Complex interconnecting of flat packs without multilayer boards.
Stick module interconnection of flat packs into single-axis motherboard
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Stick module interconnection of flat packs into single-axis motherboard
Dynamical formalism for arbitrary number of interconnected rigid bodies analyzed with reference to passive attitude stabilization of satellites
Flat pack interconnection structure composed of stick modules simplifies modular electronic assemblies by allowing a single axis mother board. Two of the wiring planes are located in the stick module, which is the lower level of assembly, with the third wiring plane in the mother board.
Fabrication technique for direct interconnection of uncased silicon integrated circuit chips
Matrix equations to describe motions of spacecraft consisting of interconnected rigid bodies
Computer program for liquid-gas interface relations in interconnected concentric cylinder tankage systems
Scattering matrix theory of interconnection of multipoles
Electroforming aluminum solar cell contacts and interconnects for increased reliability
Dielectric overcoating effects on electromigration Al interconnections, showing dependence on thickness and surface passivation
Module for interconnecting a semiconductor array to external leads or components incorporates a metal external heat sink for cooling the array. Heat sink, extending down from the molded block that supports the array, is immersed in a liquid nitrogen bath which is designed to maintain the desired array temperature.
Development of electroformed aluminum solar cell contacts and interconnects
Feasibility of electroformed aluminum solderless interconnection of silicon solar cells
Random vibration of interconnected systems, analyzing power flow and energy levels in linear oscillator interacting with environments, using Thevenin-Norton representations
Solar battery with interconnecting means for plural cells
Development of flexible selected interconnection technique for monolithic circuits
Nondestructive tests of welds, interconnections, and microjoints
Diffusion and structural changes in microcircuit interconnections subjected to heat treatment
Thermal cycling tests of bent solar cell interconnection tabs on OAO module