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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18

Exploration Toilet Integration Challenges on the International Space Station

On the International Space Station (ISS) there are currently two toilets. One is located in the Russian Service Module and the other is located in the U.S. segment's Node 3. A new Exploration Toilet will be integrated next to the existing Node 3 Waste and Hygiene Compartment (WHC). The Toilet will be evaluated as a technology demonstration for a minimum of three years. In addition, it will support an increase in ISS crew size due to Commercial Crew flights to ISS. The Toilet is designed to minimize mass and volume for Orion, the first Exploration vehicle. Currently ISS does not have a designated volume for an additional Toilet. Furthermore, operating the Toilet on ISS presents a different set of challenges as it must integrate into existing vehicle systems for urine processing. To integrate the Toilet on ISS, a suite of hardware was developed to provide mechanical, electrical, data, and fluid interfaces. This paper will provide an overview of the Toilet Integration Hardware design as well as the engineering challenges, crew interface provisions and vehicle integration complexities encountered during the concept and design phases.

Node 3↗

Evaluation and recommendations for work group integration within the Materials and Processes Lab

The goal of this study was to evaluate and make recommendations for improving the level of integration of several work groups within the Materials and Processes Lab at the Marshall Space Flight Center. This evaluation has uncovered a variety of projects that could improve the efficiency and operation of the work groups as well as the overall integration of the system. In addition, this study provides the foundation for specification of a computer integrated manufacturing test bed environment in the Materials and Processes Lab.

Farrington, Phillip A.↗

Applications and limitations of very large-scale integration in SAR azimuth processing

The major limitation of a convolution processor designed with CCD memory chips is the inability to operate in real time except for slow aircraft speeds or coarse resolutions. Two methods of summing the products were evaluated with respect to speed, power, and space requirements. A convolution processor was designed, and the number of chips as well as the power and volume requirements were determined using 4, 6, and 8 bit data words. The processor is flexible because range samples may be traded for additional azimuth samples by altering the control signals. The processor is also modular, and additional range or azimuth may be processed by adding more cards.

Kuhler, D. G.↗

Perspectives on integrated modeling of transport processes in semiconductor crystal growth

The wide range of length and time scales involved in industrial scale solidification processes is demonstrated here by considering the Czochralski process for the growth of large diameter silicon crystals that become the substrate material for modern microelectronic devices. The scales range in time from microseconds to thousands of seconds and in space from microns to meters. The physics and chemistry needed to model processes on these different length scales are reviewed.

Brown, Robert A.↗

Integrated lunar materials manufacturing process

A manufacturing plant and process for production of oxygen on the moon uses lunar minerals as feed and a minimum of earth-imported, process materials. Lunar feed stocks are hydrogen-reducible minerals, ilmenite and lunar agglutinates occurring in numerous, explored locations mixed with other minerals in the pulverized surface layer of lunar soil known as regolith. Ilmenite (FeTiO.sub.3) and agglutinates contain ferrous (Fe.sup.+2) iron reducible by hydrogen to yield H.sub.2 O and metallic Fe at about 700.degree.-1,200.degree. C. The H.sub.2 O is electrolyzed in gas phase to yield H.sub.2 for recycle and O.sub.2 for storage and use. Hydrogen losses to lunar vacuum are minimized, with no net hydrogen (or any other earth-derived reagent) consumption except for small leaks. Feed minerals are surface-mined by front shovels and transported in trucks to the processing area. The machines are manned or robotic. Ilmenite and agglutinates occur mixed with silicate minerals which are not hydrogen-reducible at 700.degree.-1,200.degree. C. and consequently are separated and concentrated before feeding to the oxygen generation process. Solids rejected from the separation step and reduced solids from the oxygen process are returned to the mine area. The plant is powered by nuclear or solar power generators. Vapor-phase water electrolysis, a staged, countercurrent, fluidized bed reduction reactor and a radio-frequency-driven ceramic gas heater are used to improve thermal efficiency.

Gibson, Michael A.↗

Integrating Efficiency of Industry Processes and Practices Alongside Technology Effectiveness in Space Transportation Cost Modeling and Analysis

This paper presents past and current work in dealing with indirect industry and NASA costs when providing cost estimation or analysis for NASA projects and programs. Indirect costs, when defined as those costs in a project removed from the actual hardware or software hands-on labor; makes up most of the costs of today's complex large scale NASA space/industry projects. This appears to be the case across phases from research into development into production and into the operation of the system. Space transportation is the case of interest here. Modeling and cost estimation as a process rather than a product will be emphasized. Analysis as a series of belief systems in play among decision makers and decision factors will also be emphasized to provide context.

