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At least 307 records · Page 17

Reliability models applicable to space telescope solar array assembly system

A complex system may consist of a number of subsystems with several components in series, parallel, or combination of both series and parallel. In order to predict how well the system will perform, it is necessary to know the reliabilities of the subsystems and the reliability of the whole system. The objective of the present study is to develop mathematical models of the reliability which are applicable to complex systems. The models are determined by assuming k failures out of n components in a subsystem. By taking k = 1 and k = n, these models reduce to parallel and series models; hence, the models can be specialized to parallel, series combination systems. The models are developed by assuming the failure rates of the components as functions of time and as such, can be applied to processes with or without aging effects. The reliability models are further specialized to Space Telescope Solar Arrray (STSA) System. The STSA consists of 20 identical solar panel assemblies (SPA's). The reliabilities of the SPA's are determined by the reliabilities of solar cell strings, interconnects, and diodes. The estimates of the reliability of the system for one to five years are calculated by using the reliability estimates of solar cells and interconnects given n ESA documents. Aging effects in relation to breaks in interconnects are discussed.

Patil, S. A.↗

Concurrent communication among multi-transceiver stations over shared media

In order to increase a local-area network's throughput beyond a single bus data rate without using dedicated switching nodes, multiple buses and multitransceiver stations are required. The design space of single-hop interconnections is explored among such stations. Interconnections are presented whose throughput can grow quadratically with the number of transmitters and receivers per station. These are referred to as selective broadcast interconnections (SBIs). The performance of various SBIs are studied. A spread-spectrum channel can accommodate several current successful transmission, and a single-transceiver node can thus utilize only a small fraction of the channel capacity. In order to allocate the appropriate fraction of capacity to a busy node, it is proposed to equip it with several transmitters and receivers, thereby turning it into a supernode. Several architectures and operation policies for supernodes are suggested and compared. It is shown that a supernode can significantly outperform a collection of independent conventional nodes with the same total numbers of transmitters and receivers. Packet-radio networks with half-duplex nodes, as well as networks with full-duplex nodes, are considered.

Birk, Yitzhak↗

On-board processing satellite network architecture and control study

The market for telecommunications services needs to be segmented into user classes having similar transmission requirements and hence similar network architectures. Use of the following transmission architecture was considered: satellite switched TDMA; TDMA up, TDM down; scanning (hopping) beam TDMA; FDMA up, TDM down; satellite switched MF/TDMA; and switching Hub earth stations with double hop transmission. A candidate network architecture will be selected that: comprises multiple access subnetworks optimized for each user; interconnects the subnetworks by means of a baseband processor; and optimizes the marriage of interconnection and access techniques. An overall network control architecture will be provided that will serve the needs of the baseband and satellite switched RF interconnected subnetworks. The results of the studies shall be used to identify elements of network architecture and control that require the greatest degree of technology development to realize an operational system. This will be specified in terms of: requirements of the enabling technology; difference from the current available technology; and estimate of the development requirements needed to achieve an operational system. The results obtained for each of these tasks are presented.

Campanella, S. Joseph↗

Thermoelectric power conversion in space

A radiatively-heated multicouple for use in the next generation of radioisotope thermoelectric generator (RTG) will employ 20 individual couples within a single cell, so that 40 n- and p-semiconductor legs will be interconnected in series. At the hot end of the RTG, the legs will be electrically interconnected using silicon molybdenum; on the cold side, the legs are interconnected by tungsten. The entire cell is then mechanically attached to a radiator, which conducts heat away and radiates it into space. Deep-space applications will use RTGs developed for vacuum operation; thermoelectric converter power systems using a unicouple configuration have flown on such missions as Pioneers 10 and 11, which used lead telluride thermoelectric converters, and Voyagers I and II, which used silicon germanium-based thermoelectrics.

Awaya, Henry I.↗

Threshold voltage for arcing on negatively biased solar arrays

The arcing that has been found to occur when negatively biased high-voltage solar arrays in LEO lie at a critical voltage with respect to the plasma environment is presently proposed to be due to a breakdown of gas emitted under electron bombardment from the solar cells' cover-glass. The elements of the model for this phenomenon include an electron current flow from the interconnect to a neighboring cover-glass, which desorbs neutral molecules under the electron bombardment. The neutral molecules form a gas over the interconnect, and this gas breaks down when the voltage over the interconnect is sufficiently high. Specific scaling predictions are made on the basis of the geometric structure and gas in question.

