, part 4

Weldalite (trademark) 049 is an Al-Cu-Li-Ag-Mg alloy designed to have ultrahigh strength and to serve in aerospace applications. The alloy displays significantly higher strength than competitive alloys in both naturally aged and artificially aged tempers. The strengthening phases in such tempers have been identified to, in part, explain the mechanical properties attained. In general, the alloy is strengthened by delta prime Al3Li and Guinier-Preston (GP) zones in the naturally aged tempers. In artificially aged tempers in slightly underaged conditions, strengthening is provided by several phases including GP zones, theta prime Al2Cu, S prime Al2CuMg, T(sub 1) Al2CuLi, and possibly a new phase. In the peak strength artificially aged tempers, T(sub 1) is the predominant strengthening phase.

Pickens, Joseph R.↗

Structure and properties during aging of an Al-Cu-Li-Ag-Mg alloy, Weldalite (tm) 049

An Al-Cu-Li-Ag-Mg alloy, Weldalite (trademark) 049, was recently introduced as an ultra-high strength alloy (7000 MPa yield strength in artificially aged tempers) with good weldability. In addition, the alloy exhibits an extraordinary natural aging response (440 MPa yield strength (YS) in the unstretch condition) and a high ductility reversion condition which may be useful as a cold-forming temper. In contrast to other Al-Li alloys, these properties can essentially be obtained with or without a stretch or other coldworking operation prior to aging. Preliminary studies have revealed that the T4 temper (no stretch, natural age) is strengthened by a combination of GP zones and delta prime (Al3Li). The T6 temper (no stretch, aged at 180 C to peak strength) was reported to be strengthened primarily by T(sub 1) phase (Al2CuLi) with a minor presence of a theta prime like (Al2Cu) phase. On the other hand, a similar but lower solute containing alloy was reported to contain omega, (stoichiometry unknown), theta prime, and S prime in the peak strength condition. The purpose of this study is to further elucidate the strengthening phases in Weldalite (trademark) 049 in the unstretched tempers, and to follow the development of the microstructure from the T4 temper through reversion (180 C for 5 to 45 minutes) to the T6 temper.

Gayle, Frank W.↗

The influence of Ag+Mg additions on the nucleation of strengthening precipitates in a non-cold-worked Al-Cu-Li alloy

Aluminum-copper-lithium alloys generally require cold work to attain their highest strengths in artificially aged tempers. These alloys are usually strengthened by a combination of the metastable delta prime (Al3Li) and theta prime (Al2Cu) phases and the equilibrium T sub 1 (Al2CuLi) phase, and where the T sub 1 phase is a more potent strengthener than the delta prime. Various investigators have shown that the high strengths obtained after artificial aging associated with cold work result from the heterogeneous precipitation of T sub 1 on matrix dislocations. The objective here is to elucidate the mechanism by which the Ag+Mg additions stimulate the precipitation of T sub 1 type precipitates without cold work. To accomplish this, the microstructure of an Al-6.3Cu-1.3Li-0.14Zr model alloy was evaluated in a T6 type temper with and without the Ag+Mg addition.

Source record↗

Characterization of Al-Cu-Mg-Ag Alloy RX226-T8 Plate

Aluminum-copper-magnesium-silver (Al-Cu-Mg-Ag) alloys that were developed for thermal stability also offer attractive ambient temperature strength-toughness combinations, and therefore, can be considered for a broad range of airframe structural applications. The current study evaluated Al-Cu-Mg-Ag alloy RX226-T8 in plate gages and compared performance with sheet gage alloys of similar composition. Uniaxial tensile properties, plane strain initiation fracture toughness, and plane stress tearing resistance of RX226-T8 were examined at ambient temperature as a function of orientation and thickness location in the plate. Properties were measured near the surface and at the mid-plane of the plate. Tensile strengths were essentially isotropic, with variations in yield and ultimate tensile strengths of less than 2% as a function of orientation and through-thickness location. However, ductility varied by more than 15% with orientation. Fracture toughness was generally higher at the mid-plane and greater for the L-T orientation, although the differences were small near the surface of the plate. Metallurgical analysis indicated that the microstructure was primarily recrystallized with weak texture and was uniform through the plate with the exception of a fine-grained layer near the surface of the plate. Scanning electron microscope analysis revealed Al-Cu-Mg second phase particles which varied in composition and were primarily located on grain boundaries parallel to the rolling direction. Fractography of toughness specimens for both plate locations and orientations revealed that fracture occurred predominantly by transgranular microvoid coalescence. Introduction High-strength, low-density Al-Cu-Mg-Ag alloys were initially developed to replace conventional 2000 (Al-Cu-Mg) and 7000 (Al-Zn-Cu-Mg) series aluminum alloys for aircraft structural applications [1]. During the High Speed Civil Transport (HSCT) program, improvements in thermal stability were demonstrated for candidate aircraft wing and fuselage skin materials through the addition of silver to Al-Cu-Mg alloys based on Al 2519 chemistry [2]. Thermal stability of the resulting Al-Cu-Mg-Ag alloys, C415-T8 and C416-T8, was due to co-precipitation of the thermally stable . (AlCu) and ' (Al2Cu) strengthening phases [1-4]. The strength and toughness behavior was investigated for these alloys produced as 0.090-inch thick rolled sheet in the T8 condition and after various thermal exposures. The mechanical properties were shown to be competitive with conventional aircraft alloys, 2519-T8 and 2618-T8 [2]. During the Integral Airframe Structure (IAS) program, advanced aluminum alloys were examined for use in an integrally stiffened airframe structure where the skin and stiffeners would be machined from plate and extruded frames would be mechanically attached (see Figure 1) [5]. Advantages of integrally stiffened structure include reduced part count, and reduced assembly times compared to conventional built-up airframe structure. The near-surface properties of a thick plate are of significance for a machined integrally stiffened airframe structure since this represents the skin location. Properties measured at the mid-plane of the plate are more representative of the stiffener web. RX226 was developed to exploit strength-toughness improvements and thermal stability benefits of Al-Cu-Mg-Ag alloys in plate gages. This study evaluated the microstructure and properties of three gages of plate produced in the T8 condition.

