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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18

All sources NASA NTRS DOE OSTI

NASA NTRS1988

Satellite ground-terminal user simulation

Realistic simulation of satellite communication systems and evaluation of satellite networking schemes require emulation of the systems's users. A laboratory model of a Ka-band satellite-switched time-division multiple-access (SS-TDMA) communication network, referred to as the System Integration, Test, and Evaluation (SITE) project, uses special bit-error-rate (BER) test sets to simulate the transmitting and receiving users of a communication network. The bit-error-rate test sets contain circuit boards that can be modified to create a variety of interfaces to satellite system ground terminals.

Shalkhauser, Mary Jo W.↗

NASA NTRS1978

Characterization and modeling of radiation effects NASA/MSFC semiconductor devices

A literature review of the near-Earth trapped radiation of the Van Allen Belts, the radiation within the solar system resulting from the solar wind, and the cosmic radiation levels of deep space showed that a reasonable simulation of space radiation, particularly the Earth orbital environment, could be simulated in the laboratory by proton bombardment. A 3 MeV proton accelerator was used to irradiate CMOS integrated circuits fabricated from three different processes. The drain current and output voltage for three inverters was recorded as the input voltage was swept from zero to ten volts after each successive irradiation. Device parameters were extracted. Possible damage mechanisms are discussed and recommendations for improved radiation hardness are suggested.

Kerns, D. V., Jr.↗

DOE OSTI2025

Bare Module Testing for the CMS Vertex Detector Upgrade

The High-Luminosity LHC will continue exploring physics beyond the standard model with proton-proton collisions at ten times the luminosity of previous LHC runs. The physics program depends on precise measurements of charged particles near the beams. The CMS experiment will use layers of high-granularity hybrid silicon pixel detectors. Pixelation is achieved by bonding silicon to tiny electrodes, which are directly connected to the specially designed integrated circuit, CROCv2. Pixel detector components are in the pre-production phase, and evaluating prototypes of sensor-chip assemblies from different vendors provides quick feedback and improves reliability during production. This article presents the efforts to test the viability of bare detector assemblies using a manual probe station and electronic charge-injection methods.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

NASA NTRS2002

Single Junction InGaP/GaAs Solar Cells Grown on Si Substrates using SiGe Buffer Layers

Single junction InGaP/GaAs solar cells displaying high efficiency and record high open circuit voltage values have been grown by metalorganic chemical vapor deposition on Ge/graded SiGe/Si substrates. Open circuit voltages as high as 980 mV under AM0 conditions have been verified to result from a single GaAs junction, with no evidence of Ge-related sub-cell photoresponse. Current AM0 efficiencies of close to 16% have been measured for a large number of small area cells, whose performance is limited by non-fundamental current losses due to significant surface reflection resulting from greater than 10% front surface metal coverage and wafer handling during the growth sequence for these prototype cells. It is shown that at the material quality currently achieved for GaAs grown on Ge/SiGe/Si substrates, namely a 10 nanosecond minority carrier lifetime that results from complete elimination of anti-phase domains and maintaining a threading dislocation density of approximately 8 x 10(exp 5) per square centimeter, 19-20% AM0 single junction GaAs cells are imminent. Experiments show that the high performance is not degraded for larger area cells, with identical open circuit voltages and higher short circuit current (due to reduced front metal coverage) values being demonstrated, indicating that large area scaling is possible in the near term. Comparison to a simple model indicates that the voltage output of these GaAs on Si cells follows ideal behavior expected for lattice mismatched devices, demonstrating that unaccounted for defects and issues that have plagued other methods to epitaxially integrate III-V cells with Si are resolved using SiGe buffers and proper GaAs nucleation methods. These early results already show the enormous and realistic potential of the virtual SiGe substrate approach for generating high efficiency, lightweight and strong III-V solar cells.

Ringel, S. A.↗

NASA NTRS2021

The Use of High Energy Heavy Ion Facilities for Single Event Effects (SEE) Testing: A Perspective on Return on Investment (ROI)

With challenges related to testing highly complex integrated circuits as well as entire systems continuing to grow, the use of higher energy heavy ions for single-event effects (SEE) testing becomes a critical technical need. This presentation, however, focuses only partially on the technical side with the main emphasis on the economics of using a high-energy heavy ion beam and comparing via notional cost models for testing.

