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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 307 records · Page 17
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Real‐Time Optical Process Monitoring for Structure and Property Control of Aerosol Jet Printed Functional Materials

Abstract Aerosol jet printing is a popular digital additive manufacturing method for flexible and hybrid electronics, but it lacks sophisticated real‐time process control schemes that would enable more widespread adoption in manufacturing environments. Here, an optical measurement system is introduced to track the aerosol density upstream of the printhead. The measured optical extinction, combined with the aerosol flow rate, is directly related to deposition rate and accurately predicts functional materials properties such as the electrical resistance of printed graphene films. This real‐time system offers a compelling solution for process drift and batch‐to‐batch variability, rendering it a valuable tool for both real‐time control of aerosol jet printing and fundamental studies of the underlying process science.

Tafoya, Rebecca R.↗
DOE OSTI2023

Effect of printing parameters on 3D-printed carbon fiber-reinforced polymer composites under magnetic field control

Magnetic field controlled (MFC) 3D printing is a promising method for realizing the intelligent control of the structural performance of carbon fiber-reinforced plastic (CFRP) composites by adjusting the fiber orientation during the printing process. However, few studies have focused on the influence of the printing parameters on the magnetic control of the fiber direction. Therefore, in this study, the mechanical properties and internal fiber distributions of MFC 3D-printed samples of CFRP composites with 10 wt% fiber content, which were printed at different speeds and layer thicknesses, were investigated. Subsequently, the effects of the fiber content on the mechanical properties and fiber distribution of the MFC 3D-printed samples were studied. Furthermore, the origin of fiber fracture was evaluated through observation and analysis of the fracture section using scanning electron microscopy. The fiber orientation could be well adjusted under the action of a magnetic field and adjustment of printing parameters, thereby improving the tensile strength, young's modulus significantly with slightly decrease of fracture elongation. The recommended parameter combinations (printing speed and layer thickness) were 40 mm/s and 0.2 mm for 10 wt% fiber content CFRP composites.

36 MATERIALS SCIENCE↗
DOE OSTI2023

An Aerosol Jet Printed Resistance Temperature Detector‐Micro Hotplate with Temperature Coefficient of Resistance Stabilized by Electrical Sintering

Abstract Aerosol jet printing (AJP) is an emerging direct write tool enabling rapid prototyping and fabrication of electronics components. AJP provides faster and less expensive production of devices with feature sizes of >10 microns compared to traditional MEMS processes. Herein, the fabrication of a resistance temperature detector‐micro hotplate (RTD‐µHP) is reported using AJP printed silver. AJP eliminates sophisticated MEMS processes such as masking, alignment, and etching. The compatibility of the AJP process with a broad range of materials is demonstrated by printing highly resolved lines on rigid and flexible substrates. Optimal thermal sintering conditions of AJP printed silver (Ag) lines are found by in situ resistance measurements. To stabilize the temperature coefficient of resistance (TCR) of the RTD‐µHP at high operating current levels, electrical sintering is performed on the RTD‐µHPs. Electrical sintering improves the conductivity of fully thermally sintered Ag RTD‐µHPs by 32% and provides a burn‐in mechanism for stabilizing the TCR. The TCR of the RTD‐µHPs after electrical sintering is 3.80 × 10 −3 at 22 °C, close to the value for bulk Ag. The performance of the RTD‐µHPs is tested using a reference thermocouple. The RTD‐µHPs show reliable and repeatable heating and temperature sensing up to 70 °C in air.

Sui, Yongkun↗
DOE OSTI2026

Screen-Printed SHJ Solar Cells with Complex Silver Inks

Metallization using complex metal inks has gained significant research interest due to its cost-effectiveness and ability to achieve performance comparable to traditional nanoparticle pastes. This study introduces the use of complex silver (Ag) inks applied via industrial screen-printing for silicon heterojunction (SHJ) solar cell metallization. The printed Ag lines exhibit a contact resistivity on SHJ tin-doped indium oxide (ITO) surfaces as low as approximately 0.2-12 mO cm2. Photoluminescence imaging reveals minimal surface passivation degradation (iVoc < 3.5 mV), while scanning electron microscopy (SEM) shows a denser structure compared to Ag layer from nanoparticle pastes. The printed Ag grid features thin (approximately 1 micrometer), continuous fingers approximately 100-120 micrometer wide, significantly thinner than conventional approximately 20-30 micrometer fingers produced with nanoparticle-based pastes. Double printing achieves SHJ device efficiencies exceeding 20%, the highest reported for industrial solar cell precursors using this technology. These findings highlight the potential of complex Ag inks as a sustainable alternative to particle-based pastes, reducing Ag consumption and processing temperatures without compromising efficiency.

