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A damage locating system also provides thermal protection. An array of sensors substantially tiles an area of interest. Each sensor is a reflective-surface conductor having operatively coupled inductance and capacitance. A magnetic field response recorder is provided to interrogate each sensor before and after a damage condition. Changes in response are indicative of damage and a corresponding location thereof.
Thermal management of power system components is one of the barriers identified towards the implementation of Electrified Aircraft Propulsion architectures. This paper documents the preliminary results of a trade space exploration of thermal management systems conducted for a new National Aeronautics and Space Administration regional transport aircraft concept called the SUbsonic Single Aft eNgine (SUSAN) Electrofan. Traditional methods of thermal management are evaluated alongside newer methods, which are still in development. Mass, power, and drag for traditional liquid / air heat exchangers were calculated, along with mass and area of oscillating heat pipes for outer mold line cooling. An initial assessment of the feasibility of using the fuel as part of the thermal management system was also conducted by evaluating the temperature over the full flight profile. Preliminary results and future work are discussed.
A thermal management system includes a first substrate having a first conductive inner surface. A second substrate has a second conductive inner surface. A connecting structure is attached to the first and second substrates to space apart the first and second inner surfaces defining an insulating space for a single architecture. One or more passively-acting elements are attached to the inner surface of at least one substrate and including a shape memory material such as a shape memory alloy (SMA). The SMA passively reacts to the temperature of the first substrate by thermally contacting or separating from the second inner surface of the second substrate for the control of the conduction of heat energy in either direction.
Space shuttle thermal protection systems technology program summary
Test facilities for space shuttle thermal protection system
Thermal protection system based on radiation cooling for high altitude cruising hypersonic flight, achieving zero net mass transfer
Space shuttle structural design and thermal protection systems
Light weight, low cost, ablative thermal protection system for space shuttles
The metallic thermal protection system technology program for the space shuttle is reviewed for the areas of environmental uncertainties, materials data base, TPS design concepts and heat-shield panel configurations, testing and evaluation of materials, panels, and complete systems.
The thermal protection system (TPS) of the space shuttle orbiter vehicle, consisting of ceramic tile/adhesive/strain isolator pad/adhesive/aluminum substructure, was modeled photoelasticity. A highly sensitive photoelastic material was used in the models to show the nature of the stress-transfer between the strain isolation pad (SIP) and the ceramic tile through the RTV-adhesive layer. Isochromatic fringe patterns were obtained for models subjected to tension and combined tension and bending. Tests indicated that the load-transfer between the SIP and the photoelastic material occurred at discrete locations causing stress concentrations in the photoelastic material. Stress concentration factors of the order of 1.9 were measured, but as the observed photoelastic response was an integrated effect through the model thickness, the local stress concentration factors at the SIP/tile interface could be even higher.
The reliability analysis of a thermal protection system (TPS) incorporating low density, fibrous ceramic materials must take into account the time-dependency and variability of the system's strength. Fracture mechanics concepts can be used to estimate the allowable strength and expected lifetime, as well as to define a proof test scheme for assuring mission success of TPS. The aim of this study was to evaluate the proof testing scheme used on the TPS of the Space Shuttle with these fracture mechanics concepts. The analysis confirmed that proof testing was necessary for the undensified system and that proof testing should lead to adequate reliability with respect to the design stresses. For the undensified system, fracture mechanics predictions were confirmed by measuring the strength of samples that survived proof testing. It was also found that the time-dependent nature of the system's strength was controlled mainly by the ceramic and that this time-strength dependency is similar to that observed for bulk glasses that have compositions similar to the glass fibers present in the ceramic tiles.
Durable shell-tile thermal-protection system consists of interlocking upper and lower hard caps, incorporating appropriate stiffeners and enclosing lightweight fibrous insulation. New shell tile more durable than reusable surface insulation (RSI) currently used on Space Shuttle orbiter.