Zapata, Edgar↗

An Optical Receiver Post-Processing System for the Integrated Radio and Optical Communications Software Defined Radio Test Bed

The Integrated Radio and Optical Communications (iROC) project at the National Aeronautics and Space Administration's (NASA) Glenn Research Center is investigating the feasibility of a hybrid radio frequency (RF) and optical communication system for future deep space missions. As a part of this investigation, a test bed for a radio frequency (RF) and optical software defined radio (SDR) has been built. Receivers and modems for the NASA deep space optical waveform are not commercially available so a custom ground optical receiver system has been built. This paper documents the ground optical receiver, which is used in order to test the RF and optical SDR in a free space optical communications link.

optical communication↗

An Optical Receiver Post Processing System for the Integrated Radio and Optical Communications Software Defined Radio Test Bed

The Integrated Radio and Optical Communications (iROC) project at the National Aeronautics and Space Administrations (NASA) Glenn Research Center is investigating the feasibility of a hybrid radio frequency (RF) and optical communication system for future deep space missions. As a part of this investigation, a test bed for a radio frequency (RF) and optical software defined radio (SDR) has been built. Receivers and modems for the NASA deep space optical waveform are not commercially available so a custom ground optical receiver system has been built. This paper documents the ground optical receiver, which is used in order to test the RF and optical SDR in a free space optical communications link.

waveforms↗

Session on High Speed Civil Transport Design Capability Using MDO and High Performance Computing

Since the inception of CAS in 1992, NASA Langley has been conducting research into applying multidisciplinary optimization (MDO) and high performance computing toward reducing aircraft design cycle time. The focus of this research has been the development of a series of computational frameworks and associated applications that increased in capability, complexity, and performance over time. The culmination of this effort is an automated high-fidelity analysis capability for a high speed civil transport (HSCT) vehicle installed on a network of heterogeneous computers with a computational framework built using Common Object Request Broker Architecture (CORBA) and Java. The main focus of the research in the early years was the development of the Framework for Interdisciplinary Design Optimization (FIDO) and associated HSCT applications. While the FIDO effort was eventually halted, work continued on HSCT applications of ever increasing complexity. The current application, HSCT4.0, employs high fidelity CFD and FEM analysis codes. For each analysis cycle, the vehicle geometry and computational grids are updated using new values for design variables. Processes for aeroelastic trim, loads convergence, displacement transfer, stress and buckling, and performance have been developed. In all, a total of 70 processes are integrated in the analysis framework. Many of the key processes include automatic differentiation capabilities to provide sensitivity information that can be used in optimization. A software engineering process was developed to manage this large project. Defining the interactions among 70 processes turned out to be an enormous, but essential, task. A formal requirements document was prepared that defined data flow among processes and subprocesses. A design document was then developed that translated the requirements into actual software design. A validation program was defined and implemented to ensure that codes integrated into the framework produced the same results as their standalone counterparts. Finally, a Commercial Off the Shelf (COTS) configuration management system was used to organize the software development. A computational environment, CJOPT, based on the Common Object Request Broker Architecture, CORBA, and the Java programming language has been developed as a framework for multidisciplinary analysis and Optimization. The environment exploits the parallelisms inherent in the application and distributes the constituent disciplines on machines best suited to their needs. In CJOpt, a discipline code is "wrapped" as an object. An interface to the object identifies the functionality (services) provided by the discipline, defined in Interface Definition Language (IDL) and implemented using Java. The results of using the HSCT4.0 capability are described. A summary of lessons learned is also presented. The use of some of the processes, codes, and techniques by industry are highlighted. The application of the methodology developed in this research to other aircraft are described. Finally, we show how the experience gained is being applied to entirely new vehicles, such as the Reusable Space Transportation System. Additional information is contained in the original.

