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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 307 records · Page 17
All sourcesNASA NTRSDOE OSTI
NASA NTRS2007

Device and Method for Connections Made Between a Crimp Connector and Wire

An ultrasonic device and method obtains desirable crimp connections between a crimp connector and a wire, or bundle of wires, by assessing the desirability of connections made in a wire-to-wire connection and in other situations where two materials with good acoustic propagation characteristics are joined together via deformation. An embodiment of the device as a crimping tool comprises a compressing means, pulse-generating circuitry. at least one ultrasonic transmitting transducer, at least one ultrasonic receiving transducer, receiving circuitry, and a display. The user may return to a previously crimped connection and assess the desirability of the connection by compressing the device about the connection, sending an acoustic signal through the crimp, andco111paring the received signal to a signal obtained from known desirable connections.

Yost, William T.↗
NASA NTRS2008

Evaluating the Gradient of the Thin Wire Kernel

Recently, a formulation for evaluating the thin wire kernel was developed that employed a change of variable to smooth the kernel integrand, canceling the singularity in the integrand. Hence, the typical expansion of the wire kernel in a series for use in the potential integrals is avoided. The new expression for the kernel is exact and may be used directly to determine the gradient of the wire kernel, which consists of components that are parallel and radial to the wire axis.

Wilton, Donald R.↗
NASA NTRS2010

A Method For The Verification Of Wire Crimp Compression Using Ultrasonic Inspection

The development of a new ultrasonic measurement technique to assess quantitatively wire crimp terminations is discussed. The amplitude change of a compressional ultrasonic wave propagating at right angles to the wire axis and through the junction of a crimp termination is shown to correlate with the results of a destructive pull test, which is a standard for assessing crimp wire junction quality. To demonstrate the technique, the case of incomplete compression of crimped connections is ultrasonically tested, and the results are correlated with pull tests. Results show that the nondestructive ultrasonic measurement technique consistently predicts good crimps when the ultrasonic transmission is above a certain threshold amplitude level. A quantitative measure of the quality of the crimped connection based on the ultrasonic energy transmitted is shown to respond accurately to crimp quality. A wave propagation model, solved by finite element analysis, describes the compressional ultrasonic wave propagation through the junction during the crimping process. This model is in agreement within 6% of the ultrasonic measurements. A prototype instrument for applying this technique while wire crimps are installed is also presented. The instrument is based on a two-jaw type crimp tool suitable for butt-splice type connections. A comparison of the results of two different instruments is presented and shows reproducibility between instruments within a 95% confidence bound.

Cramer, K. E.↗
NASA NTRS2011

Thermal Control Method for High-Current Wire Bundles by Injecting a Thermally Conductive Filler

A procedure was developed to inject thermal filler material (a paste-like substance) inside the power wire bundle coming from solar arrays. This substance fills in voids between wires, which enhances the heat path and reduces wire temperature. This leads to a reduced amount of heat generated. This technique is especially helpful for current and future generation high-power spacecraft (1 kW or more), because the heat generated by the power wires is significant enough to cause unacceptable overheating to critical components that are in close contact with the bundle.

Rodriguez-Ruiz, Juan↗
NASA NTRS2014

Process for Nondestructive Evaluation of the Quality of a Crimped Wire Connector

A process and apparatus for collecting data for nondestructive evaluation of the quality of a crimped wire connector are provided. The process involves providing a crimping tool having an anvil and opposing jaw for crimping a terminal onto a stranded wire, moving the jaw relative to the anvil to close the distance between the jaw and the anvil and thereby compress the terminal against the wire, while transmitting ultrasonic waves that are propagated through the terminal-wire combination and received at a receiving ultrasonic transducer as the jaw is moved relative to the anvil, and detecting and recording the position of the jaw relative to the anvil as a function of time and detecting and recording the amplitude of the ultrasonic wave that is received at the receiving ultrasonic transducer as a function of time as the jaw is moved relative to the anvil.

