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335 records · Page 19

Instruments for Reading Direct-Marked Data-Matrix Symbols

Improved optoelectronic instruments (specially configured digital cameras) for reading direct-marked data-matrix symbols on the surfaces of optically reflective objects (including specularly reflective ones) are undergoing development. Data-matrix symbols are two-dimensional binary patterns that are used, like common bar codes, for automated identification of objects. The first data-matrix symbols were checkerboard-like patterns of black-and-white rectangles, typically existing in the forms of paint, ink, or detachable labels. The major advantage of direct marking (the marks are more durable than are painted or printed symbols or detachable labels) is offset by a major disadvantage (the marks generated by some marking methods do not provide sufficient contrast to be readable by optoelectronic instruments designed to read black-and-white data-matrix symbols). Heretofore, elaborate lighting, lensing, and software schemes have been tried in efforts to solve the contrast problem in direct-mark matrix- symbol readers. In comparison with prior readers based on those schemes, the readers now undergoing development are expected to be more effective while costing less. All of the prior direct-mark matrix-symbol readers are designed to be aimed perpendicularly to marked target surfaces, and they tolerate very little angular offset. However, the reader now undergoing development not only tolerates angular offset but depends on angular offset as a means of obtaining the needed contrast, as described below. The prototype reader (see Figure 1) includes an electronic camera in the form of a charge-coupled-device (CCD) image detector equipped with a telecentric lens. It also includes a source of collimated visible light and a source of collimated infrared light for illuminating a target. The visible and infrared illumination complement each other: the visible illumination is more useful for aiming the reader toward a target, while the infrared illumination is more useful for reading symbols on highly reflective surfaces. By use of beam splitters, the visible and infrared collimated lights are introduced along the optical path of the telecentric lens, so that the target is illuminated and viewed from the same direction.

Schramm, Harry F.↗

Making & Breaking the Rules for DED Design

Design for Additive Manufacturing (DfAM) is widely used to describe design activities and guidelines employed in the creation of Additively Manufactured (AM) parts. Basic design rules for widely adopted processes like Powder Bed Fusion (PBF) are relatively understood including material performance, part size constraints, self-supporting angles, overhangs, wall thicknesses, and feature resolution. Complexity is often inherent with PBF using organically inspired solutions through generative design and topology optimization software to create designs that often cannot be realized via traditional manufacturing processes. The design rules for Directed Energy Deposition (DED) are less well known, and, in some cases, the lack of understanding is likely inhibiting broader application of the various DED processes. This presentation covers key design rules for DED fusion processes and elucidates opportunities like multi-material deposition and build approaches ranging from basic features to complex large-scale parts. Complementary to the opportunistic characteristics of DfAM for DED, Manufacture for AM (MfAM) encompasses the restrictive aspects of the manufacturing lifecycle with limitations due to bead width and wall thickness, self-supporting angles, surface texture, microstructural evolution, and residual stresses. AM enabled part design must always consider the entire value chain starting with incoming feedstock (e.g. plate, wire, or powder) and progressing through the printing process, post-processing (e.g. machining, inspection), and final system assembly. Key considerations, like the tradeoffs between feature resolution and build rate, for process and part selection and economic assessments will be discussed as DED is often traded against other AM processes. After highlighting typical DED design rules, we will also show how some of those rules can be broken via use cases and part designs that span the full spectrum of DED processes with examples of various DED part designs.

Additive Manufacturing↗

Sample Handling in Extreme Environments

Harsh environments, such as that on Venus, preclude the use of existing equipment for functions that involve interaction with the environment. The operating limitations of current high temperature electronics are well below the actual temperature and pressure found on Venus (460 deg C and 92 atm), so proposed lander configurations typically include a pressure vessel where the science instruments are kept at Earth-like temperature and pressure (25 deg C and 1 atm). The purpose of this project was to develop and demonstrate a method for sample transfer from an external drill to internal science instruments for a lander on Venus. The initial concepts were string and pneumatically driven systems; and the latter system was selected for its ability to deliver samples at very high speed. The pneumatic system was conceived to be driven by the pressure difference between the Venusian atmosphere and the inside of the lander. The pneumatic transfer of a small capsule was demonstrated, and velocity data was collected from the lab experiment. The sample transfer system was modeled using CAD software and prototyped using 3D printing. General structural and thermal analyses were performed to approximate the proposed system's mass and effects on the temperature and pressure inside of the lander. Additionally, a sampler breadboard for use on Titan was tested and functionality problems were resolved.

