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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18
All sourcesNASA NTRSDOE OSTI
NASA NTRS2015

Wideband Array for C, X, and Ku-Band Applications with 5.3:1 Bandwidth

Planar arrays that exploit strong intentional coupling between elements have allowed for very wide bandwidths in low-profile configurations. However, such designs also require complex impedance matching networks that must also be very compact. For many space applications, typically occurring at C-, X-, Ku-, and most recently at Ka-band, such designs require specialized and expensive fabrication techniques. To address this issue, a novel ultra-wideband array is presented, using a simplified feed network to reduce fabrication cost. The array operates from 3.5-18.5 GHz with VSWR less than 2.4 at broadside, and is of very low profile, having a total height of lambda/10 at the lowest frequency of operation. Validation is provided using a 64-element prototype array, fabricated using common Printed Circuit Board (PCB) technology. The low size, weight, and cost of this array make it attractive for space-borne applications.

X-↗
NASA NTRS2015

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

High temperature↗
NASA NTRS2015

Conformal and Spectrally Agile Ultra Wideband Phased Array Antenna for Communication and Sensing

There is a continuing need for reducing size and weight of satellite systems, and is also strong interest to increase the functional role of small- and nano-satellites (for instance SmallSats and CubeSats). To this end, a family of arrays is presented, demonstrating ultra-wideband operation across the numerous satellite communications and sensing frequencies up to the Ku-, Ka-, and Millimeter-Wave bands. An example design is demonstrated to operate from 3.5-18.5 GHz with VSWR2 at broadside, and validated through fabrication of an 8 x 8 prototype. This design is optimized for low cost, using Printed Circuit Board (PCB) fabrication. With the same fabrication technology, scaling is shown to be feasible up to a 9-49 GHz band. Further designs are discussed, which extend this wideband operation beyond the Ka-band, for instance from 20-80 GHz. Finally we will discuss recent efforts in the direct integration of such arrays with digital beamforming back-ends. It will be shown that using a novel on-site coding architecture, orders of magnitude reduction in hardware size, power, and cost is accomplished in this transceiver.

Ultra Wideband antenna↗
NASA NTRS2015

High-Efficiency Hall Thruster Discharge Power Converter

Busek Company, Inc., is designing, building, and testing a new printed circuit board converter. The new converter consists of two series or parallel boards (slices) intended to power a high-voltage Hall accelerator (HiVHAC) thruster or other similarly sized electric propulsion devices. The converter accepts 80- to 160-V input and generates 200- to 700-V isolated output while delivering continually adjustable 300-W to 3.5-kW power. Busek built and demonstrated one board that achieved nearly 94 percent efficiency the first time it was turned on, with projected efficiency exceeding 97 percent following timing software optimization. The board has a projected specific mass of 1.2 kg/kW, achieved through high-frequency switching. In Phase II, Busek optimized to exceed 97 percent efficiency and built a second prototype in a form factor more appropriate for flight. This converter then was integrated with a set of upgraded existing boards for powering magnets and the cathode. The program culminated with integrating the entire power processing unit and testing it on a Busek thruster and on NASA's HiVHAC thruster.

Jaquish, Thomas↗
NASA NTRS2016

Modifying a Commercial Centrifuge to Reduce Electromagnetic Interference and Evaluating Functionality of Ultrasound Equipment