Yost, William T.↗
NASA NTRS2016

Development of a High Performance, Low Profile Translation Table with Wire Feedthrough for a Deep Space CubeSat

NEAScout, a 6U cubesat and secondary payload on NASA's EM-1, will use an 85 sq m solar sail to travel to a near-earth asteroid at about 1 Astronomical Unit (about 1.5 x 10(exp 8) km) for observation and reconnaissance1. A combination of reaction wheels, reaction control system, and a slow rotisserie roll about the solar sail's normal axis were expected to handle attitude control and adjust for imperfections in the deployed sail during the 2.5-year mission. As the design for NEAScout matured, one of the critical design parameters, the offset in the center of mass and center of pressure (CP/CM offset), proved to be sub-optimal. After significant mission and control analysis, the CP/CM offset was accommodated by the addition of a new subsystem to NEAScout. This system, called the Active Mass Translator (AMT), would reside near the geometric center of NEAScout and adjust the CM by moving one portion of the flight system relative to the other. The AMT was given limited design space - 17 mm of the vehicle's assembly height-and was required to generate +/-8 cm by +/-2 cm translation to sub-millimeter accuracy. Furthermore, the design must accommodate a large wire bundle of small gage, single strand wire and coax cables fed through the center of the mechanism. The bend radius, bend resistance, and the exposure to deep space environment complicates the AMT design and operation and necessitated a unique design to mitigate risks of wire bundle damage, binding, and cold-welding during operation. This paper will outline the design constraints for the AMT, discuss the methods and reasoning for design, and identify the lessons learned through the designing, breadboarding and testing for the low-profile translation stages with wire feedthrough capability.

Few, Alex↗
NASA NTRS2016

Development of a High-Performance, Low-Profile Translation Table with Wire Feedthrough for a Deep Space CubeSat

NEAScout, a 6U cubesat and secondary payload on NASA's EM-1, will use an 85 sq m solar sail to travel to a near-earth asteroid at about 1 Astronomical Unit (about 1.5 x 10(exp 8) km) for observation and reconnaissance1. A combination of reaction wheels, reaction control system, and a slow rotisserie roll about the solar sail's normal axis were expected to handle attitude control and adjust for imperfections in the deployed sail during the 2.5-year mission. As the design for NEAScout matured, one of the critical design parameters, the offset in the center of mass and center of pressure (CP/CM offset), proved to be sub-optimal. After significant mission and control analysis, the CP/CM offset was accommodated by the addition of a new subsystem to NEAScout. This system, called the Active Mass Translator (AMT), would reside near the geometric center of NEAScout and adjust the CM by moving one portion of the flight system relative to the other. The AMT was given limited design space - 17 mm of the vehicle's assembly height-and was required to generate +/-8 cm by +/-2 cm translation to sub-millimeter accuracy. Furthermore, the design must accommodate a large wire bundle of small gage, single strand wire and coax cables fed through the center of the mechanism. The bend radius, bend resistance, and the exposure to deep space environment complicates the AMT design and operation and necessitated a unique design to mitigate risks of wire bundle damage, binding, and cold-welding during operation. This paper will outline the design constraints for the AMT, discuss the methods and reasoning for design, and identify the lessons learned through the designing, breadboarding and testing for the low-profile translation stages with wire feedthrough capability.

Few, Alex↗
NASA NTRS2018

Integration of Multilevel Superconducting Buried Wiring Layers with Transition-Edge Sensor Detectors for Large Scale Arrays

Lynx, one of the four mission concepts under consideration for the next Astrophysics DecadalReview, will include a microcalorimeter array consisting of more than 100,000 pixels in a compact arrangement with absorber pitch as small as 25 microns. In order to realize the desired array scale, fine-pitch multi-level superconducting wiring with high yield, compatible with rapid expansion of our hydra absorber designs, is essential. We have demonstrated a method of integrating transition edge sensor (TES) microcalorimeters with suitable multilevel buried wiring, fabricated at MIT Lincoln Laboratory using advanced tools dedicated to superconducting circuit fabrication. The TES Mo/Au bilayer is deposited on a high-quality oxide surface created by chemical-mechanical polishing, allowing tight specifications on the TES superconducting transition and link conductivity to be achieved even though the process order has been inverted. The TESs contact the top-level niobium wiring through vias etched through silicon dioxide down to the topmost wiring layer. The article discusses the overall fabrication process, as wellas the behavior of sensors with different via designs, proximity structures, and lateral sizes. An initial iteration of the integrated fabrication process indicates that microcalorimeters fabricated in this way should meet mission specifications using a Mo/Au bilayer with a reasonable critical temperature below 100 mK.

