Direct interconnection of uncased analog and digital silicon chips into a beam leaded matrix Final report, 1 Apr. 1966 - 30 Dec. 1967
Fabrication technique for direct interconnection of uncased silicon integrated circuit chips
Source record↗
SEARCH · Engineering Papers
Results for “interconnections”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
A matrix method for studying motions of spacecraft consisting of interconnected rigid bodies
Matrix equations to describe motions of spacecraft consisting of interconnected rigid bodies
Turner, R. E.↗
Liquid-gas interface configurations in interconnected concentric cylinder tankage systems
Computer program for liquid-gas interface relations in interconnected concentric cylinder tankage systems
Geiger, F. W.↗
The scattering matrix of a general interconnection of multipoles
Scattering matrix theory of interconnection of multipoles
Abele, T.-A.↗
Research and development of electroformed aluminum solar cell contacts and interconnects Periodic progress report, 5 Jun. - 4 Oct. 1969
Electroforming aluminum solar cell contacts and interconnects for increased reliability
Lui, K.↗
The effects of dielectric overcoating on electromigration in aluminum interconnections.
Dielectric overcoating effects on electromigration Al interconnections, showing dependence on thickness and surface passivation
Schwartz, S.↗
Coplanar interconnection module
Module for interconnecting a semiconductor array to external leads or components incorporates a metal external heat sink for cooling the array. Heat sink, extending down from the molded block that supports the array, is immersed in a liquid nitrogen bath which is designed to maintain the desired array temperature.
Steward, R. D.↗
Research and development of electroformed aluminum solar cell contacts and interconnects Periodic progress report, 5 Jun. - 4 Oct. 1969
Development of electroformed aluminum solar cell contacts and interconnects
Lui, K.↗
Research and development of electroformed aluminum solar cell contacts and interconnects Final report
Feasibility of electroformed aluminum solderless interconnection of silicon solar cells
Wizenick, R.↗
Random vibration of interconnected systems.
Random vibration of interconnected systems, analyzing power flow and energy levels in linear oscillator interacting with environments, using Thevenin-Norton representations
Crandall, S. H.↗
Solar battery with interconnecting means for plural cells Patent
Solar battery with interconnecting means for plural cells
Goldsmith, J. V.↗
Development of a practical flexible selected interconnection technique for monolithic circuits Final report, Jun. 1967 - Dec. 1969
Development of flexible selected interconnection technique for monolithic circuits
Basi, G. S.↗
Nondestructive testing of interconnections and microjoints Final report
Nondestructive tests of welds, interconnections, and microjoints
Source record↗
Diffusion and structural changes in microcircuit interconnections Semiannual progress report, 1 Dec. 1969 - 30 May 1970
Diffusion and structural changes in microcircuit interconnections subjected to heat treatment
Nowak, W. B.↗
Thermal cycling effects on solar cell interconnection tabs on an OAO-B sample module
Thermal cycling tests of bent solar cell interconnection tabs on OAO module
Vermillion, C. M.↗
Absolute stability of a system of nonlinear networks interconnected by lossless transition lines
Nonlinear networks interconnected by lossless transmission lines, deriving global asymptotic stability condition
De Figueiredo, R. J. P.↗
Aluminum foil interconnects for solar cell panels
Commercially available sonic welding system and a specially-designed tip bonds aluminum foil interconnects to titanium-silver solar cell contacts.
Schwartz, S.↗
Manufacturing and quality control of interconnecting wire harnesses, Volume 2
Interconnecting wire harnesses defined in the design standard are considered, including type 4, open bundle (not enclosed). Knowledge gained through experience on the Saturn 5 program coupled with recent advances in techniques, materials, and processes was incorporated into the document.
Source record↗