14 SOLAR ENERGY↗
NASA NTRS2009

Microwave Temperature Profiler Mounted in a Standard Airborne Research Canister

Many atmospheric research aircraft use a standard canister design to mount instruments, as this significantly facilitates their electrical and mechanical integration and thereby reduces cost. Based on more than 30 years of airborne science experience with the Microwave Temperature Profiler (MTP), the MTP has been repackaged with state-of-the-art electronics and other design improvements to fly in one of these standard canisters. All of the controlling electronics are integrated on a single 4 ~5-in. (.10 ~13- cm) multi-layer PCB (printed circuit board) with surface-mount hardware. Improved circuit design, including a self-calibrating RTD (resistive temperature detector) multiplexer, was implemented in order to reduce the size and mass of the electronics while providing increased capability. A new microcontroller-based temperature controller board was designed, providing better control with fewer components. Five such boards are used to provide local control of the temperature in various areas of the instrument, improving radiometric performance. The new stepper motor has an embedded controller eliminating the need for a separate controller board. The reference target is heated to avoid possible emissivity (and hence calibration) changes due to moisture contamination in humid environments, as well as avoiding issues with ambient targets during ascent and descent. The radiometer is a double-sideband heterodyne receiver tuned sequentially to individual oxygen emission lines near 60 GHz, with the line selection and intermediate frequency bandwidths chosen to accommodate the altitude range of the aircraft and mission.

Mahoney, Michael J.↗
NASA NTRSDate not supplied

Linear Array Photodiode and Data Acquisition System Development for Multi-Point Line FLDI Measurements

The continuous development and advancement of multi-point line focused laser differential interferometry (FLDI) instruments requires larger numbers of acquisition channels to make more finely spatially resolved measurements of high-frequency flow fluctuations. No current off-the-shelf system exists for these line FLDI measurements, and so a single unified system consisting of a linear array photodiode, required electronics, and a data acquisition system has been developed to enhance the measurement resolution, both spatially and temporally. A printed circuit board was developed on which the linear array photodiode is mounted for inclusion into an existing FLDI system, and amplifier breakout boards incorporate electronics to condition the signal for the data acquisition system while retaining the necessary high frequency response. The data acquisition system uses a National Instruments chassis and multiple oscilloscope modules, with a specially-designed LabVIEW user interface for laboratory and wind tunnel setup, calibration, and testing. Details regarding the development of the linear array photodiode system and the data acquisition system are provided, and systematic testing of all components is presented, culminating in a test of the system integrated into an existing line FLDI system for measurements of a turbulent jet.

Joshua M Weisberger↗
DOE OSTI2020

Nanofabrication of synthetic nanoporous geomaterials: from nanoscale-resolution 3D imaging to nano-3D-printed digital (shale) rock

Abstract Advances in imaging have made it possible to view nanometer and sub-nanometer structures that are either synthesized or that occur naturally. It is believed that fluid dynamic and thermodynamic behavior differ significantly at these scales from the bulk. From a materials perspective, it is important to be able to create complex structures at the nanometer scale, reproducibly, so that the fluid behavior may be studied. New advances in nanoscale-resolution 3D-printing offer opportunities to achieve this goal. In particular, additive manufacturing with two-photon polymerization allows creation of intricate structures. Using this technology, a creation of the first nano-3D-printed digital (shale) rock is reported. In this paper, focused ion beam-scanning electron microscopy (FIB-SEM) nano-tomography image dataset was used to reconstruct a high-resolution digital rock 3D model of a Marcellus Shale rock sample. Porosity of this 3D model has been characterized and its connected/effective pore system has been extracted and nano-3D-printed. The workflow of creating this novel nano-3D-printed digital rock 3D model is described in this paper.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2025

Laser Powder Bed Fusion Manufactured Alloys 625 and 282 and Properties Relevant to Advanced Nuclear Components

Under the Advanced Materials and Manufacturing Technologies program, two Ni-based alloys fabricated by laser powder bed fusion (LPBF) have been evaluated: γ′-strengthened Haynes 282 and solution-strengthened Inconel 625. Large printing defects were observed in the LPBF 282 alloy fabricated using a Renishaw AM250 machine, likely due to particle spattering during printing. Annealing at 1,180°C for 1 h followed by 4 h at 800°C in a high density of 50 nm γ′-strengthening precipitates as well as partial recrystallization resulted in a bimodal grain distribution. Creep testing performed at 750°C revealed lower creep life and ductility for the LPBF 282 compared with wrought 282. X-ray computed tomography combined with optical and scanning electron microscopy microstructural characterization revealed crack formation during creep testing, initiated either from printing defects or from creep cavitation at grain boundaries. Printing defects were the likely reason for the lower creep performance of LPBF 282 and could be suppressed by optimizing the build configuration. Printing 625 on an EOS M290 machine using the recommended EOS parameters resulted in a very low defect density. Superior creep strength at 725°C was observed for the as-printed LPBF 625 along the build direction when compared with wrought 625. No defect larger than ~50 µm could be detected by X-ray computed tomography in the as-printed conditions and after creep testing for 1,000 h at 725°C and 150 MPa. Small, needle-like δ-phase precipitates were observed after creep testing for 100 h at 725°C and 200 MPa. The rapid formation of the γ phase is directly related to the initial Nb and Mo segregation in the LPBF 625 cell walls, and its effect on the alloy’s high-temperature performance will be evaluated. Solution annealing was carried out at 1,150°C for 1 h and led to full recrystallization of the alloy. A decrease in strength and increase in ductility were observed after solution annealing, and the alloy recrystallization resulted in isotropic tensile properties at room temperature, contrary to what was observed for the as-printed LPBF 625.

