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At least 307 records · Page 17

Results of NASA's Magnetic Gear Program to Date

In rotorcraft, one of the main sources of mechanical failure is the gearbox, because of the many wear and failure modes associated with tooth contact in traditional mechanical gear boxes. Magnetic gears transmit torque without mechanical tooth contact between gear bodies and therefore they have none of the tooth contact related failure modes associated with mechanical gearing. As a result, magnetic gears have the potential to enable more reliable rotorcraft gearboxes. However, magnetic gears have not been demonstrated to match the performance of mechanical gearboxes at a high enough technology readiness level (TRL) to be used on an aircraft to date. To that end, NASA's Revolutionary Vertical Lift Technologies project has made an investment in developing magnetic gearboxes specifically for electrified vertical lift vehicles (EVTOL). In this presentation, the results of that investment to date will be discussed.

Tallerico, Thomas↗

Fatigue damage mapping

Observations of fatigue crack nucleation and early growth are presented. The state of stress/strain was shown to play a significant role in this process. Early growth occurs on planes experiencing the largest range of shear strain (Mode 2) or normal strain (Mode 1) depending on the stress state, strain amplitude, and microstructure. These observations were summarized in a fatigue map for each material. These maps provide regions where one fatigue failure mode dominates the behavior. Each failure mechanism results in a different failure mode. Once the expected failure mode is identified, bulk deformation models based on the cyclic stresses and strains can be used to obtain reliable estimates of fatigue lives for complex loading situations.

Socie, Darrell↗

Silicon device performance measurements to support temperature range enhancement

Testing of the metal oxide semiconductor (MOS)-controlled thyristor (MCT) has uncovered a failure mechanism at elevated temperature. The failure appears to be due to breakdown of the gate oxide. Further testing is underway to verify the failure mode. Higher current level inverters were built to demonstrate 200 C operation of the N-MOSFET's and insulated-gate-bipolar transistors (IGBT's) and for life testing. One MOSFET failed early in testing. The origin of this failure is being studied. No IGBT's have failed. A prototype 28-to-42 V converter was built and is being tested at room temperature. The control loop is being finalized. Temperature stable, high value (10 micro-F) capacitors appear to be the limiting factor in the design at this time. In this application, the efficiency will be lower for the IGBT version due to the large V sub(cesat) (3.5-4 V) compared to the input voltage of 28 V. The MOSFET version should have higher efficiency; however, the MOSFET does not appear to be as robust at 200 C. Both versions are built for comparison.

Bromstead, James↗

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses

Electronics packaging↗

Application of PoF Based Virtual Qualification Methods for Reliability Assessment of Mission Critical PCBs

Reliability is the ability of a product to perform the function for which it was intended for a specified period of time (or cycles) for a given set of life cycle conditions. In today's compressed mission development cycles where designing, building and testing the physical models has to occur in a matter of months not years, Projects don't have the luxury of iteratively building and testing those models. Physics of failure (PoF) is an engineering-based approach to reliability that begins with an understanding of materials, processes, physical interactions, degradation and failure mechanisms, as well as identifying failure models. The PoF approach uses modeling and simulation to qualify a design and manufacturing process, with the ultimate intent of eliminating failures early in the design process by addressing the root cause. The physics-of-failure analysis proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures and technologies. Virtual physics-of-failure modeling allows engineers to determine if new technological node can be added to an existing system. This presentation will illustrate an application of a PoF based tool during the initial phases of a printed circuit board assembly development and how the NASA GSFC team was able to dynamically study the effects of electronics parts and printed circuit board material configuration changes under simulated thermal and vibrational stresses.