The Project Management and Engineering Branch (SF4) supports the Human Health and Performance Directorate (HH&P) and is responsible for developing and supporting human systems hardware for the International Space Station (ISS). When a principal investigator's (PI) medical research project on the ISS is accepted, SF4 develops the necessary hardware and software to transport to the ISS. The two projects I primarily worked on were the centrifuge and ultrasound projects. Centrifuge: One concern with spacecraft such as the ISS is electromagnetic interference (EMI) from onboard equipment, typically from radio waves (frequencies of ~3 kHz to ~300 GHz), which can negatively affect nearby circuitry. Standard commercial centrifuges produce EMI above safety limits, so my task was to help reduce EMI production from this equipment. Two centrifuges were tested: one unmodified as a control and one modified. To reduce EMI below safety limits, one centrifuge was modified to become a Faraday shield, in which significant electrical contact was made between all regions of the centrifuge housing. This included removing non-conductive paint, applying conductive fabric to the lid and foam sealer, adding a 10,000 μF decoupling capacitor across the power supply, and adding copper adhesive-mount gaskets to the housing interior. EMI testing of both centrifuges was performed in the EMI/EMC Control Test and Measurement Facility. EMI for both centrifuges was below safety limits for frequencies between 10 MHz and 15 GHz (pass); however, between 14 kHz and 10 MHz, EMI for the unmodified centrifuge exceeded safety limits (fail) as expected. Alternatively, for the modified centrifuge with the Faraday shield, EMI was below the safely limit of 55 dBμV/m for electromagnetic frequencies between 14 kHz and 10 MHz. This result indicates our modifications were successful. The successful EMI test allowed us to communicate with the vendor what modifications they needed to make to their commercial unit to meet our specifications and to understand what needs to be done in lab to the new centrifuge. Our modifications will provide a standard for readying centrifuges for future missions. Once the new modified centrifuge arrives by the vendor, it will need to undergo EMI testing again for validation. The centrifuge is also in the process of compatibility testing with a custom stowage drawer, which is an ongoing project in SF4. Both of these items will be payloads on future missions to the ISS for various research purposes. Ultrasound: ISS currently has an onboard ultrasound (Ultrasound 2 system) for research and medical purposes. Every piece of medical flight hardware has an equivalent ground-unit so instrumentation can be routinely evaluated and transported to the ISS if necessary. The ground-unit ultrasound equipment must be evaluated every six months using a task performance sheet (TPS). A TPS is a document, written by the appropriate scientists and engineers, which describes how to run equipment and is written in such a way that astronauts with unspecialized training can follow the tasks. I was responsible for performing six TPSs on a combination of three ultrasounds and two video power converters (VPCs). Performing a TPS involves checking out and computationally documenting each piece of equipment removed from storage locations, setting up hardware and software, performing tasks to verify functionality, returning equipment, and logging items back into the computerized system. My work revealed all ground-unit ultrasounds were functioning properly. Because of proper function, a discrepancy report (DR) did not have to be opened. The TPS was then passed along to the Quality Engineering (QE) for review and ultimately given to Quality Assurance (QA). Other projects: In addition to my main projects, I participated in other tasks including troubleshooting an EEG headband, volunteering for an ultrasound training research study, and conformal coating printed circuit boards. My internship at SF4 has helped me understand how space systems hardware development for the ISS fits into NASA's mission and vision.

Greening, Gage J.↗
NASA NTRS2016

Electrical Performance of a High Temperature 32-I/O HTCC Alumina Package

A high temperature co-fired ceramic (HTCC) alumina material was previously electrically tested at temperatures up to 550 C, and demonstrated improved dielectric performance at high temperatures compared with the 96% alumina substrate that we used before, suggesting its potential use for high temperature packaging applications. This paper introduces a prototype 32-I/O (input/output) HTCC alumina package with platinum conductor for 500 C low-power silicon carbide (SiC) integrated circuits. The design and electrical performance of this package including parasitic capacitance and parallel conductance of neighboring I/Os from 100 Hz to 1 MHz in a temperature range from room temperature to 550 C are discussed in detail. The parasitic capacitance and parallel conductance of this package in the entire frequency and temperature ranges measured does not exceed 1.5 pF and 0.05 microsiemens, respectively. SiC integrated circuits using this package and compatible printed circuit board have been successfully tested at 500 C for over 3736 hours continuously, and at 700 C for over 140 hours. Some test examples of SiC integrated circuits with this packaging system are presented. This package is the key to prolonged T greater than or equal to 500 C operational testing of the new generation of SiC high temperature integrated circuits and other devices currently under development at NASA Glenn Research Center.

dielectric performance↗
NASA NTRS2016

Ultra-Wideband Phased Array for Millimeter-Wave 5G and ISM

Growing mobile data consumption has prompted the exploration of the millimeter-wave spectrum for large bandwidth, high speed communications. However, the allocated bands are spread across a wide swath of spectrum: fifth generation mobile architecture (5G): 28, 38, 39, 64-71 GHz, as well as Industrial, Scientific, and Medical bands (ISM): 24 and 60 GHz. Moreover, high gain phased arrays are required to overcome the significant path loss associated with these frequencies. Further, it is necessary to incorporate several of these applications in a single, small size and low cost platform. To this end, we have developed a scanning, Ultra-Wideband (UWB) array which covers all 5G, ISM, and other mm-W bands from 24-72 GHz. Critically, this is accomplished using mass-production Printed Circuit Board (PCB) fabrication.

