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At least 325 records · Page 18

Ultrasonic waveguide reflectometry for quench detection (CRADA Final Report)

Early detection of thermal runaway (quench) is critical for safely operating high-temperature superconductor (HTS) magnets. Voltage-based techniques provide late detection of quenching in HTS, which can lead to magnet burnout and system damage. Various non-voltage quench-detection approaches are therefore investigated nowadays that are based on magnetic, acoustic, and optical sensing. LBNL has been actively developing the quench detection principle based on diffuse ultrasonic wave propagation since 2017 and has demonstrated the approach's viability with several peer-reviewed publications and a patent application. Over the last decade, Etegent, LBNL partner for this proposal and effort, has been developing a sensing technology that utilizes the propagation of stress waves through the solid metallic and nonmetallic waveguides (WG). The method is based on the dependence of materials' elastic properties and the speed of sound on temperature. Compared with optical analog, acoustic WG operates at much lower frequencies, eliminating the need for expensive, complex, highly sensitive receivers and data processing. Etegent proved this technology in many harsh environments, mainly concentrated high-temperature measurements. The initial contact between LBNL and Etegent started in 2020, aiming at combining our knowledge and effort toward developing a viable ultrasound-based quench detection technique for use with HTS magnets. A preliminary study conducted jointly in 2022 found no principle restrictions for expanding the WG technology toward cryogenic temperature operation. The present CRADA work aimed at designing, building, and testing ultrasonic waveguide temperature sensors at relevant cryogenic conditions, and demonstrating this technology's applicability to detecting heating and quenching in High Temperature Superconductor (HTS)-based cables and magnets. The technical objectives of the project included: (1) Design and fabricate ultrasonic WG sensors suitable for cryogenic operation, (2) Test ultrasonic WGs under cryogenic conditions, (3) Determining a suitable way of insulating WGs to prevent ultrasonic leakage while maintaining good thermal contact with the surrounding medium, (4) WG integration and cryogenic test with HTS conductors and HTS magnets, and (5) Design and basic prototyping of a standalone WG-based quench detection system. This project adds value to the present LBNL magnet diagnostics portfolio and enables a breakthrough in addressing the HTS magnet quench detection challenge.

47 OTHER INSTRUMENTATION↗

Communications Transceivers for Venus Surface Missions

The high temperature of the surface of Venus poses many difficulties. Previous Venus landers have only operated for short durations before succumbing to the heat. NASA Glenn Research Center conducted a study on communications for long duration Venus surface missions. I report the findings in this presentation. Current technology allows production of communications transceivers that can operate on the surface of Venus, at temperatures above 450 C and pressures of over 90 atmospheres. While these transceivers would have to be relatively simple, without much of the advanced signal processing often used in modern transceivers, since current and near future integrated circuits cannot operate at such high temperatures, the transceivers will be able to meet the requirements of proposed Venus Surface mission. The communication bands of interest are High Frequency or Very High Frequency (HFNHF) for communication between Venus surface and airborne probes (including surface to surface and air to air), and Ultra High Frequency (UHF) to Microwave bands for communication to orbiters. For HFNHF, transceivers could use existing vacuum tube technology. The packaging of the vacuum tubes may need modification, but the internal operating structure already operates at high temperatures. Using metal vacuum structures instead of glass, allows operation at high pressure. Wide bandgap transistors and diodes may be able to replace some of the thermionic components. VHF communications would be useful for line-of- sight operations, while HF would be useful for short-wave type communications using the Venusian ionosphere. UHF and microwave communications use magnetically focused thermionic devices, such as traveling wave tubes (TWTs), magnetron (M-type) amplifiers, and klystrons for high power amplifiers, and backward wave oscillators (BWOs) and reflex klystrons for oscillators. Permanent magnets are already in use in industry that can operate at 500 C. These magnets could focus electron beam tubes on the surface of Venus. While microwave windows will need to be designed for the high pressure, diamond windows have already been demonstrated, so high-pressure microwave windows can be designed and built. Thus, all of these devices could be useful for Venus surface missions. Current electronic power conditioners to supply the high voltages used in these microwave devices cannot operate at high temperatures, but earlier electronic power conditioners that used vacuum tubes can be modified to work at high temperature. Evaluating the various devices in this study, the M-type traveling wave tube (where a traveling wave structure is used in a crossed-field device, similar to the Amplitron used on the Apollo missions) stood out for the high power amplifier since it requires a single high voltage, simplifying the power supply design. Since the receiver amplifier is a low power amplifier, the loss of efficiency in linear beam devices without a depressed collector (and thus needing a single high voltage) is not important; a low noise TWT is a possible solution. Before solid-state microwave amplifiers were available, such TWTs were built with a 1-2 dB noise figure. A microwave triode or transistor made from a wide bandgap material may be preferable, if available. Much of the development work needed for Venusian communication devices will need to focus on the packaging of the devices, and their connections, but the technology is available to build transceivers that can operate on the surface of Venus indefinitely.

