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At least 307 records · Page 17

All sources NASA NTRS DOE OSTI

DOE OSTI2022

Pseudouridine synthase 7 is an opportunistic enzyme that binds and modifies substrates with diverse sequences and structures

Pseudouridine (Ψ) is a ubiquitous RNA modification incorporated by pseudouridine synthase (Pus) enzymes into hundreds of noncoding and protein-coding RNA substrates. Here, in this study, we determined the contributions of substrate structure and protein sequence to binding and catalysis by pseudouridine synthase 7 (Pus7), one of the principal messenger RNA (mRNA) modifying enzymes. Pus7 is distinct among the eukaryotic Pus proteins because it modifies a wider variety of substrates and shares limited homology with other Pus family members. We solved the crystal structure of Saccharomyces cerevisiae Pus7, detailing the architecture of the eukaryotic-specific insertions thought to be responsible for the expanded substrate scope of Pus7. Additionally, we identified an insertion domain in the protein that fine-tunes Pus7 activity both in vitro and in cells. These data demonstrate that Pus7 preferentially binds substrates possessing the previously identified UGUAR (R = purine) consensus sequence and that RNA secondary structure is not a strong requirement for Pus7-binding. In contrast, the rate constants and extent of Ψ incorporation are more influenced by RNA structure, with Pus7 modifying UGUAR sequences in less-structured contexts more efficiently both in vitro and in cells. Although less-structured substrates were preferred, Pus7 fully modified every transfer RNA, mRNA, and nonnatural RNA containing the consensus recognition sequence that we tested. Our findings suggest that Pus7 is a promiscuous enzyme and lead us to propose that factors beyond inherent enzyme properties (e.g., enzyme localization, RNA structure, and competition with other RNA-binding proteins) largely dictate Pus7 substrate selection.

59 BASIC BIOLOGICAL SCIENCES↗

DOE OSTI2016

Substrate-selective Inhibition of Cyclooxygeanse-2 by Fenamic Acid Derivatives Is Dependent on Peroxide Tone

Cyclooxygenase-2 (COX-2) catalyzes the oxygenation of arachidonic acid (AA) and endocannabinoid substrates, placing the enzyme at a unique junction between the eicosanoid and endocannabinoid signaling pathways. COX-2 is a sequence homodimer, but the enzyme displays half-of-site reactivity, such that only one monomer of the dimer is active at a given time. Certain rapid reversible, competitive nonsteroidal anti-inflammatory drugs (NSAIDs) have been shown to inhibit COX-2 in a substrate-selective manner, with the binding of inhibitor to a single monomer sufficient to inhibit the oxygenation of endocannabinoids but not arachidonic acid. The underlying mechanism responsible for substrate-selective inhibition has remained elusive. In this work, we utilized structural and biophysical methods to evaluate flufenamic acid, meclofenamic acid, mefenamic acid, and tolfenamic acid for their ability to act as substrate-selective inhibitors. Crystal structures of each drug in complex with human COX-2 revealed that the inhibitor binds within the cyclooxygenase channel in an inverted orientation, with the carboxylate group interacting with Tyr-385 and Ser-530 at the top of the channel. Tryptophan fluorescence quenching, continuous-wave electron spin resonance, and UV-visible spectroscopy demonstrate that flufenamic acid, mefenamic acid, and tolfenamic acid are substrate-selective inhibitors that bind rapidly to COX-2, quench tyrosyl radicals, and reduce higher oxidation states of the heme moiety. Substrate-selective inhibition was attenuated by the addition of the lipid peroxide 15-hydroperoxyeicosatertaenoic acid. Collectively, these studies implicate peroxide tone as an important mechanistic component of substrate-selective inhibition by flufenamic acid, mefenamic acid, and tolfenamic acid.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2017

Collective transport for active matter run-and-tumble disk systems on a traveling-wave substrate