sample handling↗

Photonic Bandgap (PBG) Shielding Technology

Photonic Bandgap (PBG) shielding technology is a new approach to designing electromagnetic shielding materials for mitigating Electromagnetic Interference (EM!) with small, light-weight shielding materials. It focuses on ground planes of printed wiring boards (PWBs), rather than on components. Modem PSG materials also are emerging based on planar materials, in place of earlier, bulkier, 3-dimensional PBG structures. Planar PBG designs especially show great promise in mitigating and suppressing EMI and crosstalk for aerospace designs, such as needed for NASA's Constellation Program, for returning humans to the moon and for use by our first human visitors traveling to and from Mars. Photonic Bandgap (PBG) materials are also known as artificial dielectrics, meta-materials, and photonic crystals. General PBG materials are fundamentally periodic slow-wave structures in I, 2, or 3 dimensions. By adjusting the choice of structure periodicities in terms of size and recurring structure spacings, multiple scatterings of surface waves can be created that act as a forbidden energy gap (i.e., a range of frequencies) over which nominally-conductive metallic conductors cease to be a conductor and become dielectrics. Equivalently, PBG materials can be regarded as giving rise to forbidden energy gaps in metals without chemical doping, analogous to electron bandgap properties that previously gave rise to the modem semiconductor industry 60 years ago. Electromagnetic waves cannot propagate over bandgap regions that are created with PBG materials, that is, over frequencies for which a bandgap is artificially created through introducing periodic defects

Bastin, Gary L.↗

Enabling Technologies for Entrepreneurial Opportunities in 3D printing of SmallSats

A consortium of innovative experts in additive manufacturing (AM) comprising Northrup Grumman Technical Services, University of Texas at El Paso (UTEP), Configurable Space Microsystems Innovations & Applications Center (COSMIAC), NASA Glenn Research Center (GRC), and Youngstown State University, have made significant breakthroughs in the goal of creating the first complete 3D printed small satellite. Since AM machines are relatively inexpensive, this should lead to many entrepreneurial opportunities for the small satellite community. Our technology advancements are focused on the challenges of embedding key components within the structure of the article. We have demonstrated, using advanced fused deposition modeling techniques, complex geometric shapes which optimize the spacecraft design. The UTEP Keck Center has developed a method that interrupts the printing process to insert components into specific cavities, resulting in a spacecraft that has minimal internal space allocated for what traditionally were functional purposes. This allows us to increase experiment and instrument capability by provided added volume in a confined small satellite space. Leveraging initial progress made on a NASA contract, the team investigated the potential of new materials that exploit the AM process, producing candidate compositions that exceed the capabilities of traditional materials. These "new materials" being produced and tested include some that have improved radiation shielding, increased permeability, enhanced thermal properties, better conductive properties, and increased structural performance. The team also investigated materials that were previously not possible to be made. Our testing included standard mechanical tests such as vibration, tensile, thermal cycling, and impact resistance as well as radiation and electromagnetic tests. The initial results of these products and their performance will be presented and compared with standard properties. The new materials with the highest probability to disrupt the future of small satellite systems by driving down costs will be highlighted, in conjunction with the electronic embedding process.

Communications↗

Advanced microfabrication technologies for microspacecraft

Advanced microfabrication technologies offer the prospect of reducing the weight and size of spacecraft through the use of lighter and stronger materials in conjunction with new mechanical/structural design concepts and design optimization methods. At the same time, electronic components have been scaled down while increasing functional utility. A two-fold benefit is derived for space applications through the use of less expensive components and the lower launch costs associated with lighter components. GE-CRD is actively pursuing research in these key technologies for a wide range of applications including satellites. These key technologies will be reviewed and an update on GE progress will be given. The need to reduce weight and lower cost, while maintaining product quality and reliability are primary drivers in the design of satellites, in general, and microsatellites in particular. For the structural subsystem, these requirements pose a complex design problem unless new mechanical design concepts and computer-aided design optimization methods are employed. Several new concepts, such as battery packs doubling as panel reinforcements and fuel tanks as integral structural members, need to utilized. In addition, new viscoelastic material damping concepts for spacecraft components provide for lighter weight/lower cost designs, while satisfying the structural dynamics requirements. High density interconnect (HDI) technology permits the use of bare IC's on a ceramic substrate with 90 percent active area utilization. A copper/polyimide multilayer structure is the backbone of the technology, which has demonstrated a size/weight reduction of greater than 10x compared to printed circuit board with performance up to the GHz level. HDI modules have exceptional mechanical robustness as evidenced by survival of 180 kg rapid acceleration tests. Microelectromechanical systems (MEMS) are redefining sensors and actuators by miniaturization through micromachining techniques. Sharing many fabrication steps with HDI, we have developed a new technique for surface micromachining of copper/polyimide structures using computer-aided laser patterning.

