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At least 343 records · Page 19

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire -bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500°C are reviewed.

High Temperature, Packaging, Alumina, Thick Film↗

A 96% Alumina based Packaging System for 500°C Test of SiC Integrated Circuits

With the development of silicon carbide (SiC) sensors and electronic devices for operation at 500°C, compatible packaging technologies are needed for long term high temperature test and deployment of these sensors and electronic devices. 96% Al2O3 ceramic is an excellent electrically insulating material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. This paper presents a packaging system for low power integrated circuits including a prototype 8-I/O chip-level package and printed circuit board (PCB) based on 96% Al2O3 ceramic substrates and Au thick-film metallization for 500°C applications. The details related to designs of packages and PCBs, packaging materials, and specific packaging step recipes including wire - bonding and die-attach, are presented. Some test results of this prototype packaging approach applied to SiC integrated circuits at 500oC are reviewed.

high temperature↗

Signal and Power Integrity Design Methodology for High-Performance Flight Computing Systems

Computing capabilities of space systems have in-creased onboard performance by orders of magnitude with the use of radiation-tolerant field-programmable gate arrays (FPGA)and processors. The incorporation of signal and power integrity analysis with printed circuit board (PCB) design in reliable computing architectures for space systems has become critical to enable future mission capabilities. Developers launch high-performance processors into a breadth of orbits and missions, running varying applications that create challenges for designing reliable computing hardware. Specifically, for these designs, academic and industry research has focused on component radiation performance, fault mitigation, and reliable architectures. How-ever, other design parameters including electromagnetic interference (EMI), PCB stackup, signal integrity (SI), voltage regulator module (VRM) design, and power distribution network (PDN)are often deprioritized or disregarded as the design matures. Since these characteristics are becoming more significant in high-performance processor designs, this research presents a hardware design and analysis methodology for high-performance, space-computing systems that focuses on a holistic design approach and PDN reliability. While these challenges exist across all space hardware, the reduced PCB dimensions imposed by SmallSats and CubeSats introduce additional hurdles, specifically to VRM and decoupling design. By examining the relationship between the PDN and radiation performance, an analytical relationship is developed that incorporates Total Ionizing Dose and Single-Event Transients to ensure reliability throughout the mission duration. The presented design methodology is applied to the SpaceCube v3.0 Mini, an FPGA-based on-board science data processing system developed at NASA Goddard Space Flight Center.

Advanced avionics↗

Correlated Electromagnetic Levitation Actuator: A Reaction Sphere Based Attitude Control System

To address problems experienced by current reaction wheels and control moment gyroscopebased attitude control systems (ACS), researchers at NASA’s Marshall Space Flight Center have begun developing a reaction sphere actuator based on correlated electromagnetic levitation that will be immune to destructive bearing friction, momentum saturation, and gimbal lock. The Correlated Electromagnetic Levitation Actuator (CELA) advances the state of the art of reaction sphere ACSs by employing the concept of correlated magnetics. It is a frictionless, direct-drive reaction sphere that harnesses a unique technology with an array of applications across multiple disciplines. Correlated electromagnets function in a manner that is analogous to a matched filter; the convolution of two signals is peaked at the index representing the greatest match. For CELA, the signals are the patterns of magnetic flux density as a function of position. The magnitude of the convolution equates to an attractive or repulsive force, and these forces can be azimuthal or radial. The development of CELA is based in four distinct disciplines: Advanced Manufacturing, Prototype Development, Electromagnetic Modeling, and Controls. We are developing novel manufacturing techniques required to build arrays of permanent and electromagnet dipoles on curved surfaces. To print the permanent magnetic array, we have developed a probe with pyramidal magnets that will reside on a robotic arm to induce localized magnetic fields on a surface. The probe also includes the ability to erase dipole patterns from a permanent magnet by heating the surface to its Curie temperature. A number of test articles and prototypes have been developed using additive manufacturing methods. These prototypes have included hemispherical motors to test the drive algorithm, and a levitation test bed that demonstrates a magnetic bearing method based on attractive magnetic forces and ratiometric Hall effect sensors. We developed an array of electromagnetic dipoles on a printed circuit board (PCB) with individual H-bridges controlling each coil. This device created various flux density patterns and we measured their magnetic fields using a custom Hall effect 3-D probe and a LabVIEW virtual instrument. These data will serve as a benchmark for characterizing the accuracy of future models. Current work is focused on modeling the magnetic fields of our prototype arrays using COMSOL Finite Element Analysis and verifying the model against our test data. Accurate modeling will allow us to quickly test new patterns of electromagnets and their macro behavior. Eventually, the magnetic field models will be implemented in our controls simulations to facilitate precise control of the reaction sphere. Initial model results agree with field measurements to within 1 G (5% of measured flux density). Currently, we are testing different material properties of the electromagnets and their magnetic fields and thermal effects. These results will be used to refine the design of the electromagnetic dipoles. Our control efforts have centered on developing commutation, levitation, and field pattern shaping hardware in the form of breadboards and PCBs with software running on a local microcontroller. In addition, our partners developed MATLAB Simulink models to demonstrate a PID controller thatmitigates disturbance forces resulting from the interaction of drive and levitation magnetics. Finally, we have designed a three-axis test stand that will be used in future work to demonstrate CELA’s orientation control capability.