Here, we examine numerically the transport of an assembly of active run-and-tumble disks interacting with a traveling-wave substrate. We show that as a function of substrate strength, wave speed, disk activity, and disk density, a variety of dynamical phases arise that are correlated with the structure and net flux of disks. We find that there is a sharp transition into a state in which the disks are only partially coupled to the substrate and form a phase-separated cluster state. This transition is associated with a drop in the net disk flux, and it can occur as a function of the substrate speed, maximum substrate force, disk run time, and disk density. Since variation of the disk activity parameters produces different disk drift rates for a fixed traveling-wave speed on the substrate, the system we consider could be used as an efficient method for active matter species separation. Within the cluster phase, we find that in some regimes the motion of the cluster center of mass is in the opposite direction to that of the traveling wave, while when the maximum substrate force is increased, the cluster drifts in the direction of the traveling wave. This suggests that swarming or clustering motion can serve as a method by which an active system can collectively move against an external drift.

36 MATERIALS SCIENCE↗

DOE OSTI2018

Coherent growth of oxide films on a cleaved layered metal oxide substrate

Understanding oxide interface-induced effects requires controlled epitaxial growth of films on well-defined substrate surfaces. While conventional film growth on ex situ prepared substrates has proven to be a successful route, the choices of appropriate substrates with atomically defined surfaces are limited. Here, by depositing La 2/3 Sr 1/3 Mn O 3 on Sr 2 Ru O 4 (001), we present an alternative method of growing oxide thin films on in situ cleaved surfaces of layered-structured substrates. Cleaving Sr 2 Ru O 4 at low temperature in ultrahigh vacuum exposes an atomically flat, solely SrO-terminated surface with up to micrometer-scale terraces. The deposition of La 2/3 Sr 1/3 Mn O 3 spontaneously diminishes the surface Ru O 6 in-plane rotational distortion of the substrate and results in a cubic-like perovskite film structure with (La/Sr)-O layer termination. The interface is atomically sharp without obvious deviation of lattice spacing and chemical valence, except in the first unit cell where Ru-Mn intermixing is observed. Finally, these results demonstrate that film growth on a cleaved substrate can be an alternative route to obtain well-defined interfaces and in addition increase the availability of substrates for future oxide films.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

DOE OSTI2021

Planarization of Rough (100) GaAs Substrates via Growth by Hydride Vapor Phase Epitaxy

Wafer reuse techniques help offset the cost of III-V growth substrates by using a single wafer for multiple growths, but costly re-polishing after device removal limits the end benefit. In this work, we present planarization growth by hydride vapor-phase epitaxy (HVPE), a potentially low-cost growth technique, as a method of smoothing rough substrates for subsequent high-quality device growth without the need for polishing. First, we show there is a threshold for allowable substrate roughness without device degradation by comparing devices grown by organometallic vapor-phase epitaxy (OMVPE) on epi-ready polished and pre-polished substrates that did not have the final epi-ready polish. We then demonstrate successful smoothing with HVPE growth on substrates with different surface morphologies, with features ranging from general roughness to large facets. Initial devices grown by HVPE on a pre-polished substate showed no degradation compared to a control wafer, indicating that planarizing rough substrates through HVPE growth is a promising path toward being able to use rough substrates directly for growth, without costly polishing steps.

GaAs↗

DOE OSTI2016

The fungal cultivar of leaf-cutter ants produces specific enzymes in response to different plant substrates

