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NASA NTRS2010

High-Temperature Optical Sensor

A high-temperature optical sensor (see Figure 1) has been developed that can operate at temperatures up to 1,000 C. The sensor development process consists of two parts: packaging of a fiber Bragg grating into a housing that allows a more sturdy thermally stable device, and a technological process to which the device is subjected to in order to meet environmental requirements of several hundred C. This technology uses a newly discovered phenomenon of the formation of thermally stable secondary Bragg gratings in communication-grade fibers at high temperatures to construct robust, optical, high-temperature sensors. Testing and performance evaluation (see Figure 2) of packaged sensors demonstrated operability of the devices at 1,000 C for several hundred hours, and during numerous thermal cycling from 400 to 800 C with different heating rates. The technology significantly extends applicability of optical sensors to high-temperature environments including ground testing of engines, flight propulsion control, thermal protection monitoring of launch vehicles, etc. It may also find applications in such non-aerospace arenas as monitoring of nuclear reactors, furnaces, chemical processes, and other hightemperature environments where other measurement techniques are either unreliable, dangerous, undesirable, or unavailable.

Adamovsky, Grigory↗

NASA NTRS2006

Deep-UV Based Acousto-Optic Tunable Filter for Spectral Sensing Applications

In this paper, recent progress made in the development of quartz and KDP crystal based acousto-optic tunable filters (AOTF) are presented. These AOTFs are developed for operation over deep-UV to near-UV wavelengths of 190 nm to 400 nm. Preliminary output performance measurements of quartz AOTF and design specifications of KDP AOTF are presented. At 355 nm, the quartz AOTF device offered approx.15% diffraction efficiency with a passband full-width-half-maximum (FWHM) of less than 0.0625 nm. Further characterization of quartz AOTF devices at deep-UV wavelengths is progressing. The hermetic packaging of KDP AOTF is nearing completion. The solid-state optical sources being used for excitation include nonlinear optics based high-energy tunable UV transmitters that operate around 320 nm and 308 nm wavelengths, and a tunable deep-UV laser operating over 193 nm to 210 nm. These AOTF devices have been developed as turn-key devices for primarily for space-based chemical and biological sensing applications using laser induced Fluorescence and resonance Raman techniques.

Prasad, Narasimha S.↗

NASA NTRS1984

NSC 800, 8-bit CMOS microprocessor

The NSC 800 is an 8-bit CMOS microprocessor manufactured by National Semiconductor Corp., Santa Clara, California. The 8-bit microprocessor chip with 40-pad pin-terminals has eight address buffers (A8-A15), eight data address -- I/O buffers (AD(sub 0)-AD(sub 7)), six interrupt controls and sixteen timing controls with a chip clock generator and an 8-bit dynamic RAM refresh circuit. The 22 internal registers have the capability of addressing 64K bytes of memory and 256 I/O devices. The chip is fabricated on N-type (100) silicon using self-aligned polysilicon gates and local oxidation process technology. The chip interconnect consists of four levels: Aluminum, Polysi 2, Polysi 1, and P(+) and N(+) diffusions. The four levels, except for contact interface, are isolated by interlevel oxide. The chip is packaged in a 40-pin dual-in-line (DIP), side brazed, hermetically sealed, ceramic package with a metal lid. The operating voltage for the device is 5 V. It is available in three operating temperature ranges: 0 to +70 C, -40 to +85 C, and -55 to +125 C. Two devices were submitted for product evaluation by F. Stott, MTS, JPL Microprocessor Specialist. The devices were pencil-marked and photographed for identification.