controls↗

Correlated Electromagnetic Levitation Actuator: A Reaction Sphere-Based Attitude Control System

To address problems experienced by current reaction wheels and control moment gyroscopebased attitude control systems (ACS), researchers at National Aeronautics and Space Administration’s (NASA’s) Marshall Space Flight Center (MSFC) have begun developing a reaction sphere actuator based on correlated electromagnetic levitation that will be immune to destructive bearing friction, momentum saturation, and gimbal lock. The Correlated Electromagnetic Levitation Actuator (CELA) advances the state of the art of reaction sphere ACSs by employing the concept of correlated magnetics. It is a frictionless, direct-drive reaction sphere that harnesses a unique technology with an array of applications across multiple disciplines. Correlated electromagnets function in a manner that is analogous to a matched filter; the convolution of two signals is peaked at the index representing the greatest match. For CELA, the signals are the patterns of magnetic flux density as a function of position. The magnitude of the convolution equates to an attractive or repulsive force, and these forces can be azimuthal or radial. The development of CELA is based in four distinct disciplines: Advanced Manufacturing, Prototype Development, Electromagnetic Modeling, and Controls. We are developing novel manufacturing techniques required to build arrays of permanent and electromagnet dipoles on curved surfaces. To print the permanent magnetic array, we have developed a probe with pyramidal magnets that will reside on a robotic arm to induce localized magnetic fields on a surface. We have also used high temperature ovens to erase dipole patterns from a permanent magnet by heating the surface to its Curie temperature. A number of test articles and prototypes have been developed using additive manufacturing methods. These prototypes have included hemispherical motors to test the drive algorithm, and a levitation test bed that demonstrates a magnetic bearing method based on attractive magnetic forces and ratiometric Hall effect sensors. We developed an array of electromagnetic dipoles on a printed circuit board (PCB) with individual H-bridges controlling each coil. This device created various flux density patterns and we measured their magnetic fields using a custom Hall effect 3-D probe and a LabVIEW virtual instrument. These data will serve as a benchmark for characterizing the accuracy of future models. Current work is focused on modeling the magnetic fields of our prototype arrays using COMSOL finite element analysis (FEA) and verifying the model against our test data. Accurate modeling will allow us to quickly test new patterns of electromagnets and their macro behavior. Eventually, the magnetic field models will be implemented in our controls simulations to facilitate precise control of the reaction sphere. Initial model results agree with field measurements to within 1 G (5% of measured flux density). Currently, we are testing different material properties of the electromagnets and their magnetic fields and thermal effects. These results will be used to refine the design of the electromagnetic dipoles. Our control efforts have centered on developing commutation, levitation, and field pattern shaping hardware in the form of breadboards and PCBs with software running on a local microcontroller. In addition, our partners developed MATLAB Simulink models to demonstrate a PID controller that mitigates disturbance forces resulting from the interaction of drive and levitation magnetics. Finally, we have designed a three-axis test stand that will be used in future work to demonstrate CELA’s orientation control capability.

