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At least 307 records · Page 17
All sourcesNASA NTRSDOE OSTI
NASA NTRS1994

A hydrostatic stress-dependent anisotropic model of viscoplasticity

A hydrostatic stress-dependent, anisotropic model of viscoplasticity is formulated as an extension of Bodner's model. This represents a further extension of the isotropic Bodner model over that made to anisotropy by Robinson and MitiKavuma. Account is made of the inelastic deformation that can occur in metallic composites under hydrostatic stress. A procedure for determining the material parameters is identified that is virtually identical to the established characterization procedure for the original Bodner model. Characterization can be achieved using longitudinal/transverse tensile and shear tests and hydrostatic stress tests; alternatively, four off-axis tensile tests can be used. Conditions for a yield stress minimum under off-axis tension are discussed. The model is applied to a W/Cu composite; characterization is made using off-axis tensile data generated at NASA Lewis Research Center (LeRC).

Robinson, D. N.↗
NASA NTRS1995

Verification of surface preparation for adhesive bonding

A survey of solid rocket booster (SRB) production operations identified potential contaminants which might adversely affect bonding operations. Lap shear tests quantified these contaminants' effects on adhesive strength. The most potent contaminants were selected for additional studies on SRB thermal protection system (TPS) bonding processes. Test panels were prepared with predetermined levels of contamination, visually inspected using white and black light, then bonded with three different TPS materials over the unremoved contamination. Bond test data showed that white and black light inspections are adequate inspection methods for TPS bonding operations. Extreme levels of contamination (higher than expected on flight hardware) had an insignificant effect on TPS bond strengths because of the apparent insensitivity of the adhesive system to contamination effects, and the comparatively weak cohesive strength of the TPS materials.

Myers, Rodney S.↗
NASA NTRS1977

Exploratory Study on the Effects of Novel Diamine Curing Agents and Isocyanate Precursors on the Properties of New Epoxy and Urethane Adhesives

This report covers the results of investigations directed toward studying the effects of novel aromatic diamine structures on epoxy adhesive properties and includes work done under a modification to the original contract. Three aromatic diamines based on diphenylsulfone and benzophenone were studied as epoxy adhesive curing agents. Previously found differences in adhesive strengths for meta vs para orientation were not found in these series. The use of aluminum and alumina as fillers in a m,m'-methylene dianiline-cured epoxy adhesive was not found to be beneficial to adhesive strength. Alumina filled adhesives had much lower strength than unfilled adhesives. The unfilled m,m'-methylene dianiline-based epoxy adhesive had excellent resistance to moisture relative to a p,p'-methylene dianiline-based adhesive and maintained good strengths up to 250 F. A glass fiber composite based on a m,m'-methylene dianiline-cured epoxy appeared to be equivalent to the p,p'-methylene dianiline-cured epoxy as judged by short beam shear tests.

Glasgow, D. Gerald↗
NASA NTRS1997

Micromechanical Modeling of Woven Metal Matrix Composites

This report presents the results of an extensive micromechanical modeling effort for woven metal matrix composites. The model is employed to predict the mechanical response of 8-harness (8H) satin weave carbon/copper (C/Cu) composites. Experimental mechanical results for this novel high thermal conductivity material were recently reported by Bednarcyk et al. along with preliminary model results. The micromechanics model developed herein is based on an embedded approach. A micromechanics model for the local (micro-scale) behavior of the woven composite, the original method of cells (Aboudi), is embedded in a global (macro-scale) micromechanics model (the three-dimensional generalized method of cells (GMC-3D) (Aboudi). This approach allows representation of true repeating unit cells for woven metal matrix composites via GMC-3D, and representation of local effects, such as matrix plasticity, yarn porosity, and imperfect fiber-matrix bonding. In addition, the equations of GMC-3D were reformulated to significantly reduce the number of unknown quantities that characterize the deformation fields at the microlevel in order to make possible the analysis of actual microstructures of woven composites. The resulting micromechanical model (WCGMC) provides an intermediate level of geometric representation, versatility, and computational efficiency with respect to previous analytical and numerical models for woven composites, but surpasses all previous modeling work by allowing the mechanical response of a woven metal matrix composite, with an elastoplastic matrix, to be examined for the first time. WCGMC is employed to examine the effects of composite microstructure, porosity, residual stresses, and imperfect fiber-matrix bonding on the predicted mechanical response of 8H satin C/Cu. The previously reported experimental results are summarized, and the model predictions are compared to monotonic and cyclic tensile and shear test data. By considering appropriate levels of porosity, residual stresses, and imperfect fiber-matrix debonding, reasonably good qualitative and quantitative correlation is achieved between model and experiment.