Ultra-wide band phased array↗
NASA NTRS2017

Ultra-Wideband Array in PCB for Millimeter-Wave 5G and ISM

Growing mobile data consumption has prompted the exploration of the millimeter-wave spectrum for large bandwidth, high speed communications. However, the allocated bands are spread across a wide swath of spectrum: Fifth generation mobile architecture (5G): 28, 38, 39, 6471 GHz; Industrial, Scientific, and Medical bands (ISM): 24, 60 GHz. Moreover, high gain phased arrays are required to overcome the significant path loss associated with these frequencies. Further, it is necessary to incorporate several of these applications in a single, small size and low cost platform. To this end, we have developed a scanning, Ultra-Wideband (UWB) array which covers all 5G, ISM, and other mm-W bands from 2472 GHz. Critically, this is accomplished using mass-production Printed Circuit Board (PCB) fabrication. The results of this work are presented in this poster.

Milli-Meter Wave↗
NASA NTRS2018

Achieving Improved Reliability with Failure Analysis

Reliability is the ability of a product to properly function, within specified performance limits, for a specified period of time, under the life cycle application conditions. Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and sophisticated supply chains, but also from customers who are demanding a quicker turn-around. Unfortunately, root cause failure analysis is often performed incompletely, leading to a poor understanding of failure mechanisms and causes and, customer dissatisfaction due to recurring failures. The PDC starts with an introduction to reliability concepts, physics of failure and an overview of failure mechanisms that affect PCBs, PCBAs and components. The PDC then dives into root cause hypothesizing techniques (Pareto, FMEA, fishbone, FTA), non-destructive and destructive analysis and, materials characterization will be discussed. Numerous failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies. What Will You Learn: Topics include: Overview of Reliability Concepts Failure mechanisms of electronic products Root cause analysis Failure analysis techniques -Non-destructive techniques (optical, CSAM etc.) -Destructive analysis (DPA, Decap, FIB etc.) -Materials characterization (XRF, EDS, TMA/DSC etc.) Who Will Benefit: Reliability engineers, failure analysis engineers, engineering managers, design engineers, component engineers, quality assurance functions and, personnel involved with reliability activities within their company.

non-destructive techniques↗
NASA NTRS2018

Development of an Optical Slice for an RF and Optical Software Defined Radio

A key component in the Integrated Radio and Optical Communications project at the National Aeronautics and Space Administration's (NASA) Glenn Research Center (GRC) is the radio frequency (RF) and optical software defined radio (SDR). A NASA RF SDR might consist of a general purpose processor to run the Space Telecommunications Radio System (STRS) Architecture for radio command and control, a reconfigurable signal processing device such as a field programmable gate array (FPGA) which houses the waveform, and a digital to analog converter for (DAC) transmitting data. Prior to development, SDR architecture trades on how to combine the RF and optical elements were studied. A modular architecture with physically separate RF and optical hardware slices was chosen and the optical slice of an SDR was designed and developed. The Harris AppSTAR("TM") platform, which consists of an FPGA processing platform with a mezzanine card targeted for RF communications, was used as the base platform in prototyping the optical slice. A serially concatenated pulse position modulation (SCPPM) optical waveform was developed. The waveform follows the standard described in the Consultative Committee for Space Data Systems (CCSDS) Optical Communions Coding and Synchronization Red Book. A custom optical mezzanine printed circuit board card was developed at NASA GRC for optical transmission. The optical mezzanine card replaces the DAC, which is used in the transmission of RF signals. This paper describes RF and optical SDR architecture trades, the Harris AppSTAR("TM") platform, the design of the SCPPM waveform, and the development of the optical mezzanine card.