Suszko, S. F.↗

NASA NTRS2015

Radiation-Resistant Photon-Counting Detector Package Providing Sub-ps Stability for Laser Time Transfer in Space

We are reporting on a design, construction and performance of photon-counting detector packages based on silicon avalanche photodiodes. These photon-counting devices have been optimized for extremely high stability of their detection delay. The detectors have been designed for future applications in fundamental metrology and optical time transfer in space. The detectors have been qualified for operation in space missions. The exceptional radiation tolerance of the detection chip itself and of all critical components of a detector package has been verified in a series of experiments.

radiation hardness↗

NASA NTRS1991

Quad-Port Transceivers For A Dual-CRR LAN

Quad-port fiber-optic transceivers demonstrated successfully as physical-layer interface units in WhisperNet - local-area network (LAN) of computers and other devices in communication with each other. Each node of Dual-CRR LAN contains quad-port transceiver serving four pairs of optical fibers. Quad-port transceiver consists of two dual-port transceivers and ancillary equipment in compact package. Transceiver serves as interface between optical fibers and external computing devices. Because of high reliability, availability and "fail-soft" nature, network well suited to military and critical commercial applications.

Wiencko, Joseph A., Jr.↗

NASA NTRS2015

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

dielectric properties↗

NASA NTRS2006

Phase Calibration of Microphones by Measurement in the Free-field

Over the past several years, significant effort has been expended at NASA Langley developing new Micro-Electro-Mechanical System (MEMS)-based microphone directional array instrumentation for high-frequency aeroacoustic measurements in wind tunnels. This new type of array construction solves two challenges which have limited the widespread use of large channel-count arrays, namely by providing a lower cost-per-channel and a simpler method for mounting microphones in wind tunnels and in field-deployable arrays. The current generation of array instrumentation is capable of extracting accurate noise source location and directivity on a variety of airframe components using sophisticated data reduction algorithms [1-2]. Commercially-available MEMS microphones are condenser-type devices and have some desirable characteristics when compared with conventional condenser-type microphones. The most important advantages of MEMS microphones are their size, price, and power consumption. However, the commercially-available units suffer from certain important shortcomings. Based on experiments with array prototypes, it was found that both the bandwidth and the sound pressure limit of the microphones should be increased significantly to improve the performance and flexibility of the microphone array [3]. It was also desired to modify the packaging to eliminate unwanted Helmholtz resonance s exhibited by the commercial devices. Thus, new requirements were defined as follows: Frequency response: 100 Hz to 100 KHz (+/-3dB) Upper sound pressure limit: Design 1: 130 dB SPL (THD less than 5%) Design 2: 150-160 dB SPL (THD less than 5%) Packaging: 3.73 x 6.13 x 1.3 mm can with laser-etched lid. In collaboration with Novusonic Acoustic Innovation, NASA modified a Knowles SiSonic MEMS design to meet these new requirements. Coupled with the design of the enhanced MEMS microphones was the development of a new calibration method for simultaneously obtaining the sensitivity and phase response of the devices over their entire broadband frequency range. Traditionally, electrostatic actuators (EA) have been used to characterize air-condenser microphones; however, MEMS microphones are not adaptable to the EA method due to their construction and very small diaphragm size [4]. Hence a substitution based, free-field method was developed to calibrate these microphones at frequencies up to 80 kHz. The technique relied on the use of a random, ultrasonic broadband centrifugal sound source located in a small anechoic chamber. The free-field sensitivity (voltage per unit sound pressure) was obtained using the procedure outlined in reference 4. Phase calibrations of the MEMS microphones were derived from cross spectral phase comparisons between the reference and test substitution microphones and an adjacent and invariant grazing-incidence 1/8-inch standard microphone. The free-field calibration procedure along with representative sensitivity and phase responses for the new high-frequency MEMS microphones are presented here.

Shams, Qamar A.↗

NASA NTRS2002

Fluid Dynamics of Small, Rugged Vacuum Pumps of Viscous-Drag Type

The need to identify spikes in the concentration of hazardous gases during countdowns to space shuttle launches has led Kennedy Space Center to acquire considerable expertise in the design, construction, and operation of special-purpose gas analyzers of mass-spectrometer type. If such devices could be miniaturized so as to fit in a small airborne package or backpack them their potential applications would include integrated vehicle health monitoring in later-generation space shuttles and in hazardous material detection in airports, to name two examples. The bulkiest components of such devices are vacuum pumps, particularly those that function in the low vacuum range. Now some pumps that operate in the high vacuum range (e.g. molecular-drag and turbomolecular pumps) are already small and rugged. The present work aims to determine whether, on physical grounds, one may or may not adopt the molecular-drag principle to the low-vacuum range (in which case viscous-drag principle is the appropriate term). The deliverable of the present effort is the derivation and justification of some key formulas and calculation methods for the preliminary design of a single-spool, spiral-channel viscous-drag pump.

