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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18
All sourcesNASA NTRSDOE OSTI
NASA NTRS1956

Comparison of Theoretical Stresses and Deflections of Multicell Wings with Experimental Results Obtained from Plastic Models

The experimental deflections and stresses of six plastic multicell-wing models of unswept, delta, and swept plan form are presented and compared with previously published theoretical results obtained by the electrical analog method. The comparisons indicate that the theory is reliable except for the evaluation of stresses in the vicinity of the leading edge of delta wings and the leading and trailing edges of swept wings. The stresses in these regions are questionable, apparently because of simplifications employed in idealizing the actual structure for theoretical purposes and because of local effects of concentrated loads.

LOADS AND STRESSES, STRUCTURAL - TORSION↗
NASA NTRS1944

Data on Material Properties and Panel Compressive Strength of a Plastic-bonded Material of Glass Cloth and Canvas

Results are presented of tests for determining the tensile, compressive, and bending properties of a material of plastic-bonding glass cloth and canvas layers. In addition, 10 panel specimens were tested in compression. Although the material is not satisfactory for primary structural use in aircraft when compared on a strength-weight basis with other materials in common use, there appears to be potential strength in the material that will require research for development. These points are considered in some detail in the concluding discussion of the report. An appendix shows that a higher tensile strength can be obtained by changes in the type of weave used in the glass-cloth reinforcement.

MATERIALS, PLASTIC-STRENGTH↗
NASA NTRS1997

Constitutive Equations: Plastic and Viscoelastic Properties. (Latest citations from the Aerospace Database)

The bibliography contains citations concerning analytical techniques using constitutive equations, applied to materials under stress. The properties explored with these techniques include viscoelasticity, thermoelasticity, and plasticity. While many of the references are general as to material type, most refer to specific metals or composites, or to specific shapes, such as flat plate or spherical vessels.

VISCOELASTICITY↗
NASA NTRS1996

Constitutive Equations: Plastic and Viscoelastic Properties. (Latest Citations from the Aerospace Database)

The bibliography contains citations concerning analytical techniques using constitutive equations, applied to materials under stress. The properties explored with these techniques include viscoelasticity, thermoelasticity, and plasticity. While many of the references are general as to material type, most refer to specific metals or composites, or to specific shapes, such as flat plate or spherical vessels. (Contains 50-250 citations and includes a subject term index and title list.)

BIBLIOGRAPHIES↗
NASA NTRS2000

Plastic Encapsulated Microcircuits (PEMs) Reliability Guide

It is reported by some users and has been demonstrated by others via testing and qualification that the quality and reliability of plastic-encapsulated microcircuits (PEMs) manufactured today are excellent in commercial applications and closely equivalent, and in some cases superior to their hemetic counterparts.

plastic encapsulated microcircuits reliability gui↗
NASA NTRS2005

Experiences issues with plastic parts at cold temperatures

Missions to MARS/planets/asteroids require electronic parts to operate and survive at extreme cold conditions. At extreme cold temperatures many types of cold related failures can occur. Office 514 is currently evaluating plastic parts under various cold temperature conditions and applications. Evaluations, screens, and qualifications are conducted on flight parts.

cold temperatures↗
NASA NTRS2017

Applications of Fracture Mechanics to Quantitative Accelerated Life Testing of Plastic Encapsulated Microelectronics

Accelerated testing must address the failure mechanisms active within the devices undergoing tests in order to assess lifetimes in a meaningful way. The assumption of constant temperature, thermally activated lifetime, based upon the Arrhenius assumptions, does not always provide the necessary understanding to interpret accelerated tests in microelectronics. Plastic encapsulants, dielectric polymers, and underfill materials are subject to delamination and cracking with thermal cycling. Crack propagation during use environment exposure, drives the potential for failure of microelectronic devices and is therefore a necessary focal point in qualification and life testing. This paper reviews the available research in the application of fracture mechanics to this class of problems in microelectronics including relevant test data. In addition, useful acceleration factor models are derived for polymer crack propagation based on principles of linear elastic fracture mechanics. Further, a simple approach to estimating the minimum temperature cycling ranges, necessary to propagate a crack, is also presented. Finally, a methodology of applying acceleration factors to develop testing plans is shown, with an example in spaceflight for a cubesat in low Earth orbit. Overall, this is a paper that shows a useful and appropriate process for creating physics of failure based life testing for delamination and cracking failures in microelectronic polymers in a temperature cycling environment.

Accelerated testing↗