Force, Dale A.↗

High Temperature Fusion Reactor Cooling Using Brayton Cycle Based Partial Energy Conversion

For some future space power systems using high temperature nuclear heat sources most of the output energy will be used in other than electrical form, and only a fraction of the total thermal energy generated will need to be converted to electrical work. The paper describes the conceptual design of such a partial energy conversion system, consisting of a high temperature fusion reactor operating in series with a high temperature radiator and in parallel with dual closed cycle gas turbine (CCGT) power systems, also referred to as closed Brayton cycle (CBC) systems, which are supplied with a fraction of the reactor thermal energy for conversion to electric power. Most of the fusion reactor's output is in the form of charged plasma which is expanded through a magnetic nozzle of the interplanetary propulsion system. Reactor heat energy is ducted to the high temperature series radiator utilizing the electric power generated to drive a helium gas circulation fan. In addition to discussing the thermodynamic aspects of the system design the authors include a brief overview of the gas turbine and fan rotor-dynamics and proposed bearing support technology along with performance characteristics of the three phase AC electric power generator and fan drive motor.

Juhasz, Albert J.↗

Microfabricated thermoelectric power-generation devices

A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a BiTe alloy-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

Fleurial, Jean-Pierre↗

Microfabricated thermoelectric power-generation devices

A device for generating power to run an electronic component. The device includes a heat-conducting substrate (composed, e.g., of diamond or another high thermal conductivity material) disposed in thermal contact with a high temperature region. During operation, heat flows from the high temperature region into the heat-conducting substrate, from which the heat flows into the electrical power generator. A thermoelectric material (e.g., a BiTe alloy-based film or other thermoelectric material) is placed in thermal contact with the heat-conducting substrate. A low temperature region is located on the side of the thermoelectric material opposite that of the high temperature region. The thermal gradient generates electrical power and drives an electrical component.

Fleurial, Jean-Pierre↗

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

The emergence of wide-bandgap (WBG) devices in power electronics packages has brought significant attention to the reliability and thermal performance of the bonded interfaces. These interfaces, such as die-attach and substrate-attach, need to withstand the severe stress induced on them by the high-temperature (> 200°C) operation of the WBG devices. Sintered silver and transient liquid phase alloys are key bonded interfaces that can enable the high-temperature operation of WBG devices, however it is essential to evaluate their reliability and study the possible failure mechanisms before they can be used in power electronics packages. Sintered silver is already being adopted in commercial packages as a die-attach, but large-area substrate-attach offers additional reliability challenges. In this project, we investigate the reliability of these interface materials under accelerated thermal cycling and correlate these results with finite element simulations to develop lifetime prediction models. The failure mechanisms of these bonded interfaces are also studied.

