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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 325 records · Page 18
All sourcesNASA NTRSDOE OSTI
NASA NTRS1975

FEP-TEFLON encapsulated solar cell modules Further progress

A progress report, starting with November 1973, is given in the design, development, and performance of lightweight flexible FET (Fluorinated Ethylene Propylene) encapsulated solar cell modules intended to form standardized building blocks for large roll-up or fold-up solar cell blankets with performances on the order of 100 W/sq m and 80 W/kg in near space. It is shown that interconnected FEP encapsulated modules of advanced design can withstand all typical ground handling, assembly, storage, and launch conditions, and are well suited for high-power space applications.

Rauschenbach, H. S.↗
NASA NTRS1977

Investigation of test methods, material properties and processes for solar cell encapsulants

The potentially useful encapsulating materials for Task 3 of the Low-Cost Silicon Solar Array project were studied to identify, evaluate, and recommend encapsulant materials and processes for the production of cost-effective, long-life solar cell modules. Materials for study were chosen on the basis of existing knowledge of generic chemical types having high resistance to environmental weathering. The materials varied from rubbers to thermoplastics and presented a broad range of mechanical properties and processing requirements. Basic physical and optical properties were measured on the polymers and were redetermined after exposure to indoor artificial accelerated aging conditions covering four time periods. Strengths and weaknesses of the various materials were revealed and data was accumulated for the development of predictive methodologies. To date, silicone rubbers, fluorocarbons, and acrylic polymers appear to have the most promising combination of characteristics. The fluorocarbons may be used only as films, however, because of their high cost.

Willis, P. B.↗
NASA NTRS1978

Accelerated/abbreviated test methods, study 4 of task 3 (encapsulation) of the low-cost silicon solar array project

Inherent weatherability is controlled by the three weather factors common to all exposure sites: insolation, temperature, and humidity. Emphasis was focused on the transparent encapsulant portion of miniature solar cell arrays by eliminating weathering effects on the substrate and circuitry (which are also parts of the encapsulant system). The most extensive data were for yellowing, which were measured conveniently and precisely. Considerable data also were obtained on tensile strength. Changes in these two properties after outdoor exposure were predicted very well from accelerated exposure data.

Kolyer, J. M.↗
NASA NTRS1978

Method of making encapsulated solar cell modules

Electrical connections to solar cells in a module are made at the same time the cells are encapsulated for protection. The encapsulating material is embossed to facilitate the positioning of the cells during assembly.

Anagnostou, E.↗
NASA NTRS1976

Integral glass sheet encapsulation for terrestrial panel applications

Concepts for integral glass sheet encapsulation of terrestrial solar cell modules using techniques based upon electrostatic bonding are being developed. It is possible for the glass to provide hermetic encapsulation, the structural support, and a vehicle for integral interconnection of the solar cells. Anticipated capabilities, present status, and cost projections for large scale terrestrial utilization are discussed.

Minnucci, J. A.↗
NASA NTRS1976

Materials for encapsulation systems for terrestrial photovoltaic arrays

The paper is concerned with glass and polymeric candidate materials and processes for potential encapsulation systems that could be used in low-cost long-life terrestrial photovoltaic arrays. The characteristics of encapsulation systems in use are reviewed, and the properties of proposed materials are examined. These materials include acrylics, epoxies, fluorocarbons, polycarbonates, polyesters, polyimides, polyxylylenes, and silicones. Properties of glass types are also considered. The prospects for glass and polymeric systems are analyzed, and the knowledge gained from a study of existing systems is discussed with attention to weather/aging effects, failures, environments, hazards, costs, development efforts, and materials choices.

Carmichael, D. C.↗
NASA NTRS1978

Investigation of Test Methods, Material Properties, and Processes for Solar Cell Encapsulents

The technical activities were directed toward the assessment of encapsulation processes for use with ethylene/vinyl acetate copolymer as the pottant. Potentially successful formulations were prepared by compounding the raw polymer with ultraviolet absorbers and crosslinking agents to give stabilized and curable compositions. The compounded resin was then converted to a more useful form with an extruder to give pottant in sheets that could be more easily used in lamination. After experimenting with various techniques, the vacuum-bag process was found to be an excellent encapsulation method. Miniature single-celled and multi-celled solar modules of both substrate and superstrate designs were prepared by this technique. The resulting modules were of good appearance, were bubble-free, and successfully passed the thermal cycle test.

Source record↗
NASA NTRS1979

Encapsulation materials for photovoltaic arrays

As a part of the Low Cost Solar Array Project an encapsulation task has been established to identify, develop, and evaluate new low-cost, long-life encapsulation systems capable of meeting the project cost and performance goals. Low-cost material system candidates have been identified and are being characterized in laboratory and field tests with detailed evaluation of their environmental stability when subjected to temperature cycling, humidity, ultraviolet radiation, dirt, and various other environmental hazards.

Coulbert, C.↗
NASA NTRS1980

Encapsulation of PV cells using silicone materials

The use of silicone materials as thin conformal coatings for the protection of photovoltaic cells is investigated. Five silicone materials ranging from soft elastomers to high modulus resins were evaluated after exposure to UV radiation, outdoor weathering, thermal cycling at high humidity and temperature cycling from -40 C to 90 C. The effects of these tests were monitored by periodically measuring the output of two-cell circuit strings encapsulated with the various materials, and one exceptional silicone coating for which no significant changes in cell output were noted after 300 days was chosen as the best of the candidates. Because only a thin coating of the substance is needed, material costs 60% lower than those of previous encapsulants are now possible.