Bednarcyk, Brett A.↗
NASA NTRS1994

Progressive Damage and Fracture in Composites Under Dynamic Loading

A computational simulation tool is used to evaluate the various stages of damage progression in composite materials during losipescu shear testing. Unidirectional composite specimens with either the major or minor material axis in the load direction are considered. Damage progression characteristics are described for each specimen using two types of boundary conditions. A procedure is outlined regarding the use of computational simulation in the testing of composite materials.

Minnetyan, Levon↗
NASA NTRS1998

A 90 GHz Amplifier Assembled Using a Bump-Bonded InP-Based HEMT

We report on the performance of a novel W-band amplifier fabricated utilizing very compact bump bonds. We bump-bonded a high-speed, low-noise InP high electron mobility transistor (HEMT) onto a separately fabricated passive circuit having a GaAs substrate. The compact bumps and small chip size were used for efficient coupling and maximum circuit design flexibility. This new quasi-monolithic millimeter-wave integrated circuit (Q-MMIC) amplifier exhibits a peak gain of 5.8 dB at approx. 90 GHz and a 3 dB bandwidth of greater than 25%. To our knowledge, this is the highest frequency amplifier assembled using bump-bonded technology. Our bump-bonding technique is a useful alternative to the high cost of monolithic millimeter-wave integrated circuits (MMIC's). Effects of the bumps on the circuit appear to be minimal. We used the simple matching circuit for demonstrating the technology - future circuits would have all of the elements (resistors, via holes, bias lines, etc.) included 'in conventional MMIC's. Our design in different from other investigators' efforts in that the bumps are only 8 microns thick by 15 microns wide. The bump sizes were sufficiently small that the devices, originally designed for W-band hybrid circuits, could be bonded without alteration. Figure 3 shows the measured and simulated magnitude of S-parameters from 85-120 GHz, of the InP HEMT bump-bonded to the low noise amplifier (LNA) passive. The maximum gain is 5.8 dB at approx. 90 GHz, and gain extends to 117 GHz. Measurement of a single device (without matching networks) shows approx. 1 dB of gain at 90 GHz. The measured gain of the amplifier agrees well with the design in the center of the measurement band, and the agreement falls off at the band edges. Since no accommodation for the bump-bonding parasitics was made in the design, the result implies that the parasitic elements associated with the bonding itself do not dominate the performance of the LNA circuit. It should be noted that this amplifier was designed for good noise performance, which is why the input and output return losses are poorer than one would expect for an amplifier simply matched for gain. However, noise performance has not been measured at this time. While the agreement between modeled vs. experimental data is not exact, the data prove that bump-bonded technology can be used for amplifiers at frequencies at least as high as 100 GHz. JPL is pursuing this technology as a way to economically and quickly incorporate the best available HEMTs into a circuit with all of the reliability and circuit design flexibility offered by MMIC technology. We are currently using the technology to fabricate 4-stage, wide-band, W-band LNA's. We have also performed pull and shear tests which show that the bump bonds are sufficiently robust for any anticipated application.

Pinsukanjana, Paul R.↗
NASA NTRS2002

Incorporation of Mean Stress Effects into the Micromechanical Analysis of the High Strain Rate Response of Polymer Matrix Composites

The results presented here are part of an ongoing research program, to develop strain rate dependent deformation and failure models for the analysis of polymer matrix composites subject to high strain rate impact loads. A micromechanics approach is employed in this work, in which state variable constitutive equations originally developed for metals have been modified to model the deformation of the polymer matrix, and a strength of materials based micromechanics method is used to predict the effective response of the composite. In the analysis of the inelastic deformation of the polymer matrix, the definitions of the effective stress and effective inelastic strain have been modified in order to account for the effect of hydrostatic stresses, which are significant in polymers. Two representative polymers, a toughened epoxy and a brittle epoxy, are characterized through the use of data from tensile and shear tests across a variety of strain rates. Results computed by using the developed constitutive equations correlate well with data generated via experiments. The procedure used to incorporate the constitutive equations within a micromechanics method is presented, and sample calculations of the deformation response of a composite for various fiber orientations and strain rates are discussed.

