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At least 307 records · Page 17

Custom electronic subsystems for the laboratory telerobotic manipulator

The National Aeronautics and Space Administration (NASA) Space Station Program presents new opportunities for the application of telerobotic and robotic systems. The Laboratory Telerobotic Manipulator (LTM) is a highly advanced 7 degrees-of-freedom (DOF) telerobotic/robotic manipulator. It was developed and built for the Automation Technology Branch at NASA's Langley Research Center (LaRC) for work in research and to demonstrate ground-based telerobotic manipulator system hardware and software systems for future NASA applications in the hazardous environment of space. The LTM manipulator uses an embedded wiring design with all electronics, motor power, and control and communication cables passing through the pitch-yaw differential joints. This design requires the number of cables passing through the pitch/yaw joint to be kept to a minimum. To eliminate the cables needed to carry each pitch-yaw joint's sensor data to the VME control computers, a custom-embedded electronics package for each manipulator joint was developed. The electronics package collects and sends the joint's sensor data to the VME control computers over a fiber optic cable. The electronics package consist of five individual subsystems: the VME Link Processor, the Joint Processor and the Joint Processor power supply in the joint module, the fiber optics communications system, and the electronics and motor power cabling.

Glassell, R. L.↗

Sensor Requirements and Roadmaps

The chapter starts with a brief overview of the state-of-the-art of the sensing technologies. Principles of detection and the stage of integration in conjunction with the need are discussed. Based on the projected sensor requirements to accomplish propulsion systems with distributed active control, the existent gaps and selected types of sensor technologies are addressed, which are foreseen to deliver the required sensitivity, the resolution, the range, and the bandwidth in classes of sensors and which will allow operation under harsh environment conditions. By changing the packaging and/or design of the current sensors, operation environments of 750°C may be possible, which would meet requirements for sensors located towards the engine intake, compressor and in some cases low-pressure turbine. However, the majority of sensors for locations close to the engine combustion chamber or afterburner (with operation temperatures up to 1700°C) do not exist. There is also a need for smart sensors, which would enable future distributed control architecture. In addition a number of sensors, which are of interest for more intelligent gas turbine engines, are being explored or do not yet exist, for example turbine emission species sensors, burning patter factor sensors, fuel property sensors, and exhaust gas composition sensors. Meanwhile, rapid emerging technologies were made available during the three years duration of the Task Group. These include tip clearance measurement technologies such as eddy current, and microwave methods. To meet future sensor requirements, new fabrication and material technologies (MEMS, other), advanced sensing principles (spectroscopy, other), and their potential applications to new sensor types need to be explored. The status of current R&D for new sensors and future expectations are summarized in a comprehensive table. Sensors and associated electronics that have to operate in high temperature are foreseen to be largely available by 2015 (SiC) and 2020 (SiCN). Both of these technologies come with the potential of embedding such high temperature sensors within the structure. The information presented in the chapter represents the state-of-the-art of the sensing technology of the years 2005-2007 to the best knowledge of the authors. The authors are also fully aware of the fact that there may be many ongoing research programs as well as individual research that are not publicly supported and public information is not available. Therefore, the report might miss that section of knowledge. Also, progress in research and development is made every day such that often, the recent information may be fast outdated. The reader should bear in mind these facts.

Ion Stiharu↗

Intelligent Process Visualization through Nuclear Operation Process Modeling, Reasoning, and Object Detection from Field Videos (Final Report)