Physics of Failure↗

Fracture of Charring Avcoat With Meshfree Material Response-Coupled Fracture Approach

Fracture of thermal protection systems (TPS) is typically unfavorable, but often unavoidable. TPS can fracture during entry, manufacturing or from impact. Many NASA missions use ablative materials for TPS, including the fore-body for Dragonfly (PICA) and Orion for Artemis-I (Avcoat). The material response to thermal and mechanical loads during entry is integral to TPS sizing, design and analysis. The fracture of TPS also depends, and can be caused by, the change of material properties during entry. Simulations that resolve fracture of TPS due to thermo-mechanical forces can identify TPS failure mechanisms and be applied to conditions inaccessible to ground testing. We present simulation work using a mesh-free/Lagrangian approach to solving continuum mechanics, coupled to material response. Two different materials are simulated under different model entry-like boundary conditions. The dynamic crack structure is analyzed and compared across simulations. Crack analyses inform the role of design features, such as entry trajectories and manufacturing-influenced material properties, play in TPS fracture.

Andrew P Santos↗

Heterogeneous Solid Electrolyte Interphase Interactions Dictate Interface Instability in Sodium Metal Electrodes

Sodium (Na) metal batteries have attracted recent attention due to their low cost and high abundance of Na. However, the advancement of Na metal batteries is impeded due to key challenges such as dendrite growth, solid electrolyte interphase (SEI) fracture, and low Coulombic efficiency. This study examines the coupled electro‐chemo‐mechanical interactions governing the electrodeposition stability and morphological evolution at the Na/electrolyte interface. The SEI heterogeneities influence transport and reaction kinetics leading to the formation of current and stress hotspots during Na plating. Further, it is demonstrated that the heterogeneity‐induced Na metal evolution and its influence on the stress distribution critically affect the mechanical overpotential, contributing to a faster SEI failure. The analysis reveals three distinct failure mechanisms—mechanical, transport, and kinetic—that govern the onset of instabilities at the interface. Finally, a comprehensive comparative study of SEI failure in Na and lithium (Li) metal anodes illustrates that the electrochemical and mechanical characteristics of the SEI are crucial in tailoring the anode morphology and interface stability. This work delineates mechanistic stability regimes cognizant of the SEI attributes and underlying failure modes and offers important guidelines for the design of artificial SEI layers for stable Na metal electrodes.

25 ENERGY STORAGE↗

Elevated temperature ductility dip in an additively manufactured Al-Cu-Ce alloy

The deformation and failure mechanisms of Al-9Cu-6Ce (wt%) based alloys fabricated with laser powder bed fusion were investigated from room temperature to 400°C. The yield and ultimate tensile strengths decreased monotonically with increase in temperature, but the tensile elongation dipped unexpectedly at elevated temperatures and exhibited a minimum at 300°C. The dip in tensile elongation occurred with a concomitant dip in strain-rate sensitivity (SRS) of deformation. The as-fabricated alloy microstructure was heterogeneous, and the heat affected zone (HAZ) underneath the melt pool boundary was prone to strain localization. At 300 °C, the reduced SRS promoted the progression of strain localization in the HAZ leading to failure initiation and the dip in tensile elongation. Furthermore, a higher SRS or strain-hardening rate at other temperatures improved the tensile elongation by slowing the progression of strain localization in the HAZ such that failure initiated by other mechanisms elsewhere in the microstructure. Notably, the tensile elongation was limited by the defect structure only in a narrow temperature range (150 - 200 °C) while at other temperatures it was limited by the inherent microstructural features. This investigation exemplifies unexpected deformation and failure mechanisms possible in heterogeneous microstructures that result from additive manufacturing.

36 MATERIALS SCIENCE↗

Controlling dendrite propagation in solid-state batteries with engineered stress

Metal-dendrite penetration is a mode of electrolyte failure that threatens the viability of metal-anode-based solid-state batteries. Whether dendrites are driven by mechanical failure or electrochemical degradation of solid electrolytes remains an open question. If internal mechanical forces drive failure, superimposing a compressive load that counters internal stress may mitigate dendrite penetration. Here, we investigate this hypothesis by dynamically applying mechanical loads to growing dendrites in Li 6.6 La 3 Zr 1.6 Ta 0.4 O 12 solid electrolytes. Operando microscopy reveals marked deflection in the dendrite growth trajectory at the onset of compressive loading. For sufficient loading, this deflection averts cell failure. Using fracture mechanics, we quantify the impact of stack pressure and in-plane stresses on dendrite trajectory, chart the residual stresses required to prevent short-circuit failure, and propose design approaches to achieve such stresses. For the materials studied here, we show that dendrite propagation is dictated by electrolyte fracture, with electronic leakage playing a negligible role.