Hastings, Daniel E.↗

Rapid thermal cycling of new technology solar array blanket coupons

NASA Lewis Research Center is conducting thermal cycle testing of a new solar array blanket technologies. These technologies include test coupons for Space Station Freedom (SSF) and the advanced photovoltaic solar array (APSA). The objective of this testing is to demonstrate the durability or operational lifetime of the solar array interconnect design and blanket technology within a low earth orbit (LEO) or geosynchronous earth orbit (GEO) thermal cycling environment. Both the SSF and the APSA array survived all rapid thermal cycling with little or no degradation in peak performance. This testing includes an equivalent of 15 years in LEO for SSF test coupons and 30 years of GEO plus ten years of LEO for the APSA test coupon. It is concluded that both the parallel gap welding of the SSF interconnects and the soldering of the APSA interconnects are adequately designed to handle the thermal stresses of space environment temperature extremes.

Scheiman, David A.↗

On the formulation of a minimal uncertainty model for robust control with structured uncertainty

In the design and analysis of robust control systems for uncertain plants, representing the system transfer matrix in the form of what has come to be termed an M-delta model has become widely accepted and applied in the robust control literature. The M represents a transfer function matrix M(s) of the nominal closed loop system, and the delta represents an uncertainty matrix acting on M(s). The nominal closed loop system M(s) results from closing the feedback control system, K(s), around a nominal plant interconnection structure P(s). The uncertainty can arise from various sources, such as structured uncertainty from parameter variations or multiple unsaturated uncertainties from unmodeled dynamics and other neglected phenomena. In general, delta is a block diagonal matrix, but for real parameter variations delta is a diagonal matrix of real elements. Conceptually, the M-delta structure can always be formed for any linear interconnection of inputs, outputs, transfer functions, parameter variations, and perturbations. However, very little of the currently available literature addresses computational methods for obtaining this structure, and none of this literature addresses a general methodology for obtaining a minimal M-delta model for a wide class of uncertainty, where the term minimal refers to the dimension of the delta matrix. Since having a minimally dimensioned delta matrix would improve the efficiency of structured singular value (or multivariable stability margin) computations, a method of obtaining a minimal M-delta would be useful. Hence, a method of obtaining the interconnection system P(s) is required. A generalized procedure for obtaining a minimal P-delta structure for systems with real parameter variations is presented. Using this model, the minimal M-delta model can then be easily obtained by closing the feedback loop. The procedure involves representing the system in a cascade-form state-space realization, determining the minimal uncertainty matrix, delta, and constructing the state-space representation of P(s). Three examples are presented to illustrate the procedure.

Belcastro, Christine M.↗

Appendices B thru F, volume 3

The purpose of this investigation was to determine if the intermodule ventilation (IMV) systems and water distribution systems of Space Station Freedom (SSF) modules and nodes should be connected as they are interfaced with those already in operation. It was concluded that the AC configuration and attached LAB and HAB modules and nodes should be interconnected. The H2O circuits should also be interconnected. Interconnecting the air and water provides flexibility of operation and safety comparable to the Assembly Complete (AC) configuration. This requires only only that valves and ducts be provided in the AC nodes. The AC node interfaces should also be scarred to provide for water transfer across these interfaces. Penalties for not connecting the Intermodular Ventilation (IMV) system and water circuits include an additional AR unit, possible increased water storage requirements, and considerable reduction in crew flexibility.

Source record↗

Inmarsat aeronautical mobile satellite system: Internetworking issues

The Inmarsat Aeronautical Mobile Satellite System (AMSS) provides air-ground and air-air communications services to aero-mobile users on a global basis. Communicating parties may be connected either directly, or more commonly, via interconnecting networks to the Inmarsat AMSS, in order to construct end-to-end communications circuits. The aircraft earth station (AES) and the aeronautical ground earth station (GES) are the points of interconnection of the Inmarsat AMSS to users, as well as to interconnecting networks. This paper reviews the internetworking aspects of the Inmarsat AMSS, by introducing the Inmarsat AMSS network architecture and services concepts and then discussing the internetwork address/numbering and routing techniques.