This report is a deliverable for the “Final Report” task of DOE NEET Project 19-16790, "Context-Aware Safety Information Display for Nuclear Field Workers." This project's overall goal is to test the hypothesis that integrating computer vision and process reasoning methods will enable proactive visualization of the safe operation and maintenance processes of Nuclear Power Plants (NPP) for field workers. Augmented Reality (AR) glasses adopting such proactive safety information visualization techniques can significantly increase personnel safety and reduce the NPP’s operating costs. The current practice of monitoring NPPs requires workers to switch between digital models, data, and physical workspaces in identifying relevant but potentially occluded objects and in assessing the risks of operation and maintenance processes. On the other hand, frequently changed field conditions require field workers to report to supervisors for real-time guidance. Such guidance is essential to ensure that changing conditions will not invalidate or endanger the work order and other ongoing processes that may jeopardize NPP operations. Additionally, incorrect recognition of equipment objects can result in communication errors and safety problems. AR techniques can assist engineers in viewing the physical workspaces with objects labeled with detailed operation procedures and safety reminders during field operations. The project team developed an “Intelligent Context-Aware Safety Information Display” (ICAD) for supporting Nuclear Power Plant (NPP) field workers in achieving safe and efficient execution of a series of operational tasks in uncertain and changing workspaces of an NPP. Before designing the ICAD-AR prototype, the project team synthesized NPP operational knowledge models through literature review studies, surveys, interviews with domain experts, and knowledge modeling. The project team conducted an extensive study of the operational procedures of various NPPs, and digital technologies that can support the safe and efficient execution of those procedures in different NPP operational contexts. This literature review helped the project team conduct surveys and interviews with nuclear engineers and field workers to identify three categories of information. The NPP knowledge modeling efforts reveal that the three categories of information identified have different levels of importance in a typical procedure of carrying out a series of tasks to achieve a specific NPP operation goal (e.g., shutdown, mode changes). These three categories of information include 1) Workspace dynamics – the changing spatial arrangements of workspaces, tools, protection equipment, and supporting materials, 2) Workflow prognostics – the dynamic dependencies between different parts of an NPP that functionally support and influence each other in terms of safety and efficiency, and 3) Hazards – objects and spaces that contain hazardous materials or physical conditions that can pose risks to workers or mechanical systems. The project team has profiled the importance levels of these categories of information into a knowledge model. This knowledge model specifies what types of information are more critical for a given task in a given workspace so that computers can automatically identify critical objects and sensors in a scene for delivering context-ware safety information to field workers through AR devices. Significant research development of this project results in technical research outcomes and a prototyping system that illustrates the technical feasibility of establishing an ICAD-AR system supporting the proactive safety information display for nuclear field workers. This final report summarizes the project team’s technological achievements in the past three years. Overall, the project team completed the development and integration of five techniques into a prototype ICAD Augmented Reality (ICAD-AR) system and demonstrated the developed system’s real-time execution in a mechanical room. The project team completed the analysis of using this prototype in other types of workspaces based on 3D image data and digital design models collected from two additional workspaces (a water treatment plant and a flow loop training facility). The integrated techniques include 1) Natural Language Processing (NLP) algorithms supporting the generation and updates of nuclear fieldwork process models based on text analysis of work packages and operation manuals; 2) sensor log analysis for predicting control actions in given sensor reading contexts; 3) computer vision algorithms for automatic localization and navigation of workers; 4) object detection algorithms for identifying task-related objects and correlated sensors for safety checking; 5) AR technique as a platform for supporting the integration. The testing results of these five techniques have shown that 1) the sensor log analysis model can predict the next control action with an accuracy of 0.883; 2) the trained natural language processing model can extract more than 80% of the critical information from paper-based procedures (PBPs); 3) the navigation algorithm with the integration of Visual Inertial Odometry (VIO) and Non-Recursive Bayesian Filter methods make operator’s trajectory estimation resilient to drift error; 4) the computer vision algorithm can detect task-specific and safety-critical objects with an average accuracy of 95.3%. The project team used work procedures collected from a flow loop training facility and two datasets collected from two mechanical rooms simulating the workspaces of NPPs to demonstrate the technical capabilities of the developed ICAD-AR prototype. The demonstration validated the technical feasibility of establishing the ICAD-AR system for nuclear field workers and identified the challenges in 1) automatic text analysis of work packages; 2) use of limited samples of sensor logs for predicting the proper timings of control actions; 3) reliably tracking workers and their task progress in mechanical rooms with many similar objects.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

Automated point dendrometer, soil moisture and temperature, and meteorological variables datasets, Oct 2024 – Nov 2025, G.A. Pearson Natural Area, Flagstaff, AZ, USA

This data package includes parsed, cleaned, and calibrated data from 48 TOMST automated point dendrometers, 48 TOMST 15 cm soil moisture sensors, and 12 TOMST 30 cm soil moisture sensors. The point dendrometers were cleaned with the “dendRoAnalyst” package in RStudio. The soil sensors were cleaned and calibrated for volumetric water content (VWC) with the “myClim” package in RStudio using the soil texture of the site (sandy clay loam). Additionally, this data package also includes raw data from 2 METER weather stations. Dendrometers and soil sensors have both their sensor ID, as well as the ID for the specific tree they were instrumented on at the G.A. Pearson Natural Area (GPNA) site and their experimental group. The purpose of these data is to understand how ponderosa pine trees in restored (thinned and burned) vs. unrestored (no treatment) areas are responding to drought and seasonal precipitation. These data use radial growth and soil moisture data to answer the following question: how are active season length, growth on different time scales (weekly, monthly, seasonally, and annually), growth during dry periods and after precipitation events, and environmental and biological drivers of radial growth different between restored versus unrestored areas?