Detector↗
NASA NTRSDate not supplied

Metallic Powder Core Tubular Wire (PCTW) Development for Additive Manufacturing

NASA Langley Research Center (LaRC) in Hampton, VA, and the Center for Welding, Joining, and Coating Research (CWJCR) in the Department of Metallurgical and Materials Engineering at the Colorado School of Mines (CSM) in Golden, CO, have collaborated for nearly fifteen years to develop metallic powder core tubular wire (PCTW) feedstock for additive manufacturing (AM) using electron beam deposition. The motivation for this development was to offset dealloying observed during deposition of titanium and aluminum alloy solid wire feedstock in the LaRC electron beam freeform fabrication (EBF3) system and to explore novel alloy compositions by tailoring the powder fill. EBF3 is a fusion-based AM process that is performed under vacuum and is consequently prone to vaporization loss of low vapor pressure alloying elements. Research spanning four graduate student research projects succeeded in developing the basic methodology to fabricate PCTW, the mass balance equations used to define the powder fill, microstructure control through particulate inoculation, and the feasibility of producing metal matrix composite materials. Metallic PCTW is comprised of a thin foil sheath wrapped around a powder blend. Fabrication of PCTW at CSM was accomplished using a tubular wire mill system to first bend a flat strip into a u-shaped cross section, deposit a powder fill, create a lap joint to seal the wire, and draw to final diameter. Powder management systems were developed to ensure uniform mixing of powder constituents and identify feed rates for optimum fill ratios. Processing parameters were successfully developed for titanium and aluminum alloy sheaths to account for material work hardening during drawing. Mass balance equations were developed to account for compositional contributions of the sheath and powder fill. PCTW composition can be adjusted through selection of the sheath or powder materials. PCTWs were successfully developed to offset Al loss in deposits of Ti-6-4 and Mg loss in Al 6061, resulting in deposits that were within the composition limits for each material. Ti-6-4 deposits were fabricated using PCTW comprised of commercially pure (CP) titanium sheath and a fill of pre-alloyed Ti-6-4 powder with additions of elemental Al and V powders. Additions of both elements were required to account for the CP Ti from the sheath, and Al was further enhanced to offset documented losses in EBF3 deposits. For Al 6061 deposits, composition was modulated through the choice of sheath material. The PCTW was made using an Al 5052 sheath to supplement Mg content and a fill composition of pre-alloyed 6061 powder with additions of Si and Cu.The slower solidification rate of the EBF3 process compared with laser powder bed fusion processes can lead to coarse-grained microstructures and mechanical property anisotropy. EBF3deposits of Ti-6-4 exhibited large epitaxially grown β grains, which result in degraded mechanical properties in the deposition direction. Microstructure refinement was achieved through a combination of electron beam modulation and the use of a PCTW designed for Ti-6-4 deposits and modified by the addition of powder made from Fe and B. Resulting deposits exhibited reductions in β grain size, α phase colony intercept length and lath width, and an increased volume fraction of β phase. The mechanism of microstructure refinement was related to precipitation of boride particles. Hardness testing confirmed that mechanical property anisotropy was reduced and an overall increase in hardness was achieved.Metal matrix composite (MMC) materials offer strength and stiffness benefits over unreinforced materials. Two methods were investigated using PCTW technology for producing Al 6061 basedMMC materials; the direct addition of SiC reinforcing particles and the in-situ generation of reinforcements through reaction synthesis of precursor powders. Al 6061 based MMCs reinforced with SiC exhibited particle clustering and formation of aluminum carbides during deposition. The application of a Ni coating to the SiC particles prior to incorporation into the powder fill eliminated aluminum carbide formation and aided particle distribution during deposition. Modulation of beam focus and power further reduced aluminum carbide formation and aided particle distribution. In reaction synthesis, precursor additions undergo an exothermic reaction during deposition to form new ceramic products, generally of finer scale than the initial precursor components. The product phases provide reinforcement in the MMC and act as nucleation sites during solidification, resulting in grain refinement, improved mechanical properties, and reduced susceptibility to solidification cracking. Higher tensile strength and stiffness were demonstrated in Al 6061 based MMCs with 2 vol% reinforcement. These combined research efforts demonstrate the potential of PCTW technology for customizing of alloy composition and achieving microstructure control. A manufacturing process for titanium- and aluminum-based PCTWs was developed based on iterative design, theoretical calculations, and empirical data. PCTW technology successfully mitigated Al loss from Ti-6-4 and Mg loss in Al 6061, resulted in grain refinement in Ti-6-4, and demonstrated fabrication of Al based MMCs

Marcia S Domack↗
DOE OSTI2022

Wire-based metallization and stringing for solar cells

Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

Sewell, Richard Hamilton↗
DOE OSTI2023

Wire rivet

A rivet assembly for securing a wire in electrical communication with a substrate having a hollow cylindrical body with a first opening at a proximal end and a second opening at a distal end. The rivet assembly further includes a wire with a portion in electrical communication with the cylindrical body. The rivet assembly yet further includes a compression mechanism configured for use selectively compressing the cylindrical body along an axial direction. Compression of the cylindrical body can cause diametric expansion of an outer diameter of the cylindrical body to retain the cylindrical body within a substrate. The rivet assembly additionally includes wire retention structure configured for holding the wire in electrical contact with the compressed cylindrical body.