Rehder, Joe↗

Spacecraft Power Source Installation at Launch Complex

For certain space missions, an assembly must be integrated onto the spacecraft as late as possible in the launch vehicle processing flow. 12This late integration can be driven for a variety of reasons including thermal or hazardous materials constraints. This paper discusses the process of integrating an assembly onto a spacecraft as late as one week prior to the opening of the launch window. Consideration is given to achieving sufficient access for hardware integration, methods of remotely securing hardware to the spacecraft, maintaining spacecraft cleanliness throughout the integration process, and electrically integrating the component to the spacecraft. Specific examples are taken from the remote mechanical, electrical, and fluid cooling system integration of the power source onto the Mars Science Laboratory (MSL) Rover at the Atlas V Vertical Integration Facility (VIF) at Cape Canaveral Air Force Station, Florida.

Lytal, Paul↗

NASA Space Technology Draft Roadmap Area 13: Ground and Launch Systems Processing

This slide presentation reviews the technology development roadmap for the area of ground and launch systems processing. The scope of this technology area includes: (1) Assembly, integration, and processing of the launch vehicle, spacecraft, and payload hardware (2) Supply chain management (3) Transportation of hardware to the launch site (4) Transportation to and operations at the launch pad (5) Launch processing infrastructure and its ability to support future operations (6) Range, personnel, and facility safety capabilities (7) Launch and landing weather (8) Environmental impact mitigations for ground and launch operations (9) Launch control center operations and infrastructure (10) Mission integration and planning (11) Mission training for both ground and flight crew personnel (12) Mission control center operations and infrastructure (13) Telemetry and command processing and archiving (14) Recovery operations for flight crews, flight hardware, and returned samples. This technology roadmap also identifies ground, launch and mission technologies that will: (1) Dramatically transform future space operations, with significant improvement in life-cycle costs (2) Improve the quality of life on earth, while exploring in co-existence with the environment (3) Increase reliability and mission availability using low/zero maintenance materials and systems, comprehensive capabilities to ascertain and forecast system health/configuration, data integration, and the use of advanced/expert software systems (4) Enhance methods to assess safety and mission risk posture, which would allow for timely and better decision making. Several key technologies are identified, with a couple of slides devoted to one of these technologies (i.e., corrosion detection and prevention). Development of these technologies can enhance life on earth and have a major impact on how we can access space, eventually making routine commercial space access and improve building and manufacturing, and weather forecasting for example for the effect of these process improvements on our daily lives.

Clements, Greg↗

Interconnection of Semiconductor Devices in Extreme Environment Microelectronic Integrated Circuit Chips

A process of fabrication and the resulting integrated circuit device is made of patterned metal electrical interconnections between semiconductor devices residing on and forming extremely harsh environment integrated circuit chips. The process enables more complicated wide band gap semiconductor integrated circuits with more than one level of interconnect to function for prolonged time periods (over 1000 hours) at much higher temperatures (500 C).

Spry, David J.↗

The ISS EXPRESS Rack: An Innovative Approach of Rapid Integration

The EXpedite the PRocessing of Experiments to Space Station or EXPRESS Rack System, was developed to provide Space Station accommodations for small, subrack payloads. The EXPRESS Rack accepts Space Shuttle middeck locker type payloads and International Subrack Interface Standard (ISIS) Drawer payloads, allowing previously flown payloads an opportunity to transition to the International Space Station. The EXPRESS Rack provides power, data, command and control, video, water cooling, air cooling, vacuum exhaust, and Nitrogen supply to payloads. The EXPRESS Rack system also includes transportation racks to transport payloads to and from the Space Station, Suitcase Simulators to allow a payload developer to verify power and data interfaces at the development site, Functional Checkout Units to allow Payload checkout at KSC prior to launch, and trainer racks for the astronauts to learn how to operate the EXPRESS Racks prior to flight. Standard hardware and software interfaces provided by the EXPRESS Rack simplify the analytical and physical integration processes, and facilitates simpler ISS payload development. The EXPRESS Rack has also formed the basis for the U.S. Life Sciences payload racks and the Window Observational Research Facility on Space Station.

Sledd, Annette M.↗

Fabrication of Microstripline Wiring for Large Format Transition Edge Sensor Arrays

We have developed a process to integrate microstripline wiring with transition edge sensors (TES). The process includes additional layers for metal-etch stop and dielectric adhesion to enable recovery of parameters achieved in non-microstrip pixel designs. We report on device parameters in close-packed TES arrays achieved with the microstrip process including R(sub n), G, and T(sub c) uniformity. Further, we investigate limits of this method of producing high-density, microstrip wiring including critical current to determine the ultimate scalability of TES arrays with two layers of wiring.

Chervenak, James A.↗