Kenneth A. LaBel↗

NASA NTRS2013

Planar Superconducting Millimeter-Wave/Terahertz Channelizing Filter

This innovation is a compact, superconducting, channelizing bandpass filter on a single-crystal (0.45 m thick) silicon substrate, which operates from 300 to 600 GHz. This device consists of four channels with center frequencies of 310, 380, 460, and 550 GHz, with approximately 50-GHz bandwidth per channel. The filter concept is inspired by the mammalian cochlea, which is a channelizing filter that covers three decades of bandwidth and 3,000 channels in a very small physical space. By using a simplified physical cochlear model, and its electrical analog of a channelizing filter covering multiple octaves bandwidth, a large number of output channels with high inter-channel isolation and high-order upper stopband response can be designed. A channelizing filter is a critical component used in spectrometer instruments that measure the intensity of light at various frequencies. This embodiment was designed for MicroSpec in order to increase the resolution of the instrument (with four channels, the resolution will be increased by a factor of four). MicroSpec is a revolutionary wafer-scale spectrometer that is intended for the SPICA (Space Infrared Telescope for Cosmology and Astrophysics) Mission. In addition to being a vital component of MicroSpec, the channelizing filter itself is a low-resolution spectrometer when integrated with only an antenna at its input, and a detector at each channel s output. During the design process for this filter, the available characteristic impedances, possible lumped element ranges, and fabrication tolerances were identified for design on a very thin silicon substrate. Iterations between full-wave and lumped-element circuit simulations were performed. Each channel s circuit was designed based on the availability of characteristic impedances and lumped element ranges. This design was based on a tabular type bandpass filter with no spurious harmonic response. Extensive electromagnetic modeling for each channel was performed. Four channels, with 50-GHz bandwidth, were designed, each using multiple transmission line media such as microstrip, coplanar waveguide, and quasi-lumped components on 0.45- m thick silicon. In the design process, modeling issues had to be overcome. Due to the extremely high frequencies, very thin Si substrate, and the superconducting metal layers, most commercially available software fails in various ways. These issues were mitigated by using alternative software that was capable of handling them at the expense of greater simulation time. The design of on-chip components for the filter characterization, such as a broadband antenna, Wilkinson power dividers, attenuators, detectors, and transitions has been completed.

Ehsan, Negar↗

NASA NTRS2019

Development of a High-Propellant Throughput Small Spacecraft Electric Propulsion System to Enable Lower Cost NASA Science Missions

This paper describes recent progress at the NASA Glenn Research Center (GRC) in the development and demonstration of an integrated high-propellant throughput small spacecraft electric propulsion (HT-SSEP) system based on a Hall-effect thruster. A center-mounted cathode and an innovative magnetic circuit topology were implemented in the design of the Hall-effect thruster to achieve high-propellant throughput, high performance, and efficient packaging. To minimize technical risk, the HT-SSEP development approach sought to limit design features and materials to those with a clear path-to-flight. A propellant throughput capability of greater than 100 kg at a minimum thruster efficiency of 50% was targeted. The proof-of-concept NASA-H64M laboratory model (LM) thruster was designed, fabricated, and tested at GRC in fiscal year 2018. The thruster development leveraged heritage Hall-effect thruster design and manufacturing processes wherever appropriate. Recent NASA advances in Hall-effect thruster technology were also leveraged. A scalable discharge power supply (DPS) capable of powering the H64M-LM was developed, then demonstrated as part of an integrated system test. The DPS uses commercial off-the-shelf components with spaceflight equivalents. A keeper supply with DC ignitor was breadboarded, then demonstrated with a laboratory cathode. Finally, feed system trade studies were performed to ascertain what feed system architecture might be appropriate for an HT-SSEP system. This paper details the motivations for the project, the development approach, the chosen sub-system architectures, design considerations, and test results.

