Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “dislocation densities”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 343 records · Page 19

Thermal viscoplastic buckling during the growth of silicon ribbon

This paper is an analysis of the conditions to be satisfied in order to avoid buckling during the growth of a silicon ribbon that is being slowly pulled from the melt. A viscoplastic constitutive equation with a dislocation density effect is used to model the material behavior. The critical thicknesses and the corresponding deflection shapes are calculated by the finite element method for the cantilever boundary conditions. The value of the parameter which controls the speed of the lateral deflection is computed by using Galerkin's method. It is demonstrated that, due to the effect of viscoplasticity, some deflection shapes increase in magnitude with time and other shapes damp out.

Tsai, C. T.↗

Dislocation dynamics and the viscoplastic buckling of dendritic web type silicon ribbon

The effect of dendrites (reinforced edges) on the residual stresses, dislocation densities and buckling behavior during growth of web type silicon ribbon is studied. A viscoplastic material response function (Haasen-Sumino model) is used to calculate the stresses and the disloction density at each point in the silicon ribbon. In addition, the role of dendrites on the viscoplastic buckling behavior of the ribbon is investigated. The critical thicknesses, the corresponding deflection shapes and lateral deflection speeds are calculated. These results are then compared with similar data obtained for flat plates.

Tsai, C. T.↗

Characteristics of GaAs with inverted thermal conversion

GaAs crystals exhibiting inverted thermal conversion (ITC) of resistivity were investigated in conjunction with standard semiinsulating (SI) GaAs regarding characteristics important in device processing. It was established that dislocation density and Si implant activation are unaffected by transformation to the ITC state. However, in ITC GaAs the controlled increase of the EL2 (native midgap donor) concentration during annealing makes it possible to attain resistivities one order of magnitude greater (e.g., about 10 to the 9th ohm cm of 300 K) than those attained in standard SI GaAs (e.g., 10 to the 7th-10 to the 8th ohm cm).

Kang, C. H.↗

Growth and characterization of GaAs layers on Si substrates by migration-enhanced molecular beam epitaxy

Migration-enhanced molecular beam epitaxial (MEMBE) growth and characterization of the GaAs layer on Si substrates (GaAs/Si) are reported. The MEMBE growth method is described, and material properties are compared with those of normal two-step MBE-grown or in situ annealed layers. Micrographs of cross-section view transmission electron microscopy and scanning surface electron microscopy of MEMBE-grown GaAs/Si showed dislocation densities of 10 to the 7th/sq cm. AlGaAs/GaAs double heterostructures have been successfully grown on MEMBE GaAs/Si by both metalorganic chemical vapor deposition and liquid phase epitaxy.

Kim, Jae-Hoon↗

Ultrasonic attenuation measurements determine onset, degree, and completion of recrystallization

Ultrasonic attenuation was measured for cold worked Nickel 200 samples annealed at increasing temperatures. Localized dislocation density variations, crystalline order and volume percent of recrystallized phase were determined over the anneal temperature range using transmission electron microscopy, X-ray diffraction, and metallurgy. The exponent of the frequency dependence of the attenuation was found to be a key variable relating ultrasonic attenuation to the thermal kinetics of the recrystallization process. Identification of this key variable allows for the ultrasonic determination of onset, degree, and completion of recrystallization.

Generazio, E. R.↗

TEM studies of oxidized NiAl and Ni3Al cross sections

Cross sections of oxide scale/(Ni-Al) intermetallics were prepared by a new method and studied using primarily TEM. The cross sections were prepared by encasing an oxidized metal specimen sandwich in a low-melting-temperature zinc alloy. Observations of oxidized zirconium-doped beta-NiAl cross sections revealed crystallographic voids beneath an adherent Al2O3 scale. The oxide-metal interface was incoherent, but a high dislocation density in the metal near the interface suggested that a large tensile stress was induced by the attached oxide scale. A duplex Al2O3-NiAl2O4 scale formed on zirconium-doped and zirconium/boron-doped gamma-prime-Ni3Al alloys. Additional results are presented involving oxidation mechanisms and oxide-metal interface structures.

Doychak, J.↗

The equivalence between dislocation pile-ups and cracks

Cracks and dislocation pile-ups are equivalent to each other. In this paper, the physical equivalence between cracks and pile-ups is delineated, and the relationshps between crack-extension force, force on the leading dislocation, stress-intensity factor, and dislocation density are reviewed and summarized. These relations make it possible to extend quantitatively the recent advances in the concepts and practices of fracture mechanics to the studies of microfractures and microplastic deformations.