47 OTHER INSTRUMENTATION↗

Induction graphitizing furnace acceptance test report

The induction furnace was designed to provide the controlled temperature and environment required for the post-cure, carbonization and graphitization processes for the fabrication of a fibrous graphite NERVA nozzle extension. The acceptance testing required six tests and a total operating time of 298 hrs. Low temperature mode operations, 120 to 850 C, were completed in one test run. High temperature mode operations, 120 to 2750 C, were completed during five tests.

Source record↗

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

Chen, Liang-Yu↗

Modified Tubular Combustors as High-temperature Gas Generators

A pair of combustors and transition liners in a quarter-annular, direct-connect assembly was operated at temperatures up to 2400 degrees F to determine the feasibility of using production-type combustor systems as high-tmeperature gas generators for turbine-cooling studies. Operation at high temperatures for 32 hours was possible when minor liner modifications were made that provided greater cooling-air flow between the turbine casing and interior components.

Friedman, Robert↗

Characterization of high-temperature figure of merit for solar-thermal absorbers

The figure of merit (FOM) is a widely used metric to characterize the solar-thermal conversion performance of solar absorber layers. Many of previous works have reported FOMs estimated from the radiative properties measured at room temperature. However, advanced concentrated solar power (CSP) plants operate at very high temperatures (~750°C), which can strongly affect the absorber’s radiative properties. Here, the present work proposes using a 1-D conduction-based reference bar technique to directly measure the converted thermal energy to determine the FOM at high absorber temperatures (≳ 750°C) while operating under a large solar concentration (~ 1200 x suns). Using the finite difference method, we carefully analyze several key parameters influencing the design of the experimental setup, such as temperature distribution, material properties, heat loss, and sensor accuracy. In addition, a rigorous uncertainty analysis is incorporated into the FOM to ascertain the confidence level of the result. We validate this new technique on a custom-built tungsten reference bar with an oxidized Inconel 625 solar-thermal absorber. A good agreement between the model and the experiment shows the reliability of the FOM measurement with a well-defined uncertainty. The same method can be implemented to measure the high-temperature FOM of most surface or volumetric solar absorbers for CSP.

14 SOLAR ENERGY↗

Ultrasonic/Sonic Drill for High Temperature Application

Venus is one of the many significant scientific targets for NASA. New rock sampling tools with the ability to be operated at high temperatures of the order of 460 deg C are required for surface in-situ sampling/analysis missions. Piezoelectric materials such as LiNbO? crystals and Bismuth Titanate are potentially operational at the temperature range found on the surface of Venus. A study of the feasibility of producing piezoelectric drills for a temperature up to 500 deg C was conducted. The study includes investigation of the high temperature properties of piezoelectric crystals and ceramics with different formulas and doping. Several prototypes of Ultrasonic/Sonic Drill/Corers (USDC) driven by transducers using the high temperate piezoelectric ceramics and single LiNbO? crystal were fabricated. The transducers were analyzed by scanning the impedance at room temperature and 500 deg C under both low and high voltages. The drilling performances were tested at temperature up to 500 deg C. Preliminary results were previously reported [Bao et al, 2009]. In this paper, the progress is presented and the future works for performance improvements are discussed.