Russell, John M.↗

DOE OSTI2024

Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding

High temperature packaging technologies are a necessity for high temperature capable devices. SAC305 solder has an operational limit of 174°C imposed by creep effects which aligns well with current junction temperature limits of 175°C. Wide band gap semiconductor materials have the potential to reach junction temperatures of up to 800°C that are not currently attainable with significant reliability. Capitalizing on this potential will requires substrates and attachments that can operate well beyond the current 175°C standard. Silver sintering pastes have received widespread interest as a high temperature attachment alternative. However, the process requires high pressure bonding in an inert environment to achieve acceptable bond quality. Transient liquid phase (TLP) sintering is capable of good bond quality without pressure requirements but suffers from low thermal conductivity and only slightly reduced cost compared to silver sintering. SAC305 solder contains the same constituent materials for TLP as available copper-tin TLP sintering paste. By introducing engineered surface structures into the bond, intermetallic formation can be accelerated producing a bond similar to TLP sintering but in an ambient environment and for reduced cost. While this process has been demonstrated, it has not yet been optimized. Currently bonds are formed using a 75 μm stencil on substrate surface structures 24 μm tall, covering 19% of the bonding area. The process takes about 4 hours not including the formation of surface structures. Here, this study will center on the effects of stencil thickness and coating methods. Samples will be analyzed by scanning acoustic microscopy, die shear testing and cross sectional scanning acoustic microscopy.

42 ENGINEERING↗

DOE OSTI2023

Power Conversion Systems Enabled by SiC BiDFET Device

The BiDirectional Field-Effect Transistor (BiDFET) can enable circuit topologies requiring four quadrant switches, that were earlier designed using discrete combinations of MOSFETs, IGBTs, GaN HEMTs and PiN diodes. The monolithic nature of the BiDFET allows lower device count, smaller switch volume, lower inductance, and simpler packaging, and hence more reliable and commercially viable implementation in power electronics converters. Furthermore, the matrix converter topologies, now feasible using BiDFETs, can eliminate the bulky and unreliable dc link capacitors or inductors required for conventional voltage-source or current-source converters in ac-ac and ac dc applications. The 1.2 kV BiDFET has the potential to disrupt all the applications utilizing 1.2 kV switches, including electric vehicle (EV) drivetrain, bidirectional EV chargers, industrial motor drives, solid-state transformers, datacenter power supplies, elevator drives, dc microgrids, energy storage grid integration, solid-state breakers, etc.

42 ENGINEERING↗

DOE OSTI2024

Dendrometer data at The Morton Arboretum Forestry Plots 2019-2023

We are collecting long-term dendrometer data at The Morton Arboretum to determine seasonal growth patterns in trees. This data on stem growth patterns will eventually be integrated with other ongoing data streams to paint a broader picture of plant phenology. This data package contains the outputs from three types of dendrometer devices: ICT band dendrometer data is in the "ICT_data2020_2023.csv" file, TreeHugger band dendrometer data is in the "TreeHugger_data2019_2020.csv" file, and TOMST point dendrometer data is in the "TOMST_data2021_2023.csv" file. The TreeHugger and TOMST files contain corrected and raw uncorrected values, whereas the ICT data file contains only raw data. Initial tree size data at device installation is located in the "Initial_Tree_Size.csv" file. Additional information on units are contained within each data file's respective data dictionary, and the location metadata file contains the geographic locations of the 23 forestry plots at The Morton Arboretum as well as the measured tree species at each location.