25 ENERGY STORAGE↗

Experimental studies of graphite-epoxy and boron-epoxy angle ply laminates in compression

A test program aimed at studying the nonlinear/inelastic response under axial compression across a wide range of angle ply was graphite-epoxy and boron-epoxy laminates was presented and described. The strength allowables corresponding to the various laminate configurations were defined and the failure mechanisms which dictate their mode of failure were detected. The program involved two types of specimens for each laminate configuration: compression sandwich coupons and compression tubes. The test results indicate that the coupons perform better than the tubes displaying considerably high stress-strain allowables and mechanical properties relative to the tubes. Also, it is observed that depending on their dimensions the coupons are susceptible to very pronounced edge effects. This sensitivity results in assigning to the laminate conservative mechanical properties rather than the actual ones.

Weller, T.↗

Characterization of edge damage induced on REBCO superconducting tape by mechanical slitting

Abstract Rare-earth barium-copper-oxide (REBCO) superconductors are high-field superconductors fabricated in a tape geometry that can be utilized in magnet applications well in excess of 20 T. Due to the multilayer architecture of the tape, delamination is one cause of mechanical failure in REBCO tapes. During a mechanical slitting step in the manufacturing process, edge cracks can be introduced into the tape. These cracks are thought to be potential initiation sites for crack propagation in the tapes when subjected to stresses in the fabrication and operation of magnet systems. We sought to understand which layers were the mechanically weakest by locating the crack initiation layer and identifying the geometrical conditions of the slitter that promoted or suppressed crack formation. The described cracking was investigated by selectively etching and characterizing each layer with scanning electron microscopy, laser confocal microscopy, and digital image analysis. Our analysis showed that the average crack lengths in the REBCO, LaMnO 3 (LMO) and Al 2 O 3 layers were 34 μ m, 28 μ m, and 15 μ m, respectively. The total number of cracks measured in 30 mm of wire length was between 3000 and 5700 depending on the layer and their crack densities were 102 cracks mm −1 for REBCO, 108 cracks mm −1 for LMO, and 183 cracks mm −1 for Al 2 O 3 . These results indicated that there are separate crack initiation mechanisms for the REBCO and the LMO layers, as detailed in the paper. With a better understanding of the crack growth behavior exhibited by REBCO tapes, the fabrication process can be improved to provide a more mechanically stable and cost-effective superconductor.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Safety Analysis for Accident-Tolerant Fuels with Increased Enrichment and Extended Burnup

The ERP research and development efforts in FY22 focused on the safety analysis of ATF with increased enrichment and extended burnup to provide scientific knowledge of the ATF fuel performance, failure mechanism and source term analysis during severe accident of the NPP. FeCrAl clad ATF was selected as basis of the reactor fuel. An optimized equilibrium cycle was developed for 24-months extended burnup operation. A 4-loop PWR model under loss-of-coolant accident (LOCA) was assessed and the behavior of the major source term from failed ATF has been analyzed. The result showed that grace to enhanced mechanical characteristics of ATF, the fuel failure starts up to 200~500 seconds later than conventional Zr clad fuel. This time gives sufficient buffer until low pressure safety injection (LPSI) of the emergency core cooling system (ECCS) restarted by the operator which reduces fuel fragmentation, relocation and dispersal (FFRD). As a consequence, the total amount of major radioactive materials released from FeCrAl clad fuel into the reactor containment was found up to three times less compare to Zr clad fuel.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗

Failure in glass

Review of state of the art concerning glass failure mechanisms and fatigue theories discusses brittle fracture in glass, fatigue mechanisms, fatigue behavior, environmental effects on failure rate, and aging.