optical communications↗
NASA NTRS2018

Development of an Optical Slice for an RF and Optical Software Defined Radio

A key component in the Integrated Radio and Optical Communications project at the National Aeronautics and Space Administration's (NASA) Glenn Research Center (GRC) is the radio frequency (RF) and optical software defined radio (SDR). A NASA RF SDR might consist of a general purpose processor to run the Space Telecommunications Radio System (STRS) Architecture for radio command and control, a reconfigurable signal processing device such as a field programmable gate array (FPGA) which houses the waveform, and a digital to analog converter (DAC) for transmitting data. Prior to development, SDR architecture trades on how to combine the RF and optical elements were studied. A modular architecture with physically separate RF and optical hardware slices was chosen and the optical slice of an SDR was designed and developed. The Harris AppSTARTM platform, which consists of an FPGA processing platform with a mezzanine card targeted for RF communications, was used as the base platform in prototyping the optical slice. A serially concatenated pulse position modulation (SCPPM) optical waveform was developed. The waveform follows the standard described in the Consultative Committee for Space Data Systems (CCSDS) Optical Communications Coding and Synchronization Red Book. A custom optical mezzanine printed circuit board card was developed at NASA GRC for optical transmission. The optical mezzanine card replaces the DAC, which is used in the transmission of RF signals. This paper describes RF and optical SDR architecture trades, the Harris AppSTAR platform, the design of the SCPPM waveform, and the development of the optical mezzanine card.

Nappier, Jennifer M.↗
NASA NTRS2018

Puffer: Pop-Up Flat Folding Explorer Robot

A repeatably reconfigurable robot, comprising at least two printed circuit board (PCB) rigid sections, at least one PCB flexible section coupled to the at least two PCB rigid sections, at least one wheel, hybrid wheel propeller, wheel and propeller, or hybrid wheel screw propeller rotatably coupled to at least one of the at least two PCB rigid sections and at least one actuator coupled to the at least two PCB rigid sections, wherein the at least one actuator folds and unfolds the repeatably reconfigurable robot.

Karras, Jaakko T.↗
NASA NTRS2018

2.5/3D Daisy Chain Reliability Evaluation

The objective of this task is to evaluate thermal cycle behavior of advanced 2.5/3D electronics — commercial-off the-shelf (COTS) —packages of different configurations assembled onto printed circuit boards (PCBs). Three key approaches were considered for evaluation. The first approach focused on the through-mold via (TMV™) technology at assembly level. The second approach focused on evaluation of 2.5D (also known as, System in Package (SiP)) in fine pitch ball grid array (FPGA). The third approach focused on evaluation of through-silicone-via (TSV) technologies. This report presents the test results for TMV™ and SiP packaging technologies and reliability, and it also provides lessons learned on quality assurance methods. Specifically, the report presents the test matrix for various 3D TMV™ packaging assembly configurations and reliability characterizations performed under two accelerated thermal cycling (ATC) and accelerated thermal shock cycling (ATSC) conditions. The ATC and ATSC were performed in the range of –55°C to 125°C and –100°C to 100°C, respectively. The report also includes assembly of a SiP— a 60-mm fine-pitch ball-grid array (FPGA) interposer with an IC at the center and six chip-scale package (CSP) daisy chains at the periphery—with package assembly characterizations. After assembly, the daisy chains were subjected to ATCs in the range of –40°C to 125°C for reliability evaluation. Finally, for both TMV™ and SiP packaging configurations, characterizations results by X-ray, optical imaging, and daisy-chain resistance evaluations were also presented.

Ghaffarian, Reza↗
NASA NTRS2019

OuroboroSat: A Modular, CubeSat-Scale Instrumentation Platform

OuroboroSat (also known as MRMSS: the Modular Rapidly Manufactured Spacecraft System) is a modular instrumentation platform consisting of multiple 3 inch (7.5 centimeter) square printed circuit boards that are mechanically and electrically connected to one another in order to produce a fully- functioning payload facility system. Each OuroboroSat module consists of a microcontroller, a battery, conditioning and monitoring circuitry for the battery, optional space for solar panels, and an expansion area where an experimental payload or specialized functionality (such as wireless communication submodules) can be attached.