Ghezzo, M.↗

IR DirectFET Extreme Environments Evaluation Final Report

In 2007, International Rectifier (IR) introduced a new version of its DirectFET metal oxide semiconductor field effect transistor (MOSFET) packaging. The new version (referred to as 'Version 2') enhances device moisture resistance, makes surface mount (SMT) assembly of these devices to printed wiring boards (PWBs) more repeatable, and subsequent assembly inspection simpler. In the present study, the National Aeronautics Space Administration (NASA) Jet Propulsion Laboratory (JPL), in collaboration with Stellar Microelectronics (Stellar), continued an evaluation of the DirectFET that they started together in 2006. The present study focused on comparing the two versions of the DirectFET and examining the suitability of the DirectFET devices for space applications. This study evaluated both versions of two DirectFET packaged devices that had both been shown in the 2006 study to have the best electrical and thermal properties: the IRF6635 and IRF6644. The present study evaluated (1) the relative electrical and thermal performance of both versions of each device, (2) the performance through high reliability testing, and (3) the performance of these devices in combination with a range of alternate solder alloys in the extreme thermal environments of deep space....

electronic parts packaging↗

Bank Terminals

In the photo, employees of the UAB Bank, Knoxville, Tennessee, are using Teller Transaction Terminals manufactured by SCI Systems, Inc., Huntsville, Alabama, an electronics firm which has worked on a number of space projects under contract with NASA. The terminals are part of an advanced, computerized financial transaction system that offers high efficiency in bank operations. The key to the system's efficiency is a "multiplexing" technique developed for NASA's Space Shuttle. Multiplexing is simultaneous transmission of large amounts of data over a single transmission link at very high rates of speed. In the banking application, a small multiplex "data bus" interconnects all the terminals and a central computer which stores information on clients' accounts. The data bus replaces the maze-of wiring that would be needed to connect each terminal separately and it affords greater speed in recording transactions. The SCI system offers banks real-time data management through constant updating of the central computer. For example, a check is immediately cancelled at the teller's terminal and the computer is simultaneously advised of the transaction; under other methods, the check would be cancelled and the transaction recorded at the close of business. Teller checkout at the end of the day, conventionally a time-consuming matter of processing paper, can be accomplished in minutes by calling up a summary of the day's transactions. SCI manufactures other types of terminals for use in the system, such as an administrative terminal that provides an immediate printout of a client's account, and another for printing and recording savings account deposits and withdrawals. SCI systems have been installed in several banks in Tennessee, Arizona, and Oregon and additional installations are scheduled this year.

Source record↗

Distributed Spacecraft Autonomy - Development of Swarm Autonomy Capability and Scalability for Spacecraft

The Distributed Spacecraft Autonomy project is developing a suite of software tools that enable an operator to command and receive data from a swarm as a single entity, enable a swarm to autonomously coordinate its actions via distributed decision making and reactive closed-loop control, and model swarm behavior in the presence of anomalies or failures. Our use case is the mapping of the electron density of the ionosphere using radio tomography by coordinating the selection of appropriate GPS channels, and by recording Total Electron Count (TEC) measurements. DSA will be demonstrated onboard the NASA Ames Starling mission – a swarm of four small, LEO spacecraft, scheduled to launch in 2021. We will also perform a ground demonstration with simulated and hardware-in-the-loop elements, to validate the tools for controlling swarms of up to 100 assets. The capability to communicate autonomously between the swarm satellites is demonstrated via a sophisticated simulation architecture. Historical Plasmasphere TEC data obtained via dual-band Novatel GPS Receivers are utilized as a representative input dataset for the swarm. The representative TEC data and GPS satellite observability information is fed to the autonomous software package in place of a true real-time ground data collection process. The swarm satellites actively share status updates amongst one another and utilize multi-agent decision making to optimally identify regions of interest in the TEC distribution. The software, aware of the bandwidth limitations of the swarm satellites, prioritizes explorative measurements, which define the range of observability for the satellites, as well as exploitative measurements, which focus on maximizing the observance potential of regions with prolonged, elevated TEC density. The science of this study can ultimately be used to determine the dynamics and coupling of Earth’s magnetosphere, ionosphere, and atmosphere and their response to solar and terrestrial inputs. The findings can be applied to the imaging of critical, transient phenomena in the magnetosphere in later missions. Meanwhile, the swarm autonomy capabilities have far reaching potential in future satellite missions. As an experimental demonstration of the autonomous capabilities of the network, a message is first printed within a core Flight Executive (cFE) application. Two cFE applications that communicate with one another within the same core Flight System (cFS) are shown. Communication between mission applications on the internal cFE bus is extended to utilize Data Distribution Service (DDS) for vehicle-to-vehicle networking. The DDS middleware provides reliable delivery, routing, and topic subscription features over User Datagram Protocol (UDP). Leveraging Linux containerization, a networked set of satellite instances are generated by script to simulate swarm behavior. Swarm commanding and synchronization through the network is demonstrated under various topologies and data-loss conditions. Finally, autonomous swarm scalability from 2 satellites to 100 satellites is shown.

