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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Acoustic fields support and cool liquid particles. Levitated by sound energy, liquid drop in acoustic standing-wave field surrounded by acousticically-induced jet streams. Streaming gas cools drow below its freezing point in small fraction of second. Allows new amorphous alloys including "metallic glass" to be formed.
A self-powered furnace is defined as one that imports no electricity: a power cycle integrated into the furnace generates all the electrical power needed, and the heat rejected by the power cycle contributes to space heating. This paper presents criteria for selection of suitable power generation technology for such a furnace. A weighting system was presented to assign weight to each criterion based on its importance to the success of a self-powered furnace implementation. Power generation candidates were reviewed and scored based on the selection criteria. The top five candidates were analyzed to quantitatively compare the additional heat exchange requirements they impose on a baseline furnace. Air-cooled internal combustion engines and microturbine generators had negligible impact on the heat exchange requirement compared to a baseline furnace. Liquid-cooled internal combustion engines increased the heat exchange requirement by a factor of 1.5. Thermoelectric generators and thermophotovoltaic increased the heat exchange requirement by a factor of roughly 2.5. Organic Rankine cycle increased the heat exchange requirement by a factor of 5.
Lightweight, flexible probes have been developed for measuring temperatures at multiple locations in tanks that contain possibly pressurized cryogenic fluids. If the fluid in a given tank is subcritical (that is, if it consists of a liquid and its vapor), then in one of two modes of operation, the temperature measurements made by a probe of this type can be used to deduce the approximate level of the liquid. The temperature sensors are silicon diodes located at intervals along a probe. If the probe is to be used to measure a temperature gradient along a given axis in the tank, then the probe must be mounted along that axis. In the non-liquid-level-sensing temperature-measurement mode, a constant small electric current is applied to each diode and the voltage across the diode . a known function of the current and temperature . is measured as an indication of its temperature. For the purpose of this measurement, "small electric current" signifies a current that is not large enough to cause a significant increase in the measured temperature. More specifically, the probe design calls for a current of 10 A, which, in the cryogenic temperature range of interest, generates heat at a rate of only about 0.01 mW per diode. In the liquid-level-sensing mode, one applies a larger current (30 mA) to each diode so as to heat each diode appreciably (with a power of about 36 mW in the temperature range of interest). Because the liquid cools the diode faster than does the vapor, the temperature of the diode is less when diode is immersed in the liquid than when it is above the surface of the liquid. Thus, the temperature (voltage) reading from each diode can be used to determine whether the liquid level is above or below the diode, and one can deduce that the liquid level lies between two adjacent diodes, the lower one of which reads a significantly lower temperature. The aforementioned techniques for measuring temperature and deducing liquid level are not new. What is new here are the designs of the probes and of associated external electronic circuitry. In each probe, the diodes and the lead wires are embedded in a strong, lightweight, flexible polyimide strip. Each probe is constructed as an integral unit that includes a multipin input/output plug or socket for solderless connection of the lead wires to the external circuitry. The polyimide strip includes mounting tabs with holes that can accommodate rivets, screws, or other fasteners. Alternatively, a probe can be mounted by use of an epoxy. A probe can be manufactured to almost any length or width, and the diodes can be embedded at almost any desired locations along and across the polyimide strip. In designing a probe for a specific application, one seeks a compromise between (1) minimizing the number of diodes in order to minimize the complexity of input/output connections and external electronic circuitry while (2) using enough diodes to obtain the required precision. Optionally, to minimize spurious heating of the cryogenic fluid, the external circuitry can be designed to apply power to the probe only during brief measurement intervals. Assuming that the external circuitry is maintained at a steady temperature, a power-on interval of only a few seconds is sufficient to obtain accurate data on temperatures and/or the height of the liquid/vapor interface.
The objectives of this article are to develop a multidisciplinary, computational methodology to predict the hot-gas-side and coolant-side heat transfer in film cooling assisted, regeneratively cooled liquid rocket engine combustors, and to use it in parametric studies to recommend optimized design of the coolant channels for a developmental combustor. An integrated numerical model which incorporates computational fluid dynamics (CFD) for the hot-gas thermal environment, and thermal analysis for the liner and coolant channels, was developed. This integrated CFD/thermal model was validated by comparing predicted heat fluxes with those of hot-firing test and industrial design methods for a 40-k calorimeter thrust chamber and the Space Shuttle Main Engine main combustion chamber. Parametric studies were performed for the advanced main combustion chamber to find a strategy for a proposed coolant channel design.
