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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 343 records · Page 19

High temperature superconductivity space experiment (HTSSE)

An experiment dealing with high-temperature superconducting devices and components in space is discussed. A variety of devices (primarily passive microwave and millimeter-wave components) has been procured and will be integrated with a cryogenic refrigerating and data acquisition system to form the space package, which will be launched in late 1992. This space experiment is expected to demonstrate that this technology is sufficiently robust to survive the space environment and that the technology has the potential to improve the operation of space systems significantly. The devices for the initial launch have been evaluated electrically, thermally, and mechanically, and will be integrated into the final space package early in 1991. The performance of the devices is summarized, and some potential applications of this technology in space systems are outlined.

Ritter, J. C.↗

Self-consistent integrated modeling of combined hybrid discharge-laser produced plasma devices for extreme ultraviolet metrology

Discharge- and laser-produced plasma (DLPP) devices are being used as light sources for extreme ultraviolet (EUV) generation. A key challenge for both, DPP and LPP, is achieving sufficient brightness to support the throughput requirements of nanometrology tools. To simulate the environment of a hybrid DLPP device and optimize the EUV output, we have developed an integrated HEIGHTS-DLPP computer simulation package. The package integrates simulation of two evolving plasmas (DPP and LPP) and includes modeling of a set of integrated self-consistent processes: external power source and plasma energy balance, plasma resistive magnetohydrodynamics, plasma heat conduction, detailed radiation transport (RT), and laser absorption and refraction. We simulated and optimized DLPP devices using Xe gas as a target material. We synchronized the external circuit parameters, chamber gas parameters, and laser beam temporal and spatial profiles to achieve maximum EUV output. The full 3D Monte Carlo scheme was integrated for detailed RT and EUV output calculations in Xe using more than 3600 spectral groups. The modeling results are in good agreement with Julich Forschungszentrum experimental data. Theoretical models, developed and integrated into the HEIGHTS package, showed wide capabilities and flexibility. In conclusion, the models and package can be used for optimization of the experimental parameters and settings, investigation of DLPP devices with complex design, analyzing the impact of integrated spatial effects and working timeline arrangement on the final EUV output, and EUV source size, shape, and angular distribution.

70 PLASMA PHYSICS AND FUSION TECHNOLOGY↗

Test equipment data package for the KC-135 fiber pulling apparatus

The Fiber Pulling Apparatus (FPA) is a device designed to produce continuous glass fibers from simulated lunar soil, and to determine the effects of reduced gravity, specifically 1/6 g on fiber formation and resultant properties. Briefly, pre-melt simulated lunar soil will be placed in a pint crucible and heated to 1200 C or higher, up to a maximum temperature of 1400 C. At a given temperature, a quartz fiber will be immersed into the melt and then pulled through a chill block and wound onto a cylindrical bobbin using a servo motor control. A high resolution video camera will record the fiber as it is being pulled. This assembly wil be enclosed in Plexiglas. Before fiber pulling commences, the apparatus will be backfilled with dry nitrogen. A separate data acquisition system will support this apparatus. This system will contain a personal computer, video recorder, and monitor. Temperature, acceleration, winding speed, and video images will be controlled and recorded using the data acquisition system. Thus, the FPA will consist of two hardware packages, the fiber production assembly and the data acquisition rack. The primary objective of this test is to determine the effects of 1/6 g on the formation of continuous glass fiber made from simulated lunar soil. Baseline studies using the FPA on the ground will provide a reference for the 1/6 g studies. Of particular interest will be the effect of 1/6 g on the free fluid zone where the fiber exits the crucible. In the fiber spinning parlance this zone is known as the upper jet region, where the boundary slope is greater than one tenth. The properties of the resulting glass fiber will depend on the jet shape as well as distributions of velocity, temperature and tension within the jet. It is unknown at this time how 1/6 g will effect these parameters.

Kosten, Sue↗

Comprehensive analysis of disruption mitigation methods using gas and pellet-like injections in ITER-like Tokamaks

Abstract Inert-gas shielding could be an effective mechanism for protection of plasma facing surfaces (PFS) against plasma particles impact and photon radiation heat loads during transient events in fusion devices. Neutral gas injection is one promising way to mitigate erosion of tokamak components and contamination. The objective of this work is to study and optimize mitigation methods using neutral gas and pellet-like injections to decrease the heat load to the divertor surfaces and to prevent vaporization of the various internal surfaces due to transient events in ITER-like devices. The integrated self-consistent models implemented in the HEIGHTS package was used for detailed analysis of the potential secondary plasma generation from the injected inert gas, its radiative characteristics, and shielding effectiveness. We varied the density, size, and location of an argon gas cloud to minimize the disruption energy deposited into the divertor components. We also investigated innovative ways for minor changes in ITER-like internal design to mitigate disruptions. We found the optimum parameters to fully protect ITER tokamak surfaces from erosion and vaporization during plasma instabilities. This preliminary analysis showed that using Ar gas injection methods could lead to enhancement in components lifetime in ITER-like and future DEMO devices with minor design changes.