reaction sphere↗

Modular Composite Damage Detection System (MCDDS)

The 2020 CIF funded Modular Composite Damage Detection System (MCDDS) aims to advance the technology of damage detection in composites in the areas of thin, flexible damage detection panel construction, encapsulation techniques in composite matrixes, innovative integration and interfacing techniques with flexible embedded sensory panels, repair methods of composite materials, and improved packaging of the MCDDS. Custom thin, flexible polyimide printed circuit boards (PCBs) were designed and procured for fabrication of test specimens. A custom interface PCB was designed and fabricated to monitor the newly developed damage detection test specimens. Test specimens were fabricated using the novel flexible circuitry that were either fully or partially encapsulated. The fully encapsulated specimens were used to demonstrate embedded damage detection concepts and the partially encapsulated specimens were used to demonstrate surface-mounted (laminate) damage detection concepts. The new composite damage detection test specimens were tested and evaluated to determine if the novel damage detection sensory panels could withstand low-cycle threshold fatigue loading per a modified version of American Society for Testing and Materials (ASTM) D 7264 for up to 50 cycles without void formation. The data for multiple sensory panels indicates that the newly fabricated sensory panels are robust and do indeed withstand three-point bend flexural loading for more than 50 cycles. Additionally, testing was performed to determine if damage could be detected in damage detection test specimens subjected to failure using a 3-point bend test per a modified version of ASTM D 7264. Again, multiple sensory panels (both fully and partially encapsulated) showed the ability to detect damage to specimens subjected to failure per a modified version of ASTM D 7264. Additionally, a novel concept for tracking and monitoring of cracking (and potentially delamination) in composites was designed and developed that utilizes painted-on conductors.

Christopher Forney↗

Linear Array Photodiode and Data Acquisition System Development for Multi-Point Line FLDI Measurements

The continuous development and advancement of multi-point line focused laser differential interferometry (FLDI) instruments requires larger numbers of acquisition channels to make more finely spatially resolved measurements of high-frequency flow fluctuations. No current off-the-shelf system exists for these line FLDI measurements, and so a single unified system consisting of a linear array photodiode, required electronics, and a data acquisition system has been developed to enhance the measurement resolution, both spatially and temporally. A printed circuit board was developed on which the linear array photodiode is mounted for inclusion into an existing FLDI system, and amplifier breakout boards incorporate electronics to condition the signal for the data acquisition system while retaining the necessary high frequency response. The data acquisition system uses a National Instruments chassis and multiple oscilloscope modules, with a specially-designed LabVIEW user interface for laboratory and wind tunnel setup, calibration, and testing. Details regarding the development of the linear array photodiode system and the data acquisition system are provided, and systematic testing of all components is presented, culminating in a test of the system integrated into an existing line FLDI system for measurements of a turbulent jet.

Joshua M Weisberger↗

Press-fit Connectors in Spaceflight Applications - Drivers and Challenges

Starting from the 1970s when press-fit technology was nascent and confined within the telecommunications industry, this technology has matured as its adoption has increased within high reliability applications such as medical devices and avionics. Press-fit connectors are strongly preferred in today’s designs because the smaller press-fit pins require smaller diameter holes which require smaller pads and allows more routing real-estate without taking exceptions to specs. The lack of solder for a press-fit connection makes the conductive path more predictable for high-speed digital design and impedance discontinuities can be minimized as the signal moves from the printed circuit board to the connector. Touch-up during manufacturing is also reduced and streamlines the assembly process. This presentation at the 2022 NEPP ETW will introduce the audience to press-fit connectors and its contact physics followed by a deeper dive into specific press-fit applications for space flight environments, including information on qualification, testing, and screening.