The Space Station Active Thermal Control System (ATCS) has been modeled using modified SINDA/SINFLO programs to solve two-phase Thermo-fluid problems. The modifications include changes in several subroutines to incorporate implicit solution which allows larger time step as compared to that for explicit solutions. Larger time step saves computer time but involves larger computational error. Several runs were made using various time steps for the ATCS model. It has been found that for a reasonable approach, three times larger time step as compared to that used in explicit method is a good value which will reduce the computer time by approximately 50 percent and still maintain the accuracy of the output data to within 90 percent of the explicit values.
The Thermal Protection System (TPS), introduced by NASA, continues to incorporate many of the advances in materials over the past two decades. A comprehensive, single-volume summary of the TPS, including system design rationales, key design features, and broad descriptions of the subsystems of TPS (E.g., reusable surface insulation, leading edge structural, and penetration subsystems) is provided. Details of all elements of TPS development and application are covered (materials properties, manufacturing, modeling, testing, installation, and inspection). Disclosures and inventions are listed and potential commercial application of TPS-related technology is discussed.
A flexible thin metal film thermal sensing system is provided. A self-metallized polymeric film has a polymeric film region and a metal surface disposed thereon. A layer of electrically-conductive metal is deposited directly onto the self-metallized polymeric film's metal surface. Coupled to at least one of the metal surface and the layer of electrically-conductive metal is a device/system for measuring an electrical characteristic associated therewith as an indication of temperature.
A finite element ablation and thermal response program is presented for simulation of three-dimensional transient thermostructural analysis. The three-dimensional governing differential equations and finite element formulation are summarized. A novel probabilistic design methodology for thermal protection systems is presented. The design methodology is an eight step process beginning with a parameter sensitivity study and is followed by a deterministic analysis whereby an optimum design can determined. The design process concludes with a Monte Carlo simulation where the probabilities of exceeding design specifications are estimated. The design methodology is demonstrated by applying the methodology to the carbon phenolic compression pads of the Crew Exploration Vehicle. The maximum allowed values of bondline temperature and tensile stress are used as the design specifications in this study.
A combination structural support and thermal protection system is provided. A cured preceramic polymer matrix reinforced with carbon fibers can be used alone or in a multiple component system.
On December 5, 2014 NASA conducted the first flight test of its next generation human-class Orion spacecraft. The flight was called the Exploration Flight Test -1 (EFT-1) which lasted for 4 hours and culminated into a re-entry trajectory at 9 km/s. This flight test of the 5-meter Orion Crew Module demonstrated various sub-systems including the Avcoat ablative thermal protection system (TPS) on the heat shield. The Avcoat TPS had been developed from the Apollo-era recipe with a few key modifications. The engineering for thermal sizing was supported by modeling, analysis, and ground tests in arc jet facilities. This paper will describe a postlfight analysis plan and present results from post-recovery inspections, data analysis from embedded sensors, TPS sample extraction and characterization in the laboratory. After the recovery of the vehicle, a full photographic survey and surface scans of the TPS were performed. The recovered vehicle showed physical evidence of flow disturbances, varying degrees of surface roughness, and excessive recession downstream of compression pads. The TPS recession was measured at more than 200 locations of interest on the Avcoat surface. The heat shield was then processed for sample extraction prior to TPS removal using the 7-Axis Milling machine at Marshall Space Flight Center. Around 182 rectangular TPS samples were extracted for subsequent analysis and investigation. The final paper will also present results of sample analysis. The planned investigation includes sidewall imaging, followed by image analysis to characterize TPS response by quantifying different layers in the char and pyrolysis zones. A full postmortem of the instrumentation and sensor ports will also be performed to confirm no adverse effects due to the sensors themselves. A subset of the samples will undergo structural testing and perform detailed characterization of any cracks and integrity of gore seams. Finally, the material will be characterized with layer-by-layer density measurements and SEM investigations to evaluate material morphology at microstructural level including identification of elements and compounds.