Lach, Cynthia L.↗

Friction-Stir Welding - Heavy Inclusions in Bi-metallic welds of Al 2219/2195

Heavy Inclusions (HI) were detected for the first time by radiographic examination in aluminum alloy 2219forging/2195plate (advancing/retreating side) Friction Sir Welds (FSW) for the Space Shuttle External Tank (ET) Program. Radiographic HI indications appear as either small (approx.0.005"-0.025") individual particles or clusters of small particles. Initial work was performed to verify that the HI was not foreign material or caused by FSW pin tool debris. That and subsequent elemental analysis determined that the HI were large agglomerations of Al2Cu (theta phase), which is the strengthening precipitate in Al2219. A literature search on that subject determined that the agglomeration of phase has also been found in Al2219 bead on plate FSW [Ref. 1]. Since this was detected in ET space flight hardware, an investigative study of the effect of agglomerated theta phase particles in FSW Al2219f/2195p was performed. Numerous panels of various lengths were welded per ET weld procedures and radiographically inspected to determine if any HI was detected. Areas that had HI were sampled for room temperature and cyclic cryogenic (-423F) tensile testing and determined no significant adverse affect on mechanical properties when compared to test specimens without HI and historical data. Fracture surface examination using the Scanning Electron Microscope (SEM) revealed smaller phase agglomerations undetectable by radiographic inspection dispersed throughout the Al2219f/2195p FSW. This indicates that phase agglomeration is inherent to the Al2219f/2195p FSW process and only rarely creates agglomerations large enough to be detected by radiography. HI has not been observed in FSW of plate to plate material for either Al2219 or AL2195.

Rietz, Ward W., Jr.↗

The many faces of θ' -Al 2 Cu precipitates: Energetics of pristine and solute segregated Al/ θ' semi-coherent interfaces

θ'-Al 2 Cu precipitates in Al-Cu alloys have various distorted octagon shapes, which can be explained by the competition between {100} and {110} type semi-coherent interfaces with the Al matrix. While most prior studies on the semi-coherent Al/θ' interfaces have focused on the {100} orientation, little is known about the {110} interface. We have investigated the energetics of pristine and solute-segregated {110} semi-coherent Al/θ' interfaces with advanced characterization and first-principles studies. We report interfacial, strain, and solute segregation energetics of the {110} Al/θ' semi-coherent interface for 39 elements and compared them with previously reported values of the {100} interface. We discuss the atomic features and atomic local structures to identify similarities and differences between the two types of Al/θ' semi-coherent interfaces. Here, the isotropy in pristine Al/θ' semi-coherent interfacial energy and the anisotropy resulting from solute segregation provide insight into the formation of different types of θ' precipitate “faces” reported in the literature.

36 MATERIALS SCIENCE↗

Deformation behavior of nanoscale Al–Al 2 Cu eutectics studied by in situ micropillar compression

We report deformation behavior of nanoscale laser processed Al–Al 2 Cu eutectics at room temperature is characterized through in situ micro-pillar compression testing in a scanning transmission microscope. Interlamellar spacing of Al–Al 2 Cu eutectics varies from hundreds of nanometers to 20 nm. Three different sizes of micro-pillars are fabricated in order to study the deformation behaviors of single colony and multiple colonies, corresponding to the single crystal and polycrystal respectively. For single colonies, lamellar orientations parallel, normal or inclined to the loading direction were tested. The main findings are: 1) the plasticity mechanisms strongly depend on loading orientation: buckling and kinking in the parallel-loaded eutectics, planar sliding along Al–Al 2 Cu lamellar interfaces in the incline-loaded eutectics and localized shearing in the normal-loaded eutectics. 2) the incline-loaded eutectics exhibits the lowest compression flow strength, and the normal-loaded eutectics has the highest compression flow strength. 3) with decreasing inter-lamellar spacing, the strength increases and plasticity is uniformly distributed, as opposed to shear localization. Highest compressive plasticity is observed in polycrystalline eutectics with an ensemble of lamellar orientations with ~20 nm average spacing: 17.9% at flow stress of 1.63 GPa, and degenerate, bimodal morphology: 11.1% at flow stress of 1.36 GPa.

36 MATERIALS SCIENCE↗