Goldberg, Robert K.↗
NASA NTRS2002

Evaluation of a Multi-Axial, Temperature, and Time Dependent (MATT) Failure Model

To obtain a better understanding the response of the structural adhesives used in the Space Shuttle's Reusable Solid Rocket Motor (RSRM) nozzle, an extensive effort has been conducted to characterize in detail the failure properties of these adhesives. This effort involved the development of a failure model that includes the effects of multi-axial loading, temperature, and time. An understanding of the effects of these parameters on the failure of the adhesive is crucial to the understanding and prediction of the safety of the RSRM nozzle. This paper documents the use of this newly developed multi-axial, temperature, and time (MATT) dependent failure model for modeling failure for the adhesives TIGA 321, EA913NA, and EA946. The development of the mathematical failure model using constant load rate normal and shear test data is presented. Verification of the accuracy of the failure model is shown through comparisons between predictions and measured creep and multi-axial failure data. The verification indicates that the failure model performs well for a wide range of conditions (loading, temperature, and time) for the three adhesives. The failure criterion is shown to be accurate through the glass transition for the adhesive EA946. Though this failure model has been developed and evaluated with adhesives, the concepts are applicable for other isotropic materials.

Richardson, D. E.↗
NASA NTRS2004

A Novel Surface Treatment for Titanium Alloys

High-speed commercial aircraft require a surface treatment for titanium (Ti) alloy that is both environmentally safe and durable under the conditions of supersonic flight. A number of pretreatment procedures for Ti alloy requiring multi-stages have been developed to produce a stable surface. Among the stages are, degreasing, mechanical abrasion, chemical etching, and electrochemical anodizing. These treatments exhibit significant variations in their long-term stability, and the benefits of each step in these processes still remain unclear. In addition, chromium compounds are often used in many chemical treatments and these materials are detrimental to the environment. Recently, a chromium-free surface treatment for Ti alloy has been reported, though not designed for high temperature applications. In the present study, a simple surface treatment process developed at NASA/LaRC is reported, offering a high performance surface for a variety of applications. This novel surface treatment for Ti alloy is conventionally achieved by forming oxides on the surface with a two-step chemical process without mechanical abrasion. This acid-followed-by-base treatment was designed to be cost effective and relatively safe to use in a commercial application. In addition, it is chromium-free, and has been successfully used with a sol-gel coating to afford a strong adhesive bond after exposure to hot-wet environments. Phenylethynyl containing adhesives were used to evaluate this surface treatment with sol-gel solutions made of novel imide silanes developed at NASA/LaRC. Oxide layers developed by this process were controlled by immersion time and temperature and solution concentration. The morphology and chemical composition of the oxide layers were investigated using scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), and Auger electron spectroscopy (AES). Bond strengths made with this new treatment were evaluated using single lap shear tests.

Lowther, S. E.↗
NASA NTRS2001

Organic-Inorganic Hybrids Using Novel Phenylethynyl Imide Silanes

In this presentation, polyimide-silica hybrids using novel phenylethynyl imide silanes are reported. The phenylethynyl group is present in the organic precursor as either a pendent or an end group to bond chemically with the polyimide adhesive containing phenylethynyl groups during processing, while the silane group of the organic precursor would chemically react with the inorganic precursor through oxane bond formation. The chemical compositions of these novel hybrids were examined using X-ray mapping modes of scanning electron microscopy (SEM), which revealed a silicon gradient interphase between the high surface energy substrate and the polyimide adhesive. Novel aromatic phenylethynyl imide silanes (APEISs) and pendent phenylethynyl imide oligomeric disilanes (PPEIDSs) have been synthesized, and sol-gel solutions containing the new silanes, a phenylethynyl terminated imide oligomer (PETI-5), and an inorganic precursor were formulated to develop a gradient hybrid interphase between a titanium alloy and the adhesive. Two different sol-gel systems were investigated to develop organic-inorganic hybrids. Hybrid I was composed of an organic precursor containing both phenylethynyl and silane groups (PPEIDS) and an inorganic precursor. Functional group concentrations were controlled by the variation of the molecular weight of the imide backbone of PPEIDS. Hybrid II was composed of organic and inorganic precursors and a coupling agent containing both phenylethynyl and silane groups. Morphology and chemical composition of the hybrid interphase between the inorganic substrate and the adhesive were investigated, and the bond strength and durability were evaluated using lap shear tests at various conditions. The assessment of how the bonding at an interface is affected by various sol-gel solution compositions and environments is reported.