Sengupta, Jay R.↗

Time-variant analysis of rotorcraft systems dynamics - An exploitation of vector processors

In this paper a generalized algorithmic procedure is presented for handling constraints in mechanical transmissions. The latter are treated as multibody systems of interconnected rigid/flexible bodies. The constraint Jacobian matrices are generated automatically and suitably updated in time, depending on the geometrical and kinematical constraint conditions describing the interconnection between shafts or gears. The type of constraints are classified based on the interconnection of the bodies by assuming that one or more points of contact exist between them. The effects due to elastic deformation of the flexible bodies are included by allowing each body element to undergo small deformations. The procedure is based on recursively formulated Kane's dynamical equations of motion and the finite element method, including the concept of geometrical stiffening effects. The method is implemented on an IBM-3090-600j vector processor with pipe-lining capabilities. A significant increase in the speed of execution is achieved by vectorizing the developed code in computationally intensive areas. An example consisting of two meshing disks rotating at high angular velocity is presented. Applications are intended for the study of the dynamic behavior of helicopter transmissions.

Amirouche, F. M. L.↗

A decentralized software bus based on IP multicas ting

We describe decentralized reconfigurable implementation of a conference management system based on the low-level Internet Protocol (IP) multicasting protocol. IP multicasting allows low-cost, world-wide, two-way transmission of data between large numbers of conferencing participants through the Multicasting Backbone (MBone). Each conference is structured as a software bus -- a messaging system that provides a run-time interconnection model that acts as a separate agent (i.e., the bus) for routing, queuing, and delivering messages between distributed programs. Unlike the client-server interconnection model, the software bus model provides a level of indirection that enhances the flexibility and reconfigurability of a distributed system. Current software bus implementations like POLYLITH, however, rely on a centralized bus process and point-to-point protocols (i.e., TCP/IP) to route, queue, and deliver messages. We implement a software bus called the MULTIBUS that relies on a separate process only for routing and uses a reliable IP multicasting protocol for delivery of messages. The use of multicasting means that interconnections are independent of IP machine addresses. This approach allows reconfiguration of bus participants during system execution without notifying other participants of new IP addresses. The use of IP multicasting also permits an economy of scale in the number of participants. We describe the MULITIBUS protocol elements and show how our implementation performs better than centralized bus implementations.

Callahan, John R.↗

InP tunnel junction for InGaAs/InP tandem solar cells

Chemical beam epitaxy (CBE) has been shown to allow the growth of high quality materials with reproducible complex compositional and doping profiles. The main advantage of CBE compared to metalorganic chemical vapor deposition (MOCVD), the most popular technique for InP-based photovoltaic device fabrication, is the ability to grow high purity epilayers at much lower temperatures (450-530 C). We have previously shown that CBE is perfectly suited toward the fabrication of complex photovoltaic devices such as InP/InGaAs monolithically integrated tandem solar cells, because its low process temperature preserves the electrical characteristics of the InGaAs tunnel junction commonly used as an ohmic interconnect. In this work using CBE for the fabrication of optically transparent (with respect to the bottom cell) InP tunnel diodes is demonstrated. Epitaxial growth were performed in a Riber CBE 32 system using PH3 and TMIn as III and V precursors. Solid Be (p-type) and Si (n-type) have been used as doping sources, allowing doping levels up to 2 x 10(exp -19)/cu cm and 1 x 10(exp -19)/cu cm for n and p type respectively. The InP tunnel junction characteristics and the influence of the growth's conditions (temperature, growth rate) over its performance have been carefully investigated. InP p(++)/n(++) tunnel junction with peak current densities up to 1600 A/sq cm and maximum specific resistivities (V(sub p)/I(sub p) - peak voltage to peak current ratio) in the range of 10(exp -4) Omega-sq cm were obtained. The obtained peak current densities exceed the highest results previously reported for their lattice matched counterparts, In(0.53)Ga( 0.47)As and should allow the realization of improved minimal absorption losses in the interconnect InP/InGaAs tandem devices for Space applications. Owing to the low process temperature required for the top cell, these devices exhibit almost no degradation of its characteristics after the growth of subsequent thick InP layer suggesting minimal doping cross diffusion in the narrow space-charge region (approximately 1-5 nm) of the device. The fabrication of tandem devices using InP tunnel diodes as interconnect is in progress and will be reported at the conference.

