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All sourcesNASA NTRSDOE OSTI
NASA NTRS2019

The International Space Station (ISS) Port 1 (P1) External Active Thermal Control System (EATCS) Ammonia Leak

From 2011 to 2017, the crew onboard the International Space Station (ISS) was at risk of dire consequences due to an external ammonia leak. Ammonia is used in the External Active Thermal Control System (EATCS) to cool the pressurized modules and external electrical systems. Engineers at NASA's Johnson Space Center (JSC) initially detected the leak in one of two cooling loops by monitoring the system ammonia inventory decay over time. White flakes seen on High Definition (HD) cameras were also thought to be associated with the leakage but not confirmed. Initially, the leak was small enough that the ammonia inventory and system operations were not in jeopardy. However, the leak began to accelerate to the point where troubleshooting and corrective action were vital to the sustainability of the ISS. Therefore, it became imperative that the leak be located and repaired for ISS operations to continue. No tools were readily available on the ISS to locate such a leak when it was initially detected, however NASA engineers were already in the process of developing a new device for this purpose called the Robotic External Leak Locator (RELL). The RELL is a robotic instrument package with a mass spectrometer and an ion pressure gauge. Initial checkout operations with RELL happened to coincide with the increasing leak, and ammonia vapors were measured around the P1 EATCS Radiator #3 flexible jumper hoses. The leak stopped after the radiator and its flexible hoses were remotely isolated from the loop and the ammonia from the isolated segment was vented to space. Astronauts conducted a spacewalk that successfully removed the hoses, which were returned to ground for further investigation. The purpose of this paper is to review the leak detection and isolation efforts, investigation results, lessons learned and the recovery plan.

Cowan, Darnell T.↗
NASA NTRSDate not supplied

Experimental Verification of the Parabolic Deformable Mirror for the ExoSpec Project

For the Habitable Worlds Observatory, it is essential to broaden the controllable wavelength bandwidth for high-contrast imaging and spectroscopy to increase the exoEarth yield and characterization. The Parabolic Deformable Mirrors (PDM) under the NASA Headquarters directed ExoSpec Work package is specifically tailored to do so. We have successfully procured a generation 1 (Gen 1) PDM device and completed in-depth characterization of the device. This robust evaluation has become instrumental in informing subsequent stages of development, particularly in shaping the design and specifying requirements for the next generation, Gen2, PDM device. We have built a testbed in an environmentally controlled cleanroom to experimentally demonstrate the use of a parabolic DM in a coronagraph instrument as well an integral field spectrograph (IFS). This versatile testbed is designed to test different DM architectures, various low-order wavefront schemes, and a lenslet based IFS. This provides us with a basis for comparison with different DM configurations – 1) flat DM, 2) parabolic DMs, and 3) a flat DM and parabolic DMs. In this communication, we will discuss the testbed design and updates, parabolic DM characterization, Gen 2 requirement definitions, and different tests planned for the testbed.

Hari Subedi↗
NASA NTRS1995

Solar Concentrator Conceptual Design for the /SUS Advanced Technology Demonstration

An Integrated Solar Upper stage would permit such realignment to smaller vehicles but would also change the current expendable stage paradigm to a reusable one. ISUS would remain with the satellite following orbit insertion and function as its electrical power and propulsion subsystems. Since a satellite's power subsystem represents as much as 30% of its total mass, using the upper stage to replace an onboard photovoltaic/battery system will purchase additional mass for sensors and communication packages. The timely demonstration of an ISUS system, before the turn of the century, will permit such devices to be fielded in the early 2000's and in time to fly aboard major satellite block changes.

Charles H. Castle↗
NASA NTRS2016

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

dielectric performance↗
NASA NTRS1974

Skylab electronic technological advancements

The present work describes three electronic devices designed for use in the Skylab airlock module: the teleprinter system, the quartz crystal microbalance contamination monitor (QCM), and the speaker. Design considerations, operation, characteristics, and system development are described for these systems, with accompanying diagrams, graphs, and photographs. The teleprinter is a thermal dot printer used to produce hard copy messages by electrically heating print elements in contact with heat-sensitive paper. The QCM was designed to estimate contamination buildup on optical surfaces of the earth resources experiment package. A vibrating quartz crystal is used as a microbalance relating deposited mass to shifts in the crystal's resonant frequency. Audio devices provide communication between crew members and between crew and STDN, and also provide audible alarms, via the caution and warning system, of out-of-limit-conditions.