pressfit↗

A Dual Linear/Circular Polarized Wideband Flat Panel Phased Array Antenna for K/Ka-band 6U CubeSat Communications Applications

Circular polarized (CP) electromagnetic waves are preferred for space-to-space and space-to-ground satellite communications (SATCOM). CubeSats with 6U sizes (1U represents a 10 cm x 10 cm x 10 cm), that will rotate together with the Moon as it orbits Earth require high gain CP antenna systems to maintain reliable communication links. Here, we have designed an 8x8 dual linear and dual circularly polarized phased array antenna (PAA) aperture that offers 22-28 GHz bandwidth, with maximum gain of 23 dBic, and beam scanning capability of ±50o with acceptable axial ratio over all scan angles. A stacked patch topology is selected to achieve wide impedance bandwidth. Each driven patch has two via feed point locations that are connected to grounded coplanar waveguide (CPW) feed structures. By utilizing phase shifters from the Anokiwave RFICs (AWMF-0165) employed for the beamforming network (BFN), we have generated both dual linear polarization and dual circular polarization in each patch. Each driven and parasitic patch is innovatively shaped to achieve excellent isolation between two feed points which, in turn, leads to low cross polarization, high efficiency and good axial ratio over the entire bandwidth. Each chip has eight outputs which feed one 2x2 sub-array consisting of four dual linear or dual circularly polarized driven patches, simultaneously. Each 2x2 sub-array of the 8x8 array are sequentially rotated which improves axial ratio performance when the antenna operates in the dual circularly polarized mode. By utilizing a mirror effect, cross-polarized fields are also improved when operated in a dual linear polarized mode. The 8x8 array aperture is simulated taking into account the effect of the multilayer printed circuit board (PCB) stack-up of the BFN and co-simulated with the power splitter outputs and chip outputs and results are compared with only passive array performance. The performance of the antenna is still excellent when non-ideal chip performances are included in the simulation analysis. The fabricated array will be tested for radiation patterns in the Antenna and Microwave Laboratory (AML) of the San Diego State University and the NASA Glenn Research Center (GRC) spherical near field chambers. The design of the 8x8 antenna array with BFN layout is shown in Fig. 1.

5G↗

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origami-inspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigid-flex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL's Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

John Bell↗

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origamiinspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigidflex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL’s Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

de la Croix, Jean-Pierre↗

Passive PCB Mounted Thermal Switch

A printed circuit board (PCB) generates heat during operation. In a vacuum this heat can only be rejected by conduction and radiation. In order to reject heat effectively the PCB needs to be thermally conductive to the electronics enclosure. However, when the enclosure temperature gets too low, too much heat is rejected from the PCB and it can fail. This thermal switch has been designed to allow for heat rejection when the PCB is sufficiently warm but then greatly reduce heat rejection when the temperature gets low enough.

Jarret Bone↗

Flex-Capsules for the Roman Space Telescope High Gain Antenna Gimbal

The Cable Wrap mechanism has been traditionally used for feeding power and telemetry through each gimbal actuator exiting at the gimbal output flange. Such a mechanism had often utilized round wire bundles or a multitude of single insulated conductors woven together flatwise to handle the angular rotation. Though flexible printed circuit board (PCB) is not a new technology, it was decided to implement it for the Roman Space Telescope (RST) High Gain Antenna Gimbal in an effort to improve reliability with consistency of manufacture and to save mass and minimize required volume. This paper provides a description of what we term Flex-Capsule (a similar vendor flight development is termed Twist Capsule), discusses the reasoning behind choosing a new engineering development over maintaining heritage, and includes commentary pertaining to life cycle analysis, electrical performance, and flexible PCB lubrication. Lessons learned from the design, analysis, and test campaign are also included. The conclusion is that benefits of pursuing the Flex-Capsule over heritage Cable Wrap have been realized.