Distributed Autonomy↗

Distributed Spacecraft Autonomy (DSA): Development of Swarm Autonomy Capability and Scalability for Spacecraft

The Distributed Spacecraft Autonomy project is developing a suite of software tools that enable an operator to command and receive data from a swarm as a single entity, enable a swarm to autonomously coordinate its actions via distributed decision making and reactive closed-loop control, and model swarm behavior in the presence of anomalies or failures. Our use case is the mapping of the electron density of the ionosphere using radio tomography by coordinating the selection of appropriate GPS channels, and by recording Total Electron Count (TEC)measurements. DSA will be demonstrated on board the NASA Ames Starling mission a swarm of four small, LEO spacecraft, scheduled to launch in 2021. We will also perform a ground demonstration with simulated and hardware-in-the-loop elements, to validate the tools for controlling swarms of up to 100 assets.The capability to communicate autonomously between the swarm satellites is demonstrated via a sophisticated simulation architecture. Historical Plasma sphere TEC data obtained via dual-band Novatel GPS Receivers are utilized as a representative input data set for the swarm. The representative TEC data and GPS satellite observability information is fed to the autonomous software package in place of a true real-time ground data collection process. The swarm satellites actively share status updates amongst one another and utilize multi-agent decision making to optimally identify regions of interest in the TEC distribution. The software,aware of the bandwidth limitations of the swarm satellites, prioritizes explorative measurements,which define the range of observability for the satellites, as well as exploitative measurements,which focus on maximizing the observance potential of regions with prolonged, elevated TEC density. The science of this study can ultimately be used to determine the dynamics and coupling of Earth's magnetosphere, ionosphere, and atmosphere and their response to solar and terrestrial inputs. The findings can be applied to the imaging of critical, transient phenomena in the magnetosphere in later missions. Meanwhile, the swarm autonomy capabilities have far reaching potential in future satellite missions.As an experimental demonstration of the autonomous capabilities of the network, a message is first printed within a core Flight Executive (cFE) application. Two cFE applications that communicate with one another within the same core Flight System (cFS) are shown.Communication between mission applications on the internal cFE bus is extended to utilize Data Distribution Service (DDS) for vehicle-to-vehicle networking. The DDS middle ware provides reliable delivery, routing, and topic subscription features over User Data gram Protocol (UDP).Leveraging Linux containerization, a networked set of satellite instances are generated by script to simulate swarm behavior. Swarm commanding and synchronization through the network is demonstrated under various topologies and data-loss conditions. Finally, autonomous swarms calability from 2 satellites to 100 satellites is shown.

Fugate, Jason↗

Electromagnetically Clean Solar Arrays

The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the wiring on the back of the panel. Each step increases the potential for occurrence of latent defects, loss of process control, and attrition of components. An EMCSA panel includes an integral cover made from a transparent material. The silicone cover supplants the individual cover glasses on the cells and serves as an additional unitary structural support that offers the advantage, relative to glass, of the robust, forgiving nature of the silcone material. The cover contains pockets that hold the solar cells in place during the lamination process. The cover is coated with indium tin oxide to make its surface electrically conductive, so that it serves as a contiguous, electrically grounded shield over the entire panel surface. The cells are mounted in proximity to metallic printed wiring. The painted-wiring layer comprises metal-film traces on a sheet of Kapton (or equivalent) polyimide. The traces include contact pads on one side of the sheet for interconnecting the cells. Return leads are on the opposite side of the sheet, positioned to form the return currents substantially as mirror images of, and in proximity to, the cell sheet currents, thereby minimizing magnetic moments. The printed-wiring arrangement mimics the back-wiring arrangement of conventional solar arrays, but the current-loop areas and the resulting magnetic moments are much smaller because the return-current paths are much closer to the solar-cell sheet currents. The contact pads are prepared with solder fo electrical and mechanical bonding to the cells. The pocketed cover/shield, the solar cells, the printed-wiring layer, an electrical bonding agent, a mechanical-bonding agent, a composite structural front-side face sheet, an aluminum honeycomb core, and a composite back-side face sheet are all assembled, then contact pads are soldered to the cells and the agents are cured in a single lamination process.

Stem, Theodore G.↗