Vilela, M. F.↗

High-voltage space-plasma interactions measured on the PASP Plus test arrays

The Photovoltaic Array Space Power Plus Diagnostics (PASP Plus) experiment was developed by the Air Force's Phillips Laboratory with support from NASA's Lewis Research Center. It was launched on the Advanced Photovoltaic and Electronics EXperiments (APEX) satellite on August 3, 1994 into a 70 degree inclination, 363 km by 2550 km elliptical orbit. This orbit allows the investigation of space plasma effects on high-voltage operation (leakage current at positive voltages and arcing at negative voltages) in the perigee region. PASP Plus is testing twelve solar arrays. There are four planar Si arrays: an old standard type (used as a reference), the large-cell Space Station Freedom (SSF) array, a thin 'APSA' array, and an amorphous Si array. Next are three GaAs on Ge planar arrays and three new material planar arrays, including InP and two multijunction types. Finally, there are two concentrator arrays: a reflective-focusing Mini-Cassegrainian and a Fresnel-lens focusing Mini-Dome. PASP Plus's diagnostic sensors include: Langmuir probe to measure plasma density, an electrostatic analyzer (ESA) to measure the 30 eV to 30 KeV electron/ion spectra and determine vehicle negative potential during positive biasing, and a transient pulse monitor (TPM) to characterize the arcs that occur during the negative biasing. Through positive biasing of its test arrays, PASP Plus investigated the snapover phenomenon, which took place over the range of +100 to +300 V. It was found that array configurations where the interconnects are shielded from the space plasma (i.e., the concentrators or arrays with 'wrap-through' connectors) have lower leakage current. The concentrators exhibited negligible leakage current over the whole range up to +500 V. In the case of two similar GaAs on Ge arrays, the one with 'wrap-through' connectors had lower leakage current than the one with conventional interconnects. Through negative biasing, PASP Plus investigated the arcing rates of its test arrays. The standard Si array, with its old construction (exposed rough-surface interconnects), arced significantly over a wide voltage and plasma-density range. The other arrays arced at very low rates, mostly at voltages greater than -350 V and plasma densities near or greater than 10(exp 5)/cm(exp -3). AS expected according to theory, arcing was more prevalent when array temperatures were cold (based on biasing in eclipse).

Guidice, Donald A.↗

Advanced packaging for Integrated Micro-Instruments

The relationship between packaging, microelectronics, and micro-electrical-mechanical systems (MEMS) is an important one, particularly when the edges of performance boundaries are pressed, as in the case of miniaturized systems. Packaging is a sort of physical backbone that enables the maximum performance of these systems to be realized, and the penalties imposed by conventional packing approaches is particularly limiting for MEMS devices. As such, advanced packaging approaches, such as multi-chip modules (MCM's) have been touted as a true means of electronic 'enablement' for a variety of application domains. Realizing an optimum system of packaging, however, in not as simple as replacing a set of single chip packages with a substrate of interconnections. Research at Phillips Laboratory has turned up a number of integrating options in the two- and three-dimensional rending of miniature systems with physical interconnection structures with intrinsically high performance. Not only do these structures motivate the redesign of integrated circuits (IC's) for lower power, but they possess interesting features that provide a framework for the direct integration of MEMS devices. Cost remains a barrier to the application of MEMS devices, even in space systems. Several innovations are suggested that will result in lower cost and more rapid cycle time. First, the novelty of a 'constant floor plan' MCM which encapsulates a variety of commonly used components into a stockable, easily customized assembly is discussed. Next, the use of low-cost substrates is examined. The anticipated advent of ultra-high density interconnect (UHDI) is suggested as the limit argument of advanced packaging. Finally, the concept of a heterogeneous 3-D MCM system is outlined that allows for the combination of different compatible packaging approaches into a uniformly dense structure that could also include MEMS-based sensors.