Hornback, G. L.↗
NASA NTRS2013

Hollow-Fiber Spacesuit Water Membrane Evaporator

The hollow-fiber spacesuit water membrane evaporator (HoFi SWME) is being developed to perform the thermal control function for advanced spacesuits and spacecraft to take advantage of recent advances in micropore membrane technology in providing a robust, heat-rejection device that is less sensitive to contamination than is the sublimator. After recent contamination tests, a commercial-off-the-shelf (COTS) micro porous hollow-fiber membrane was selected for prototype development as the most suitable candidate among commercial hollow-fiber evaporator alternatives. An innovative design that grouped the fiber layers into stacks, which were separated by small spaces and packaged into a cylindrical shape, was developed into a full-scale prototype for the spacesuit application. Vacuum chamber testing has been performed to characterize heat rejection as a function of inlet water temperature and water vapor back-pressure, and to show contamination resistance to the constituents expected to be found in potable water produced by the wastewater reclamation distillation processes. Other tests showed tolerance to freezing and suitability to reject heat in a Mars pressure environment. In summary, HoFi SWME is a lightweight, compact evaporator for heat rejection in the spacesuit that is robust, contamination- insensitive, freeze-tolerant, and able to reject the required heat of spacewalks in microgravity, lunar, and Martian environments. The HoFi is packaged to reject 810 W of heat through 800 hours of use in a vacuum environment, and 370 W in a Mars environment. The device also eliminates free gas and dissolved gas from the coolant loop.

Bue, Grant↗
NASA NTRS2003

Integrated Electrode Arrays for Neuro-Prosthetic Implants

Arrays of electrodes integrated with chip-scale packages and silicon-based integrated circuits have been proposed for use as medical electronic implants, including neuro-prosthetic devices that might be implanted in brains of patients who suffer from strokes, spinal-cord injuries, or amyotrophic lateral sclerosis. The electrodes of such a device would pick up signals from neurons in the cerebral cortex, and the integrated circuit would perform acquisition and preprocessing of signal data. The output of the integrated circuit could be used to generate, for example, commands for a robotic arm. Electrode arrays capable of acquiring electrical signals from neurons already exist, but heretofore, there has been no convenient means to integrate these arrays with integrated-circuit chips. Such integration is needed in order to eliminate the need for the extensive cabling now used to pass neural signals to data-acquisition and -processing equipment outside the body. The proposed integration would enable progress toward neuro-prostheses that would be less restrictive of patients mobility. An array of electrodes would comprise a set of thin wires of suitable length and composition protruding from and supported by a fine-pitch micro-ball grid array or chip-scale package (see figure). The associated integrated circuit would be mounted on the package face opposite the probe face, using the solder bumps (the balls of the ball grid array) to make the electrical connections between the probes and the input terminals of the integrated circuit. The key innovation is the insertion of probe wires of the appropriate length and material into the solder bumps through a reflow process, thereby fixing the probes in place and electrically connecting them with the integrated circuit. The probes could be tailored to any distribution of lengths and made of any suitable metal that could be drawn into fine wires. Furthermore, the wires could be coated with an insulating layer using anodization or other processes, to achieve the correct electrical impedance. The probe wires and the packaging materials must be biocompatible using such materials as lead-free solders. For protection, the chip and package can be coated with parylene.

Brandon, Erik↗
NASA NTRS1986

Predicting the Cosmic-Ray Environment Near Earth

Package of computer programs developed to predict cosmic-ray environment for spacecraft in orbit near Earth. Single cosmic-ray particle deposits enough electrical charge on sensitive area of individual circuit to change bit state. Single-event upsets may not cause permanent damage but upset functioning devices. Used to predict upset rate for space mission. Also calculates time-average cosmic-ray environment for multiple circular orbits, fragments of trajectories, and isolated points. Package written in HPL for interactive execution and implemented on HP 9825B desktop computer.