Park, C.↗
NASA NTRS2007

Mechanical Properties of 17-4PH Stainless Steel Foam Panels

Rectangular 17-4PH stainless steel sandwiched foam panels were fabricated using a commercial manufacturing technique by brazing two sheets to a foam core. Microstructural observations and ultrasonic nondestructive evaluation of the panels revealed large variations in the quality of the brazed areas from one panel to the next as well as within the same panel. Shear tests conducted on specimens machined from the panels exhibited failures either in the brazed region or in the foam core for the poorly brazed and well-brazed samples, respectively. Compression tests were conducted on the foam cores to evaluate their elastic and plastic deformation behavior. These data were compared with published data on polymeric and metallic foams, and with theoretical deformation models proposed for open cell foams.

Raj, S. V.↗
NASA NTRS2010

Microstructural and Mechanical Evaluation of a Cu-Based Active Braze Alloy to Join Silicon Nitride Ceramics

Self-joining of St. Gobain Si3N4 (NT-154) using a ductile Cu-Al-Si-Ti active braze (Cu-ABA) was demonstrated. A reaction zone approx.2.5-3.5 microns thick) developed at the interface after 30 min brazing at 1317 K. The interface was enriched in Ti and Si. The room temperature compressive shear strengths of Si3N4/Si3N4 and Inconel/Inconel joints (the latter created to access baseline data for use with the proposed Si3N4/Inconel joints) were 140+/-49MPa and 207+/-12MPa, respectively. High-temperature shear tests were performed at 1023K and 1073 K, and the strength of the Si3N4/Si3N4 and Inconel/Inconel joints were determined. The joints were metallurgically well-bonded for temperatures above 2/3 of the braze solidus. Scanning and transmission electron microscopy studies revealed a fine grain microstructure in the reaction layer, and large grains in the inner part of the joint with interfaces being crack-free. The observed formation of Ti5Si3 and AlN at the joint interface during brazing is discussed.

Singh, M.↗
NASA NTRS2018

Update - Body of Knowledge (BOK) for Copper Wire Bonds

Copper wire bond technology developments continue to be a subject of technical interest to the NASA (National Aeronautics and Space Administration) NEPP (NASA Electronic Parts and Packaging Program) which funded this update. Based on this new research, additional copper bond wire vulnerabilities were found in the literature - Crevice corrosion, intrinsic degradation of palladium coated copper wire, congregation of palladium near ball bond interface leading to failure, residual aluminum pad metallization impact on device lifetimes, stitch cracking phenomena, package delamination's that have resulted in wire bond failures and device failure due to elemental sulfur. A search of the U.S.A. patent web site found 3 noteworthy patents on the following developments: claim of a certain IMC (Intermetallic Compound) thickness as a mitigation solution to chlorine corrosion; claim of using materials with different pHs to neutralize contaminants in a package containing copper wire bonds; and a discussion on ball shear test threshold values for different applications. In addition, an aerospace contractor of military hardware had a presentation on copper bond wires where it was reported that there was a parametric shift and noise susceptibility of devices with copper bond wires which affected legacy design performance. A review of silver bond wire (another emerging technology) technical papers found that an electromigration failure mechanism was evident in device applications that operate under high current conditions. More studies may need to be performed on a comprehensive basis. Research areas for consideration are suggested, however, these research and or qualification/standard test areas are not all inclusive and should not be construed as the element (s) that delivers any potential copper wire bond solution. A false sense of security may occur, whenever there is a reliance on passing any particular qualification, standard, or test protocol.