Benavides, Gabriel F.↗

NASA NTRS2019

Development of a High-Propellant Throughput Small Spacecraft Electric Propulsion System to Enable Lower Cost NASA Science Missions

Benavides, Gabriel F.↗

NASA NTRS1999

A More Accurate and Efficient Technique Developed for Using Computational Methods to Obtain Helical Traveling-Wave Tube Interaction Impedance

The phenomenal growth of commercial communications has created a great demand for traveling-wave tube (TWT) amplifiers. Although the helix slow-wave circuit remains the mainstay of the TWT industry because of its exceptionally wide bandwidth, until recently it has been impossible to accurately analyze a helical TWT using its exact dimensions because of the complexity of its geometrical structure. For the first time, an accurate three-dimensional helical model was developed that allows accurate prediction of TWT cold-test characteristics including operating frequency, interaction impedance, and attenuation. This computational model, which was developed at the NASA Lewis Research Center, allows TWT designers to obtain a more accurate value of interaction impedance than is possible using experimental methods. Obtaining helical slow-wave circuit interaction impedance is an important part of the design process for a TWT because it is related to the gain and efficiency of the tube. This impedance cannot be measured directly; thus, conventional methods involve perturbing a helical circuit with a cylindrical dielectric rod placed on the central axis of the circuit and obtaining the difference in resonant frequency between the perturbed and unperturbed circuits. A mathematical relationship has been derived between this frequency difference and the interaction impedance (ref. 1). However, because of the complex configuration of the helical circuit, deriving this relationship involves several approximations. In addition, this experimental procedure is time-consuming and expensive, but until recently it was widely accepted as the most accurate means of determining interaction impedance. The advent of an accurate three-dimensional helical circuit model (ref. 2) made it possible for Lewis researchers to fully investigate standard approximations made in deriving the relationship between measured perturbation data and interaction impedance. The most prominent approximations made in the analysis were addressed and fully investigated for their accuracy by using the three-dimensional electromagnetic simulation code MAFIA (Solution of Maxwell's Equations by the Finite Integration Algorithm) (refs. 3 and 4). We found that several approximations introduced significant error (ref. 5).

Kory, Carol L.↗

NASA NTRS2019

Development of a High-Propellant Throughput Small Spacecraft Electric Propulsion System (HT-SSEP) to Enable Lower Cost NASA Science Missions

Discusses progress at the NASA Glenn Research Center (GRC) in the development and demonstration of an integrated high-propellant throughput small spacecraft electric propulsion (HT-SSEP) system based on a Hall-effect thruster. A center-mounted cathode and an innovative magnetic circuit topology were implemented in the design of the Hall-effect thruster to achieve high-propellant throughput, high performance, and efficient packaging. To minimize technical risk, the HT-SSEP development approach sought to limit design features and materials to those with a clear path-to-flight. A propellant throughput capability of greater than 100 kilograms at a minimum thruster efficiency of 50 percent was targeted. The proof-of-concept NASA-H64M laboratory model (LM) thruster was designed, fabricated, and tested at GRC in fiscal year 2018. The thruster development leveraged heritage Hall-effect thruster design and manufacturing processes wherever appropriate. Recent NASA advances in Hall-effect thruster technology were also leveraged. A scalable discharge power supply (DPS) capable of powering the H64M-LM was developed, then demonstrated as part of an integrated system test. The DPS uses commercial off-the-shelf components with spaceflight equivalents. A keeper supply with DC ignitor was breadboarded, then demonstrated with a laboratory cathode. Finally, feed system trade studies were performed to ascertain what feed system architecture might be appropriate for an HT-SSEP system. This paper details the motivations for the project, the development approach, the chosen sub-system architectures, design considerations, and test results.

Benavides, Gabriel↗

NASA NTRS2002

Commercial-Off-The-Shelf Microelectromechanical Systems (MEMS) Flow-Measurement Probes Fabricated And Assembled