22 GENERAL STUDIES OF NUCLEAR REACTORS↗
DOE OSTI2021

Implementation of Disruptive Designs for Gas Turbine Components Utilizing Additive Manufacturing

Electron beam melting (EBM) is an additive manufacturing process used to print metallic components with complex geometries for aerospace applications. A preheating characteristic enables this technology to avoid large accumulation of residual stress during printing. However, cracking mechanisms particularly in Ni-based superalloys are associated with not only residual stress but also with microstructure (i.e., solidification morphology, transient evolution of γ'). Siemens is committed to AM technology for gas turbine applications. The ability to novel predictive designs of turbine blades would reduce process development time and allow acquisition of key microstructure and performance data early in a design campaign. Siemens initiated a project to establish the design rules for the fabrication of non-printable Nibased superalloys. This phase 1 program demonstrates the feasibility for virtual fabrication of the actual blade geometries through EBM process.

42 ENGINEERING↗
NASA NTRS1966

Tool forms right angles in component leads

Hand tool forms right angles in electronic component leads so they fit the spaced holes of a printed circuit board. This tool firmly holds the leads at points near the component ends to prevent damage and provide accuracy.

Glenn, C. G.↗
DOE OSTI2020

A Review of Inkjet Printed Graphene and Carbon Nanotubes Based Gas Sensors

Graphene and carbon nanotube (CNT)-based gas/vapor sensors have gained much traction for numerous applications over the last decade due to their excellent sensing performance at ambient conditions. Inkjet printing various forms of graphene (reduced graphene oxide or modified graphene) and CNT (single-wall nanotubes (SWNTs) or multiwall nanotubes (MWNTs)) nanomaterials allows fabrication onto flexible substrates which enable gas sensing applications in flexible electronics. This review focuses on their recent developments and provides an overview of the state-of-the-art in inkjet printing of graphene and CNT based sensors targeting gases, such as NO 2 , Cl 2 , CO 2 , NH 3 , and organic vapors. Moreover, this review presents the current enhancements and challenges of printing CNT and graphene-based gas/vapor sensors, the role of defects, and advanced printing techniques using these nanomaterials, while highlighting challenges in reliability and reproducibility. The future potential and outlook of this rapidly growing research are analyzed as well.

flexible electronics↗
DOE OSTI2020

4D Printing of Stretchable Supercapacitors via Hybrid Composite Materials

Stretchable supercapacitors (SCs) have attracted significant attention in developing power-independent stretchable electronic systems due to their intrinsic energy storage function and unique mechanical properties. Most current SCs are generally limited by their low stretchability, complicated fabrication process, and insufficient performance and robustness. This study presents a facile method to fabricate arbitrary-shaped stretchable electrodes via 4D printing of conductive composite from reduced graphene oxide, carbon nanotube, and poly(3,4-ethylenedioxythiophene) polystyrene sulfonate. The electrode patterns of an arbitrary shape can be deposited onto prestretched substrates by aerosol-jet printing, then self-organized origami (ridge) patterns are generated after releasing the substrates from holding stretchers due to the mismatched strains. The stretchable electrodes demonstrate superior mechanical robustness and stretchability without sacrificing its outstanding electrochemical performance. The symmetric SC prototype possesses a gravimetric capacitance of ≈21.7 F g -1 at a current density of 0.5 A g -1 and a capacitance retention of ≈85.8% from 0.5 to 5 A g -1 . A SC array with arbitrary-shaped electrodes is also fabricated and connected in series to power light-emitting diode patterns for large-scale applications. Finally, the proposed method paves avenues for scalable manufacturing of future energy-storage devices with controlled extensibility and high electrochemical performance.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Tuning the Selectivity of Carboxylic Acid–Based Eutectic Solvents for the Dissolution and Electrochemical Separation of Metal Oxides

