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At least 307 records · Page 17

Development of Individually Addressable Micro-Mirror-Arrays for Space Applications

We have been developing a 32 x 32 prototype array of individually addressable Micro-Mirrors capable of operating at cryogenic temperature for Earth and Space Science applications. Micro-Mirror-Array technology has the potential to revolutionize imaging and spectroscopy systems for NASA's missions of the 21st century. They can be used as programmable slits for the Next Generation Space Telescope, as smart sensors for a steerable spectrometer, as neutral density filters for bright scene attenuation etc. The, entire fabrication process is carried out in the Detector Development Laboratory at NASA, GSFC. The fabrication process is low temperature compatible and involves integration of conventional CMOS technology and surface micro-machining used in MEMS. Aluminum is used as the mirror material and is built on a silicon substrate containing the CMOS address circuit. The mirrors are 100 microns x l00 microns in area and deflect by +/- 10 deg induced by electrostatic actuation between two parallel plate capacitors. A pair of thin aluminum torsion straps allow the mirrors to tilt. Finite-element-analysis and closed form solutions using electrostatic and mechanical torque for mirror operation were developed and the results were compared with laboratory performance. The results agree well both at room temperature and at cryogenic temperature. The development demonstrates the first cryogenic operation of two-dimensional Micro-Mirrors with bi-state operation. Larger arrays will be developed meeting requirements for different science applications. Theoretical analysis, fabrication process, laboratory test results and different science applications will be described in detail.

Dutta, Sanghamitra B.↗

Cryogenic Quenching Process for Electronic Part Screening

The use of electronic parts at cryogenic temperatures (less than 100 C) for extreme environments is not well controlled or developed from a product quality and reliability point of view. This is in contrast to the very rigorous and well-documented procedures to qualify electronic parts for mission use in the 55 to 125 C temperature range. A similarly rigorous methodology for screening and evaluating electronic parts needs to be developed so that mission planners can expect the same level of high reliability performance for parts operated at cryogenic temperatures. A formal methodology for screening and qualifying electronic parts at cryogenic temperatures has been proposed. The methodology focuses on the base physics of failure of the devices at cryogenic temperatures. All electronic part reliability is based on the bathtub curve, high amounts of initial failures (infant mortals), a long period of normal use (random failures), and then an increasing number of failures (end of life). Unique to this is the development of custom screening procedures to eliminate early failures at cold temperatures. The ability to screen out defects will specifically impact reliability at cold temperatures. Cryogenic reliability is limited by electron trap creation in the oxide and defect sites at conductor interfaces. Non-uniform conduction processes due to process marginalities will be magnified at cryogenic temperatures. Carrier mobilities change by orders of magnitude at cryogenic temperatures, significantly enhancing the effects of electric field. Marginal contacts, impurities in oxides, and defects in conductor/conductor interfaces can all be magnified at low temperatures. The novelty is the use of an ultra-low temperature, short-duration quenching process for defect screening. The quenching process is designed to identify those defects that will precisely (and negatively) affect long-term, cryogenic part operation. This quenching process occurs at a temperature that is at least 25 C colder than the coldest expected operating temperature. This quenching process is the opposite of the standard burn-in procedure. Normal burn-in raises the temperature (and voltage) to activate quickly any possible manufacturing defects remaining in the device that were not already rejected at a functional test step. The proposed inverse burn-in or quenching process is custom-tailored to the electronic device being used. The doping profiles, materials, minimum dimensions, interfaces, and thermal expansion coefficients are all taken into account in determining the ramp rate, dwell time, and temperature.

Sheldon, Douglas J.↗

Cryogenic fiber optic temperature sensor and method of manufacturing the same

This invention teaches the fiber optic sensors temperature sensors for cryogenic temperature range with improved sensitivity and resolution, and method of making said sensors. In more detail, the present invention is related to enhancement of temperature sensitivity of fiber optic temperature sensors at cryogenic temperatures by utilizing nanomaterials with a thermal expansion coefficient that is smaller than the thermal expansion coefficient of the optical fiber but larger in absolute value than the thermal expansion coefficient of the optical fiber at least over a range of temperatures.