Edmonds, L.↗
NASA NTRS2009

Alternative Packaging for Back-Illuminated Imagers

An alternative scheme has been conceived for packaging of silicon-based back-illuminated, back-side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in "Making a Back-Illuminated Imager With Back-Side Connections" (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38. To avoid misunderstanding, it should be noted that in the terminology of imaging integrated circuits, "front side" or "back side" does not necessarily refer to the side that, during operation, faces toward or away from a source of light or other object to be imaged. Instead, "front side" signifies that side of a semiconductor substrate upon which the pixel pattern and the associated semiconductor devices and metal conductor lines are initially formed during fabrication, and "back side" signifies the opposite side. If the imager is of the type called "back-illuminated," then the back side is the one that faces an object to be imaged. Initially, a back-illuminated, back-side-thinned image-detector is fabricated with its back side bonded to a silicon handle wafer. At a subsequent stage of fabrication, the front side is bonded to a glass wafer (for mechanical support) and the silicon handle wafer is etched away to expose the back side. The frontside integrated circuitry includes metal input/output contact pads, which are rendered inaccessible by the bonding of the front side to the glass wafer. Hence, one of the main problems is to make the input/output contact pads accessible from the back side, which is ultimately to be the side accessible to the external world. The present combination of an alternative packaging scheme and associated fabrication process constitute a solution of the problem.

Pain, Bedabrata↗
NASA NTRS1998

Analysis of a Memory Device Failure

The recent failure of a vintage memory device presented a unique challenge to failure analysts. Normally device layouts, fabrication parameters and other technical information were available to assist the analyst in the analysis. However, this device was out of production for many years and the manufacturer was no longer in business, so the information was not available. To further complicate this analysis, the package leads were all but removed making additional electrical testing difficult. Under these conditions, new and innovative methods were used to analyze the failure. The external visual exam, radiography, PIND, and leak testing were performed with nominal results. Since electrical testing was precluded by the short lead lengths, the device was delidded to expose the internal structures for microscopic examination. No failure mechanism was identified. The available electrical data suggested an ESD or low level EOS type mechanism which left no visible surface damage. Due to parallel electrical paths, electrical probing on the chip failed to locate the failure site. Two non-destructive Scanning Electron Microscopy techniques, CIVA (Charge Induced Voltage Alteration) and EBIC (Electron Beam Induced Current), and a liquid crystal decoration technique which detects localized heating were employed to aid in the analysis. CIVA and EBIC isolated two faults in the input circuitry, and the liquid crystal technique further localized two hot spots in regions on two input gates. Removal of the glassivation and metallization revealed multiple failure sites located in the gate oxide of two input transistors suggesting machine (testing) induced damage.

Nicolas, David P.↗
NASA NTRS1972

Miniature biotelemeter gives multichannel wideband biomedical data

A miniature biotelemeter was developed for sensing and transmitting multiple channels of biomedical data over a radio link. The design of this miniature, 10-channel, wideband (5 kHz/channel), pulse amplitude modulation/ frequency modulation biotelemeter takes advantage of modern device technology (e.g., integrated circuit operational amplifiers, complementary symmetry/metal oxide semiconductor logic, and solid state switches) and hybrid packaging techniques. The telemeter is being used to monitor 10 channels of neuron firings from specific regions of the brain in rats implanted with chronic electrodes. Design, fabrication, and testing of an engineering model biotelemeter are described.

Carraway, J. B.↗
NASA NTRS2000

Evaluation of Thermo-Mechanical Stability of COTS Dual-Axis MEMS Accelerometers for Space Applications

Microelectromechanical systems in MEMS is one of the fastest growing technologies in microelectronics, and is of great interest for military and aerospace applications. Accelerometers are the earliest and most developed representatives of MEMS. First demonstrated in 1979, micromachined accelerometers were used in automobile industry for air bag crash- sensing applications since 1990. In 1999, N4EMS accelerometers were used in NASA-JPL Mars Microprobe. The most developed accelerometers for airbag crash- sensing are rated for a full range of +/- 50 G. The range of sensitivity for accelerometers required for military or aerospace applications is much larger, varying from 20,000 G (to measure acceleration during gun and ballistic munition launches), and to 10(exp -6) G, when used as guidance sensors (to measure attitude and position of a spacecraft). The presence of moving parts on the surface of chip is specific to MEMS, and particularly, to accelerometers. This characteristic brings new reliability issues to micromachined accelerometers, including cyclic fatigue cracking of polysilicon cantilevers and springs, mechanical stresses that are caused by packaging and contamination in the internal cavity of the package. Studies of fatigue cracks initiation and growth in polysilicon showed that the fatigue damage may influence MEMS device performance, and the presence of water vapor significantly enhances crack initiation and growth. Environmentally induced failures, particularly, failures due to thermal cycling and mechanical shock are considered as one of major reliability concerns in MEMS. These environmental conditions are also critical for space applications of the parts. For example, the Mars pathfinder mission had experienced 80 mechanical shock events during the pyrotechnic separation processes.