Piezoelectric Drill↗

Circuit and Method for Communication Over DC Power Line

A circuit and method for transmitting and receiving on-off-keyed (OOK) signals with fractional signal-to-noise ratios uses available high-temperature silicon- on-insulator (SOI) components to move computational, sensing, and actuation abilities closer to high-temperature or high-ionizing radiation environments such as vehicle engine compartments, deep-hole drilling environments, industrial control and monitoring of processes like smelting, and operations near nuclear reactors and in space. This device allows for the networking of multiple, like nodes to each other and to a central processor. It can do this with nothing more than the already in-situ power wiring of the system. The device s microprocessor allows it to make intelligent decisions within the vehicle operational loop and to effect control outputs to its associated actuators. The figure illustrates how each node converts digital serial data to OOK 18-kHz in transmit mode and vice-versa in receive mode; though operations at lower frequencies or up to a megahertz are within reason using this method and these parts. This innovation s technique modulates a DC power bus with millivolt-level signals through a MOSFET (metal oxide semiconductor field effect transistor) and resistor by OOK. It receives and demodulates this signal from the DC power bus through capacitive coupling at high temperature and in high ionizing radiation environments. The demodulation of the OOK signal is accomplished by using an asynchronous quadrature detection technique realized by a quasi-discrete Fourier transform through use of the quadrature components (0 and 90 phases) of the carrier frequency as generated by the microcontroller and as a function of the selected crystal frequency driving its oscillator. The detected signal is rectified using an absolute-value circuit containing no diodes (diodes being non-operational at high temperatures), and only operational amplifiers. The absolute values of the two phases of the received signal are then summed and hard limited (digitized) by comparing them to a reference level and are then input into a microprocessor as a serial bit stream. The quasi-discrete Fourier transform is performed in high-temperature components (operational amplifiers, analog switches, resistors, and capacitors). The demodulated signal is a serial data stream that is input to the UART (universal asynchronous receiver transmitter) receiver pin of the microprocessor. The OOK of the carrier frequency uses the output of the UART pin as an enabling signal that drives the gate of the MOSFET. Logic low bits enable the carrier frequency (realized by using the 0 phase signal from the microcontroller, though either phase may be used) to be DC-coupled to the power supply bus through a current-limiting resistor mounted between the MOSFET drain and the supply rail. The presence of logic lows on the power supply rail is realized by carrier bursts while logic highs are realized by the absence of bursts.

Krasowski, Michael J.↗

Whistle Gauge Measures Flow And Temperature

Simple, rugged gauge used to measure speed of flow and temperature of steam or other gas flowing through pipes of arbitrary diameter, from 1 to 28 in. or larger. Specially designed, instrumented whistle - has no moving parts, small, nonobstruction, operates at high temperature and pressure, and cleans itself. Does not operate at zero flow, but at moderate flows (tens of meters per second) generates intense sound for use in measurements. Consists of slanted ring groove of depth D and pressure taps in wall of pipe carrying flow to be measured. Resonant wavelength of sound generated by ring groove depends primarily on size and shape of groove and approximately equal to 4D.

Shakkottai, Parthasarathy↗

New materials for high temperature turbines; ONERA's DS composites confronted with blade problems

ONERA's refractory DS composites were cited as materials required for use in advanced aircraft turbines, operating at high temperatures. These materials were found to be reliable in the construction of turbine blades. Requirements for a blade material in aircraft turbines operating at higher temperatures were compared with the actual performance as found in COTAC DS composite testing. The structure and properties of the more fully developed 74 and 741 types were specified. High temperature structural stability, impact of thermal and mechanical fatigue, oxidation resistance and coating capability were thoroughly evaluated. The problem of cooling passages in DS eutectic blades is also outlined.

Bibring, H.↗

Low Frequency High Amplitude Temperature Oscillations in Loop Heat Pipe Operation

This paper presents viewgraphs on the low frequency high amplitude temperature oscillations observed in loop heat pipe operations. The topics include: 1) Proposed Theory; 2) Test Loop and Test Results; and 3) Effects of Various Parameters. The author also presents a short summary on the conditiions that must be met in order to sustain a low frequency high amplitude temperature oscillation.

Ku, Jentung↗

Developments on high temperature fiber optic microphone

A fiber optic microphone, based on the principle of the fiber optic lever, features small size, extended bandwidth, and capability to operate at high temperatures. These are requirements for measurements in hypersonic flow. This paper describes the principles of operation of fiber optic sensors, a discussion of the design of a fiber optic microphone, the functional elements and packaging techniques of the optoelectronic circuitry, and the calibration techniques used in the development of the high temperature fiber optic microphone.

Wright, Kenneth D., II↗

Power Electronics Thermal Management

This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (250°C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers that will present reliability challenges and require higher-temperature substrates and bonding materials.

47 OTHER INSTRUMENTATION↗