Science & Technology - Other Topics↗

Adaptive Mesh Refinement for Microelectronic Device Design

Finite element and finite volume methods are used in a variety of design simulations when it is necessary to compute fields throughout regions that contain varying materials or geometry. Convergence of the simulation can be assessed by uniformly increasing the mesh density until an observable quantity stabilizes. Depending on the electrical size of the problem, uniform refinement of the mesh may be computationally infeasible due to memory limitations. Similarly, depending on the geometric complexity of the object being modeled, uniform refinement can be inefficient since regions that do not need refinement add to the computational expense. In either case, convergence to the correct (measured) solution is not guaranteed. Adaptive mesh refinement methods attempt to selectively refine the region of the mesh that is estimated to contain proportionally higher solution errors. The refinement may be obtained by decreasing the element size (h-refinement), by increasing the order of the element (p-refinement) or by a combination of the two (h-p refinement). A successful adaptive strategy refines the mesh to produce an accurate solution measured against the correct fields without undue computational expense. This is accomplished by the use of a) reliable a posteriori error estimates, b) hierarchal elements, and c) automatic adaptive mesh generation. Adaptive methods are also useful when problems with multi-scale field variations are encountered. These occur in active electronic devices that have thin doped layers and also when mixed physics is used in the calculation. The mesh needs to be fine at and near the thin layer to capture rapid field or charge variations, but can coarsen away from these layers where field variations smoothen and charge densities are uniform. This poster will present an adaptive mesh refinement package that runs on parallel computers and is applied to specific microelectronic device simulations. Passive sensors that operate in the infrared portion of the spectrum as well as active device simulations that model charge transport and Maxwell's equations will be presented.

Cwik, Tom↗

Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks

Rapid advancements in electronic devices yield an urgent demand for high-performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the requirements simultaneously. Here, an effective strategy is proposed for significantly promoting the thermal conductivity and machinability of negative thermal expansion alloy (Zr,Nb)Fe 2 through eutectic precipitation of copper networks. The eutectic dual-phase alloy exhibits an isotropic chips-matched thermal expansion coefficient and a thermal conductivity enhancement exceeding 200% compared with (Zr,Nb)Fe 2 , along with an ultimate compressive strength of 550 MPa. The addition of copper reorganizes the composition of (Zr,Nb)Fe 2 , which smooths the magnetic transition and shifts it toward higher temperature, resulting in linear low thermal expansion in a wide temperature range. The highly fine eutectic copper lamellae construct high thermal conductivity networks within (Zr,Nb)Fe 2 , serving as highways for heat transfer electrons and phonons. The in situ forming of eutectic copper lamellae also facilitates the mechanical properties by enhancing interfacial bonding and bearing additional stress after yielding of (Zr,Nb)Fe 2 . This work provides a novel strategy for promoting thermal conductivity and mechanical properties of negative thermal expansion alloys via eutectic precipitation of copper networks.

36 MATERIALS SCIENCE↗

The Apollo X-ray fluorescence spectrometer

The Apollo X-ray fluorescence spectrometer was a part of a geochemical package flown on the Apollo 15 and 16 missions. The device was to map the concentrations of aluminum, magnesium, and silicon in the lunar regolith along the spacecraft ground track. A functional description of the spectrometer is given and the telemetry data format is discussed together with the pulse height analyzer, the pulse shape discriminator, questions of in-flight calibration, and the flight results.

Jagoda, N.↗

Design, processing, and testing of LSI arrays for space station

Data for the beam-leaded silicon-on-sapphire (SOS) process using the TA5388 dual-complementary pair plus inverted circuit show the stability of the dc device characteristics through the complete beam-lead processing and packaging steps. A more complex circuit, the TA6567 - a silicon-gate, voltage-sense BL/CMOS/SOS 256-bit RAM, has also been made that was functionally perfect at wafer probe. Efforts to increase the yield of this circuit and to obtain electrically perfect packaged units are discussed.

