Gain and noise considerations in integrated circuits R.F. feedback amplifiers.
Equivalent noise circuit applicable to active RF feedback amplifier
Bellomo, A. F.↗
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Results for “integrated circuits”
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Electron microbeam testing of integrated circuits
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Crawford, C. K.↗
Study of Failure Modes of Multilevel Large Scale Integrated Circuits Interim Report, 15 Apr. - 14 Oct. 1968
Failure modes of large multilevel silicon microcircuit arrays
Schlegel, E. S.↗
Process techniques study of integrated circuits Quarterly report no. 13
Dielectric defects in oxide layers by surface irregularities, and treatment
Meinhard, J. E.↗
Inter-relations between advanced processing techniques, integrated circuits, materials development and analysis Quarterly report, 1 Mar. - 31 May 1969
Gyrator tuned circuit amplifier and microcircuit interconnections
Carlson, W.↗
Improved beam-lead interconnection structure for uncased integrated circuit chips
Interconnection structure eliminates several levels of manually made interconnections and shortens the path lengths from generator to load, permitting reduction in consumed power.
Marley, J.↗
Integrated circuit flat-pack lead bender
Tool bends leads quickly and accurately for mounting on printed circuit boards. It has grooves and bend-angles aligned for particular circuit board applications.
Koster, C. H.↗
An investigation of the strength of aluminum wire used in integrated circuits
Microloop pull test is developed to stress wire loops in situ until failure. The applied loads, the nature of the fracture, and its location are recorded. This test also stresses the wire bonds.
Adams, M. A.↗
Integrated circuit random-access memory decoder
Decoder circuit with complementary-symmetry circuit configuration composed of MOS and n-p-n bipolar devices minimizes power consumption. Emitter-follower drive scheme results in low power dissipation and high speed operation.
Katz, S.↗
Study of failure modes of multilevel large scale integrated circuits
Evaluation tests for electrical properties of oxide silicon interfaces in multilevel microcircuits
Schlegel, E. S.↗
A brief review of the state of the art and some recent results on electromigration in integrated circuit aluminum metallization.
Dielectric overcoatings effect on Al interconnections electromigration in IC metallization, noting longer intervals between failures
Schwartz, S.↗
Large scale integrated circuits for space electronics
LSI circuits in space electronics, discussing packaging, reliability, applications, etc
Hamiter, L.↗
Silicon contact for area reduction of integrated circuits
Epitaxially grown Si contact for area reduction of MOS transistor circuits
Alexander, D. S.↗
Metallization systems for integrated circuits
Metallization systems materials for IC, discussing environmental stability, metals electromigration, electrochemical corrosion tests, etc
Terry, L. E.↗
Improved methods of forming monolithic integrated circuits having complementary bipolar transistors
Two new processes form complementary transistors in monolithic semiconductor circuits, require fewer steps /infusions/ than previous methods, and eliminate such problems as nonuniform h sub FE distribution, low yield, and large device formation.
Bohannon, R. O., Jr.↗
Computer-aided design of large-scale integrated circuits - A concept
Circuit design and mask development sequence are improved by using general purpose computer with interactive graphics capability establishing efficient two way communications link between design engineer and system. Interactive graphics capability places design engineer in direct control of circuit development.
Schansman, T. T.↗
Advantages of vapor-plated phosphosilicate films in large-scale integrated circuit arrays
MOS large scale IC phosphosilicate glass substrate vapor deposits effects, including hardness, pinhole density and electromigration
Keen, R. S., Jr.↗
Ferrimagnetic parts for microwave integrated circuits
Ferrimagnetic components in microwave IC, considering junction circulators, planar phase shifters, etc
Harrison, G. R.↗