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At least 343 records · Page 19

Theoretical Investigation of Delafossite-Cu 2 ZnSnO 4 as a Promising Photovoltaic Absorber

In the quest for efficient and cost-effective photovoltaic absorber materials beyond silicon, considerable attention has been directed toward exploring alternatives. One such material, zincblende-derived Cu2ZnSnS4 (CZTS), has shown promise due to its ideal band gap size and high absorption coefficient. However, challenges such as structural defects and secondary phase formation have hindered its development. In this study, we examine the potential of another compound, Cu2ZnSnO4 (CZTO), with a similar composition to CZTS as a promising alternative. Employing ab initio density function theory (DFT) calculations in combination with an evolutionary structure prediction algorithm, we identify that the crystalline phase of delafossite structure is the most stable among the 900 (meta)stable CZTO. Its thermodynamic stability at room temperature is also confirmed by the molecular dynamics study. Excitingly, this new phase of CZTO displays a direct band gap where the dipole-allowed transition occurs, making it a strong candidate for efficient light absorptions. Furthermore, the estimation of spectroscopic limited maximum efficiency (SLME) directly demonstrates the high potential of delafossite-CZTO as a photovoltaic absorber. Our numerical results suggest that delafossite-CZTO holds promise for future photovoltaic applications.

14 SOLAR ENERGY↗

Ceramic Powders

In developing its product line of specialty ceramic powders and related products for government and industrial customers, including companies in the oil, automotive, electronics and nuclear industries, Advanced Refractory Technologies sought technical assistance from NERAC, Inc. in specific areas of ceramic materials and silicon technology, and for assistance in identifying possible applications of these materials in government programs and in the automotive and electronics industry. NERAC conducted a computerized search of several data bases and provided extensive information in the subject areas requested. NERAC's assistance resulted in transfer of technologies that helped ART staff develop a unique method for manufacture of ceramic materials to precise customer specifications.

Source record↗

Improving the toughness of refractory compounds

Composition and processing studies were conducted on silicon nitride and silicon carbide materials. Charpy mode impact testing to 2415 F established the effectiveness of higher purity silicon nitride powder sources in reducing the scatter of measurements and in improving short time bend strengths as well as bend stress rupture properties. Stabilized zirconia additions in particular were observed to dramatically enhance low and high temperature bend strengths and stress rupture properties for all grades of silicon nitride powder. Silicon carbide samples showed relatively poor impact resistance, although the maxima in stress rupture behavior was exhibited by this material.

Vasilos, T.↗

Lead sulfide - Silicon MOSFET infrared focal plane development

A process for directly integrating photoconductive lead sulfide (PbS) infrared detector material with silicon MOS integrated circuits has been developed primarily for application in long (greater than 10,000 detector elements) linear arrays for pushbroom scanning applications. The processing technology is based on the conventional PMOS and CMOS technologies with a variation in the metallization. Results and measurements on a fully integrated eight-element multiplexer are shown.

Barrett, J. R.↗

Minority carrier diffusion length measurements - A review and comparison of techniques

A review of the major techniques for measuring minority carrier diffusion lengths in solar cells is given. Limits of applicability are indicated for each method, as relevant to indirect bandgap materials such as silicon, and direct bandgap materials like gallium arsenide. A discussion and bibliography is presented for the following techniques: uniform generation, electron beam induced current, Schottky barrier (and other steady-state) photocurrent, surface photovoltage, transient decay, and luminescence.

Khan, A. A.↗

Genesis Field Recovery

The Genesis mission returned to Earth on September 8, 2004 after a nearly flawless three-year mission to collect solar matter. The intent was to deploy a drogue chute and parafoil high over the Utah desert and to catch the fragile payload capsule in mid-air by helicopter. The capsule would then be opened in a clean-room constructed for that purpose at UTTR, and a nitrogen purge was to be installed before transporting the science canister to JSC. Unfortunately, both chutes failed to deploy, causing the capsule to fall to the desert floor at a speed of nearly 200 MPH. Still, Genesis represents a milestone in the US space program, comprising the first sample return since the Apollo Missions as well as the first return of materials exposed to the space environment outside of low Earth orbit and beyond the Earth s magnetosphere for an extended period. We have no other comparable materials in all of our collections on Earth. The goal of the Genesis Mission was to collect a representative sample of the composition of the solar wind and thus, the solar nebula from which our solar system originated. This was done by allowing the naturally accelerated species to implant shallowly in the surfaces of ultra-pure, ultra-clean collector materials. These collectors included single crystal silicon (FZ and CZ), sapphire, silicon carbide; those materials coated with aluminum, silicon, diamond like carbon, and gold; and isotopically enriched polycrystalline diamond and amorphous carbon. The majority of these materials were distributed on five collector arrays. Three of the materials were housed in an electrostatic concentrator designed to increase the flux of low-mass ions. There was also a two-inch diameter bulk metallic glass collector and a gold foil, polished aluminum, and molybdenum coated platinum foil collector. An excellent review of the Genesis collector materials is offered in reference [1].