Schneider, W. C.↗

An ultraviolet polarimeter for the Solar Maximum Mission

The Solar Maximum Mission experiment contingency will include one instrument originally designed and built for OSO-8. The engineering model of the OSO-8 High Resolution Spectrometer has been rebuilt to make it lightworthy and to encompass several new functions, including solar ultraviolet polarimetry. The rebuilt package is designated as the High Resolution Ultraviolet Spectrometer/Polarimeter. The device that enables polarimetry is a dual channel rotating waveplate system. The waveplates are magnesium fluoride and will allow measurements to be made ranging from the Lyman alpha line to near visible ultraviolet. One wavelength channel will use the polarization characteristics of the spectrometer diffraction grating as the analyzer. The second channel has a built-in four-mirror polarizer. This paper describes the polarimeter design, operation, and calibration.

Calvert, J.↗

An investigation of optimization techniques for drawing computer graphics displays

Techniques for reducing vector data plotting time are studied. The choice of tolerances in optimization and the application of optimization to plots produced on real time interactive display devices are discussed. All results are developed relative to plotting packages and support hardware so that results are useful in real world situations.

Stocker, F. R.↗

The MSFC complementary metal oxide semiconductor (including multilevel interconnect metallization) process handbook

The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.

Bouldin, D. L.↗

Integrating Commercial Off-The-Shelf (COTS) graphics and extended memory packages with CLIPS

This paper addresses the question of how to mix CLIPS with graphics and how to overcome PC's memory limitations by using the extended memory available in the computer. By adding graphics and extended memory capabilities, CLIPS can be converted into a complete and powerful system development tool, on the other most economical and popular computer platform. New models of PCs have amazing processing capabilities and graphic resolutions that cannot be ignored and should be used to the fullest of their resources. CLIPS is a powerful expert system development tool, but it cannot be complete without the support of a graphics package needed to create user interfaces and general purpose graphics, or without enough memory to handle large knowledge bases. Now, a well known limitation on the PC's is the usage of real memory which limits CLIPS to use only 640 Kb of real memory, but now that problem can be solved by developing a version of CLIPS that uses extended memory. The user has access of up to 16 MB of memory on 80286 based computers and, practically, all the available memory (4 GB) on computers that use the 80386 processor. So if we give CLIPS a self-configuring graphics package that will automatically detect the graphics hardware and pointing device present in the computer, and we add the availability of the extended memory that exists in the computer (with no special hardware needed), the user will be able to create more powerful systems at a fraction of the cost and on the most popular, portable, and economic platform available such as the PC platform.

Callegari, Andres C.↗

Imaging Beyond What Man Can See

Three lightweight, portable hyperspectral sensor systems have been built that capture energy from 200 to 1700 nanometers (ultravio1et to shortwave infrared). The sensors incorporate a line scanning technique that requires no relative movement between the target and the sensor. This unique capability, combined with portability, opens up new uses of hyperspectral imaging for laboratory and field environments. Each system has a GUI-based software package that allows the user to communicate with the imaging device for setting spatial resolution, spectral bands and other parameters. NASA's Space Partnership Development has sponsored these innovative developments and their application to human problems on Earth and in space. Hyperspectral datasets have been captured and analyzed in numerous areas including precision agriculture, food safety, biomedical imaging, and forensics. Discussion on research results will include realtime detection of food contaminants, molds and toxin research on corn, identifying counterfeit documents, non-invasive wound monitoring and aircraft applications. Future research will include development of a thermal infrared hyperspectral sensor that will support natural resource applications on Earth and thermal analyses during long duration space flight. This paper incorporates a variety of disciplines and imaging technologies that have been linked together to allow the expansion of remote sensing across both traditional and non-traditional boundaries.

May, George↗

Policies and Procedures for Accessing Archived NASA Lunar Data via the Web

The National Space Science Data Center (NSSDC) was established by NASA to provide for the preservation and dissemination of scientific data from NASA missions. This paper describes the policies specifically related to lunar science data. NSSDC presently archives 660 lunar data collections. Most of these data (423 units) are stored offline in analog format. The remainder of this collection consists of magnetic tapes and discs containing approximately 1.7 TB of digital lunar data. The active archive for NASA lunar data is the Planetary Data System (PDS). NSSDC has an agreement with the PDS Lunar Data Node to assist in the restoration and preparation of NSSDC-resident lunar data upon request for access and distribution via the PDS archival system. Though much of NSSDC's digital store also resides in PDS, NSSDC has many analog data collections and some digital lunar data sets that are not in PDS. NSSDC stands ready to make these archived lunar data accessible to both the research community and the general public upon request as resources allow. Newly requested offline lunar data are digitized and moved to near-line storage devices called digital linear tape jukeboxes. The data are then packaged and made network-accessible via FTP for the convenience of a growing segment of the user community. This publication will 1) discuss the NSSDC processes and policies that govern how NASA lunar data is preserved, restored, and made accessible via the web and 2) highlight examples of special lunar data requests.

