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At least 307 records · Page 17
All sourcesNASA NTRSDOE OSTI
NASA NTRS2010

Digital Microfluidics Sample Analyzer

Three innovations address the needs of the medical world with regard to microfluidic manipulation and testing of physiological samples in ways that can benefit point-of-care needs for patients such as premature infants, for which drawing of blood for continuous tests can be life-threatening in their own right, and for expedited results. A chip with sample injection elements, reservoirs (and waste), droplet formation structures, fluidic pathways, mixing areas, and optical detection sites, was fabricated to test the various components of the microfluidic platform, both individually and in integrated fashion. The droplet control system permits a user to control droplet microactuator system functions, such as droplet operations and detector operations. Also, the programming system allows a user to develop software routines for controlling droplet microactuator system functions, such as droplet operations and detector operations. A chip is incorporated into the system with a controller, a detector, input and output devices, and software. A novel filler fluid formulation is used for the transport of droplets with high protein concentrations. Novel assemblies for detection of photons from an on-chip droplet are present, as well as novel systems for conducting various assays, such as immunoassays and PCR (polymerase chain reaction). The lab-on-a-chip (a.k.a., lab-on-a-printed-circuit board) processes physiological samples and comprises a system for automated, multi-analyte measurements using sub-microliter samples of human serum. The invention also relates to a diagnostic chip and system including the chip that performs many of the routine operations of a central labbased chemistry analyzer, integrating, for example, colorimetric assays (e.g., for proteins), chemiluminescence/fluorescence assays (e.g., for enzymes, electrolytes, and gases), and/or conductometric assays (e.g., for hematocrit on plasma and whole blood) on a single chip platform.

Pollack, Michael G.↗
NASA NTRS2011

Fault Detection, Isolation and Recovery (FDIR) Portable Liquid Oxygen Hardware Demonstrator

The Fault Detection, Isolation and Recovery (FDIR) hardware demonstration will highlight the effort being conducted by Constellation's Ground Operations (GO) to provide the Launch Control System (LCS) with system-level health management during vehicle processing and countdown activities. A proof-of-concept demonstration of the FDIR prototype established the capability of the software to provide real-time fault detection and isolation using generated Liquid Hydrogen data. The FDIR portable testbed unit (presented here) aims to enhance FDIR by providing a dynamic simulation of Constellation subsystems that feed the FDIR software live data based on Liquid Oxygen system properties. The LO2 cryogenic ground system has key properties that are analogous to the properties of an electronic circuit. The LO2 system is modeled using electrical components and an equivalent circuit is designed on a printed circuit board to simulate the live data. The portable testbed is also be equipped with data acquisition and communication hardware to relay the measurements to the FDIR application running on a PC. This portable testbed is an ideal capability to perform FDIR software testing, troubleshooting, training among others.

Oostdyk, Rebecca L.↗
NASA NTRS2010

Disruptive Technologies in Workmanship: pH-neutral Flux, CDM ESD Events, HDI PCBs

This slide presentation describes what it calls "disruptive technologies", i.e., "Low-end disruption" occurs when the rate at which products improve exceeds the rate at which customers can adopt the new performance. Therefore, at some point the performance of the product overshoots the needs of certain customer segments. At this point, a disruptive technology may enter the market and provide a product which has lower performance than the incumbent but which exceeds the requirements of certain segments, thereby gaining a foothold in the market. This concept is viewed in impacting incumbent technologies Rosin Flux, with a pH-neutral water soluble Flux; electrostatic discharge models being disrupted by the charge device model (CDM) concept; and High Density Interconnect Printed Circuit Boards (HDI PCB).