Air temperature↗

Design, building and test of one prototype and four final position sensor assemblies: Hall effect position sensors

This report covers the development of a three channel Hall effect position sensing system for the commutation of a three phase dc torquer motor. The effort consisted of the evaluation, modification and re-packaging of a commercial position sensor and the design of a target configuration unique to this application. The resulting design meets the contract requirements and, furthermore, the test results indicate not only the practicality and versatility of the design, but also that there may be higher limits of resolution and accuracy achievable.

Source record↗

500 C Electronic Packaging and Dielectric Materials for High Temperature Applications

High-temperature environment operable sensors and electronics are required for exploring the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high temperature electronics, and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by these high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed. High-temperature environment operable sensors and electronics are required for probing the inner solar planets and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500C. A compatible packaging system is essential for long-term testing and eventual applications of high temperature electronics and sensors. High temperature passive components are also necessary for high temperature electronic systems. This talk will discuss ceramic packaging systems developed for high electronics and related testing results of SiC circuits at 500C and silicon-on-insulator (SOI) integrated circuits at temperatures beyond commercial limit facilitated by high temperature packaging technologies. Dielectric materials for high temperature multilayers capacitors will also be discussed.

dielectric performance↗

Thin Film Physical Sensor Instrumentation Research and Development at NASA Glenn Research Center

A range of thin film sensor technology has been demonstrated enabling measurement of multiple parameters either individually or in sensor arrays including temperature, strain, heat flux, and flow. Multiple techniques exist for refractory thin film fabrication, fabrication and integration on complex surfaces and multilayered thin film insulation. Leveraging expertise in thin films and high temperature materials, investigations for the applications of thin film ceramic sensors has begun. The current challenges of instrumentation technology are to further develop systems packaging and component testing of specialized sensors, further develop instrumentation techniques on complex surfaces, improve sensor durability, and to address needs for extreme temperature applications. The technology research and development ongoing at NASA Glenn for applications to future launch vehicles, space vehicles, and ground systems is outlined.

Wrbanek, John D.↗

Integration and Packaging

Vertically integrated (3D) combinations of sensors and electronics provide the ability to fabricate small, fine pitch pixels with very small total capacitance monolithically integrated with complex circuitry. The small capacitance, enabled by the fine pixel pitch and low interconnect capacitance available in 3D hybrid bonding, provides excellent signal/noise with moderate power. This combination enables fabrication of integrated sensors and electronics with both excellent position and time resolution. In this white paper a discussion will be presented on 3D integration advantages, ongoing projects and prospects in high energy physics and beyond.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

SIMBIOS Project Data Processing and Analysis Results

The Sensor Intercomparison and Merger for Biological and Interdisciplinary Oceanic Studies (SIMBIOS) Project is concerned with ocean color satellite sensor data intercomparison and merger for biological and interdisciplinary studies of the global oceans. Imagery from different ocean color sensors can now be processed by a single software package using the same algorithms, adjusted by different sensor spectral characteristics, and the same ancillary meteorological and environmental data. This enables cross-comparison and validation of the data derived from satellite sensors and, consequently, creates continuity in ocean color information on both the temporal and spatial scale. The next step in this process is the integration of in situ ocean and atmospheric parameters to enable cross-validation and further refinement of the ocean color methodology. The SIMBIOS Project Office accomplishments during 2000 year are summarized under satellite data processing, data product validation, SeaWiFS Bio-Optical Archive and Storage System (SeaBASS) database, supporting services, sun photometers and calibration activities, and calibration round robins. These accomplishments are described.

Ainsworth, Ewa↗

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

High temperature↗

Assessment of Flow-Enhanced Electrochemical Sensor Testing and Deployments for MSRs

This report serves as the deliverable for Milestone M3RS-23AN0401061 that is part of Work Package RS-23AN040106 (Flow Enhanced Sensors for MSRs – ANL). The goal of this milestone was to determine performance of the flow enhanced electrochemical sensor (FEES) and modular flow instrumentation testbed (MFIT) in safeguards relevant scenarios. Flow enhanced electrochemical sensors are a type of electroanalytical sensor that has been developed at Argonne National Laboratory to be installed directly into MSR flow conduits to make measurements of the salt composition. These sensors represent a significant improvement in capabilities compared to earlier electroanalytical sensors that instead can only be operated in quiescent conditions. Previous work has focused on testing of the FEES in flowing conditions provided by the MFIT to assess the accuracy and precision of the sensor measurements. To further improve this capability, in FY23 we undertook a campaign of safeguards relevant scenarios in molten salt containing a range of uranium chloride concentrations (0 to 3 wt%). All the testing carried out in FY23 was aided by a control system designed to automatically actuate flow conditions and collect data. This new automation system is estimated to have increased experimental throughput by a factor of four and enabled testing in a variety of complex conditions. The advancements in throughput and repeatability led to improved quantification of actinide concentrations using the in-flow sensors, with a reduction of the mean absolute relative error from 5.6% in FY22 to 3.1% in FY23. In addition to safeguards scenarios run in the MFIT, FY23 work included deployment of a FEES at a partner institution where it will be tested in a flowing salt loop. The FEES was successfully integrated into that loop and is being tested prior to loop startup. In FY23, work also continued on the smaller flow system that we have named the mini-MFIT. This smaller system is capable of rapid prototyping of new sensor designs prior to installation in the larger MFIT radiological flow system. Work was carried out to test this new system in non-radiological molten salts in a separate glovebox. This work is helping us to enhance the accuracy of our salt monitoring capabilities through the integration of multiple types of sensors. The high degree of accuracy required by 10 CFR 74 represents a significant challenge, and further design evolution and integration of the sensors into multimodal sensing frameworks will be needed to further push the measurement accuracy to the needed level.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗

Assessment of Flow-Enhanced Sensors for Actinide Quantification in MSRs

This report serves as the deliverable for Milestone M2RS-22AN0401062 that is part of Work Package RS-22AN040106 (Flow Enhanced Sensors for MSRs – ANL). The goal of this milestone is to assess the capabilities of flow-enhanced electrochemical sensors (FEES) to quantify actinides in molten salt reactors. Flow enhanced electrochemical sensors are a type of electroanalytical sensor that has been developed at Argonne National Laboratory to be installed directly into MSR flow conduits in order to make measurements of the salt composition. These sensors represent a significant improvement in capabilities compared to earlier electroanalytical sensors that instead can only be operated in quiescent conditions. To support this work, Argonne constructed a molten salt flow system to serve as a testbed for the development of safeguards and process monitoring-relevant sensors in challenging molten salt flow conditions. Through extensive flow testing using UCl3-bearing salts, Argonne has been able to show that the FEES are able to make good measurements of salt composition. Concentration measurements with a mean absolute error of 0.09 wt% have been achieved for representative fuel salt mixtures across a range of UCl3 loadings. Repeatability was also good, with the relative standard deviation from repeated measurements being less than 1.0%. These sensors have also been shown to be able to measure the flow rate of the salt within the flow system’s transfer line. Although the accuracy of the sensors has been good, the sensors have thus far not been able to achieve performance good enough to satisfy the nuclear material accountancy requirements in 10 CFR 74. To do so, accuracy levels of 0.1% must be achieved; the FEES when operated in Argonne’s flow system have so far only been able to achieve relative errors of approximately 5.0%. Much of the error that has been observed at this stage is due to challenges in maintaining a stable salt composition in the molten salt flow system, and it is not believed that there are any inherent flaws in the sensor design. Nonetheless, the high degree of accuracy required by 10 CFR 74 represents a significant challenge, and further design evolution and integration of the sensors into multimodal sensing frameworks will likely be needed to push the measurement accuracy to the needed level.

Moore, Colin E.↗

Packaging Technology for SiC High Temperature Electronics

High-temperature environment operable sensors and electronics are required for long-term exploration of Venus and distributed control of next generation aeronautical engines. Various silicon carbide (SiC) high temperature sensors, actuators, and electronics have been demonstrated at and above 500 C. A compatible packaging system is essential for long-term testing and application of high temperature electronics and sensors in relevant environments. This talk will discuss a ceramic packaging system developed for high temperature electronics, and related testing results of SiC integrated circuits at 500 C facilitated by this high temperature packaging system, including the most recent progress.

Chen, Liang-Yu↗

DigiFloat (Final Scientific/Technical Report)

This purpose of this report is to document the development of a floating offshore wind platform Digital Twin for the ARPA-E-funded DigiFloat project led by Principle Power, Inc. In Offshore Wind, Digital Twins are aimed at reducing farm-wide OPEX expenditures through reduced-basis inspection, assessing life extension methods, and obtaining better knowledge of the deployed assets for future product optimization. There is a high level of technical effectiveness and economic feasibility for the technology investigated, as it uses commercial off-the-shelf sensors, and a commercial software package. A substantial portion of the project goals are improvement of existing technology for use with floating wind turbines, and new application of an existing technology to a rapidly-growing sector. A few sensors applied to a small number of units bring benefit to the entire fleet of floating wind turbines in a given farm, and in other future wind farms. The benefits to the public of this project are further optimization and maturation of floating wind technology, to bring it to the U.S. market faster and cheaper.