54 ENVIRONMENTAL SCIENCES↗

NASA NTRS2001

Deep Space 1: Testing New Technologies for Future Small Bodies Missions

Launched on October 24, 1998, Deep Space 1 (DS1) was the first mission of NASA's New Millennium Program, chartered to validate in space high-risk, new technologies important for future space science programs. The advanced technology payload that was tested on DS1 comprises solar electric propulsion, solar concentrator arrays, autonomous on-board navigation and other autonomous systems, several telecommunications and microelectronics devices, and two low-mass integrated science instrument packages. The mission met or exceeded all of its success criteria. The 12 technologies were rigorously exercised so that subsequent flight projects would not have to incur the cost and risk of being the fist users of these new capabilities. Examples of the benefits to future small body missions from DS1's technologies will be described.

Deep Space 1 (DS1)↗

NASA NTRS2018

A Study of Shape Memory Polymer Based Slat-Cove Filler

Aircraft noise reduction is an application of current intense interest for which smart materials show significant potential. Specifically, the aeroacoustic noise produced by the unsteady aerodynamic flow about the leading-edge high-lift device, such as leading-edge slat, of typical transport-aircraft wings is of particular interest. Concepts with the most promise to mitigate this noise source, most notably the slat-cove filler concept, have focused on highly reconfigurable structures that change shape between different phases of the flight envelope. These shape changes often involve large deformation, which has stimulated the consideration of shape memory materials. In recent years, shape memory materials (SMMs) have drawn greater interest for applications such as smart fabrics, intelligent medical devices, self-deployable space structures, morphing structures and packaging. Compared to other shape memory materials, like shape memory alloys (SMAs) or shape memory ceramics (SMCs), shape memory polymers (SMPs) have desirable advantages such as high elastic deformation to enable large shape change, broad tailorability of mechanical properties, potential biocompatibility and biodegradability, ductility, light weight and ease of processing. However, SMPs still have some critical disadvantages such as insufficient mechanical and thermal characteristics for structural applications, low recovery stress, and long response time. The new LaRC shape memory thermosetting polymer composite (LaRC-SMPC) discussed herein was synthesized with nontoxic monomers and conductive/magnetic fillers to yield enhanced thermal/mechanical characteristics and faster response times. LaRC-SMPCs with a variety of fiber reinforcements [Kevlar®, carbon fiber (standard and thin-ply), and carbon-nanotube (CNT) sheet] were fabricated to tailor the physical properties and test for suitability as a slat-cove filler (SCF). The performance of SCF prototypes fabricated with the developed LaRC-SMPCs was evaluated using a bench-top test apparatus. The SCFs made of Kevlar® fiber fabric or carbon fiber fabric infused shape memory polymer composite (SMPC) exhibited kinking during simulated deployment and stowage, which can be problematic during operation. The SCF made of CNT sheet/SMP composite did not exhibit kinking, but the deployment was sluggish compared to carbon fiber fabric/SMP composite. This report documents the evolution of designing SMPCs as slat-cove fillers for aircraft noise reduction. In the course of the investigation, several 2 approaches were investigated to address shortcomings in material characteristics based on performance requirements of operational slat-cove fillers.

Kang, Jin Ho↗

NASA NTRS2010

NEPP non-volatile memory : FY09 summary report

This report documents the activities and results of the fiscal year 2009 (FY09) funding for the NASA Electronic Parts and Packaging (NEPP) program for non-volatile memory (NVM) devices. The FY09 task was divided into two main efforts: 1. Development of in-house measurement capability for flash devices 2. Reliability characterization of multi-level vs. single-level flash devices The FY09 NEPP Non Volatile Memory study was organized into these two sections in recognition of the continued and increasing importance of NVM to NASA. All NASA missions use NVM for boot code storage and some limited data archiving. Space-grade NVM has lagged commercial NVM development by many orders of magnitude, however. This gap in density only continues to increase as space-grade memories remain constant in the 1–16 Mbit levels, while commercial flash-based devices shrink in size and double in capacity every 18 months. Commercial flash devices are now at the 32 Gbit level, 10,000 times denser than current NASA NVM. This FY marks the beginning of a significant technological transition in NVM for NASA. The aggressive scaling of commercial NVMs has, as a by-product, made some of the flash devices radiation-tolerant enough to be at least considered for low-level radiation environment missions [Irom 2008]. This NEPP task is focused on understanding the reliability and potential future applications of such highly scaled flash memories.