Keeton, S. C.↗

IC Ku-band Impatt Amplifier

High efficiency GaAs low-high-low IMPATTs were investigated. Theoretical analyses were employed to establish a design window for the material parameters to maximize microwave performance. Single mesa devices yielded typically 2 to 3 W with 16 to 23% efficiency in waveguide oscillator test circuits. IMPATTs with high reliability Pt/TiW/Pt/Au metallizations were subjected to temperature stress, non-rf bias-temperature stress, and rf bias-temperature stress. Assuming that temperature is the driving force behind the dominant failure mechanism, a mean-time-to-failure considerably greater than 500,000 hours is indicated by the stress tests. A 15 GHz, 4W, 56 dB gain microstrip amplifier was realized using GaAs FETs and IMPATTs. Power combining using a 3 db Lange coupler is employed in the power output stage having an intrinsic power-added efficiency of 15.7%. Overall dc-to-rf efficiency of the amplifier is 10.8%. The amplifier has greater than a 250 MHz, 1 db bandwidth; operates over the 0 deg to 50 C (base plate) temperature range with less than 0.5 db change in the power output; weighs 444 grams; and has a volume of 220 cu cm.

Sokolov, V.↗

Fault tolerant distributed systems using Ada

This paper discusses the use of Ada on distributed systems in which failure of processors has to be tolerated. It is assumed that communication between tasks on separate processors will take place using the facilities of the Ada language, primarily the rendezvous. It is shown that there are numerous aspects of the language which make its use on a distributed system very difficult. The issues are raised from the desire to be able to recover, reconfigure, and provide continued service in the presence of hardware failure. For example, if a rendezvous takes place between two tasks on different processors, failure of the processor executing the serving task will cause the calling task to be permanently suspended because the rendezvous will never end. Extensive modifications to the execution support required for Ada are proposed which provide all the necessary facilities for programs written in Ada to withstand arbitrary processor failure. Mechanisms are suggested to allow processor failure to be detected and for tasks which would be permanently suspended to be released. Provided the required program structures are used, continued processing can be provided.

Knight, J. C.↗

FAA/NASA International Symposium on Advanced Structural Integrity Methods for Airframe Durability and Damage Tolerance

International technical experts in durability and damage tolerance of metallic airframe structures were assembled to present and discuss recent research findings and the development of advanced design and analysis methods, structural concepts, and advanced materials. The symposium focused on the dissemination of new knowledge and the peer-review of progress on the development of advanced methodologies. Papers were presented on: structural concepts for enhanced durability, damage tolerance, and maintainability; new metallic alloys and processing technology; fatigue crack initiation and small crack effects; fatigue crack growth models; fracture mechanics failure, criteria for ductile materials; structural mechanics methodology for residual strength and life prediction; development of flight load spectra for design and testing; and advanced approaches to resist corrosion and environmentally assisted fatigue.

Harris, Charles E.↗

FAA/NASA International Symposium on Advanced Structural Integrity Methods for Airframe Durability and Damage Tolerance, part 2

The international technical experts in the areas of durability and damage tolerance of metallic airframe structures were assembled to present and discuss recent research findings and the development of advanced design and analysis methods, structural concepts, and advanced materials. The principal focus of the symposium was on the dissemination of new knowledge and the peer-review of progress on the development of advanced methodologies. Papers were presented on the following topics: structural concepts for enhanced durability, damage tolerance, and maintainability; new metallic alloys and processing technology; fatigue crack initiation and small crack effects; fatigue crack growth models; fracture mechanics failure criteria for ductile materials; structural mechanics methodology for residual strength and life prediction; development of flight load spectra for design and testing; and corrosion resistance.

Harris, Charles E.↗