Kochergin, Vladimir↗

Investigation of minimum operating temperatures for cryogenic wind tunnels

Total temperatures corresponding to the onset of condensation effects were determined for flow over a 0.137-m NACA 0012-64 airfoil mounted in the Langley 1/3-m transonic wind tunnel. Tests were carried out at a total pressure range from 1.2 to 4.5 atm and at free-stream Mach numbers of 0.75, 0.85, and 0.95. No condensation effects were found to occur until total temperatures were below those associated with free-stream saturation. Significant increases in Reynolds number may apparently be obtained by operation at wind tunnel temperatures below those associated with local saturation over the airfoil but above those where effects first occur. For the 0.85 and 0.95 Mach numbers the increase in Reynolds number was at least 15% over those achieved at local saturation conditions for the same pressure range. Higher pressures may have had some detrimental effect in the 0.95 Mach number test.

Hall, R. M.↗

Characterization and Failure Analysis of 650 V Enhancement-Mode GaN HEMT for Cryogenically-Cooled Power Electronics

In order to evaluate the feasibility of newly developed GaN devices in a cryogenically-cooled converter, this paper characterizes a 650 V enhancement-mode Gallium-Nitride high-electron-mobility transistor (GaN HEMT) at cryogenic temperatures. The characterization includes both static and dynamic behaviors. The results show that this GaN HEMT is an excellent device candidate to be applied in cryogenic-cooled applications. For example, transconductance at cryogenic temperature (93 K) is 2.5 times higher than one at room temperature (298 K), and accordingly, peak di/dt during turn-on transients at cryogenic temperature is around 2 times of that at room temperature. Moreover, the on-resistance of the channel at cryogenic temperature is only one-fifth of that at room temperature. The corresponding explanations of performance trends at cryogenic temperatures are also given from the view of semiconductor physics. In addition, several device failures were observed during the dynamic characterization of GaN HEMTs at cryogenic temperatures. The ultra-fast switching speed induced high di/dt and dv/dt at cryogenic temperatures amplifies the negative effects of parasitics inside the switching loop. Based on failure waveforms, two failure modes were classified, and detailed failure mechanisms caused by ultra-fast switching speed are given in this paper.

Static and dynamic characterization↗

Cryogenic Temperature-Dependent Refractive Index Measurements of CaF2 and Infrasil 301

In order to enable high quality lens design using calcium fluoride (CaF2) and Heraeus Infrasil 30 (Infrasil) at cryogenic temperatures, we have measured the absolute refractive index of prisms of these two materials using the Cryogenic, High-Accuracy Refraction Measuring System (CHARMS) at NASA's Goddard Space Flight Center, as a function of both wavelength and temperature. For CaF2, we report absolute refractive index and thermo-optic coefficient (dn/dT) at temperatures ranging from 25 to 300 K at wavelengths from 0.4 to 5.6 micrometers; for Infrasil we cover temperatures ranging from 35 to 300K and wavelengths from 0.4 to 3.6 micrometers. We investigate the interspecimen variability between measurements of two unrelated samples of CaF2, and we also compare our results for Infrasil to previous measurements fo Corning 7980 fused silica. Finally, we provide temperature-dependent Sellmeier coefficients based on our data to allow accurate interpolation of index to other wavelengths and temperatures and compare those results to other data found in the literature.

Frey, Bradley J.↗

Cryogenic Temperature-dependent Refractive Index Measurements of N-BK7, BaLKN3, and SF15 for NOTES PDI

In order to enable high quality lens designs using N-BK7, BaLKN3, and SF15 at cryogenic temperatures, we have measured the absolute refractive index of prisms of these three materials using the Cryogenic, High-Accuracy Refraction Measuring System (CHARMS) at NASA's Goddard Space Flight Center, as a function of both wavelength and temperature. For N-BK7, we report absolute refractive index and thermo-optic coefficient (dn/dT) at temperatures ranging from 50 to 300 K at wavelengths from 0.45 to 2.7 micrometers; for BaLKN3 we cover temperatures ranging from 40 to 300 K and wavelengths from 0.4 to 2.6 micrometers; for SF15 we cover temperatures ranging from 50 to 300 K and wavelengths from 0.45 to 2.6 micrometers. We compare our measurements with others in the literature and provide temperature-dependent Sellmeier coefficients based on our data to allow accurate interpolation of index to other wavelengths and temperatures. While we generally find good agreement (plus or minus 2 x 10(exp -4) for N-BK7, less than 1 x 10(exp -4) for the other materials) at room temperature between our measured values and those provided by the vendor, there is some variation between the datasheets provided with the prisms we measured and the catalog values published by the vendor. This underlines the importance of measuring the absolute refractive index of the material when precise knowledge of the refractive index is required.