Plante, Jeannette F.↗
NASA NTRS2011

Commercialization of LARC (TradeMark) -SI Polyimide Technology

LARC(TradeMark)-SI, Langley Research Center- Soluble Imide, was developed in 1992, with the first patent issuing in 1997, and then subsequent patents issued in 1998 and 2000. Currently, this polymer has been successfully licensed by NASA, and has generated revenues, at the time of this reporting, in excess of $1.4 million. The success of this particular polymer has been due to many factors and many lessons learned to the point that the invention, while important, is the least significant part in the commercialization of this material. Commercial LARC(TradeMark)-SI is a polyimide composed of two molar equivalents of dianhydrides: 4,4 -oxydiphthalic anhydride (ODPA), and 3,3 ,4,4 -biphenyltetracarboxylic dianhydride (BPDA) and 3,4 -oxydianiline (3,4 -ODA) as the diamine. The unique feature of this aromatic polyimide is that it remains soluble after solution imidization in high-boiling, polar aprotic solvents, even at solids contents of 50-percent by weight. However, once isolated and heated above its T(sub g) of 240 C, it becomes insoluble and exhibits high-temperature thermoplastic melt-flow behavior. With these unique structure property characteristics, it was thought this would be an advantage to have an aromatic polyimide that is both solution and melt processable in the imide form. This could potentially lead to lower cost production as it was not as equipment- or labor-intensive as other high-performance polyimide materials that either precipitate or are intractable. This unique combination of properties allowed patents with broad claim coverage and potential commercialization. After the U.S. Patent applications were filed, a Small Business Innovation Research (SBIR) contract was awarded to Imtec, Inc. to develop and supply the polyimide to NASA and the general public. Some examples of demonstration parts made with LARC(TradeMark)-SI ranged from aircraft wire and multilayer printed-circuit boards, to gears, composite panels, supported adhesive tape, composite coatings, cookware, and polyimide foam. Even with its unique processing characteristics, the thermal and mechanical properties were not drastically different from other solution or meltprocessable polyimides developed by NASA. LARC(TradeMark)-SI risked becoming another interesting, but costly, high-performance material.

Bryant, Robert G.↗
NASA NTRS2005

Front-Side Microstrip Line Feeding a Raised Antenna Patch

An improved design concept for a printed-circuit patch antenna and the transmission line that feeds the patch calls for (1) a microstrip transmission line on the front (radiative) side of a printed-circuit board based on a thin, high-permittivity dielectric substrate; (2) using the conductor covering the back side of the circuit board as a common ground plane for both the microstrip line and the antenna patch; (3) supporting the antenna patch in front of the circuit board on a much thicker, lower-permittivity dielectric spacer layer; and (4) connecting the microstrip transmission line to the patch by use of a thin wire or narrow ribbon that extends through the thickness of the spacer and is oriented perpendicularly to the circuit-board plane. The thickness of the substrate is typically chosen so that a microstrip transmission line of practical width has an impedance between 50 and 100 ohms. The advantages of this design concept are best understood in the context of the disadvantages of prior design concepts, as explained

Hodges, Richard↗
NASA NTRS2011

Development of Sample Verification System for Sample Return Missions

This paper describes the development of a proof of-concept sample verification system (SVS) for in-situ mass measurement of planetary rock and soil sample in future robotic sample return missions. Our proof-of-concept SVS device contains a 10 cm diameter pressure sensitive elastic membrane placed at the bottom of a sample canister. The membrane deforms under the weight of accumulating planetary sample. The membrane is positioned in proximity to an opposing substrate with a narrow gap. The deformation of the membrane makes the gap to be narrower, resulting in increased capacitance between the two nearly parallel plates. Capacitance readout circuitry on a nearby printed circuit board (PCB) transmits data via a low-voltage differential signaling (LVDS) interface. The fabricated SVS proof-of-concept device has successfully demonstrated approximately 1pF/gram capacitance change

Electrodes↗
NASA NTRS2004

Stroboscope Controller for Imaging Helicopter Rotors

A versatile electronic timing-and-control unit, denoted a rotorcraft strobe controller, has been developed for use in controlling stroboscopes, lasers, video cameras, and other instruments for capturing still images of rotating machine parts especially helicopter rotors. This unit is designed to be compatible with a variety of sources of input shaftangle or timing signals and to be capable of generating a variety of output signals suitable for triggering instruments characterized by different input-signal specifications. It is also designed to be flexible and reconfigurable in that it can be modified and updated through changes in its control software, without need to change its hardware. Figure 1 is a block diagram of the rotorcraft strobe controller. The control processor is a high-density complementary metal oxide semiconductor, singlechip 8-bit microcontroller. It is connected to a 32K x 8 nonvolatile static random-access memory (RAM) module. Also connected to the control processor is a 32K 8 electrically programmable read-only-memory (EPROM) module, which is used to store the control software. Digital logic support circuitry is implemented in a field-programmable gate array (FPGA). A 240 x 128-dot, 40- character 16-line liquid-crystal display (LCD) module serves as a graphical user interface; the user provides input through a 16-key keypad mounted next to the LCD. A 12-bit digital-to-analog converter (DAC) generates a 0-to-10-V ramp output signal used as part of a rotor-blade monitoring system, while the control processor generates all the appropriate strobing signals. Optocouplers are used to isolate all input and output digital signals, and optoisolators are used to isolate all analog signals. The unit is designed to fit inside a 19-in. (.48-cm) rack-mount enclosure. Electronic components are mounted on a custom printed-circuit board (see Figure 2). Two power-conversion modules on the printedcircuit board convert AC power to +5 VDC and 15 VDC, respectively.