Modular instrumentation platform↗
NASA NTRS2018

Characterizing Microfluidic Operations Underlying an Electrowetting Heat Pipe on the International Space Station

Electrowetting heat pipes (EHPs) are a newly conceptualized class of heat pipes, wherein the adiabatic wick section is replaced by electrowetting-based pumping of the condensate (as droplets) to the evaporator. Specific advantages include the ability to transport high heat loads over long distances, low thermal resistance and power consumption, and the absence of moving mechanical parts. In this work, we describe characterization of key microfluidic operations (droplet motion and splitting) underlying the EHP on the International Space Station (ISS). The testing was performed under the Advanced Passive Thermal eXperiment (APTx) project, a project to test a suite of passive thermal control devices funded by the ISS Technology Demonstration Office at NASA JSC (Johnson Space Center). A rapid manufacturing method was used to fabricate the electrowetting device on a printed circuit board. Key device-related considerations were to ensure reliability and package the experimental hardware within a confined space. Onboard the ISS, experiments were conducted to study electrowetting-based droplet motion and droplet splitting, by imaging droplet manipulation operations via pre-programmed electrical actuation sequences. An applied electric field of 36 Volts per micron resulted in droplet speeds approaching 10 millimeters per second. Droplet splitting dynamics were observed and the time required to split droplets was quantified. Droplet motion data was analyzed to estimate the contact line friction coefficient. Overall, this demonstration is the first-ever electrowetting experiment in space. The obtained results are useful for future design of the EHP and other electrowetting-based systems for microgravity applications.

Electrowetting↗
NASA NTRSDate not supplied

Operational Experience with the Electromagnetic Position Sensor (EPS) for the NASA 6-inch MSBS

We rebuilt the wind tunnel model position signal conditioner for the MIT 6-Inch Magnetic Suspension and Balance System (MSBS) Electromagnetic Position Sensor (EPS) that is now in use at the NASA Langley Research Center (LaRC). The effort began at LaRC in ~1990 to replace the original MIT system that was still operating with the low speed wind tunnel until its decommissioning a few years later. The MIT filtering and demodulating scheme mostly remained in the newly designed two-layer printed circuit boards (PCB) with some rearranging of order. The finished product was hampered by noise problems due to problematic grounding design etc. and never successfully operated in the MSBS. After over 20 years, the Langley unit was recovered from Old Dominion University where the MSBS was on loan from NASA but never refurbished. The EPS was brought back to LaRC in 2015 while planning for the return of the MSBS and work began to evaluate its condition and acquire supporting instrumentation. The repair, testing, operational issues, and future improvements are discussed along with an overview of the EPS as a subsystem.

Timothy D Schott↗
NASA NTRS2010

FPGA-based hardware/software co-design instrument command-and-control solutions

Traditional design methodology dictates that an instrument electronics platform should consist of a printed circuit board (PCB)—often multiple boards—populated with many components and support electronics. More specifically, each subsystem is composed of numerous integrated circuits (ICs) spread across the board(s), connected with innumerable traces and wires. Additionally, it is often the case that the hardware and software design teams are quite separated—the hardware team designs a board and hands it to a software team, who must then deal with any hardware quirkiness and may need to rewrite software due to inadequately defined interfaces...

Allen, Mark A.↗
NASA NTRS2012

Design and Operation of the Planetary In-Situ Capillary Electrophoresis System (PISCES)

The PISCES instrument is a portable, miniature, modular instrument designed to analyze organic molecular signatures of life. PISCES uses microcapillary electrophoresis (μCE) with laser-induced fluorescence detection (LIFD) to analyze fluorescently-labeled analytes prepared on a multi-layer microfluidic chip. As a modular instrument composed of five independently functioning units, each module can be easily detached from the system and used for subsystem testing in different environments, e.g. low temperature. The pneumatic module contains mechanical and electrical components necessary to control pneumatically-actuated valves for on-chip sample processing. A prototype LabVIEW program and two custom printed circuit boards (PCBs) operate the pneumatics module using an Arduino microcontroller, and a tentative design for the module’s housing has been developed. The high-voltage module contains circuitry required to apply varying electrical potentials to the electrophoretic channel of the microdevice. Work is currently being done to design the circuit and PCB for this module in collaboration with our SBIR partners at Los Gatos Research. The optical electronics module contains the spectrometer, laser, and laser power supply. The mounting components for the electronics and housing for the module have been designed, assembled, and tested. The optical module contains optical components to focus the laser to a 20μm spot in the center of the electrophoretic channel.The housing for this module has been designed and assembled with the aligned optical components inside.

Willis, Peter A.↗