Frey, Bradley J.↗

Select Electronic Parts Operation at Extreme Low Temperature

The purpose of the study presented in this paper is to extend the test period of a selected set of electronics parts at cryogenic condition to dwell period of about 24 hours to demonstrate extreme cold operational capability of these components. The parts tested are tantalum polymer, BX and P90 type ceramic capacitors, thick film resistors, analog multiplexers, a digital inverter, and a D-flip-flop. These parts were tested to assist identifying candidate components that can be used for development of a cold capable telemetry board. There are several past investigations that have shown that COTS (commercial-off-the-shelf) capacitors and resistors tested at cryogenic temperatures and frequencies up to 10MHz did not exhibit significant changes in capacitance and resistance values. Also, there are several test results for active parts. These past tests collected measurements during a temperature sweep from room temperature down to cryogenic temperature with very short dwell time at cryogenic temperature, and back to room temperature. This study extends the operational dwell time to at least 24 hours and returning to room temperature operation without significant degradation in performance, thus, demonstrating the potential for longer dwell time in actual operation in these extreme cold temperatures and a method for identifying the cold operability.

Ashtijou, Mohammad↗

Real gas effects 2: Influence of condensation on minimum operating temperatures of cryogenic wind tunnels

Condensation effects are responsible for the minimum operating temperatures of cryogenic wind tunnels at total pressures up to about 9 atmospheres. The two primary modes of condensation homogeneous nucleation and heterogeneous nucleation and the conditions with which either may limit minimum operating temperatures are reveiwed. Previous hypersonic and supersonic condensation data are reviewed as are data taken in the nitrogen gas, Langley 0.3 Meter Transonic Cryogenic Tunnel. Analysis of data in the 0.3 m tunnel suggests that the onset of homogenous nucleation may be approximated by an analysis by sivier and that the onset of heterogeneous nucleation is only apparent just below free stream saturation. Extension of the results from the 0.3 m tunnel to other nitrogen gas cryogenic tunnels is discussed and is shown to depend on length scales, purity of the liquid nitrogen injected for cooling, number of particulates in the flow, and the extent to which the injected liquid nitrogen is evaporated.

Hall, R. M.↗

Flight Reynolds Number Testing of the Orion Launch Abort Vehicle in the NASA Langley National Transonic Facility

A 6%-scale unpowered model of the Orion Launch Abort Vehicle (LAV) ALAS-11-rev3c configuration was tested in the NASA Langley National Transonic Facility to obtain static aerodynamic data at flight Reynolds numbers. Subsonic and transonic data were obtained for Mach numbers between 0.3 and 0.95 for angles of attack from -4 to +22 degrees and angles of sideslip from -10 to +10 degrees. Data were also obtained at various intermediate Reynolds numbers between 2.5 million and 45 million depending on Mach number in order to examine the effects of Reynolds number on the vehicle. Force and moment data were obtained using a 6-component strain gauge balance that operated both at warm temperatures (+120 . F) and cryogenic temperatures (-250 . F). Surface pressure data were obtained with electronically scanned pressure units housed in heated enclosures designed to survive cryogenic temperatures. Data obtained during the 3-week test entry were used to support development of the LAV aerodynamic database and to support computational fluid dynamics code validation. Furthermore, one of the outcomes of the test was the reduction of database uncertainty on axial force coefficient for the static unpowered LAV. This was accomplished as a result of good data repeatability throughout the test and because of decreased uncertainty on scaling wind tunnel data to flight.

Chan, David T.↗

An Approach to Reliability Testing of Microcircuits at Cryogenic Conditions

This viewgraph presentation reviews an approach to testing microcircuits at cryogenic temperatures. Standard testing procedures are not adequate to test microcircuits that are to operate at cryogenic temperatures. It is therefore necessary to perform analysis of operation conditions and reliability conditions for planning qualification testing of microcircuits at cryogenic temperatures. The major degradations for microcircuits operating at low temperatures depend on the number of switching cycles rather than on the duration of part operation. Therefore instead of accelerating degradation of the parts by increasing the level of stress, the possibility of which is very limited at cryogenic temperatures, the reliability testing can be based on the number of switching cycles.