Jensen, Scott↗
NASA NTRS2004

Electrically Small Microstrip Quarter-Wave Monopole Antennas

Microstrip-patch-style antennas that generate monopole radiation patterns similar to those of quarter-wave whip antennas can be designed to have dimensions smaller than those needed heretofore for this purpose, by taking advantage of a feed configuration different from the conventional one. The large sizes necessitated by the conventional feed configuration have, until now, made such antennas impractical for frequencies below about 800 MHz: for example, at 200 MHz, the conventional feed configuration necessitates a patch diameter of about 8 ft (.2.4 m) . too large, for example, for mounting on the roof of an automobile or on a small or medium-size aircraft. By making it possible to reduce diameters to between a tenth and a third of that necessitated by the conventional feed configuration, the modified configuration makes it possible to install such antennas in places where they could not previously be installed and thereby helps to realize the potential advantages (concealment and/or reduction of aerodynamic drag) of microstrip versus whip antennas. In both the conventional approach and the innovative approach, a microstrip-patch (or microstrip-patch-style) antenna for generating a monopole radiation pattern includes an electrically conductive patch or plate separated from an electrically conductive ground plane by a layer of electrically insulating material. In the conventional approach, the electrically insulating layer is typically a printed-circuit board about 1/16 in. (.1.6 mm) thick. Ordinarily, a coaxial cable from a transmitter, receiver, or transceiver is attached at the center on the ground-plane side, the shield of the cable being electrically connected to the ground plane. In the conventional approach, the coaxial cable is mated with a connector mounted on the ground plane. The center pin of this connector connects to the center of the coaxial cable and passes through a hole in the ground plane and a small hole in the insulating layer and then connects with the patch above one-third of the radial distance from the center. The modified feed configuration of the innovative approach is an inductive-short-circuit configuration that provides impedance matching and that has been used for many years on other antennas but not on microstrip-style monopole antennas. In this configuration, the pin is connected to both the conductive patch and the ground plane. As before, the shield of the coaxial cable is connected to the ground plane, but now the central conductor is connected to a point on the pin between the ground plane and the conductive plate (see figure). The location of the connection point on the pin is chosen so that together, the inductive short circuit and the conductive plate or patch act as components of a lumped-element resonant circuit that radiates efficiently at the resonance frequency and, at the resonance frequency, has an impedance that matches that of the coaxial cable. It should be noted that the innovative design entails two significant disadvantages. One disadvantage is that the frequency bandwidth for efficient operation is only about 1/20 to 1/15 that of a whip antenna designed for the same nominal frequency. The other disadvantage is that the estimated gain is between 3-1/2 and 4-1/2 dB below that of the whip antenna. However, if an affected radio-communication system used only a few adjacent frequency channels and the design of the components of the system other than the antenna provided adequate power or gain margin, then these disadvantages could be overcome.