Liu, H. W.↗

Slow plastic deformation of extruded NiAl-10TiB2 particulate composites at 1200 and 1300 K

A dispersion of 1-micron TiB2 particles in the B2 crystal structure NiAl intermetallic can effectively increase its elevated temperature strength, in association with increasing deformation resistance with TiB2 volume fraction. Attention is presently given to alternative densification methods, which may increase the initial as-fabricated dislocation density and lead to enhanced elevated-temperature strength. The 'XD' extrusion method was used to produce NiAl with 10 vol pct TiB2. Although apparent extrusion defects were occasionally found, neither grain-boundary cracking nor particle-matrix separation occurred.

Whittenberger, J. D.↗

Heteroepitaxial InP solar cells on Si and GaAs substrates

The characteristics of InP cells processed from thin layers of InP heteroepitaxially grown on GaAs, on silicon with an intervening GaAs layer, and on GaAs with intervening Ga(x)In(1-x)As layers are described, and the factors affecting cell efficiency are discussed. Under 10 MeV proton irradiations, the radiation resistances of the heteroepitaxial cells were superior to that of homoepitaxial InP cells. The superior radiation resistance is attributed to the high dislocation densities present in the heteroepitaxial cells.

Weinberg, Irving↗

Crystal-melt interface shape of Czochralski-grown large diameter germanium crystals

Crystal-melt interface shapes of 100 to 200 mm diameter 111-line Ge grown by the Czochralski technique have been examined using the method of fast withdrawal from the melt. Initially, the interface shape is convex, then transforms gradually into a sigmoidal shape, becomes nearly planar at about one third of the final crystal length, and finally assumes a concave profile with progressively increasing curvature. The nearly planar interface has a double-facet structure, with an annular facet at the edge of the crystal in addition to the central (111) facet. Formation of the annular facet is accompanied by a giant oscillation of the pull rate when the maximum average pull rate is exceeded. Such oscillation is detrimental to crystal quality, since it introduces a region of high dislocation density. An average pull rate maximum of 2 cm/h has been found to allow for a smooth growth of 200 mm diameter crystals. The origin of the pull rate perturbation is discussed in terms of an instantaneous change in the equilibrium shape of the meniscus.

Roth, M.↗

Effects of radiation of InP cells epitaxially grown on Si and GaAs substrates

The properties of heteroepitaxial InP cells were determined both before and after 10-MeV proton irradiations. Numerical values, obtained for the diffusion and recombination components of the reverse saturation currents, were found to be consistent with the distribution of dislocations. The radiation resistance of the heteroepitaxial cells was significantly greater than that observed for n/p homoepitaxial InP cells. The carrier removal rate, obtained by C-V measurements, was 1800/cm for 10-MeV protons compared with 2.2/cm for 1-MeV electrons. The high carrier removal rate was found to have no significant effect on the cell's series resistance. It was concluded that the heteroepitaxial cell performance is dominated by the high dislocation density attributable to lattice constant mismatch. Although the efficiencies of the present cells are low, the recent achievement of 13.7 percent AM0 efficiencies using a GaAs substrate demonstrates the marked improvement that can be attained using more appropriate transition layers.

Weinberg, I.↗

Wide gap, permanent magnet biased magnetic bearing system

The unique features and applications of the presented electrical permanent magnetic bearing system essentially result from three facts: (1) the only bearing rotor components are nonlaminated ferromagnetic steel collars or cylinders; (2) all radial and axial forces are transmitted via radial gaps; and (3) large radial bearing gaps can be provided with minimum electric power consumption. The large gaps allow for effective encapsulation and shielding of the rotors at elevated or low temperatures, corrosive or ultra clean atmosphere or vacuum or high pressure environment. Two significant applications are described: (1) a magnetically suspended x ray rotary anode was operated under high vacuum conditions at 100 KV anode potential, 600 C temperature at the rotor collars and speed 18000 rpm with 13 mm radial bearing gap; and (2) an improved Czochralski type crystal growth apparatus using the hot wall method for pulling GaAs single crystals of low dislocation density. Both crystal and crucible are carried and transported by magnetically suspended shafts inside a hermetically sealed housing at 800 C shaft and wall temperature. The radial magnetic bearing gap measures 24 mm.

Boden, Karl↗

Hardening mechanisms in a dynamic strain aging alloy, Hastelloy X, during isothermal and thermomechanical cyclic deformation

The relative contributions of the hardening mechanisms in Hastelloy X during cyclic deformation were investigated by conducting isothermal cyclic deformation tests within a total strain range of +/-0.3 pct and at several temperatures and strain rates, and thermomechanical tests within several different temperature limits. The results of the TEM examinations and special constant structure tests showed that the precipitation on dislocations of Cr23C6 contributed to hardening, but only after sufficient time above 500 C. Solute drag alone produced very considerable cyclic hardening. Heat dislocation densities, peaking around 10 exp 11 per sq cm, were found to develop at temperatures producing the greatest cyclic hardening.