Herbivores use symbiotic microbes to help gain access to energy and nutrients from plant material. Leaf-cutter ants are a paradigmatic example, having tremendous impact on their ecosystems as dominant generalist herbivores through cultivation of a fungus, Leucoagaricus gongylophorous. Here we examine how this mutualism could facilitate the flexible substrate incorporation of the ants by providing leaf-cutter ant subcolonies four substrate types: leaves, flowers, oats, and a mixture of all three. Through metaproteomic analysis of the fungus gardens, we were able to identify and quantify 1766 different fungal proteins, including 161 biomass-degrading enzymes. This analysis revealed that fungal protein profiles were significantly different between subcolonies fed different substrates with the highest abundance of cellulolytic enzymes observed in the leaf and flower treatments. When the fungus garden is provided with leaves and flowers, which contain the majority of their energy in recalcitrant material, it increases its production of proteins that break down cellulose: endoglucanases, exoglucanase and β-glucosidase. Further, the complete metaproteomes for the leaves and flowers treatments were very similar, the mixed treatment closely resembled the treatment with oats alone. This suggests that when provided a mixture of substrates, the fungus garden preferentially produces enzymes necessary for breakdown of simpler, more digestible substrates. This flexible, substrate-specific response of the fungal cultivar allows the leaf-cutter ants to derive energy from a wide range of substrates, which may contribute to their ability to be dominant generalist herbivores.

59 BASIC BIOLOGICAL SCIENCES↗

DOE OSTI2020

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Direct bonded copper (DBC) substrates used in power modules have limited heat spreading and manufacturing capability due to ceramic properties and manufacturing technology. The ceramic and copper bonding is also subject to high mechanical stress due to coefficient of thermal expansion mismatch between the copper and the ceramic. For wide-bandgap (WBG) devices, it is of interest exploring new substrate technologies that can overcome some of the challenges of direct bonded copper substrates. In this technical paper, the design, analysis, and comparison of insulated metal substrates (IMSs) for high-power wide-bandgap semiconductor-based power modules are discussed. This paper starts with technical description and discussion of state-of-the-art DBC substrates with different ceramic insulators such as aluminum nitride (AlN), Al 2 O 3 , and Si 3 N 4 . Next, an introduction of IMSs and their material properties, and a design approach for SiC (silicon carbide) metal-oxide-semiconductor field-effect transistor (MOSFET)-based power modules for high-power applications is provided. The influence of dielectric thickness on the power handling capability of the substrate are also discussed. The designed IMS and DBC substrates were characterized in terms of steady-state and transient thermal performance using finite element simulation. Finally, the performance of the IMS and DBC are validated in an experimental setup under different loading and cooling temperature conditions. We report the simulation and experimental results showed that the IMS can provide high steady-state thermal performance for high-power modules based on SiC MOSFETs. Furthermore, the IMS provided enhanced transient thermal performance, which provided a reduced junction temperature when the module is operated at low fundamental output frequencies in traction drive systems.

42 ENGINEERING↗

DOE OSTI2017

Integrated Plastic Substrates for OLED Lighting

OLED lighting has immense potential as aesthetically pleasing, energy-efficient general illumination. Unlike other light sources, such as incandescents, fluorescents, and inorganic LEDs, OLEDs naturally emit over a large-area surface. They are glare free, do not need to be shaded, and are cool to the touch, requiring no heatsink. The best efficiencies and lifetimes reported are on par with or better than current forms of illumination. However, the cost for OLED lighting remains high – so much so that these products are not market competitive and there is very low consumer demand. We believe that flexible, plastic-based devices will highlight the advantages of aesthetically-pleasing OLED lighting systems while paving the way for lowering both materials and manufacturing costs. These flexible devices require new development in substrate and support technology, which was the focus of the work reported here. The project team, led by Sinovia Technologies, has developed integrated plastic substrates to serve as supports for flexible OLED lighting. The substrates created in this project would enable large-area, flexible devices and are specified to perform three functions. They include a barrier to protect the OLED from moisture and oxygen-related degradation, a smooth, highly conductive transparent electrode to enable large-area device operation, and a light scattering layer to improve emission efficiency. Through the course of this project, integrated substrates were fabricated, characterized, evaluated for manufacturing feasibility and cost, and used in white OLED demonstrations to test their impact on flexible OLED lighting. Our integrated substrates meet or exceed the DOE specifications for barrier performance in water vapor and oxygen transport rates, as well as the transparency and conductivity of the anode film. We find that these integrated substrates can be manufactured in a completely roll-to-roll, high throughput process and have developed and demonstrated manufacturing methods that can produce thousands of feet of material without defects. We have evaluated the materials and manufacturing costs of these films at scale and find that they meet the current and future cost targets for bringing down the cost of OLED lighting while enabling future roll-to-roll manufacturing of the complete device. And finally, we have demonstrated that the inherent light-scattering properties of our films enhance white OLED emission efficiency from 20% to 50% depending on the metric. This work has shown that these substrates can be created, manufactured, and will perform as needed to enable flexible OLED lighting to enter the marketplace.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2019