James, Nathan L.↗

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

High temperature operation of wide bandgap devices continue to be a challenge for the power electronics packages. Thermal performance and reliability are important factors that determine the viability of a bonded interface for operation at high temperatures. In this presentation, we present the technical approach and key results from the research on sintered silver, transient liquid phase alloy, and polymeric materials. A lifetime prediction model that incorporates the thermomechanical behavior of sintered silver at 200C was developed. The copper-aluminum transient alloy completed 350 thermal cycles from -40C to 200C and little increase in the defect level was observed. In addition to material research, we initiated a time-series analysis on the scanning acoustic microscope images of eutectic solder to explore statistical forecasting methods and machine learning techniques. Initial results that report the accuracy of a few different statistical models are presented.

ADVANCED PROPULSION SYSTEMS↗

Thermal Optimization and Experimental Demonstration of a Silicon Carbide, Half-Bridge Power Module

This paper describes modeling and experimental work to design and demonstrate a silicon carbide (SiC), single-side-cooled power module. Two SiC metal-oxide-semiconductor field-effect transistors (MOSFET) were used for each switch position and packaged on a metalized ceramic substrate. Thermal modeling was first conducted to optimize the module packaging to minimize junction-to-fluid thermal resistance and device temperature variations. This procedure identified the optimal device placement and baseplate thickness to maximize thermal performance. A heat exchanger - incorporating impinging jets of water-ethylene glycol - was designed to cool the module's baseplate to minimize thermal resistance and pumping power. The heat exchanger used relatively low fluid velocities (<1.5 m/s) to minimize erosion-corrosion effects and relatively large fluid channel sizes (>=1 mm) to prevent clogging. The power module concept was fabricated, and experiments were conducted to measure its thermal performance. Direct current was used to power the module devices, and junction temperatures were measured via device temperature-sensitive parameters. The experimental results were found to be in good agreement with model predictions (within 2%) and yielded junction-to-fluid thermal resistance values as low as about 15 mm2 K/W at relatively low pumping power values. The results demonstrate the improved performance associated with jet impingement cooling and represent an improvement over existing channel-flow-type cold plates, which can enable improvements to power density and reliability.

36 MATERIALS SCIENCE↗

Dielectric Performance of High Purity HTCC Alumina at High Temperatures - A Comparison Study with Other Polycrystalline Alumina

A very high purity (99.99+) high temperature co-fired ceramic (HTCC) alumina has recently become commercially available. The raw material of this HTCC alumina is very different from conventional HTCC alumina, and more importantly there is no glass additive in this co-fired material. Previously, selected HTCC and LTCC (low temperature co-fired ceramic) alumina materials were evaluated at high temperatures as dielectric and compared to a regularly sintered 96 polycrystalline alumina (96 Al2O3), where 96 alumina was used as the benchmark. A prototype packaging system based on regular 96 alumina with Au thick-film metallization successfully facilitated long term testing of high temperature silicon carbide (SiC) electronic devices for over 10,000 hours at 500C. In order to evaluate this new HTCC alumina for possible high temperature packaging applications, the dielectric properties of this HTCC alumina substrate were measured and compared with those of 96 alumina and a LTCC alumina from room temperature to 550C at frequencies of 120 Hz, 1 KHz, 10 KHz, 100 KHz, and 1 MHz. A parallel-plate capacitive device with dielectric of the HTCC alumina and precious metal electrodes were used for measurements of the dielectric constant and dielectric loss of the co-fired alumina material in the temperature and frequency ranges. The capacitance and AC parallel conductance of the capacitive device were directly measured by an AC impedance meter, and the dielectric constant and parallel AC conductivity of the dielectric were calculated from the capacitance and conductance measurement results. The temperature and frequency dependent dielectric constant, AC conductivity, and dissipation factor of the HTCC alumina substrate are presented and compared to those of 96 alumina. Other technical advantages of this new co-fired material for possible high packaging applications are also discussed.

High temperature↗