Heidecker, Jason↗

NASA NTRS1995

High Precision Piezoelectric Linear Motors for Operations at Cryogenic Temperatures and Vacuum

The Jet Propulsion Laboratory evaluated the use of an electromechanical device for optically positioning a mirror system during the pre-project phase of the Pluto-Fast-Flyby (PFF) mission. The device under consideration was a piezoelectric driven linear motor functionally dependent upon a time varying electric field which induces displacements ranging from submicrons to millimeters with positioning accuracy within nanometers. Using a control package, the mirror system provides image motion compensation and mosaicking capabilities. While this device offers unique advantages, there were concerns pertaining to its operational capabilities for the PFF mission. The issues include irradiation effects and thermal concerns. A literature study indicated that irradiation effects will not significantly impact the linear motor's operational characteristics. On the other hand, thermal concerns necessitated an in depth study.

piezoelectric motors↗

NASA NTRS1972

Nimbus D RMP program

The development of an advanced long life rate measuring package, designed for a five year useful life as a meteorological satellite control sensor is discussed. The primary function of the rate mesuring package is to provide rate information for the reaction wheel and gas jet torquing devices that are used to damp spacecraft oscillations and to constrain the spacecraft to the required attitude with respect to the orbital plane. The specifications for the rate measuring package sensor are described. Application of the rate measuring package to the Nimbus D satellite is proposed.

Source record↗

NASA NTRS1991

The Rocketdyne Multifunction Tester. Part 1: Test Method

The Rocketdyne Multifunction Tester is a general purpose test apparatus which utilizes axial and radial magnetic bearings as shaft excitation devices. The tester is modular in design so that different seal and bearing packages can be tested on the same test stand. The tester will be used for rotordynamic coefficient extraction, as well as life and fluid/material compatibility evaluations. Use of a magnetic bearing as a shaft excitation device opens up many possibilities for shaft excitation and rotordynamic coefficient extraction. In addition to describing the basic apparatus, some of the excitation and extraction methods are described. Some of the excitation methods to be discussed include random, aperiodic, harmonic, impulse and chirp.

Murphy, Brian T.↗

NASA NTRS1995

A new RF package suitable for aeronautical commercial and DSCS satellite applications

Higher levels of integration through the use of GaAs and silicon MMIC devices, a die-cast housing, and the reduction of the number of subassemblies has enabled a large reduction of the size and weight of the electronics package for commercial and military satellite communications. This paper presents an electronics architecture and hardware that utilizes many new integrated circuits and design techniques, and allows flexibility for future satellite frequency changes and expansion. Key features of the radio are extended C-band, InSat, Defense Satellite Communications System (DSCS), and Ku-band coverage options; 70 (or 140) MHz transponder bandwidth or L-band block bandwidth IFs; integrated RS-232 control through local handheld terminal or remote computer; remote control of crystal reference oscillator for aging and temperature compensation; integrated 2 or 5 watt solid-state power amplifiers (SSPA); optional integrated solid-state booster amplifiers to 40 watts; optional external amplifiers to 100 watts; integral beacon tracking with second integrated downcoverter for antenna positioning; radio, including low-noise block converter (LNB) and SSPA, weighs 8.5 kg and measures 32 x 23 x 16.5 cm; environmentally ruggedized for -40 to +60 C; O-ring sealed for waterproofing; passive (convection) cooling; and simple cabling and installation, with a single cable between radio and LNB, and two cables between radio and IF interface. The small size and light weight of the radio make it ideal for mounting on stabilized antenna platforms (gyroscopic or servo). Several input power options (110 or 220 VAC; +48, +12, or -24 VDC) facilitate operation on multiple platforms.

Hamilton, Robert J., Jr.↗