Rutkowski, E.↗
NASA NTRSDate not supplied

On the Representation of Through-The-Thickness Reinforcements in Finite Element Analysis of Stitched, Blade Stiffened Panels

Modern aircraft employ laminated composites for their tailorable in-plane properties, high specific strengths, and high specific stiffnesses. However, laminated composites exhibit relatively poor interlaminar properties without through-the-thickness reinforcements. Quantifying the necessary amount of through-the-thickness reinforcements is necessary to reduce cost and meet damage tolerance certification requirements. In this study, a discrete superposed cohesive element (DSCE) approach is applied to represent the mixed-mode delamination behavior of stitched stiffened panels subjected to seven-point bending. This approach is compared to a one-dimensional embedded spring element (ESE) method. The DSCE approach uses two superposed bilinear traction-separation laws to obtain a representative load-displacement response determined from interlaminar tensile and shear tests. Additionally, several stitch configurations (unstitched, stitched, and overstitched) are evaluated in terms of their load-displacement response and crack-arrestment capability. Results indicate that the DSCE and ESE approaches show good agreement with respect to the predicted load-displacement response, but the ESE method tends to overpredict the crack growth behavior by approximately 13%. Stitches were not observed to fail during skin-stringer separation. Using an overstitched laminate with stitches near the flange edge provides the greatest crack-arrestment capability. Furthermore, the skin retains 92% of its stiffness after skin-stringer separation occurs.

composites↗
NASA NTRSDate not supplied

On the Representation of Through-The-Thickness Reinforcements in Finite Element Analysis of Stitched, Blade Stiffened Panels

Modern aircraft employ laminated composites for their tailorable in-plane properties, high specific strengths, and high specific stiffnesses. However, laminated composites exhibit relatively poor interlaminar properties without through-the-thickness reinforcements. Quantifying the necessary amount of through-the-thickness reinforcements is necessary to reduce cost and meet damage tolerance certification requirements. In this study, a discrete superposed cohesive element (DSCE) approach is applied to represent the mixed-mode delamination behavior of stitched stiffened panels subjected to seven-point bending. This approach is compared to a one-dimensional embedded spring element (ESE) method. The DSCE approach uses two superposed bilinear traction-separation laws to obtain a representative load-displacement response determined from interlaminar tensile and shear tests. Additionally, several stitch configurations (unstitched, stitched, and overstitched) are evaluated in terms of their load-displacement response and crack-arrestment capability. Results indicate that the DSCE and ESE approaches show good agreement with respect to the predicted load-displacement response, but the ESE method tends to overpredict the crack growth behavior by approximately 13%. Stitches were not observed to fail during skin-stringer separation. Using an overstitched laminate with stitches near the flange edge provides the greatest crack-arrestment capability. Furthermore, the skin retains 92% of its stiffness after skin-stringer separation occurs.

composites↗
NASA NTRSDate not supplied

Ares: A Coupling Methodology for Ablation Modeling

To enable modeling of complex and coupled ablation problems, a multi-physics framework is developed. A methodology for modeling shape change in coupled systems is presented. The approach taken to model gas-surface interactions and translate coupled surface phenomena to physically meaningful boundary conditions in the distinct solvers is discussed. Particular emphasis is placed on the nature of coupled boundary conditions pertaining to surface energy and mass balances as well as surface chemistry modeling. The developed methodology is used to simulate a shear test in arc-jet conditions in order to assess the validity of the coupled approach as well as the implementation of the relevant physical processes.

EDL↗
NASA NTRSDate not supplied

Ares: A Coupling Methodology for Ablation Modeling

To enable modeling of complex and coupled ablation problems, a multi-physics framework is developed. A methodology for modeling shape change in coupled systems is presented. The approach taken to model gas-surface interactions and translate coupled surface phenomena to physically meaningful boundary conditions in the distinct solvers is discussed. Particular emphasis is placed on the nature of coupled boundary conditions pertaining to surface energy and mass balances as well as surface chemistry modeling. The developed methodology is used to simulate a shear test in arc-jet conditions in order to assess the validity of the coupled approach as well as the implementation of the relevant physical processes.

EDL↗