Sharma, Ashok K.↗
NASA NTRS2014

Aeroflex Technology as Class-Y Demonstrator

Modern space field programmable gate array (FPGA) devices with increased functional density and operational frequency, such as Xilinx Virtex 4 (V4) and S (V5), are packaged in non-hermetic ceramic flip chip forms. These next generation space parts were not qualified to the MIL-PRF-38535 Qualified Manufacturer Listing (QML) class-V when they were released because class-V was only intended for hermetic parts. In order to bring Xilinx V5 type packages into the QML system, it was suggested that class-Y be set up as a new category. From 2010 through 2014, a JEDEC G12 task group developed screening and qualification requirements for Class-Y products. The Document Standardization Division of the Defense Logistics Agency (DLA) has completed an engineering practice study. In parallel with the class-Y efforts, the NASA Electronic Parts and Packaging (NEPP) program has funded JPL to study potential reliability issues of the class-Y products. The major hurdle of this task was the absence of adequate research samples. Figure 1-1 shows schematic diagrams of typical structures of class-Y type products. Typically, class-Y products are either in ceramic flip chip column grid array (CGA) or land grid array (LGA) form. In class-Y packages, underfill and heat spread adhesive materials are directly exposed to the spacecraft environment due to their non-hermeticity. One of the concerns originally raised was that the underfill material could degrade due to the spacecraft environment and negatively impact the reliability of the package. In order to study such issues, it was necessary to use ceramic daisy chain flip chip package samples so that continuity of flip chip solder bumps could be monitored during the reliability tests. However, none of the commercially available class-Y daisy chain parts had electrical connections through flip chip solder bumps; only solder columns were daisy chained, which made it impossible to test continuity of flip chip solder bumps without using extremely costly functional parts. Among space parts manufacturers who were interested in producing class-Y products, Aeroflex Microelectronic Solutions-HiRel had been developing assembly processes using their internal R&D classy type samples. In early 2012, JPL and Aeroflex initiated a collaboration to study reliability of the Aeroflex technology as a class-Y demonstrator.

Suh, Jong-ook↗
NASA NTRSDate not supplied

Experimental Verification of the Parabolic Deformable Mirror for the ExoSpec Project

For the Habitable Worlds Observatory (HWO), it is essential to broaden the controllable wavelength bandwidth for high-contrast imaging and spectroscopy to increase the exoEarth yield and characterization. The Parabolic Deformable Mirrors (PDM) subpackage, under the NASA Headquarters-directed Exoplanet Spectroscopy (ExoSpec) Work Package, is specifically tailored to do so. We have successfully procured a first-generation (Gen 1) PDM device and completed in-depth characterization of the device. This robust evaluation has become instrumental in informing subsequent stages of development, particularly in shaping the design and specifying requirements for the next generation, Gen 2, PDM device. We have built a testbed in an environmentally controlled cleanroom to experimentally demonstrate the use of a PDM in a coronagraph instrument with an integral field spectrograph (IFS). This versatile testbed is designed to test different DM architectures, low-order wavefront sensing schemes, and a lenslet-based IFS. This provides us with a basis for comparison with different DM configurations: 1) flat DM, 2) PDMs, and 3) a flat DM and PDMs. In this communication, we will discuss the testbed design and updates, PDM characterization, and Gen 2 requirement definitions.