Roll-to-Roll Integrated Substrates for OLED Lighting (Final Report)

OLED lighting has immense potential as aesthetically pleasing, energy-efficient general illumination. Unlike other light sources, such as incandescents, fluorescents, and inorganic LEDs, OLEDs naturally emit over a large-area surface. They are glare free, do not need to be shaded, and are cool to the touch, requiring no heatsink. The best efficiencies and lifetimes reported are on par with or better than current forms of illumination. However, the cost for OLED lighting remains high – so much so that these products are not market competitive and there is very low consumer demand. We believe that flexible, plastic-based devices will highlight the advantages of aesthetically-pleasing OLED lighting systems while paving the way for lowering both materials and manufacturing costs. These flexible devices require new development in substrate and support technology, which was the focus of the work reported here. Sinovia Technologies, as part of a collaborative team, has developed integrated plastic substrates to serve as supports for flexible OLED lighting. These substrates include a barrier to protect the OLED from moisture and oxygen-related degradation, a smooth, highly conductive transparent anode to define the OLED area, and a light scattering layer to improve emission efficiency. To ensure low cost, the anode pattern must be defined using high throughput, continuous processing, and any pattern shape should be possible. No current patterning technique meets all of these requirements. This SBIR work demonstrated the use of flexographic printing as an effective method of patterning for integrated substrates. Flexography is a letterpress process commonly used for many types of everyday items including boxes, retail bags, milk cartons, food packaging, disposable cups, adhesive tapes, envelopes, wallpaper, and newspaper. The printing process can go as fast as 600 meters per minute with feature resolution around 10 microns, showing promise for low-cost with high throughput. In this case, Sinovia has successfully used this technique to print transparent anode patterns roll-to-roll as part of our integrated substrate for OLED lighting. We have characterized the printed films and tailored the edges of the printed areas for OLED compatibility. We followed this by making white OLEDs using these anodes. To ensure that our anodes were compatible with different OLED stack structures, we fabricated solution-processed polymer white OLEDs, as well as collaborated with OLEDWorks to fabricate evaporated small-molecule devices. Comparing to results from our previous studies, we find that the flexography process does not have any detrimental effects to our overall substrate. We were able to show that our flexographically printed integrated substrate improves OLED efficiency by 24 – 35%, similar to previous results demonstrated using batch-patterning techniques. The success of this work represents two substantial opportunities for OLED lighting manufacturers. The first to first facilitate flexible lighting panels at scale, and the second to lower costs for by enabling roll-to-roll manufacture of the entire device stack. When realized, both of these will help OLED to become market competitive with other forms of general illumination.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2019

Enhanced Light Extraction from Low Cost White OLEDs Fabricated on Novel Patterned Substrates” (Final Report)