17 WIND ENERGY↗

An Intelligent Adaptable Monitoring Package. Final Report

The “Intelligent Adaptable Monitoring Package” project was a four-year effort that demonstrated the feasibility of integrated sensing packages at tidal and wave energy sites. Such integration is generally required by the breadth of sensors required to understand environmental effects at marine energy sites and the operational difficulty of deploying, maintaining, and recovering such sensors. Over the course of the project, the Adaptable Monitoring Package (AMP) was deployed in multiple settings, each corresponding to a project budget period: - Budget Period 1: Demonstration of cabled deployment at Pacific Northwest National Laboratory’s Marine Science Laboratory. The deployment highlighted AMP hardware endurance over a 4-month deployment in a tidally-dominated environment and laid the groundwork for machine learning algorithms to detect and classify targets present in active sonar data. - Budget Period 2: Demonstration of an autonomous deployment at PacWave South off the coast of Newport, Oregon. The deployment highlighted the stability of AMP hardware and software, with the autonomous package collecting data on a duty cycle over a 1.5-month deployment. - Budget Period 3: Demonstration of an autonomous deployment powered by a wave energy converter at the U.S. Navy’s Wave Energy Test Site. The deployment highlighted the potential of wave energy to power ocean observatories and led to the development of machine learning algorithms to detect and classify targets in optical camera data. In aggregate, this project’s greatest success was demonstrating the AMP’s flexibility in a range of deployment scenarios. Each budget period represented a “first of a kind” demonstration of integrated instrumentation – cabled AMP, autonomous AMP, wave-energy powered AMP – and each deployment helped to identify and set goals for the next. Further, despite the exploratory nature of these deployments, each one achieved high system up-time and proved that flexible integration of multiple sensors in a single package represents a viable strategy for marine energy environmental monitoring. The key lessons learned from the project are: - Without continuous power, either from a shore cable or in situ source, many of the benefits of integration are lost (If continuous power is not available, the ability to detect rare events is lost, as is the ability to minimize the risk of behavioral changes through adaptive sensing. However, even on a duty cycle, there is still value in being able to acquire synchronous data from multiple sensors.); and - Observations from a moving platform present substantially greater data processing challenges than those from stationary platforms. Finally, these deployments also demonstrate an important truth: successful integration alone does not guarantee that relevant data are collected. To grow the knowledge base about environmental interactions with marine energy converters, integrated systems, like the AMP, need to include the right sensor mix and connect the data pipelines to effective processing algorithms. These deployments establish a strong foundation for future collaborations with the environmental research community: not only to understand the environmental effects of marine energy, but also to improve our general ability to study life in the sea.

16 TIDAL AND WAVE POWER↗

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages. Phase 2, supplement 1: Moisture permeation of adhesive-sealed hybrid microcircuit packages

The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure.

Perkins, K. L.↗

Skylab program earth resources experiment package: Ground truth data for test sites (SL-2)

Field measurements were performed at selected ground sites in order to provide comparative calibration measurements of sensors for the Earth Resources Experiment Package. Specifically, the solar radiation (400 to 1300 namometers) and thermal radiation (8-14 micrometers) were measured. Sites employed for the thermal measurements consisted of warm and cold water lakes. The thermal brightness temperature of the lake water, the temperature and humidity profile above the lake, and near surface meteorology (wind speed, pressure, etc.) were measured near the time of overpass. Sites employed for the solar radiation measurements were two desert type sites. Ground measurements consisted of: (1) direct solar radiation - optical depth; (2) diffuse solar radiation; (3) total solar radiation, (4) target directional (normal) reflectance; (5) target hemispherical reflectance; and (6) near surface meteorology.

Source record↗

Assessment and Assurance of Microelectronics Packaging Technology of Microelectromechanical Systems (MEMS)

Microelectromechanical systems (MEMS) have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, etc. Standard semiconductor microelectronics packaging needs the integrated circuits to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the packaging technology. In the case of MEMS the microstructures (active elements) often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it 'measures to assure the MEMS technology by lowering the risk to zero. MEMS technology has a major application in developing a microspacecraft for space systems provided assurance of MEMS technology is sufficiently addressed nondestructively. This technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's safety and mission assurance goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively by teaming-up with the other NASA centers using the limited resources available. This paper discusses the latest developments in the MEMS technology and challenging issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices based on silicon, poly-silicon, and other materials for microspacecraft applications considering the space environment and reliability assurance qualification guidelines in perspective. Acknowledgments: The above research work is supported by the NASA Electronics Parts and Packaging Program (NEPP) and performed by the Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA under a contract with the NASA - Code Q for the Office of Safety and Mission Assurance Program 323-79.

Ramesham, Rajeshuni↗