Young, W. Robert↗
NASA NTRS2003

Signal-Conditioning Amplifier Recorders

Signal-conditioning amplifier recorders (SCAmpRs) have been proposed as a means of simplifying and upgrading the Kennedy Space Center (KSC) Ground Measurement System (GMS), which is a versatile data-acquisition system that gathers and records a variety of measurement data before and during the launch of a space shuttle. In the present version of the GMS system, signal conditioning amplifiers digitize and transmit data to a VME chassis that multiplexes up to 416 channels. The data is transmitted via a high-speed data bus to a second VME chassis where it is available for snapshots. The data is passed from the second VME chassis to a high-speed data recorder. This process is duplicated for installations at two launch pads and the Vehicle Assembly Building (VAB). Since any failure of equipment in the data path results in loss of data, much of the system is redundant. The architecture of the existing GMS limits expansion or any modification to the system to meet changing requirements because of the cost and time required. A SCAmpR-based system is much more flexible. The basis of the simplification, flexibility, and reliability is the shifting of the recording function to the individual amplifier channels. Each SCAmpR is a self-contained single channel data acquisition system, which in its current implementation, has a data storage capacity of up to 30 minutes when operating at the fastest data sampling rates. The SCAmpR channels are self-configuring and self-calibrating. Multiple SCAmpR channels are ganged on printed circuit boards and mounted in a chassis that provides power, a network hub, and Inter-Range Instrument Group (IRIG) time signals. The SCAmpR channels share nothing except physical mounting on a circuit board. All circuitry is electrically separate for each channel. All that is necessary to complete the data acquisition system is a single master computer tied to the SCAmpR channels by standard network equipment. The size of the data acquisition system dictates the requirements for the specific network equipment.

Medelius, Pedro J.↗
NASA NTRS2011

MOSFET Switching Circuit Protects Shape Memory Alloy Actuators

A small-footprint, full surface-mount-component printed circuit board employs MOSFET (metal-oxide-semiconductor field-effect transistor) power switches to switch high currents from any input power supply from 3 to 30 V. High-force shape memory alloy (SMA) actuators generally require high current (up to 9 A at 28 V) to actuate. SMA wires (the driving element of the actuators) can be quickly overheated if power is not removed at the end of stroke, which can damage the wires. The new analog driver prevents overheating of the SMA wires in an actuator by momentarily removing power when the end limit switch is closed, thereby allowing complex control schemes to be adopted without concern for overheating. Either an integral pushbutton or microprocessor-controlled gate or control line inputs switch current to the actuator until the end switch line goes from logic high to logic low state. Power is then momentarily removed (switched off by the MOSFET). The analog driver is suited to use with nearly any SMA actuator.

Gummin, Mark A.↗
NASA NTRS2011

PCB-Based Break-Out Box

Break-out boxes (BOBs) are necessary for all electrical integration/cable checkouts and troubleshooting. Because the price of a BOB is high, and no work can be done without one, often the procedure stops, simply waiting for a BOB. A less expensive BOB would take less time in the integration, testing, and troubleshooting process. The PCB-based BOB works and looks the same as a standard JPL BOB, called Gold Boxes. The only differences between the old BOB and the new PCB-based BOB is that the new one has 80 percent of its circuitry in a printed circuit board. This process reduces the time for fabrication, thus making the BOBs less expensive. Moreover, because of its unique design, the new BOBs can be easily assembled and fixed. About 80 percent of the new PCB-based BOB is in a $22 (at the time of this reporting) custom-designed, yet commercially available PCB. This device has been used successfully to verify that BOB cables were properly made. Also, upon completion, the BOB was beeped out via a multimeter to ensure that all sockets on the connectors were properly connected to the respective banana jack. When compared to the Gold Box BOBs, the new BOB has many advantages. It is much more cost efficient, it delivers equal usability at substantially lower cost of the BOB, and the Gold Box is much heavier when compared to the new BOB. The new BOB is also a bit longer and much more versatile in that connectors are easily changeable and if a banana jack is broken, it can be replaced instead of throwing away an entire BOB.