Organic LEDs (OLEDs) are a very attractive emerging solid state lighting (SSL) technology. Currently, one of the main challenges is to increase the extraction of the light generated inside the OLED into the forward (viewing) hemisphere. In conventional OLEDs fabricated on a transparent flat anode coated on glass the outcoupling factor is only about 20%. About 50% of the light is lost at the metal cathode (surface plasmon excitation), and waveguided internally in the organic layers and the transparent anode. Another ~30% is waveguided in the substrate to its edges. The research addressed this issue of outcoupling by evaluating OLEDs fabricated on corrugated plastic substrates manufactured in a cost-effective approach. It demonstrated that the outcoupling from such OLEDs can exceed 50% by mitigating plasmon–related loss and internal waveguiding, even without the addition of a microlens array or a hemispherical lens, either of which extracts the light trapped in the substrate. Simulations conducted in parallel with the experimental effort demonstrated how the corrugation assists in the outcoupling. The project also evaluated the role of the corrugation pitch and height in determining the outcoupling factor and other properties of the OLEDs. The technical effectiveness and economic feasibility of the project lie in the patterning of the extracting plastic substrates in an approach that is scalable to roll-to-roll (R2R) manufacturing. R2R processes are drastically lower-cost than batch or single-unit fabrication. The corrugated plastic substrates studied are part of an integrated substrate that includes also a microlens array at the air-side of the substrate and a conductive electrode. The project that was a university-industry collaboration is of major benefit to the public as it demonstrates the feasibility of manufacturing highly efficient OLEDs for SSL in a R2R process, which would drastically reduce the manufacturing cost and increase production in the USA. SSL is efficient and environmentally-friendly. It reduces electricity consumption, and hence lighting cost.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2018

Low Cost Corrugated Substrates for High Efficiency OLEDs (Final Report)

The external quantum efficiency (EQE) of a planar OLED is limited to 25%. Around 75% of the light is trapped in the substrate, waveguided and SPP modes. In this project, we demonstrated that nano-structures can significantly improve the EQE of OLEDs. The objective is to improve the EQE to 70% using corrugated substrate, low index layer incorporation and micro lens arrays. We conducted optical study of the operating devices using ARES measurement, and used the result to guide the design of corrugated substrates as well as the OLED stack for better performance. During the first year of the program, we have demonstrated over 60% EQE in a corrugated green OLED with half-ball lens for light extraction. By comparing, the optical characteristics of OLEDs fabricated on single and poly crystal corrugated structures, we confirm that the enhancement using corrugated substrates comes from waveguided and SPP modes extraction. To push the device EQE to 70%, further optimization of the corrugated substrate is needed. The extraction of waveguided and SPP modes are influenced by the corrugation pitch, depth and profile. Therefore, we developed a series of processes to precisely control the corrugation morphology. Through comparison of different corrugated substrates, we observed that while an abrupt surface profile results in stronger mode extraction, it also introduces strong leakage current; while a smooth profile are less efficient in mode extraction, it preserves the quality of an OLED. Based on these observations, we conclude that a single crystal hole corrugation results in optimum EQE % and low leakage current when planarized with PEDOT. To improve the extraction of waveguided mode, we also introduce a low index contrast layer (ICL) to increase the index contrast between corrugated ITO and glass interface. We optimized our recipe for the index contrast layer processing and reduced its refractive index from 1.50 to 1.38. As a result, the optimized device shows 47.6% EQE, which is 1.64 times higher than the reference planar device. By extracting the substrate mode with a hemispherical lens, we obtained an EQE of 71.6%, which is a 2.46 times enhancement. The cross-section SEM image reveals the high EQE is due to the formation of an air gap at the interface of the ICL, resulting in an increase of the index contrast to Δn ~ 1. We use angle-resolved electroluminescence spectroscopy (ARES) to demonstrate that the ICL improves the diffraction efficiency at the ITO/glass interface, extracts TM, TE waveguide and SPP mode more efficiently, and leads to the observed high efficiency. We also address the directional emission issue with the single crystalline microlens arrays (MLAs) by fabricating polycrystalline MLAs. The process uses colloidal assembly method to create a mono-layer of silica spheres, then uses PDMS stamps to replicate the pattern for multi-use imprinting. The MLAs are close-packed in short range but have random orientations in the long range. This avoids stronger extraction along the optical axes of single crystal MLAs and prevents the directional emission issue. We also demonstrate that the color shift induced by the corrugation can be minimized using MLAs. In this scenario, the MLAs work as diffuser to randomize the directional emission from extracted waveguide and SPP modes.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

