Voltage controlled monolithic oscillator Final report, Jun. 1967 - Mar. 1969
Solid state voltage controlled oscillator using two silicon integrated circuit chips and thin film resistor chip
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Solid state voltage controlled oscillator using two silicon integrated circuit chips and thin film resistor chip
RF sputtering system and techniques for sputtering high ohms/square resistive films to form thin film resistors used in Apollo communication systems
Reliability studies of thick film products including resistors, capacitors, and conductors
Adjustable resistor taps in gain-control feedback loop of the transducer permit wide sensing range, shorting the pins on electrical connector allows selection of appropriate range. Electrical specifications of the transducer and its applications are cited.
Quality assurance provisions cover personnel training, radiographic equipment, radiographic test procedures, and inspection and examination of radiographs. Supplementary information includes accept and reject criteria for radiographic inspection of resistors, capacitors, transistors, hybrid microcircuits, diodes, small coils and transformers.
Circuit which includes a thermistor-resistor combination to compensate for temperature fluctuations by supplying input voltage to light-emitting diode, maintains constant light output. Similar circuits can be used for temperature-induced variations in photodiode applications.
Temperature controller is described which reduces difference between temperature oscillations about control point. Standard temperature-sensitive resistor element is utilized which is highly stable and reproducible. Temperature sensing circuitry is conventional dc bridge with power supplied by battery or highly regulated supply source.
The development of a rocket borne instrument to measure electric fields in thunderstorms is described. Corona currents from a sharp needle atop a small rocket are used to sense the electric field. A high ohm resistor in series with the corona needle linearizes the relationship between corona current and electric field. The corona current feeds a relaxation oscillator, whose pulses trigger a transmitter which operates in the 395 to 410 MHz meteorological band. The instrument senses fields between 5 kV/m and 100 kV/m.
The properties and behavior of ceramic materials used in components for electronic circuitry are examined to appraise the present and future directions for microelectronics, and to suggest further product development, and how innovations may be useful in other technologies. Ceramic and glass insulators, resistors, capacitors, and the use of ceramics and glasses in microcircuitry are discussed along with technology transfer to nonaerospace uses.
Cold performance tests and startup tests were conducted on the Brayton-cycle inverter, motor-driven pump, dc supply, speed control with parasitic load resistor and the Brayton control system. These tests were performed with the components in a vacuum and mounted on coldplates. A temperature range of ?25 to -50 C was used for the tests. No failures occurred, and component performance gave no indication that there would be any problem with the safe operation of the Brayton power generating system.
The application of analog signal to discrete interval converter (ASDTIC), a hybrid micromodule, two loop control subsystem, to a switching, stepdown dc to dc converter is described. The power circuitry, interface and ASDTIC subsystems used in this switching regulator were developed to exhibit the improved regulation, transient performance, regulator stability and freedom from the effects of variations in parts characteristics due to environmental changes and aging. ASDTIC can be used with other types of power circuits that use duty-cycle control techniques by simple changes in the interface subsystem. The circuitry and performance characteristics of a +10V dc switching converter as well as that of the ASDTIC micromodule are described. Realization of the ASDTIC hybrid micromodule has been accomplished with a hermetically sealed, beam-lead, bonded/deposited nichrome thin film resistors, discrete capacitors and integrated circuits on dilithic, glazed alumina substrates using 22 feed through terminals in an integrated package.
A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.
Improved temperature compensation of the output from a GaAs LED can be obtained by connecting the diode in series with the emitter of an n-p-n transistor whose base circuit incorporates a high-gain operational amplifier and a parallel thermistor-resistor network. The temperature dependence of several photodiodes is also reported along with a practical temperature compensation scheme. Finally, the temperature compensation of a photon coupled pair consisting of a GaAs LED and a silicon photodiode is described. The combination provides a stability, linearity, and repeatability of about 1% over the upper 60% of the LED forward current range in the temperature interval from 15 to 45 C.
Technique can provide four-phase clock signal from single-phase clock and requires only one power supply voltage. This arrangement saves considerable power compared to circuits having load resistor between power supply and ground.
Frequency shifting, commonly used in electronic signal processing, is applied in tuning, automatic frequency control, antenna element switching, phase shifting, etc. Frequency shifting can be accomplished economically and reliably with simple circuit comprising conventional resistor and solid-state switching device which can be equivalent to two capacitors, depending on switching state.
Circuit computes and indicates efficiency of RF amplifier as inputs and other parameters are varied. Voltage drop across internal resistance of ammeter is amplified by operational amplifier and applied to one multiplier input. Other input is obtained through two resistors from positive terminal of power supply.
The relations between signal shaping, noise, and timing resolution in nuclear particle detection systems are examined in this paper. Mathematical analysis of five commonly used types of filters leads to numerical results for system noise components arising from sources in the preamplifier, detector, and bias resistors. These results are presented in the form of design curves for the various filters, showing the dependence of each output noise component on both the magnitude of the noise sources and the filter time constants. Three of the filters considered are simple RC types; the remaining two are combinations of delay lines and RC elements. The quantitative calculations specifically assume a silicon detector and a field-effect-transistor preamplifier. Those filters that exhibit bipolar step response are analyzed in terms of crossover timing resolution, based on the earlier noise calculations. Again, the results are summarized in sets of design curves for each filter. Finally, the comparative performance of the various filter types is discussed, and specific examples are given.
Data accumulated during 4 years of research and evaluation of ceramic chip capacitors, ceramic carrier mounted active devices, beam-lead transistors, and chip resistors are presented. Life and temperature coefficient test data, and optical and scanning electron microscope photographs of device failures are presented and the failure modes are described. Particular interest is given to discrete component qualification, power burn-in, and procedures for testing and screening discrete components. Burn-in requirements and test data will be given in support of 100 percent burn-in policy on all NASA flight programs.