Lee, Jason H.↗
NASA NTRS2012

Focal Plane Alignment Utilizing Optical CMM

In many applications, an optical detector has to be located relative to mechanical reference points. One solution is to specify stringent requirements on (1) mounting the optical detector relative to the chip carrier, (2) soldering the chip carrier onto the printed circuit board (PCB), and (3) installing the PCB to the mechanical structure of the subsystem. Figure 1 shows a sketch of an optical detector mounted relative to mechanical reference with high positional accuracy. The optical detector is typically a fragile wafer that cannot be physically touched by any measurement tool. An optical coordinate measuring machine (CMM) can be used to position optical detectors relative to mechanical reference points. This approach will eliminate all requirements on positional tolerances. The only requirement is that the PCB is manufactured with oversized holes. An exaggerated sketch of this situation is shown in Figure 2. The sketch shows very loose tolerances on mounting the optical detector in the chip carrier, loose tolerance on soldering the chip carrier to the PCB, and finally large tolerance on where the mounting screws are located. The PCB is held with large screws and oversized holes. The PCB is mounted loosely so it can move freely around. The optical CMM measures the mechanical reference points. Based on these measurements, the required positions of the optical detector corners can be calculated. The optical CMM is commanded to go to the position where one detector corner is supposed to be. This is indicated with the cross-hairs in Figure 2(a). This figure is representative of the image of the optical CMM monitor. Using a suitable tapping tool, the PCB is manually tapped around until the corner of the optical detector is at the crosshairs of the optical CMM. The CMM is commanded to another corner, and the process is repeated a number of times until all corners of the optical detector are within a distance of 10 to 30 microns of the required position. The situation is sketched in Figure 2(b) (the figure also shows the tapping tool and where to tap). At this point the fasteners for the PCB are torqued slightly so the PCB can still move. The PCB location is adjusted again with the tapping tool. This process is repeated 3 to 4 times until the final torque is achieved. The oversized mounting holes are then filled with a liquid bonding agent to secure the board in position (not shown in the sketch). A 10- to 30-micron mounting accuracy has been achieved utilizing this method..

Liebe, Carl Christian↗
NASA NTRS2013

Packaging Technologies for 500C SiC Electronics and Sensors

Various SiC electronics and sensors are currently under development for applications in 500C high temperature environments such as hot sections of aerospace engines and the surface of Venus. In order to conduct long-term test and eventually commercialize these SiC devices, compatible packaging technologies for the SiC electronics and sensors are required. This presentation reviews packaging technologies developed for 500C SiC electronics and sensors to address both component and subsystem level packaging needs for high temperature environments. The packaging system for high temperature SiC electronics includes ceramic chip-level packages, ceramic printed circuit boards (PCBs), and edge-connectors. High temperature durable die-attach and precious metal wire-bonding are used in the chip-level packaging process. A high temperature sensor package is specifically designed to address high temperature micro-fabricated capacitive pressure sensors for high differential pressure environments. This presentation describes development of these electronics and sensor packaging technologies, including some testing results of SiC electronics and capacitive pressure sensors using these packaging technologies.

Chen, Liang-Yu↗
NASA NTRS2013

Compact Radar Transceiver with Included Calibration

The Digital Beamforming Synthetic Aperture Radar (DBSAR) is an eight-channel phased array radar system that employs solid-state radar transceivers, a microstrip patch antenna, and a reconfigurable waveform generator and processor unit. The original DBSAR transceiver design utilizes connectorized electronic components that tend to be physically large and heavy. To achieve increased functionality in a smaller volume, PCB (printed circuit board) transceivers were designed to replace the large connectorized transceivers. One of the most challenging problems designing the transceivers in a PCB format was achieving proper performance in the calibration path. For a radar loop-back calibration path, a portion of the transmit signal is coupled out of the antenna feed and fed back into the receiver. This is achieved using passive components for stability and repeatability. Some signal also leaks through the receive path. As these two signal paths are correlated via an unpredictable phase, the leakage through the receive path during transmit must be 30 dB below the calibration path. For DBSAR s design, this requirement called for a 100-dB isolation in the receiver path during transmit. A total of 16 solid-state L-band transceivers on a PCB format were designed. The transceivers include frequency conversion stages, T/R switching, and a calibration path capable of measuring the transmit power-receiver gain product during transmit for pulse-by-pulse calibration or matched filtering. In particular, this calibration path achieves 100-dB isolation between the transmitted signal and the low-noise amplifier through the use of a switching network and a section of physical walls achieving attenuation of radiated leakage. The transceivers were designed in microstrip PCBs with lumped elements and individually packaged components for compactness. Each transceiver was designed on a single PCB with a custom enclosure providing interior walls and compartments to isolate transceiver subsystems from radiated interference. The enclosure also acts as a heat sink for the voltage regulators and power amplifiers inside the system. The PCB transceiver design produces transmit pulses of 2 W with an arbitrary duty cycle. Each transceiver is fed by an external 120-MHz signal transmit and two 1,140-MHz local oscillator signals. The received signal is amplified and down-converted to 120 MHz and is fed to the data processor. The transceiver dimensions are approximately 3.5 11.5 0.6 in. (9 29 1.5 cm). The PCB transceiver design reduces the volume and weight of the DBSAR instrument while maintaining the functionality found in the original design. Both volume and weight are critical for airborne and flight remote sensing instrumentation.