DOE OSTI2022

III-V Solar Cells with Novel Epitaxial Lift-off Architectures for Extended Substrate Reuse for Low-cost Manufacturing

The highest solar cell efficiencies have been achieved with III-V photovoltaics (PV). Still, the use of III-V materials in terrestrial applications has been very limited, mainly because of their high cost. The high cost is primarily due to the expensive Ge or GaAs wafers which could amount up to one-half of the total module cost! A prominent approach to reduce the impact of the high cost of substrates used for III-V PV is through re-use of the wafer substrates by Epitaxial Lift-Off (ELO). Typically, using a sacrificial layer such as AlAs, the device part of the cell is lifted off, leaving behind the substrate for re-use for fabrication of the next device. While conversion efficiency as high as 29.1% has been achieved by ELO method, chemical mechanical polishing (CMP) of the substrate is required which significantly adds to the overall solar cell cost. In this project, we have developed a novel ELO architecture for single junction gallium arsenide (GaAs) solar cells that will not require CMP of the substrate for re-use. Multiple reuses of GaAs wafers have been demonstrated with no CMP, without degradation in solar cell efficiency. Also, the solar cells have been successfully lifted off and transferred to inexpensive substrates with less than 2% change in efficiency. By elimination of the CMP process, which is the highest cost component of III-V solar cells made by conventional ELO method (~$10/W), and decreasing the substrate cost by multiple re-uses, the developed technology could be a leap forward in significantly reducing the cost of III-V photovoltaics.

14 SOLAR ENERGY↗

DOE OSTI2023

Thermal Spray toolpath development for a capped cylinder (“cake pan”) substrate

A near net shape coating is desired to be applied to the outer surface of a capped cylinder (“cake pan”) type substrate using thermal spray technology. A capped cylinder geometry is more complex than simple coupon-level substrate substrates (e.g., flat panels, cylinders) and thus requires a more complex toolpath to deposit a uniform coating. This report documents a practical theoretical approach to calculating relative torch-to-substrate speeds for coating the cylindrical, corner, and cap region of a rotating capped cylinder based on fundamental thermal spray toolpath principles. A preliminary experimental test deposited a thermal spray coating onto a mock substrate using toolpath speeds calculated by the theoretical approach proposed. The mock substrate was metallographically inspected to assess coating uniformity across the cylindrical, corner, and cap region. Inspection of the mock substrate revealed qualitatively uniform coating microstructure and thickness where theoretically predicted, demonstrating the viability of the proposed toolpath method and associated calculations. Pathways forward to optimizing coating uniformity at the cap center are proposed as near term suggested future work.

42 ENGINEERING↗

DOE OSTI2023

Residual stress of controlled atmosphere plasma spray blended metal deposits measured via in-situ substrate curvature method

The preliminary use of the in-situ curvature measurement technique for analyzing the planar stress evolution of controlled atmosphere plasma spray (CAPS) refractory metal deposits was performed with SNL-NM org. 1834’s CAPS system. A porous refractory metal exemplar of Ta-Nb was sprayed onto Ni-200, Ti-6Al-4V, and Al 7075-T6 substrates using a constant plasma torch parameter setting and deposition toolpath. Residual stresses of the deposits were found to be largely influenced by the substrate coefficient of thermal expansion and were calculated to be 49, 90, and -136 MPa for Ni 200, Ti-6Al-4V, and Al 7075-T6, respectively. The “Evolving stress” of the Ta-Nb deposits, which more accurately describes the mean intrinsic splat quenching stress of the spray material during deposition, was calculated to be 67, 92, and 129 MPa for Ni-200, Ti-6Al-4V, and Al 7075-T6, respectively. Notable difference in curvature measurement for the 1st coating pass for the Al 7075- T6 substrate was observed, with interface micrograph evidence suggesting potential softening and/or melting of the Al 7075-T6 substrate surface during deposition. Substrate temperature measurements prior to Ta-Nb deposition were used to calculate thermal energy absorbed from the hot gas plume by the different substrates and were found to correlate to the substrate’s thermal effusively. These calculated thermal energies were also found to be ~10 to 15% of the calculated energy output from the plasma torch’s nozzle exit for these experimental conditions.