As an alternative to conventional tubing instrumentation for measuring airflow, designers and technicians at the NASA Glenn Research Center have been fabricating packaging components and assembling a set of unique probes using commercial-off-the-shelf microelectromechanical systems (MEMS) integrated circuits (computer chips). Using MEMS as an alternative has some compelling advantages over standard measurement devices. Sensor technologies have matured through high-production usage in industries such as automotive and aircraft manufacturers. Currently, MEMS are the choice in applications such as tire pressure monitors, altimeters, pneumatic controls, cable leak detectors, and consumer appliances. Conventional instrumentation uses tubing buried in the model aerodynamic surfaces or wind tunnel walls. The measurements are made when pressure is introduced at the tube opening. The pressure then must travel the tubing for lengths ranging from 20 to hundreds of feet before reaching an electronic signal conditioner. This condition causes a considerable amount of damping and requires measurements to be made only after the test rig has reached steady-state operation. The electronic MEMS pressure sensor is able to take readings continuously under dynamic states in nearly real time. The use of stainless steel tubing for pressure measurements requires many tubes to be cleaned, cut to length, carefully installed, and delicately deburred and spliced for use. A cluster of a few hundred 1/16-in.- (0.0625-in.-) diameter tubes (not uncommon in research testing facilities) can be several inches in diameter and may weigh enough to require two men to handle. Replacing hard tubing with electronic chips can eliminate much of the bulk. Each sensor would fit on the tip of the 1/16-in. tubing with room to spare. The P592 piezoresistive silicon pressure sensor (Lucas NovaSensor, Fremont, CA) was chosen for this project because of its cost, availability, and tolerance to extreme ambient conditions. The chip is 1 mm square by 0.6 mm thick (0.039 by 0.023 in.) with 0.12-mm (0.005-in.) wire connection tabs. Three MEMS chips were used to build the first type of flow-angularity probe. This MEMS probe will be demonstrated as an alternative to a standard tube type "Cobra Probe" now used routinely in wind tunnel and aeronautical hardware applications. The response time and accuracy would allow the probe to be translated on an actuator across a flow field, yielding precision dynamic measurements not possible with conventional instrumentation. The low profile, the minimal power requirement, the rugged construction, and the moderate cost all contribute to making MEMS sensors the enticing choice instrument in future research measurement needs. The MEMS probe efforts are a continuation of work initiated by Brian Willis, without whose foresight and efforts this project would never have been realized. This task was funded through cooperation with the NASA Electronic Parts and Packaging (NEPP) program at the Jet Propulsion Laboratory.

Redding, Chip↗

NASA NTRS2005

Design for ASIC reliability for low-temperature applications

In this paper, we present a methodology to design for reliability for low temperature applications without requiring process improvement. The developed hot carrier aging lifetime projection model takes into account both the transistor substrate current profile and temperature profile to determine the minimum transistor size needed in order to meet reliability requirements. The methodology is applicable for automotive, military, and space applications, where there can be varying temperature ranges. A case study utilizing this methodology is given to design for reliability into a custom application-specific integrated circuit (ASIC) for a Mars exploration mission.

reliability↗

NASA NTRS1992

HDL to verification logic translator

The increasingly higher number of transistors possible in VLSI circuits compounds the difficulty in insuring correct designs. As the number of possible test cases required to exhaustively simulate a circuit design explodes, a better method is required to confirm the absence of design faults. Formal verification methods provide a way to prove, using logic, that a circuit structure correctly implements its specification. Before verification is accepted by VLSI design engineers, the stand alone verification tools that are in use in the research community must be integrated with the CAD tools used by the designers. One problem facing the acceptance of formal verification into circuit design methodology is that the structural circuit descriptions used by the designers are not appropriate for verification work and those required for verification lack some of the features needed for design. We offer a solution to this dilemma: an automatic translation from the designers' HDL models into definitions for the higher-ordered logic (HOL) verification system. The translated definitions become the low level basis of circuit verification which in turn increases the designer's confidence in the correctness of higher level behavioral models.

Gambles, J. W.↗

DOE OSTI2026

Cryogenic-Refined MOSFET Modeling for Oscillator, Frequency Divider, and Amplifier Designs Below 4 K

Capturing device characteristic changes at cryogenic temperatures is crucial for cryo-CMOS circuit designs. In this work, we present an isothermal cryogenic-refined modeling approach for CMOS transistors that is simple, low overhead, and easy to implement while offering the required accuracy for predicting circuit performance at the designated temperatures. Guided by die-level measurement data and circuit design principles, the model introduces corrections to only five critical parameters: threshold voltage, carrier mobility, elevated low-frequency flicker noise, dominant high-frequency shot noise, and subthreshold swing (SS). These refinements are implemented around the foundry-provided SPICE model, which is typically validated only down to about 200 K. With these adjustments, the proposed cryogenic-refined model achieves less than 5% error in both large-signal metrics (I–V characteristics) and small-signal parameters (e.g., transconductance) when compared with device measurements at deep-cryogenic temperatures. The methodology is validated in two advanced technologies: TSMC 40-nm CMOS and GlobalFoundries (GF) 45-nm RF-SOI. We further demonstrate its applicability in three representative RF circuits: a 30-GHz LC oscillator, a high-speed current-mode-logic (CML) frequency divider (FD), and a subthreshold Gb/s amplifier, all showing close agreement between simulated predictions and measurements performed at 4 and 2.5 K. Finally, we believe that the proposed approach is implementation-friendly and can significantly accelerate the development of cryo-CMOS integrated circuits.

