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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 307 records · Page 17
All sourcesNASA NTRSDOE OSTI
NASA NTRS2008

On-Wafer Measurement of a Silicon-Based CMOS VCO at 324 GHz

The world s first silicon-based complementary metal oxide/semiconductor (CMOS) integrated-circuit voltage-controlled oscillator (VCO) operating in a frequency range around 324 GHz has been built and tested. Concomitantly, equipment for measuring the performance of this oscillator has been built and tested. These accomplishments are intermediate steps in a continuing effort to develop low-power-consumption, low-phase-noise, electronically tunable signal generators as local oscillators for heterodyne receivers in submillimeter-wavelength (frequency > 300 GHz) scientific instruments and imaging systems. Submillimeter-wavelength imaging systems are of special interest for military and law-enforcement use because they could, potentially, be used to detect weapons hidden behind clothing and other opaque dielectric materials. In comparison with prior submillimeter- wavelength signal generators, CMOS VCOs offer significant potential advantages, including great reductions in power consumption, mass, size, and complexity. In addition, there is potential for on-chip integration of CMOS VCOs with other CMOS integrated circuitry, including phase-lock loops, analog- to-digital converters, and advanced microprocessors.

Samoska, Lorene↗
NASA NTRS2010

MMIC Amplifiers and Wafer Probes for 350 to 500 GHz

A wireless avionics interface exploits the constrained nature of data networks in flight systems to use a lightweight routing method. This simplified routing means that a processor is not required, and the logic can be implemented as an intellectual property (IP) core in a field-programmable gate array (FPGA). The FPGA can be shared with the flight subsystem application. In addition, the router is aware of redundant subsystems, and can be configured to provide hot standby support as part of the interface. This simplifies implementation of flight applications requiring hot stand - by support. When a valid inbound packet is received from the network, the destination node address is inspected to determine whether the packet is to be processed by this node. Each node has routing tables for the next neighbor node to guide the packet to the destination node. If it is to be processed, the final packet destination is inspected to determine whether the packet is to be forwarded to another node, or routed locally. If the packet is local, it is sent to an Applications Data Interface (ADI), which is attached to a local flight application. Under this scheme, an interface can support many applications in a subsystem supporting a high level of subsystem integration. If the packet is to be forwarded to another node, it is sent to the outbound packet router. The outbound packet router receives packets from an ADI or a packet to be forwarded. It then uses a lookup table to determine the next destination for the packet. Upon detecting a remote subsystem failure, the routing table can be updated to autonomously bypass the failed subsystem.

Samoska, Lorene A.↗
NASA NTRS2013

Whole Wafer Design and Fabrication for the Alignment of Nanostructures for Chemical Sensor Applications

A major objective in aerospace sensor development is to produce sensors that are small in size, easy to batch fabricate and low in cost, and have low power consumption The fabrication of chemical sensors involving nanostructured materials can provide these properties as well as the potential for the development of sensor systems with unique properties and improved performance. However, the fabrication and processing of nanostructures for sensor applications currently is limited in the ability to control their location on the sensor. Currently, our group at NASA Glenn Research Center has demonstrated the controlled placement of nanostructures in sensors using a sawtooth patterned electrode design. With this design the nanostructures are aligned between opposing sawtooth electrodes by applying an alternating current.

Biaggi-Labiosa, Azlin M.↗
NASA NTRS2015

Integration of Nanostructures into Microsensor Devices on Whole Wafers

Chemical sensors are used in a wide variety of applications, such as environmental monitoring, fire detection, emission monitoring, and health monitoring. The fabrication of chemical sensors involving nanostructured materials holds the potential for the development of sensor systems with unique properties and improved performance. However, the fabrication and processing of nanostructures for sensor applications currently are limited in the ability to control their location on the sensor, which in turn hinders the progress for batch fabrication. This report discusses the advantages of using nanomaterials in sensor designs, some of the challenges encountered with the integration of nanostructures into microsensor / devices, and then briefly describes different methods attempted by other groups to address this issue. Finally, this report will describe how our approach for the controlled alignment of nanostructures onto a sensor platform was applied to demonstrate an approach for the mass production of sensors with nanostructures.

Nanostructures (Devices)↗
DOE OSTI2021

Fabrication of thin-film electronic devices with non-destructive wafer reuse

Thin-film electronic devices such as LED devices and field effect transistor devices are fabricated using a non-destructive epitaxial lift-off technique that allows indefinite reuse of a growth substrate. The method includes providing an epitaxial protective layer on the growth substrate and a sacrificial release layer between the protective layer and an active device layer. After the device layer is released from the growth substrate, the protective layer is selectively etched to provide a newly exposed surface suitable for epitaxial growth of another device layer. The entire thickness of the growth substrate is preserved, enabling continued reuse. Inorganic thin-film device layers can be transferred to a flexible secondary substrate, enabling formation of curved inorganic optoelectronic devices.

Forrest, Stephen R.↗