McNamara, K. M.↗

Implementation Challenges for Sintered Silicon Carbide Fiber Bonded Ceramic Materials for High Temperature Applications

During the last decades, a number of fiber reinforced ceramic composites have been developed and tested for various aerospace and ground based applications. However, a number of challenges still remain slowing the wide scale implementation of these materials. In addition to continuous fiber reinforced composites, other innovative materials have been developed including the fibrous monoliths and sintered fiber bonded ceramics. The sintered silicon carbide fiber bonded ceramics have been fabricated by the hot pressing and sintering of silicon carbide fibers. However, in this system reliable property database as well as various issues related to thermomechanical performance, integration, and fabrication of large and complex shape components has yet to be addressed. In this presentation, thermomechanical properties of sintered silicon carbide fiber bonded ceramics (as fabricated and joined) will be presented. In addition, critical need for manufacturing and integration technologies in successful implementation of these materials will be discussed.

Singh, M.↗

Post-processing of phase change material in a zero-change commercial silicon photonic process

Integration of phase change material (PCM) with photonic integrated circuits can transform large-scale photonic systems by providing non-volatile control over phase and amplitude. The next generation of commercial silicon photonic processes can benefit from the addition of PCM to enable ultra-low power, highly reconfigurable, and compact photonic integrated circuits for large-scale applications. Despite all the advantages of PCM-based photonics, today’s commercial foundries do not provide them in their silicon photonic processes yet. We demonstrate the first-ever electrically programmable PCM device that is monolithically post-processed in a commercial foundry silicon photonics process using a few fabrication steps and coarse-resolution photolithography. These devices achieved 1.4 dB/μm of amplitude switching contrast using a thin layer of 12.5 nm GeSbTe in this work. We have also characterized the reconfiguration speed as well as repeatability of these devices over 20,000 switching cycles. Our solution enables non-volatile photonic VLSI systems that can be fabricated at low cost and high reliability in a commercial foundry process, paving the way for the development of non-volatile programmable photonic integrated circuits for a variety of emerging applications.

Optics↗

Elastic Distribution of Microshutters, Measurements Obtainable on James Web Space Telescope

Spectrographic astronomy measurements in the near-infrared region will be done by functional two-dimensional microshutter arrays that are being fabricated at the NASA Goddard Space Flight Center for the James Webb Space Telescope (JWST). These micro-shutter arrays will represent the first mission-critical MEMS devices to be flown in space. JWST will use microshutter arrays to select focal plane object. 2-D programmable aperture masks of more than 200,000 elements select such space object. The use of silicon wafer material promises high efficiency and high contrast. Microshutter operation temperature is around 35K. Microshutter arrays are fabricated as close-packed silicon nitride membranes with a unit cell size of 105 x 204 micrometers. A layer of magnetic material is deposited onto each shutter. Individual shutters are equipped with a torsion flexure. Reactive ion etching (RIE) releases the shutters so they can open up to 90 degrees using the torsion flexure. Shutter rotation is initiated into a silicon support structure via an external magnetic field. Two electrically independent aluminum electrodes are deposited, one onto each shutter and another onto the support structure side-wall, permitting electrostatic latching and 2-D addressing to hold specific shutters open via external electronics.

Kletetschka, Gunther↗

Joining of Silicon Carbide Through the Diffusion Bonding Approach

In order for ceramics to be fully utilized as components for high-temperature and structural applications, joining and integration methods are needed. Such methods will allow for the fabrication the complex shapes and also allow for insertion of the ceramic component into a system that may have different adjacent materials. Monolithic silicon carbide (SiC) is a ceramic material of focus due to its high temperature strength and stability. Titanium foils were used as an interlayer to form diffusion bonds between chemical vapor deposited (CVD) SiC ceramics with the aid of hot pressing. The influence of such variables as interlayer thickness and processing time were investigated to see which conditions contributed to bonds that were well adhered and crack free. Optical microscopy, scanning electron microscopy, and electron microprobe analysis were used to characterize the bonds and to identify the reaction formed phases.

Halbig, Michael .↗

Stress Analysis and Design of Silicon Solar Cell Arrays and Related Material Properties

A systematic approach is presented for the design of solar cell arrays to eliminate mechanical failures that might arise in components of the arrays in a thermal environment. A prerequisite to the approach is the characterization of material properties at different temperatures. Significant data is obtained for the thermal behavior of the silicon solar cell material and adhesives. Upon determining the mechanical and thermal material properties of the components of the solar cell array, utilizing a finite element idealization for predicting the stress fields in the components, and employing the von Mises failure criterion, potential failure areas in various design configurations in a given thermal environment are identified. Guide lines and means to optimize a given design are illustrated by two examples.