Extracting metals from natural resources and recovering from waste materials with less-hazardous solvents is essential for sustainable technological advancements. The commonly employed method utilizes harsh chemicals for metal dissolution and the ensuing separation. Here, in this study, we examined the potential of eutectic solvents (types III and IV) as alternative media for the selective dissolution of metals and metal oxides and their subsequent electrochemical separation. Notably, type III eutectics composed of betaine:acetic acid and triazole:lactic acid exhibited excellent solubility for cobalt oxide (24.1 g·L –1 ) and copper oxide (30.5 g·L –1 ), respectively. In comparison, the type IV eutectic mixture of Ca(NO 3 ) 2 ·4H 2 O:acetic acid demonstrated the highest conductivity and lowest viscosity with solubility for both copper oxide (6.1 g·L –1 ) and metallic copper (5.4 g·L –1 from a used electronic circuit). Using a Ca(NO 3 ) 2 ·4H 2 O:acetic acid mixture, copper was selectively dissolved from a waste printed circuit board and subsequently electrodeposited onto a nickel electrode. These findings highlight the tunability of DESs for the selective recovery of metals from electronic waste, offering a promising approach for sustainable metal recycling and resource recovery.

electrodeposition↗
NASA NTRS2013

Lumped Parameter Modeling for Rapid Vibration Response Prototyping and Test Correlation for Electronic Units

Present preliminary work using lumped parameter models to approximate dynamic response of electronic units to random vibration; Derive a general N-DOF model for application to electronic units; Illustrate parametric influence of model parameters; Implication of coupled dynamics for unit/board design; Demonstrate use of model to infer printed wiring board (PWB) dynamics from external chassis test measurement.

random vibration↗
NASA NTRS2013

Packaging Technologies for High Temperature Electronics and Sensors

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Electronic packaging↗
NASA NTRS1988

Synthesis and characterization of high-T(sub c) screen-printed Y-Ba-Cu-O films on alumina

Thick films of YBa2Cu3O(sub 7-x) have been deposited on highly polished alumina substrates by the screen printing technique. To optimize the post-printing heat treatment, the films were baked at various temperatures for different lengths of time and oxygen-annealed at a lower temperature. The resulting films were characterized by electrical resistivity measurements, x-ray diffraction, and optical and scanning electron microscopy. Properties of the films were found to be highly sensitive to the post-printing thermal treatment. Films baked for 15 min at 1000 C in oxygen were hard, adherent, near single phase, and superconducting with T(sub c)(onset) approx 96 K, T(sub c)(zero) approx 66 K and Delta T sub c (10 to 90 percent) approx 10 K.

Bansal, Narottam P.↗
NASA NTRS1988

Synthesis and characterization of high-T(c) screen-printed Y-Ba-Cu-O films on alumina

Thick films of YBa2Cu3O(sub 7-x) have been deposited on highly polished alumina substrates by the screen printing technique. To optimize the post-printing heat treatment, the films were baked at various temperatures for different lengths of time and oxygen-annealed at a lower temperature. The resulting films were characterized by electrical resistivity measurements, X-ray diffraction, and optical and scanning electron microscopy. Properties of the films were found to be highly sensitive to the post-printing thermal treatment. Films baked for 15 min at 1000 C in oxygen were hard, adherent, near single phase, and superconducting with T(sub c) (onset) approx 96 KK, T(sub c) (zero) approx 66 K and Delta T sub c (10 to 90 percent) approx 10 K.

Bansal, Narottam P.↗
DOE OSTI2024

Optimized Incorporation of Furan into Diketopyrrolopyrrole-Based Conjugated Polymers for Organic Field-Effect Transistors

Flexible electronics have received considerable attention in the past decades due to their promising application in rollable display screens, wearable devices, implantable devices, and other electronic applications. Here, in particular, conjugated polymers are favored for flexible electronics due to their mechanical flexibility and potential for solution-processed fabrication techniques, such as blade-coating, roll-to-roll printing, and high-throughput printing allowing for high-performance transistor devices. Thiophene is the prevailing conjugated unit to construct these conjugated polymers due to its favorable electronic properties. On the other hand, furans are among the few conjugated moieties that are easily derived from bio renewable resources. To promote sustainability, we selectively introduced furan into the conjugated backbone of a high-mobility polymer scaffold and systematically studied the effect on the microstructure and charge transport. We show that partially and selectively replacing thiophene units with furan can yield nearly comparable performance compared to the all-thiophene polymer. This strategy offers an improvement in the sustainability of the polymer by incorporating bio-sourced furan without sacrificing the high-performance characteristics. Meanwhile, polymers with incorrect or complete furan incorporation show reduced mobilities. This work serves to develop coherent structure–morphology–performance relationships; such knowledge will establish guidelines for the future development of sustainable, furan-based conjugated materials.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