circuit modeling↗

DOE OSTI2021

Accurate prediction of protein structures and interactions using a three-track neural network

DeepMind presented notably accurate predictions at the recent 14th Critical Assessment of Structure Prediction (CASP14) conference. We explored network architectures that incorporate related ideas and obtained the best performance with a three-track network in which information at the one-dimensional (1D) sequence level, the 2D distance map level, and the 3D coordinate level is successively transformed and integrated. The three-track network produces structure predictions with accuracies approaching those of DeepMind in CASP14, enables the rapid solution of challenging x-ray crystallography and cryo–electron microscopy structure modeling problems, and provides insights into the functions of proteins of currently unknown structure. The network also enables rapid generation of accurate protein-protein complex models from sequence information alone, short-circuiting traditional approaches that require modeling of individual subunits followed by docking. Here, we make the method available to the scientific community to speed biological research.

59 BASIC BIOLOGICAL SCIENCES↗

NASA NTRS1991

Theoretical and experimental characterization of coplanar waveguide discontinuities for filter applications

A full-wave analysis of shielded coplanar waveguide two-port discontinuities based on the solution of an appropriate surface integral equation in the space domain is presented. Frequency-dependent scattering parameters for open-end and short-end coplanar waveguide (CPW) stubs are computed using this method. The numerically derived results are compared with measurements performed in the frequency range 5-25 GHz and show very good agreement. From the scattering parameters, lumped-element equivalent circuits have been derived to model the discontinuities. The inductors and capacitors of these models have been represented by closed-form equations, as functions of the stub length, to compute the circuit element values for these discontinuities.

Dib, Nihad I.↗

NASA NTRS1993

Probe impedance measurements for millimeter-wave integrated horn antennas

In order to achieve an impedance-matched millimeter-wave integrated horn antenna mixer array, the characteristics of the antenna probes inside the horn must be known. This paper describes impedance measurements for various probes in low-frequency model horns of two different types: (1) a 3 x 3 array made of aluminum by electric discharge machining and (2) a half horn made of copper sheet placed on a big copper-clad circuit board that was used as an image plane. The results of measurements indicate that the presence of the horn increases the effective length of the probe element, in agreement with reports of Guo et al. (1991) and theoretical analysis of Eleftheriades et al. (1991). It was also found that the resonant frequencies can be controlled by changing the length of the probes or by loading the probes.

Guo, Yong↗

NASA NTRS2001

Higher-Order Theory for Functionally Graded Materials

Functionally graded materials (FGM's) are a new generation of engineered materials wherein the microstructural details are spatially varied through nonuniform distribution of the reinforcement phase(s). Engineers accomplish this by using reinforcements with different properties, sizes, and shapes, as well as by interchanging the roles of the reinforcement and matrix phases in a continuous manner (ref. 1). The result is a microstructure that produces continuously or discretely changing thermal and mechanical properties at the macroscopic or continuum scale. This new concept of engineering the material's microstructure marks the beginning of a revolution both in the materials science and mechanics of materials areas since it allows one, for the first time, to fully integrate the material and structural considerations into the final design of structural components. Functionally graded materials are ideal candidates for applications involving severe thermal gradients, ranging from thermal structures in advanced aircraft and aerospace engines to computer circuit boards. Owing to the many variables that control the design of functionally graded microstructures, full exploitation of the FGM's potential requires the development of appropriate modeling strategies for their response to combined thermomechanical loads. Previously, most computational strategies for the response of FGM's did not explicitly couple the material's heterogeneous microstructure with the structural global analysis. Rather, local effective or macroscopic properties at a given point within the FGM were first obtained through homogenization based on a chosen micromechanics scheme and then subsequently used in a global thermomechanical analysis.

Aboudi, J.↗