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At least 37 records · Page 2

Elevated temperature crack growth in aluminum alloys: Tensile deformation of 2618 and FVS0812 aluminum alloys

Understanding the damage tolerance of aluminum alloys at elevated temperatures is essential for safe applications of advanced materials. The objective of this project is to investigate the time dependent subcritical cracking behavior of powder metallurgy FVS0812 and ingot metallurgy 2618 aluminum alloys at elevated temperatures. The fracture mechanics approach was applied. Sidegrooved compact tension specimens were tested at 175, 250, and 316 C under constant load. Subcritical crack growth occurred in each alloy at applied stress intensity levels (K) of between about 14 and 25 MPa/m, well below K (sub IC). Measured load, crack opening displacement and displacement rate, and crack length and growth rate (da/dt) were analyzed with several continuum fracture parameters including, the C-integral, C (sub t), and K. Elevated temperature growth rate data suggest that K is a controlling parameter during time dependent cracking. For FVS0812, da/dt is highest at 175 C when rates are expressed as a function of K. While crack growth rate is not controlled by C (sub t) at 175 C, da/dt appears to better correlate with C (sub t) at higher temperatures. Creep brittle cracking at intermediate temperatures, and perhaps related to strain aging, is augmented by time dependent transient creep plasticity at higher temperatures. The C (sub t) analysis is, however, complicated by the necessity to measure small differences in the elastic crack growth and creep contributions to the crack opening displacement rate. A microstructural study indicates that 2618 and FVS0812 are likely to be creep brittle materials, consistent with the results obtained from the fracture mechanics study. Time dependent crack growth of 2618 at 175 C is characterized by mixed transgranular and intergranular fracture. Delamination along the ribbon powder particle boundaries occurs in FVS0812 at all temperatures. The fracture mode of FVS0812 changes with temperature. At 175 C, it is characterized as dimpled rupture, and at 316 C as mixed matrix superplastic rupture and matrix-dipersoid debonding.

Leng, Yang↗

Effects of Forged Stock and Pure Aluminum Coating on Cryogenic Performance of Heat Treated Aluminum Mirrors

We present the results of an on-going test program designed to empirically determine the effects of different stress relief procedures for aluminum mirrors. Earlier test results identified a preferred heat treatment for flat and spherical mirrors diamond turned from blanks cut out of Al 6061-T651 plate stock. Further tests have been performed on mirrors from forged stock and one set from plate stock coated with Alumiplate(trademark) aluminum coating to measure the effect of these variables on cryogenic performance. The mirrors are tested for figure error and radius of curvature at room temperature and at 80 K for three thermal cycles. We correlate the results of our optical testing with heat treatment and metallographic data.

Toland, Ronald W.↗

Reaction diffusion in the nickel-chromium-aluminum and cobalt-chromium-aluminum systems

The effects of MCrAl coating-substrate interdiffusion on oxidation life and the general mutliphase, multicomponent diffusion problem were examined. Semi-infinite diffusion couples that had sources representing coatings and sinks representing gas turbine alloys were annealed at 1,000, 1,095, 1,150, or 1,205 C for as long as 500 hours. The source and sink aluminum and chromium contents and the base metal (cobalt or nickel) determined the parabolic diffusion rate constants of the couples and predicted finite coating lives. The beta source strength concept provided a method (1) for correlating beta recession rate constants with composition; (2) for determining reliable average total, diffusion, and constitutional activation energies; and (3) for calculating interdiffusion coefficients.

Levine, S. R.↗

Design, fabrication, and evaluation of charge-coupled devices with aluminum-anodized-aluminum gates

A 4-phase, 49 1/2 bit CCD shift register was designed and fabricated using two levels of aluminum metallization with anodic Al2O3 insulation separating the layers. Test circuitry was also designed and constructed. A numerical analysis of an MOS-RC transmission line was made and results are given to characterize performance for various conductivities. The electrical design of the CCD included a low-noise dual-gate input and a balanced floating diffusion output circuit. Metallization was accomplished both by low voltage DC sputtering and thermal evaporation. The audization was according to published procedures using a buffered tartaric acid bath. Approximately 20 wafers were processed with 50 complete chips per wafer. All devices failed by shorting between the metal levels at some point. Experimental procedures eliminated temperature effects from sintering and drying, anodic oxide thickness, edge effects, photoresist stripping procedures, and metallization techniques as the primary causes of failure. It was believed from a study of SEM images that protuberances (hillocks) grow up from the first level metal through the oxide either causing a direct short or producing a weak, highly stressed insulation point which fails at low voltage. The cause of these hillocks is unknown; however, they have been observed to grow during temperature excursions to 470 C.

Gassaway, J. D.↗

Photodeposition of aluminum oxide and aluminum thin films

Uniform films of Al2O3 have been photodeposited using an excimer laser operating at 248 nm (KrF) or at 193 nm (ArF) and trimethylaluminum and N2O as the reactants. Deposition rates were typically 2000 A/min and the physical, chemical, and electrical properties of the photodeposited Al2O3 films are comparable to films deposited using conventional techniques. Properties of photodeposited aluminum films are also presented.

Solanki, R.↗

Pentaerythritol structure-directing agents bias aluminum siting in MFI zeolites to increase para -xylene selectivity during toluene methylation

MFI zeolites contain ten-membered ring channels (∼0.55 nm diameter) that intersect to form larger voids (∼0.70 nm diameter). The distribution of framework Al sites dictates the void environments that confine active H + sites. MFI synthesized with pentaerythritol (PET) and Na + as structure-directing agents are interrogated using kinetically controlled toluene methylation rates and xylene isomer selectivities. High para-xylene selectivity and low toluene methylation rates indicate that MFI-PET samples contain H + sites predominantly in smaller channels. As-synthesized samples contain more framework Al than Na + , indicating that some charge compensation is provided by protonated PET-solvent complexes that bias Al siting towards these smaller channels.

36 MATERIALS SCIENCE↗