Dennis, W. E.↗
NASA NTRS1981

Development of design, qualification, screening, and application requirements for plastic encapsulated solid-state devices for space applications

Test data were collected on 1035 plastic encapsulated devices and 75 hermetically scaled control group devices that were purchased from each of five different manufacturers in the categories of (1) low power Schottsky TTL (bipolar) digital circuits; (2) CMOS digital circuits; (3) operational amplifier linear circuits; and (4) NPN transistors. These parts were subjected to three different initial screening conditions, then to extended life testing, to determine any possible advantages or trends for any particular screen. Several tests were carried out in the areas of flammability testing, humidity testing, high pressure steam (auroclave) testing, and high temperature storage testing. Test results are presented. Procurement and application considerations for use of plastic encapsulated semiconductors are presented and a statistical analysis program written to study the log normal distributions resulting from life testing is concluded.

Source record↗
NASA NTRS1981

Investigation of test methods, material properties, and processes for solar cell encapsulants

Encapsulant materials and processes for the production of cost-effective, long-life solar cell modules were investigated. The following areas were explored: (1) soil resistant surface treatment; (2) corrosion protecting coatings from mild steel substrates; (3) primers for bonding module interfaces; and (4) RS/4 accelerated aging of candidate encapsulation compounds

Willis, P. B.↗
NASA NTRS1982

Photothermal characterization of encapsulant materials for photovoltaic modules

A photothermal test matrix and a low cost testing apparatus for encapsulant materials of photovoltaic modules were defined. Photothermal studies were conducted to screen and rank existing as well as future encapsulant candidate materials and/or material formulations in terms of their long term physiochemical stability under accelerated photothermal aging conditions. Photothermal characterization of six candidate pottant materials and six candidate outer cover materials were carried out. Principal products of photothermal degradation are identified. Certain critical properties are also monitored as a function of photothermal aging.

Liang, R. H.↗
NASA NTRS1981

Photovoltaic encapsulation materials

Candidate materials for the construction of cost-effective solar cell flat array modules are reviewed. Fabrication goals include electricity production at $.70/W with a lifetime of 20 yr. Research is currently directed toward low cost encapsulants and substrates for the cells, and outer covers which resist weathering. Ethylene/vinyl acetate copolymer (EVA) at $.09/sq ft has displayed the most promising results as the encapsulant laminate when subjected to peroxide cross-linking to prevent melting. EVA accepts the addition of antioxidants, quenchers, absorbers, and stabilizers. Wood is favored as the rigid substrate due to cost, while top covers in substrate modules comprise candidate acrylic and polyvinyl fluoride films and a copolymer. Finally, fiberglass mat is placed between the substrate and the EVA pottant as a mechanical support and for electrical insulation.

Baum, B.↗
NASA NTRS1981

An analytical approach to photovoltaic encapsulation system design

This paper describes a set of analytical methods which have been developed to enable quantitative analysis of encapsulation system designs for terrestrial photovoltaic modules. Design factors determined most important include: encapsulant thickness and modules, emissivity of module surface, ribs on substrate modulus, and AR.

Garcia, A., III↗
NASA NTRS1984

Screening Plastic-Encapsulated Solid-State Devices

Suitability of plastic-encapsulated solid-state electronic devices for use in spacecraft discussed. Conclusion of preliminary study was plasticencapsulated parts sufficiently reliable to be considered for use in lowcost equipment used at moderate temperature and low humidity. Useful to engineers as guides to testing or use of plastic encapsulated semiconductors in severe terrestrial environments.

Buldhaupt, L.↗
NASA NTRS1982

Investigation of Test Methods, Material Properties and Processes for Solar Cell Encapsulants

The evaluation of potentially useful low cost encapsulation materials is discussed. The goal is to identify, evaluate, test and recommend encapsulant materials and processes for the production of cost effective, long life solar cell modules. Technical investigations concerned the development of advanced cure chemistries for lamination type pottants; the continued evaluation of soil resistant surface treatment, and the results of an accelerated aging test program for the comparison of material stabilities. New compounds were evaluated for efficiency in curing both ethylene/vinyl acetate and ethylene/methyl acrylate pottants intended for vacuum bag lamination of solar cells. Two component aliphatic urethane casting syrups were evaluated for suitability as solar module pottants on the basis of optical, physical and fabrication characteristics.

Willis, P.↗
NASA NTRS1983

Photovoltaic module bypass diode encapsulation

The design and processing techniques necessary to incorporate bypass diodes within the module encapsulant are presented. The Semicon PN junction diode cells were selected. Diode junction to heat spreader thermal resistance measurements, performed on a variety of mounted diode chip types and sizes, have yielded values which are consistently below 1 deg C per watt, but show some instability when thermally cycled over the temperature range from -40 to 150 deg C. Three representative experimental modules, each incorporating integral bypass diode/heat spreader assemblies of various sizes, were designed. Thermal testing of these modules enabled the formulation of a recommended heat spreader plate sizing relationship. The production cost of three encapsulated bypass diode/heat spreader assemblies were compared with similarly rated externally mounted packaged diodes. It is concluded that, when proper designed and installed, these bypass diode devices will improve the overall reliability of a terrestrial array over a 20 year design lifetime.

Shepard, N. J., Jr.↗