Lightweight, flexible probes have been developed for measuring temperatures at multiple locations in tanks that contain possibly pressurized cryogenic fluids. If the fluid in a given tank is subcritical (that is, if it consists of a liquid and its vapor), then in one of two modes of operation, the temperature measurements made by a probe of this type can be used to deduce the approximate level of the liquid. The temperature sensors are silicon diodes located at intervals along a probe. If the probe is to be used to measure a temperature gradient along a given axis in the tank, then the probe must be mounted along that axis. In the temperature-measurement mode, a constant small electric current is applied to each diode and the voltage across the diode a known function of the current and temperature is measured as an indication of its temperature. For the purpose of this measurement, small electric current signifies a current that is not large enough to cause a significant increase in the measured temperature. More specifically, the probe design calls for a current of 10 A, which, in the cryogenic temperature range of interest, generates heat at a rate of only about 0.01 mW per diode. In the liquid-level-sensing mode, one applies a larger current (30 mA) to each diode so as to heat each diode appreciably (with a power of about 36 mW in the temperature range of interest). Because the liquid cools the diode faster than does the vapor, the temperature of the diode is less when the diode is immersed in the liquid than when it is above the surface of the liquid. Thus, the temperature (voltage) reading from each diode can be used to determine whether the liquid level is above or below the diode, and one can deduce that the liquid level lies between two adjacent diodes, the lower one of which reads a significantly lower temperature. The aforementioned techniques for measuring temperature and deducing liquid level are not new. What is new here are the designs of the probes and of associated external electronic circuitry. In each probe, the diodes and the lead wires are embedded in a strong, lightweight, flexible polyimide strip. Each probe is constructed as an integral unit that includes a multipin input/output plug or socket for solderless connection of the lead wires to the external circuitry. The polyimide strip includes mounting tabs with holes that can accommodate rivets, screws, or other fasteners. Alternatively, a probe can be mounted by use of an epoxy. A probe can be manufactured to almost any length or width, and the diodes can be embedded at almost any desired location along and across the polyimide strip. In designing a probe for a specific application, one seeks a compromise between (1) minimizing the number of diodes in order to minimize the complexity of input/output connections and external electronic circuitry while (2) using enough diodes to obtain the required precision. Optionally, to minimize spurious heating of the cryogenic fluid, the external circuitry can be designed to apply power to the probe only during brief measurement intervals. Assuming that the external circuitry is maintained at a steady temperature, a power-on interval of only a few seconds is sufficient to obtain accurate data on temperatures and/or the height of the liquid/vapor interface.
The Orion spacecraft has recently completed Artemis II, the first crewed mission around the moon in 54 years. This test flight demonstrated vehicle capability as the foundation for all future missions under the Artemis program. As a major system of Orion, the Active Thermal Control System (ATCS) successfully managed crew and vehicle heat loads to provide adequate cooling and thermal comfort for the duration of the Artemis II mission. Thermal control on the Orion vehicle is managed through two redundant cooling loops in the Crew Module (CM) that absorb heat loads from the cabin and Air Revitalization System (ARS) heat exchangers, the Liquid Cooling Garment (LCG) heat exchanger, and the avionics cold plates, and then transfer those heat loads to the Service Module (SM) radiator loops and/or the Phase Change Material (PCM) and ammonia boilers when required through thermal configuration or mission phase. During Artemis II, Orion did not necessitate any supplemental cooling from ammonia boilers until service module separation, allowing the maximum availability of ammonia cooling prior to entry. This presentation will provide an overview of the Orion ATCS major subsystems, highlight the performance during key mission phases, and comment on the applicability of the observed thermal response to future Artemis missions.
The next-generation Advanced Extravehicular Mobility Unit (AEMU) Portable Life Support System (PLSS) is integrating a number of new technologies to improve reliability and functionality. One of these improvements is the development of the Auxiliary Cooling Loop (ACL) for contingency crewmember cooling. The ACL is a completely redundant, independent cooling system that consists of a small evaporative cooler--the Mini Membrane Evaporator (Mini-ME), independent pump, independent feedwater assembly and independent Liquid Cooling Garment (LCG). The Mini-ME utilizes the same hollow fiber technology featured in the full-sized AEMU PLSS cooling device, the Spacesuit Water Membrane Evaporator (SWME), but Mini-ME occupies only 25% of the volume of SWME, thereby providing only the necessary crewmember cooling in a contingency situation. The ACL provides a number of benefits when compared with the current EMU PLSS contingency cooling technology, which relies upon a Secondary Oxygen Vessel; contingency crewmember cooling can be provided for a longer period of time, more contingency situations can be accounted for, no reliance on a Secondary Oxygen Vessel (SOV) for contingency cooling--thereby allowing a reduction in SOV size and pressure, and the ACL can be recharged-allowing the AEMU PLSS to be reused, even after a contingency event. The first iteration of Mini-ME was developed and tested in-house. Mini-ME is currently packaged in AEMU PLSS 2.0, where it is being tested in environments and situations that are representative of potential future Extravehicular Activities (EVA's). The second iteration of Mini-ME, known as Mini- ME2, is currently being developed to offer more heat rejection capability. The development of this contingency evaporative cooling system will contribute to a more robust and comprehensive AEMU PLSS.