Salama, A. M.↗

Defects and device performance

The necessity for a low-cost crystalline silicon sheet material for photovoltaics has generated a number of alternative crystal growth techniques that would replace Czochralski (Cz) and float-zone (FZ) technologies. Efficiencies of devices fabricated from low resistivity FZ silicon are approaching 20%, and it is highly likely that this value will be superseded in the near future. However, FZ silicon is expensive, and is unlikely ever to be used for photovoltaics. Cz silicon has many of the desirable qualities of FZ except that minority-carrier lifetimes at lower resistivities are significantly less than those of FZ silicon. Even with Cz silicon, it is unlikely that cost goals can be met because of the poor-material yield that results from sawing and other aspects of the crystal rowth. Although other silicon sheet technologies have been investigated, almost all have characteristics that limit efficiency to approx. 16%. In summary, 20% efficient solar cells can likely be fabricated from both FZ and Cz silicon, but costs are likely to be ultimately unacceptable. Alternate silicon technologies are not likely to achieve this goal, but cost per watt figures may be eventually better than either of the single crystal technologies and may rival any thin-film technology.

Storti, G.↗

Ending the Chase for a Perfect Binder: Role of Surface Chemistry Variation and its Influence on Silicon Anodes

In this work we examine the influence of the type of silicon source material (two milled and two plasma enhanced chemical vapor deposition) on the electrochemical performance of silicon-based anodes for Li-ion batteries. The four representative Si sources were previously identified in literature but have never been compared side by side, which is critical to understanding the wide variation in performance reported for silicon-based electrodes. These particles display unique surface features associated with surface oxides and residual precursor species (Si-N, Si-C, Si-H) which impact processability by changing interactions within the electrode slurry and the resulting electrochemical performance. These properties should be taken into consideration when utilizing “off-the-shelf” Si powders for investigations and would be good variables to explore to understand why certain chemistries display suitable performance, while others “don't work.”

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Method for Waterproofing Ceramic Materials

Hygroscopic ceramic materials which are difficult to waterproof with a silane, substituted silane or silazane waterproofing agent, such as an alumina containing fibrous, flexible and porous, fibrous ceramic insulation used on a reentry space vehicle, are rendered easy to waterproof if the interior porous surface of the ceramic is first coated with a thin coating of silica. The silica coating is achieved by coating the interior surface of the ceramic with a silica precursor converting the precursor to silica either in-situ or by oxidative pyrolysis and then applying the waterproofing agent to the silica coated ceramic. The silica precursor comprises almost any suitable silicon containing material such as a silane, silicone, siloxane, silazane and the like applied by solution, vapor deposition and the like. If the waterproofing is removed by e.g., burning, the silica remains and the ceramic is easily rewaterproofed. An alumina containing TABI insulation which absorbs more that five times its weight of water, absorbs less than 10 wt. % water after being waterproofed according to the method of the invention.

Cagliostro, Domenick E.↗

Evaluations of candidate encapsulation designs and materials for low-cost silicon photovoltaic arrays

Three encapsulation designs for silicon photovoltaic arrays based on cells with silk-screened Ag metallization have been evaluated: transparent polymeric coatings over cells laminated between two films or sheets of polymeric materials; cells adhesively bonded to a glass cover with a polymer pottant and a glass or other substrate component. Silicone and acrylic coatings were assessed, together with acrylic sheet, 0.635 mm fiberglass-reinforced polyester sheet, 0.102 mm polycarbonate/acrylic dual-layer film, 0.127 mm fluorocarbon film, soda-lime glass, borosilicate glass, low-iron glass, and several adhesives. The encapsulation materials were characterized by light transmittance measurements, determination of moisture barrier properties and bond strengths, and by the performance of cells before and after encapsulation. Silicon and acrylic coatings provided inadequate protection. Acrylic and fluorocarbon films displayed good weatherability and acceptable optical transmittance. Borosilicate, low-iron and soda-lime-float glasses were found to be acceptable candidate encapsulants for most environments.