twist capsule↗

Topics in Reliability

This talk will wind through the details of history of reliability in the agency, where things are today, and where we need to go tomorrow. It will provide many examples of reliability that are often discounted because they are not tied to some mantra from the past. Furthermore, it will separate us from the red herrings that are ever present based on the misuse of terms and practices in reliability. It will delve into several key subject matter areas that have long been considered the key reliability drivers, such as parts, printed circuit boards, radiation, and workmanship. Finally, it will highlight how the Center and Agency need to change our approach at learning lessons from past experiences to maintain a basis for reliability long into the future.

COTS↗

Flex-Capsule for the Roman Space Telescope High Gain Antenna Gimbal

The Cable Wrap mechanism has been traditionally used for feeding power and telemetry through each gimbal actuator exiting at the Gimbal output flange. Such a mechanism had often utilized round wire bundles, or a multitude of single insulated conductors woven together flatwise to handle the angular rotation. Though flexible printed circuit board (PCB) is not a new technology, it was decided to implement it for the Roman Space Telescope (RST) High Gain Antenna Gimbal in an effort to improve reliability with consistency of manufacture and to save mass and minimize required volume. This paper provides a description of what we term Flex-Capsule (a similar vendor flight development is termed Twist Capsule), discusses the reasoning behind choosing a new engineering development over maintaining heritage, and includes commentary pertaining to life cycle analysis, electrical performance, and flexible PCB lubrication. Lessons learned from the design, analysis, and test campaign are also included. The conclusion is that benefits of pursuing the Flex-Capsule over heritage Cable Wrap have been realized.

twist capsule↗

Passive PCB Mounted Thermal Switch

A printed circuit board (PCB) generates heat during operation. In a vacuum this heat can only be rejected by conduction and radiation. To reject heat effectively and avoid overheating, the PCB needs to be thermally conductive to the electronics enclosure. However, if the system rejects too much heat, or not enough heat, either can result in system failure. The thermal switch will be able to regulate the amount of heat the system rejects to stay within the operational temperature range.

Jarret Bone↗

A High-Frequency Planar Transformer with Medium-Voltage Isolation: Preprint

This paper presents the design of a low-loss, high-frequency planar transformer having medium-voltage (10's of kV) isolation capability while transformer primary and secondary windings are interleaved to reduce losses. Medium-voltage isolation between adjacent printed circuit board (PCB) layers is extremely challenging using traditional PCB dielectrics. The isolation requirement is met using PCB with $7$\,kV/mil polyimide (Panasonic Felios RF775) as the dielectric, and by an appropriate layout of the windings and the inter-winding vias. The transformer is used to implement a dual active bridge (DAB) converter in a stackable dc-ac architecture where the dc port is connected to a photovoltaic (PV) string and ac outputs are connected in series to achieve direct PV string-to-medium voltage conversion without the need for low-voltage collection or a bulky line frequency transformer. Since each DAB transformer processes time-varying power, a design methodology is developed to minimize line-cycle-averaged losses. Experimental results are presented for a 1:1 planar transformer in a 7.5\,kW SiC-based dc-to-ac module operating at 200 kHz. Isolation of 26 kV between the primary and secondary layers and between the windings and the core is verified using a hipot tester.

41 EE - Solar Energy Technologies Office (EE-4S)↗

Ion beam mill etch depth monitoring with nanometer-scale resolution

A method for measuring conductance of a material real-time during etching/milling includes providing a fixture having a socket for receiving the material. The socket is attached to a printed circuit board (PCB) mounted on one side of a plate that has at least one opening for providing ion beam access to the material sample. Conductive probes extend from the other side of the PCB to contact and span a target area of the material. A measurement circuit in electrical communication with the probes measures the voltage produced when a current is applied across the material sample to measure changes in electrical properties of the sample over time.

Cybart, Shane A.↗