The next-generation Advanced Extravehicular Mobility Unit (AEMU) Portable Life Support System (PLSS) is integrating a number of new technologies to improve reliability and functionality. One of these improvements is the development of the Auxiliary Cooling Loop (ACL) for contingency crewmember cooling. The ACL is a completely redundant, independent cooling system that consists of a small evaporative cooler--the Mini Membrane Evaporator (Mini-ME), independent pump, independent feedwater assembly and independent Liquid Cooling Garment (LCG). The Mini-ME utilizes the same hollow fiber technology featured in the full-sized AEMU PLSS cooling device, the Spacesuit Water Membrane Evaporator (SWME), but Mini-ME occupies only approximately 25% of the volume of SWME, thereby providing only the necessary crewmember cooling in a contingency situation. The ACL provides a number of benefits when compared with the current EMU PLSS contingency cooling technology, which relies upon a Secondary Oxygen Vessel; contingency crewmember cooling can be provided for a longer period of time, more contingency situations can be accounted for, no reliance on a Secondary Oxygen Vessel (SOV) for contingency cooling--thereby allowing a reduction in SOV size and pressure, and the ACL can be recharged-allowing the AEMU PLSS to be reused, even after a contingency event. The first iteration of Mini-ME was developed and tested in-house. Mini-ME is currently packaged in AEMU PLSS 2.0, where it is being tested in environments and situations that are representative of potential future Extravehicular Activities (EVA's). The second iteration of Mini-ME, known as Mini-ME2, is currently being developed to offer more heat rejection capability. The development of this contingency evaporative cooling system will contribute to a more robust and comprehensive AEMU PLSS.
The objective of this study is to conduct a unified computational analysis for computing design parameters such as axial thrust, convective and radiative wall heat fluxes for regeneratively cooled liquid rocket engine nozzles, so as to develop a computational strategy for computing those parameters through parametric investigations. The computational methodology is based on a multidimensional, finite-volume, turbulent, chemically reacting, radiating, unstructured-grid, and pressure-based formulation, with grid refinement capabilities. Systematic parametric studies on effects of wall boundary conditions, combustion chemistry, radiation coupling, computational cell shape, and grid refinement were performed and assessed. Under the computational framework of this study, it is found that the computed axial thrust performance, flow features, and wall heat fluxes compared well with those of available data and calculations, using a strategy of structured-grid dominated mesh, finite-rate chemistry, and cooled wall boundary condition.
The Liquid Waste Organization (LWO) at the Savannah River Site (SRS) uses a “Power As One®” motto to process and dispose of radioactive waste. The Defense Waste and Processing Facility (DWPF) treats the high-level waste through a process of vitrification. The DWPF receives three incoming waste streams that are added to the Sludge Receipt and Adjustment Tank (SRAT): sludge, Monosodium Titanate/Sludge Solids (MST/SS), and Strip Effluent (SE). The liquid waste is mixed with pre-fabricated frit and treated with high temperatures in the melter prior to being poured into stainless steel canisters. The liquid cools to form solid glass within these canisters that are suitable for long-term storage and disposal. Savannah River Mission Completion (SRMC), the SRS liquid waste contractor for the U.S. Department of Energy, has implemented several facility improvements to further enhance the operations to support the Liquid Waste Operation (LWO) mission. Two of these operational enhancements include implementing the electronic Material Tracking Program Calculator (eMTPC)software and increasing the DWPF canister heat rate limit.
Future generations of portable life support systems (PLSS's) for space suites (extravehicular mobility units or EMU's) may require regenerable nonventing thermal sinks (RNTS's). For purposes of mobility, a PLSS must be as light and compact as possible. Previous venting PLSS's have employed water sublimators to reject metabolic and equipment heat from EMU's. It is desirable for long-duration future space missions to minimize the use of water and other consumables that need to be periodically resupplied. The emission of water vapor also interferes with some types of instrumentation that might be used in future space exploration. The test article is a type of RNTS based on a metal hydride heat pump (MHHP). The task of reservicing EMU's after use must be made less demanding in terms of time, procedures, and equipment. The capability for quick turnaround post-EVA servicing (30 minutes) is a challenging requirement for many of the RNTS options. The MHHP is a very simple option that can be regenerated in the airlock within the 30 minute limit by the application of a heating source and a cooling sink. In addition, advanced PLSS's must provide a greater degree of automatic control, relieving astronauts of the need to manually adjust temperatures in their liquid cooled ventilation garments (LCVG's). The MHHP includes automatic coolant controls with the ability to follow thermal load swings from minimum to maximum in seconds. The MHHP includes a coolant loop subsystem with pump and controls, regeneration equipment for post-EVA servicing, and a PC-based data acquisition and control system (DACS).
Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.
Reacting liquid sodium with gaseous silicon tetrafluoride effective way of producing high-purity silicon for solar cells; but liquid sodium is such active substance, it readily clogs nozzle through which it is introduced into reactor. Flowing through constriction around sodium-delivery nozzle, silicon tetrafluoride gas cools liquid sodium emerging from nozzle. Sodium-delivery nozzle consists of stainless-steel tube with one-fourth inch outside diameter.
An investigation was made in the NACA 7- by 10-foot wind tunnel of a large-chord wing model with a duct to house a simulated radiator suitable for a liquid-cooled engine. The duct was expanded to reduce the radiator losses, and the installation of the duct and radiator was made entirely within the wing to reduce form and interference drag. The tests were made using a two-dimensional flow set-up with a full-span duct and radiator. Section aerodynamic characteristics of the basic airfoil are given and also curves showing the characteristics of the various duct-radiator combinations. An expression for efficiency, the primary criterion of merit of any duct, and the effect of the several design parameters of the duct-radiator arrangement are discussed. The problem of throttling is considered and a discussion of the power required for cooling is included. It was found that radiators could be mounted in the wing and efficiently pass enough air for cooling with duct outlets located at any point from 0.25c to 0.70c from the wing leading edge on the upper surface. The duct-inlet position was found to be critical and, for maximum efficiency, had to be at the stagnation point of the airfoil and to change with flight attitude. The flow could be efficiently throttled only by a simultaneous variation of duct inlet and outlet sizes and of inlet position. It was desirable to round both inlet and outlet lips. With certain arrangements of duct, the power required for cooling at high speed was a very low percentage of the engine power.
Personal cooling systems are used to alleviate symptoms of multiple sclerosis and to prevent increased core temperature during daily activities. Configurations of these systems include passive ice vests and circulating liquid cooling garments (LCGs) in the forms of vests, cooling caps and combined head and neck cooling systems. However, little information is available oil the amount or heat that can be extracted from the body with these systems or the physiologic changes produced by routine operation of these systems. The objective of this study was to determine the operating characteristics and the physiologic change, produced by short term use of one commercially available thermal control system.
Report presents the results of an investigation made in the NACA 7 by 10-foot wind tunnel of a large-chord wing model with a duct to house a simulated radiator suitable for a liquid-cooled engine. The duct was expanded to reduce the radiator losses, and the installation of the duct and radiator was made entirely within the wing to reduce form and interference drag. The tests were made using a two-dimensional-flow setup with a full-span duct and radiator. Section aerodynamic characteristics of the basic airfoil are given and also curves showing the characteristics of the various duct-radiator combinations. An expression for efficiency, the primary criterion of merit of any duct, and the effect of the several design parameters of the duct-radiator arrangement are discussed. The problem of throttling is considered and a discussion of the power required for cooling is included.
In 1997, NASA initiated a study of a liquid oxygen and ethanol orbital maneuvering and reaction control system for space shuttle upgrades as well as other reusable launch vehicle applications. The pressure-fed system uses sub-cooled liquid oxygen at 2413.2 KPa (350 psia) stored passively using insulation. Thermal stratification builds up while the space shuttle is docked at the international space station. The venting from the space shuttle's liquid oxygen tank is not desired during this 96-hr time period. Once the shuttle undocks from the space station there could be a pressure collapse in the liquid oxygen tank caused by fluid mixing due to the thruster fU"ings . The thermal stratification and resulting pressure rise in the tank were examined by a computational fluid dynamic model. Since the heat transfer from the pressurant gas to the liquid will result in a decrease in tank pressure the final pressure after the 96 hours will be significantly less when the tank is pressurized with ambient temperature helium. Therefore, using helium at ambient temperature to pressurize the tank is preferred to pressurizing the tank with helium at the liquid oxygen temperature. The higher helium temperature will also result in less mass of helium to pressurize the tank.
This paper discusses design tradeoffs and thermal modeling explored in cooling strategies for an aircraft propulsion electric motor with additively manufactured coils and distributed power electronics integrated with heat pipes. Design tradeoffs include heat pipe Qmax performance related to inclination, condenser configuration, coolant type, coolant flow path complexity, and ease of access to modular power electronics. Three cooling strategies were selected and realized into CAD models. These models were further evaluated using 3D thermal FEA and optimization tools to explore cooling geometry details that include fin thickness, spacing and count with the objective to minimize fin mass under a set of constraints. Lastly, motorette test data is presented comparing air versus liquid cooling of heat pipes.