Gaines, G. B.↗

Simulated Reentry Heating by Torching

The two first order reentry heating parameters are peak heating flux (W/cm2) and peak heat load (kJ/cm2). Peak heating flux (and deceleration, gs) is higher for a ballistic reentry and peak heat load is higher for a lifting reentry. Manned vehicle reentries are generally lifting reentries at nominal 1-5 gs so that personnel will not be crushed by high deceleration force. A few off-nominal manned reentries have experienced 8 or more gs with corresponding high heating flux (but below nominal heat load). The Shuttle Orbiter reentries provide about an order of magnitude difference in peak heating flux at mid-bottom (TPS tiles, approximately 6 W/cm2 or 5 BTU/ft2- sec) and leading edge (RCC, approximately 60 W/cm2 or 50 BTU/ft2- sec). Orion lunar return and Mars sample lander are of the same order of magnitude as orbiter leading edge peak heat loads. Flight temperature measurements are available for some orbiter TPS tile and RCC locations. Return-to-Flight on-orbit tile-repair-candidate-material-heating performance was evaluated by matching propane torch heating of candidate-materials temperatures at several depths to orbiter TPS tile flight-temperatures. Char and ash characteristics, heat expansion, and temperature histories at several depths of the cure-in-place ablator were some of the TPS repair material performance characteristics measured. The final char surface was above the initial surface for the primary candidate (silicone based) material, in contrast to a receded surface for the Apollo-type ablative heat shield material. Candidate TPS materials for Orion CEV (LEO and lunar return), and for Mars sample lander are now being evaluated. Torching of a candidate ablator material, PICA, was performed to match the ablation experienced by the STARDUST PICA heat shield. Torching showed that the carbon fiberform skeleton in a sample of PICA was inhomogeneous in that sample, and allowed measurements (of the clumps and voids) of the inhomogeneity. Additional reentry heating-performance characterizations of high temperature insulation materials were performed.

Harvey, Gale A.↗

Simulated Reentry Heating by Torching

The two first order reentry heating parameters are peak heating flux (W/square cm) and peak heat load (kJ/square cm). Peak heating flux (and deceleration, gs) is higher for a ballistic reentry and peak heat load is higher for a lifting reentry. Manned vehicle reentries are generally lifting reentries at nominal 1-5 gs so that personnel will not be crushed by high deceleration force. A few off-nominal manned reentries have experienced 8 or more gs with corresponding high heating flux (but below nominal heat load). The Shuttle Orbiter reentries provide about an order of magnitude difference in peak heating flux at mid-bottom (TPS tiles, approximately 6 W/square cm or 5 BTU/square ft - sec) and leading edge (RCC, approximately 60 W/square cm or 50 BTU/square ft- sec). Orion lunar return and Mars sample lander are of the same order of magnitude as orbiter leading edge peak heat loads. Flight temperature measurements are available for some orbiter TPS tile and RCC locations. Return-to-Flight on-orbit tile-repair-candidate-material-heating performance was evaluated by matching propane torch heating of candidate-materials temperatures at several depths to orbiter TPS tile flight-temperatures. Char and ash characteristics, heat expansion, and temperature histories at several depths of the cure-in-place ablator were some of the TPS repair material performance characteristics measured. The final char surface was above the initial surface for the primary candidate (silicone based) material, in contrast to a receded surface for the Apollo-type ablative heat shield material. Candidate TPS materials for Orion CEV (LEO and lunar return), and for Mars sample lander (MSL) are now being evaluated. Torching of a candidate ablator material, PICA, was performed to match the ablation experienced by the STARDUST PICA heat shield. Torching showed that the carbon fiberform skeleton in a sample of PICA was inhomogeneous in that sample, and allowed measurements (of the clumps and voids) of the inhomogeneity. Additional reentry heating-performance characterizations of high temperature insulation materials were performed.

Harvey, Gale A.↗

Fast, High-Precision Readout Circuit for Detector Arrays

The GEO-CAPE mission described in NASA's Earth Science and Applications Decadal Survey requires high spatial, temporal, and spectral resolution measurements to monitor and characterize the rapidly changing chemistry of the troposphere over North and South Americas. High-frame-rate focal plane arrays (FPAs) with many pixels are needed to enable such measurements. A high-throughput digital detector readout integrated circuit (ROIC) that meets the GEO-CAPE FPA needs has been developed, fabricated, and tested. The ROIC is based on an innovative charge integrating, fast, high-precision analog-to-digital circuit that is built into each pixel. The 128×128-pixel ROIC digitizes all 16,384 pixels simultaneously at frame rates up to 16 kHz to provide a completely digital output on a single integrated circuit at an unprecedented rate of 262 million pixels per second. The approach eliminates the need for off focal plane electronics, greatly reducing volume, mass, and power compared to conventional FPA implementations. A focal plane based on this ROIC will require less than 2 W of power on a 1×1-cm integrated circuit. The ROIC is fabricated of silicon using CMOS technology. It is designed to be indium bump bonded to a variety of detector materials including silicon PIN diodes, indium antimonide (InSb), indium gallium arsenide (In- GaAs), and mercury cadmium telluride (HgCdTe) detector arrays to provide coverage over a broad spectral range in the infrared, visible, and ultraviolet spectral ranges.

Rider, David M.↗