Miner, R. V.↗

Ground based experiments on the growth and characterization of L-Arginine Phosphate (LAP) crystals

L-Arginine Phosphate (LAP) is a new nonlinear optical material with higher efficiency for harmonic generation compared to KDP. Crystals of LAP were grown in the laboratory from supersaturated solutions by temperature lowering technique. Investigations revealed the presence of large dislocation densities inside the crystals which are observed to produce refractive index changes causing damage at high laser powers. This is a result of the convection during crystal growth from supersaturated solutions. It is proposed to grow these crystals in a diffusion controlled growth condition under microgravity environment and compare the crystals grown in space with those grown on ground. Physical properties of the solutions needed for modelling of crystal growth are also presented.

Rao, S. M.↗

High purity isotopically enriched Ge-70 and Ge-74 single crystals - Isotope separation, growth, and properties

Ge-70 and Ge-74 isotopes were successfully separated from natural Ge, and were zone purified. Several highly enriched, high purity Ge-70 and Ge-74 single crystals were grown by the vertical Bridgman method. The growth system was designed for reliable growth of low dislocation density, high purity Ge single crystals of about 4 g weight. A Ge-70 and a Ge-74 crystal were selected for complete characterization. In spite of the large surface-to-volume ratio of these ingots, both Ge-70 and Ge-74 crystals contain low electrically active chemical net-impurity concentrations of about 2 x 10 exp 12/cu cm, which is 2 orders of magnitude better than that of Ge-74 crystals previously grown by two different groups. Isotopic enrichment of the Ge-70 and the Ge-74 crystals is 96.3 percent and 96.8 percent, respectively. The residual donors and acceptors present in both crystals were identified as phosphorus and copper, respectively. In addition, less than 10 exp 11/cu cm Ga, Al, and In were found in the Ge-70 crystal.

Itoh, Kohei↗

Radiation effects in heteroepitaxial InP solar cells

Heteroepitaxial InP solar cells, with GaAs substrates, were irradiated by 0.5 and 3 MeV protons and their performance, temperature dependency, and carrier removal rates determined as a function of fluence. The radiation resistance of the present cells was significantly greater than that of non-heteroepitaxial InP cells at both proton energies. A clear difference in the temperature dependency of V(sub oc), was observed between heteroepitaxial and homoepitaxial InP cells. The analytically predicted dependence of dV(sub oc)/dT on Voc was confirmed by the fluence dependence of these quantities. Carrier removal was observed to increase with decreasing proton energy. The results obtained for performance and temperature dependency were attributed to the high dislocation densities present in the heteroepitaxial cells while the energy dependence of carrier removal was attributed to the energy dependence of proton range.

Weinberg, I.↗

Heteroepitaxial InP, and ultrathin, directly glassed, GaAs 3-5 solar cells

The commercial application of Indium Phosphide solar cells in practical space missions is crucially dependent upon achieving a major cost reduction which could be offered by heteroepitaxy on cheaper, more rugged substrates. Furthermore, significant mass reduction, compatibility with mechanically stacked multijunction cells, and elimination of the current loss through glue discoloration, is possible in III-V solar cells by the development of ultrathin, directly glassed cells. The progress of a UK collaborative program to develop high efficiency, homojunction InP solar cells, grown by MOCVD on Si substrates, is described. Results of homoepitaxial cells (is greater than 17 percent 1 Sun AM0) are presented, together with progress in achieving low dislocation density heteroepitaxy. Also, progress in a UK program to develop ultrathin directly-glassed GaAs cells is described. Ultrathin (5 micron) GaAs cells, with 1 Sun AM0 efficiencies up to 19.1 percent, are presented, together with progress in achieving a direct (adhesive-less) bond between the cell and coverglass. Consequential development to, for example, cell grids, are also discussed.

Hardingham, C. M.↗

Organometallic chemical vapor deposition and characterization of ZnGeP2/GaP multiple heterostructures on GaP substrates

The growth of ZnGeP2/GaP double and multiple heterostructures on GaP substrates by organometallic chemical vapor deposition is reported. These epitaxial films were deposited at a temperature of 580 C using dimethylzinc, trimethylgallium, germane, and phosphine as source gases. With appropriate deposition conditions, mirror smooth epitaxial GaP/ZnGeP2 multiple heterostructures were obtained on (001) GaP substrates. Transmission electron microscopy (TEM) and secondary ion mass spectroscopy (SIMS) studies of the films showed that the interfaces are sharp and smooth. Etching study of the films showed dislocation density on the order of 5x10(exp 4)cm(sup -2). The growth rates of the GaP layers depend linearly on the flow rates of trimethylgallium. While the GaP layers crystallize in zinc-blende structure, the ZnGeP2 layers crystallize in the chalcopyrite structure as determined by (010) electron diffraction pattern. This is the first time that multiple heterostructures combining these two crystal structures were made.

Xing, G. C.↗