Hari B. Subedi↗
NASA NTRS2016

Single-Event Latchup Testing of the Micrel MIC4424 Dual Power MOSFET Driver

We conducted 47 exposures of four different MIC4424 devices and did not observe any SEL or high-current events. This included worst-case conditions with a LET of 81 MeV-sq cm/mg, applied voltage of 18.5 V, a case temperature greater than 120 C, and a final fluence of 1x10(exp 7)/sq cm. We also monitored both the outputs for the presence of SETs. While the period of the 1 MHz square wave was slightly altered in some cases, no pulses were added or deleted. 1. Purpose: The purpose of this testing is to characterize the BiCMOS/DMOS Micrel MIC4424 dual, non-inverting MOSFET driver for single-event latchup (SEL) susceptibility. These data will be used for flight lot evaluation purposes. 2. Devices Tested: The MIC4423/4424/4425 family are highly reliable BiCMOS/DMOS buffer/driver MOSFET drivers. They are higher output current versions of the MIC4426/4427/4428. They can survive up to 5V of noise spiking, of either polarity, on the ground pin. They can accept, without either damage or logic upset, up to half an amp of reverse current (either polarity) forced back into their outputs. Primarily intended for driving power MOSFETs, the MIC4423/4424/4425 drivers are suitable for driving other loads (capacitive, resistive, or inductive) which require low-impedance, high peak currents, and fast switching times. Heavily loaded clock lines, coaxial cables, or piezoelectric transducers are some examples. The only known limitation on loading is that total power dissipated in the driver must be kept within the maximum power dissipation limits of the package. Five (5) parts were provided for SEL testing. We prepared four parts for irradiation and reserved one piece as an un-irradiated control. More information about the devices can be found in Table 1. The parts were prepared for testing by removing the lid from the CDIP package to expose the target die. The parts were then soldered to small copper circuit adapter boards for easy handling. These parts are fabricated in a bulk BiCMOS/DMOS technology. Since we do not know the number of overlayers used in the fabrication processes, linear energy transfer calculations are determined based on the top-surface incident ion species and kinetic energy.

Power MOSFET↗
NASA NTRS2009

On Nibbles and Bytes: The Conundrum of Memory for Space Systems - NASA Electronic Parts and Packaging (NEPP) and Efforts in Memories

Radiation requirements and trends. TID: 1) >90% of NASA applications are < 100 krads-Si in piecepart requirements. a) Many commercial devices (NVM and SDRAMs) meet or come close to this. b) Charge pump TID tolerance has improved an order magnitude over the last 10 years. 2) There are always a few programs with higher level needs and, of course, defense needs SEL: 1) Prefer none or rates that are considered low risk. a) Latent damage is a bear to deal with. 2) As we re packing cells tighter and even with lower Vdd, we re seeing SEL on commercial devices regularly (<90nm). a) Often in power conversion, I/O, or control areas. SEU: 1) It s not the bit errors, it s the SEFIs errors that are the biggest issues. a) Scrubbing concerns for risk, power, speed.

LaBel, Kenneth A.↗
NASA NTRS1976

A high speed imaging system for nuclear diagnostics

A high speed imaging system based on state-of-the-art photosensor arrays was designed for use in nuclear diagnostics. The system is comprised of a front end rapid scan solid state camera, a high speed digitizer, and a PCM line driver in a downhole package and a memory buffer system in an uphole trailer. The downhole camera takes a snapshot of a nuclear device created flux stream, digitizes the image and transmits it to the uphole memory system before being destroyed. The memory system performs two functions: it retains the data for local display and processing by a microprocessor, and it buffers the data for retransmission at slower rates to a computational facility. In the talk, the impetus for such a system as well as its operation was discussed, along with systems under development which incorporate higher data rates and more resolution.

Eyer, H. H.↗
NASA NTRS1987

Development of a P-I-N HgCdTe photomixer for laser heterodyne spectrometry

An improved HgCdTe photomixer technology was demonstrated employing a p-i-n photodiode structure. The i-region was near intrinsic n-type HgCdTe; the n-region was formed by B+ ion implantation; and the p-region was formed either by a shallow Au diffusion or by a Pt Schottky barrier. Experimental devices in a back-side illuminated mesa diode configuration were fabricated, tested, and delivered. The best photomixer was packaged in a 24-hour LN2 dewar along with a cooled GaAs FET preamplifier. Testing was performed by mixing black-body radiation with a CO2 laser beam and measuring the IF signal, noise, and signal-to-noise ratio in the GHz frequency range. Signal bandwidth for this photomixer was 1.3 GHz. The heterodyne NEP was 4.4 x 10 to the -20 W/Hz out to 1 GHz increasing to 8.6 x 10 to the -10 W/Hz at 2 GHz. Other photomixers delivered on this program had heterodyne NEPs at 1 GHz ranging from 8 x 10 to the -20 to 4.4 x 10 to the -19 W/Hz and NEP bandwidths from 2 to 4 GHz.

Bratt, Peter R.↗