36 MATERIALS SCIENCE↗

DOE OSTI2017

Single-molecule FRET unveils induced-fit mechanism for substrate selectivity in flap endonuclease 1

Human flap endonuclease 1 (FEN1) and related structure-specific 5’nucleases precisely identify and incise aberrant DNA structures during replication, repair and recombination to avoid genomic instability. Yet, it is unclear how the 5’nuclease mechanisms of DNA distortion and protein ordering robustly mediate efficient and accurate substrate recognition and catalytic selectivity. Here, single-molecule sub-millisecond and millisecond analyses of FEN1 reveal a protein-DNA induced-fit mechanism that efficiently verifies substrate and suppresses off-target cleavage. FEN1 sculpts DNA with diffusion-limited kinetics to test DNA substrate. This DNA distortion mutually ‘locks’ protein and DNA conformation and enables substrate verification with extreme precision. Strikingly, FEN1 never misses cleavage of its cognate substrate while blocking probable formation of catalytically competent interactions with noncognate substrates and fostering their pre-incision dissociation. These findings establish FEN1 has practically perfect precision and that separate control of induced-fit substrate recognition sets up the catalytic selectivity of the nuclease active site for genome stability.

59 BASIC BIOLOGICAL SCIENCES↗

NASA NTRS1984

Method and apparatus for coating substrates using a laser

Metal substrates, preferably of titanium and titanium alloys, are coated by alloying or forming TiN on a substrate surface. A laser beam strikes the surface of a moving substrate in the presence of purified nitrogen gas. A small area of the substrate surface is quickly heated without melting. This heated area reacts with the nitrogen to form a solid solution. The alloying or formation of TiN occurs by diffusion of nitrogen into the titanium. Only the surface layer of the substrate is heated because of the high power density of the laser beam and short exposure time. The bulk of the substrate is not affected, and melting of the substrate is avoided because it would be detrimental.

Zaplatynsky, I.↗

NASA NTRS1987

Mechanical strength and tribological behavior of ion-beam deposited boron nitride films on non-metallic substrates

An investigation was conducted to examine the mechanical strength and tribological properties of boron nitride (BN) films ion-beam deposited on silicon (Si), fused silica (SiO2), gallium arsenide (GaAs), and indium phosphide (InP) substrates in sliding contact with a diamond pin under a load. The results of the investigation indicate that BN films on nonmetallic substrates, like metal films on metallic substrates, deform elastically and plastically in the interfacial region when in contact with a diamond pin. However, unlike metal films and substrates, BN films on nonmetallic substrates can fracture when they are critically loaded. Not only does the yield pressure (hardness) of Si and SiO2 substrates increase by a factor of 2 in the presence of a BN film, but the critical load needed to fracture increases as well. The presence of films on the brittle substrates can arrest crack formation. The BN film reduces adhesion and friction in the sliding contact. BN adheres to Si and SiO2 and forms a good quality film, while it adheres poorly to GaAs and InP. The interfacial adhesive strengths were 1 GPa for a BN film on Si and appreciably higher than 1 GPa for a BN film on SiO2.

Miyoshi, Kazuhisa↗

NASA NTRS1987

Mechanical strength and tribological behavior of ion-beam-deposited boron nitride films on non-metallic substrates

Miyoshi, Kazuhisa↗