Lyke, James L.↗

Scalable Performance Environments for Parallel Systems

As parallel systems expand in size and complexity, the absence of performance tools for these parallel systems exacerbates the already difficult problems of application program and system software performance tuning. Moreover, given the pace of technological change, we can no longer afford to develop ad hoc, one-of-a-kind performance instrumentation software; we need scalable, portable performance analysis tools. We describe an environment prototype based on the lessons learned from two previous generations of performance data analysis software. Our environment prototype contains a set of performance data transformation modules that can be interconnected in user-specified ways. It is the responsibility of the environment infrastructure to hide details of module interconnection and data sharing. The environment is written in C++ with the graphical displays based on X windows and the Motif toolkit. It allows users to interconnect and configure modules graphically to form an acyclic, directed data analysis graph. Performance trace data are represented in a self-documenting stream format that includes internal definitions of data types, sizes, and names. The environment prototype supports the use of head-mounted displays and sonic data presentation in addition to the traditional use of visual techniques.

Reed, Daniel A.↗

Balancing Contention and Synchronization on the Intel Paragon

The Intel Paragon is a mesh-connected distributed memory parallel computer. It uses an oblivious and deterministic message routing algorithm: this permits us to develop highly optimized schedules for frequently needed communication patterns. The complete exchange is one such pattern. Several approaches are available for carrying it out on the mesh. We study an algorithm developed by Scott. This algorithm assumes that a communication link can carry one message at a time and that a node can only transmit one message at a time. It requires global synchronization to enforce a schedule of transmissions. Unfortunately global synchronization has substantial overhead on the Paragon. At the same time the powerful interconnection mechanism of this machine permits 2 or 3 messages to share a communication link with minor overhead. It can also overlap multiple message transmission from the same node to some extent. We develop a generalization of Scott's algorithm that executes complete exchange with a prescribed contention. Schedules that incur greater contention require fewer synchronization steps. This permits us to tradeoff contention against synchronization overhead. We describe the performance of this algorithm and compare it with Scott's original algorithm as well as with a naive algorithm that does not take interconnection structure into account. The Bounded contention algorithm is always better than Scott's algorithm and outperforms the naive algorithm for all but the smallest message sizes. The naive algorithm fails to work on meshes larger than 12 x 12. These results show that due consideration of processor interconnect and machine performance parameters is necessary to obtain peak performance from the Paragon and its successor mesh machines.

Bokhari, Shahid H.↗

Metal-Silicate Segregation in Deforming Dunitic Rocks: Applications to Core Formation in Europa and Ganymede

Core formation is an important event in the evolution of a planetary body, affecting both the geochemical and geophysical properties of the body. Metal-silicate segregation could have proceeded either by settling of liquid metal through a magma ocean or by percolation of liquid metal through a solid silicate mantle. Percolation of metallic melt had previously been excluded as a viable segregation mechanism because metallic melts do not form an interconnected network under hydrostatic conditions, except at high melt fraction (>5 vol%), due to the high dihedral angle between metals and silicates (>60 ). Without an interconnected network, porous flow of metallic melt is impossible, leaving the magma ocean scenario as the only mechanism to form the core. Moment-of-inertia measurements of Europa and Ganymede from the Galileo probe indicate that they are differentiated. This evidence suggests that a method for segregating metals and silicates at temperatures low enough to retain volatile compounds must exist. We have investigated the effect of deformation on the distribution of metallic melts in silicates. We have deformed samples of olivine + 5-9 vol% Fe-S to strains of 2.5 in simple shear and find that the metallic melt segregates into melt-rich planes oriented at 20 to the shear plane. These metallic melt-rich bands are similar in structure to the silicate melt-rich bands reported by Holtzman, indicating that deformation can interconnect isolated metallic melt pockets and allow porous flow of non-wetting melts. Such a core formation process could have occurred in the jovian satellites.

Hustoft, J. W.↗

Applications of SPICE for modeling miniaturized biomedical sensor systems

This paper proposes a model for a miniaturized signal conditioning system for biopotential and ion-selective electrode arrays. The system consists of three main components: sensors, interconnections, and signal conditioning chip. The model for this system is based on SPICE. Transmission-line based equivalent circuits are used to represent the sensors, lumped resistance-capacitance circuits describe the interconnections, and a model for the signal conditioning chip is extracted from its layout. A system for measurements of biopotentials and ionic activities can be miniaturized and optimized for cardiovascular applications based on the development of an integrated SPICE system model of its electrochemical, interconnection, and electronic components.

Microelectrodes↗