Briggs, Timothy↗
DOE OSTI2023

Wire-based metallization and stringing for solar cells

Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a substrate has a surface. A plurality of N-type and P-type semiconductor regions is disposed in or above the surface of the substrate. A conductive contact structure is disposed on the plurality of N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of conductive wires, each conductive wire of the plurality of conductive wires essentially continuously bonded directly to a corresponding one of the N-type and P-type semiconductor regions.

14 SOLAR ENERGY↗
DOE OSTI2024

Round superconductor wires

A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.

Majkic, Goran↗
DOE OSTI2024

Wire-based metallization and stringing for solar cells

Wire-based metallization and stringing techniques for solar cells, and the resulting solar cells, modules, and equipment, are described. In an example, a string of solar cells includes a plurality of back-contact solar cells, wherein each of the plurality of back-contact solar cells includes P-type and N-type doped diffusion regions. A plurality of conductive wires is disposed over a back surface of each of the plurality of solar cells, wherein each of the plurality of conductive wires is substantially parallel to the P-type and N-type doped diffusion regions of each of the plurality of solar cells. One or more of the plurality of conductive wires adjoins a pair of adjacent solar cells of the plurality of solar cells and has a relief feature between the pair of adjacent solar cells.

Sewell, Richard Hamilton↗
DOE OSTI2024

Wire-based metallization for solar cells

Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.

Sewell, Richard Hamilton↗
DOE OSTI2024

Enhanced Second Generation (2G) High Temperature Superconducting (HTS) wire for Electric Motor Applications

This project focused on the development of a revolutionary Second Generation (2G) high temperature superconducting (HTS) wire engineered specifically to meet the requirements for a new generation of high temperature superconducting electric machines. This novel design combined a roll-to-roll irradiation process to enhance the performance of the HTS wire in the presence of strong magnetic fields (improved flux pinning) with an innovative process to incorporate multiple HTS layers within a single 2G wire.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2022

Use of wire grid polarizers with liquid crystal display for large-volume stereolithography

Spatial light modulators that use liquid crystal devices (LCDs) to pattern ultraviolet light for vat polymerization suffer from a few limitations: limited range of wavelengths that can be patterned, low damage threshold for incoming light, and low efficiency of light transmission. A monochrome LCD can more efficiently transmit useful wavelengths of light for stereolithography (365–405 nm) than a color LCD, but it still contains two absorptive film polarizers that suffer from the aforementioned limitations. Wire grid polarizers reflect rather than absorb the blocked polarizations of light, resulting in a higher intensity damage threshold. They can also polarize lower wavelength light that is limited only by the wire pitch. In this work, this research investigates the effects of replacing an LCD’s film polarizers with wire grid polarizers to enable polarization and patterning of high intensity UV light, resulting in shorter curing times and the ability to print a wider range of stereolithography feedstocks.

42 ENGINEERING↗
DOE OSTI2020

Size effect in stainless steel thin wires under tension

Miniaturization of modern devices drives the exploration into how materials behave in small dimensions. However, the mechanical behaviors of micro-scale specimens under varied loading conditions are still challenging to characterize and predict. In this work, specimen size-dependent weakening effect was experimentally revealed in 316L stainless steel thin wires under tension with wire diameter decreasing from 200 μm down to 61 μm. The underlying mechanisms were primarily associated with surface grain softening and strain localization, which were largely dependent on the number of grains across wire diameter. Through an analog composite model with surface and interior grains that follows the Hall-Petch relation, the extent of surface grain softening was found to coincide with the flow stress reduction due to lack of boundary strengthening. Further using elasto-plastic self-consistent polycrystal modeling, the stress-strain behaviors of interior and surface grains were well described in analogy to those of bulk materials with similar-size grains and extremely large grains, respectively. Subsequently, the analog composite model well simulated the specimen size-dependent weakening effect under tension. This article provided more insights into the size effect exploration and proposed a practical model for describing size-dependent mechanical behaviors of small-scale materials to be applied to miniaturized devices.

316L stainless steel↗