Teverovsky, Alexander↗

Coercivity maxima at low temperatures

Recent measurements have shown that the magnetic coercive forces of some Apollo lunar samples show an unexpected decrease with decreasing temperature at cryogenic temperatures. This behavior can be explained quantitatively in terms of a model which considers additive contributions from a soft, reversible magnetic phase and from a harder, hysteretic magnetic phase.

Schwerer, F. C.↗

Low-temperature solder for joining large cryogenic structures

Three joining methods were considered for use in fabricating cooling coils for the National Transonic Facility. After analysis and preliminary testing, soldering was chosen as the cooling coil joining technique over mechanical force fit and brazing techniques. Charpy V-Notch tests, cyclic thermal tests (ambient to 77.8 K) and tensile tests at cryogenic temperatures were performed on solder joints to evaluate their structural integrity. It was determined that low temperature solder can be used to ensure good fin-to-tube contact for cooling-coil applications.

Buckley, J. D.↗

Compression behavior of the forged Ll2 compounds Al67Ti25Cr8 and Al66Ti25Mn9

The paper presents the findings of a compression study as a function of temperature from cryogenic temperatures to 1373 K at a strain rate of about 0.0001/s on forged Al67Ti25Cr8 and Al66Ti25Mn9 compounds. The creep response of these alloys is analyzed at strain rates varying from 2 x 10 to the -4th to 2 x 10 to the -7th /s at 1000 K and 1100 K. It is shown that as-cast microstructures for both compounds are dendritic, while both intermetallics forged very well with no edge cracking, with the microstructures appearing fully recrystallized. True comprehensive stress-strain diagrams determined at 1100 K as a function of nominal strain rate reveal a range of behaviors in both materials.

Brown, S. A.↗

Cryogenic optical systems and instruments IV; Proceedings of the Meeting, San Diego, CA, July 10-12, 1990

Consideration is given to cryogenic system design and optical technology; cryogenic instruments, sensors, and detectors; space cryogenic dewars and coolers; and cryogenic mechanisms, testing, and structures. Particular attention is given to mission optimization of the Space Infrared Telescope Facility (SIRTF), alternative aperture stop position designs for SIRTF, scaling laws for lightweight optics, evaluation of a far-infrared Ge:Ga multiplexed detector array, cryogenic limb array etalon spectrometer calibration, reliability growth of coolers for advanced optical systems and instruments, flight-qualified solid argon cooler for the BBXRT instrument, precision mechanisms for optical alignments at cryogenic temperatures, versatile cryogenic rotary-positioning systems, and optical alignments of the Cosmic Background Explorer observatory.

Melugin, Ramsey K.↗

The influences of fluorine and process variations on polysilicon film stress and MOSFET hot carrier effects

The use of fluorinated gate oxides may provide an improvement in nMOSFET reliability by enhancing hot carrier resistance. In order to clarify the mechanisms by which polysilicon processing and fluorination influence the oxide behavior, a matrix of nMOSFET structures was prepared using various processing, doping, and implantation strategies. These structures were evaluated for crystalline morphology and chemical element distribution. Mechanical stress measurements were taken on the polysilicon films from room temperature to cryogenic temperature. These examinations showed that fluorination of a structure with randomly oriented polysilicon can reduce residual mechanical stress and improve hot carrier resistance at room temperature.

Lowry, Lynn E.↗

An Improved Formulation for Calorimetric Emittance Testing of Spacecraft Thermal Control Coatings

Spacecraft often really heavily on passive thermal control to maintain operating temperature. An important parameter in the spacecraft heat balance equation is the emittance of thermal control coatings as a function of coating temperature. One method for determining the emittance of spacecraft thermal control from elevated temperature to cryogenic temperatures relies on a calorimetric technique. The fundamental equation governing this test method can be found in numerous places in the literature and although it generally provides reasonable results, its formulation is based on a conceptual flaw that only becomes apparent when the sample temperature approaches the wall temperature during testing. This paper investigates the cause for this error and develops the correct formulation for calorimetric emittance testing. Experimental data will also be presented that illustrates the difference between the two formulations and the resulting difference in the calculated emittance.

Kauder, Lonny R.↗