McLinden, Matthew↗
NASA NTRS2014

Deployable Fresnel Rings

Deployable Fresnel rings (DFRs) significantly enhance the realizable gain of an antenna. This innovation is intended to be used in combination with another antenna element, as the DFR itself acts as a focusing or microwave lens element for a primary antenna. This method is completely passive, and is also completely wireless in that it requires neither a cable, nor a connector from the antenna port of the primary antenna to the DFR. The technology improves upon the previous NASA technology called a Tri-Sector Deployable Array Antenna in at least three critical aspects. In contrast to the previous technology, this innovation requires no connector, cable, or other physical interface to the primary communication radio or sensor device. The achievable improvement in terms of antenna gain is significantly higher than has been achieved with the previous technology. Also, where previous embodiments of the Tri-Sector antenna have been constructed with combinations of conventional (e.g., printed circuit board) and conductive fabric materials, this innovation is realized using only conductive and non-conductive fabric (i.e., "e-textile") materials, with the possible exception of a spring-like deployment ring. Conceptually, a DFR operates by canceling the out-of-phase radiation at a plane by insertion of a conducting ring or rings of a specific size and distance from the source antenna, defined by Fresnel zones. Design of DFRs follow similar procedures to those outlined for conventional Fresnel zone rings. Gain enhancement using a single ring is verified experimentally and through computational simulation. The experimental test setup involves a microstrip patch antenna that is directly behind a single-ring DFR and is radiating towards a second microstrip patch antenna. The first patch antenna and DFR are shown. At 2.42 GHz, the DFR improves the transmit antenna gain by 8.6 dB, as shown in Figure 2, relative to the wireless link without the DFR. A figure illustrates the relative strength of power coupling between the first and second microstrip antennas with and without the DFR. Typically, a DFR is designed for use at a particular frequency; however, testing of a DFR indicated a relatively wide operational bandwidth of approximately 8.2%. Wider bandwidth operation and multi-band operation are anticipated by extending the known art of conventional Fresnel rings to the DFRs. Increasing the number of rings used to construct a DFR antenna increases the gain, with the upper bound limited often by the largest practical dimensions that can be tolerated for a given application. The maximum theoretical improvement in gain for a single ring is 9.5 dB. Experimental results are within 0.9 dB of this theoretical value. Adding rings increases gain, and theoretically, improvements of 10 to 13 dB above that of the primary antenna gain can be achieved with two- and three-ring versions.

Kennedy, Timothy F.↗
NASA NTRS2013

Plant Habitat Telemetry / Command Interface and E-MIST

Plant Habitat (PH) is an experiment to be taken to the International Space Station (ISS) in 2016. It is critical that ground support computers have the ability to uplink commands to control PH, and that ISS computers have the ability to downlink PH telemetry data to ground support. This necessitates communication software that can send, receive, and process, PH specific commands and telemetry. The objective of the Plant Habitat Telemetry/ Command Interface is to provide this communication software, and to couple it with an intuitive Graphical User Interface (GUI). Initial investigation of the project objective led to the decision that code be written in C++ because of its compatibility with existing source code infrastructures and robustness. Further investigation led to a determination that multiple Ethernet packet structures would need to be created to effectively transmit data. Setting a standard for packet structures would allow us to distinguish these packets that would range from command type packets to sub categories of telemetry packets. In order to handle this range of packet types, the conclusion was made to take an object-oriented programming approach which complemented our decision to use the C++ programming language. In addition, extensive utilization of port programming concepts was required to implement the core functionality of the communication software. Also, a concrete understanding of a packet processing software was required in order to put aU the components of ISS-to-Ground Support Equipment (GSE) communication together and complete the objective. A second project discussed in this paper is Exposing Microbes to the Stratosphere (EMIST). This project exposes microbes into the stratosphere to observe how they are impacted by atmospheric effects. This paper focuses on the electrical and software expectations of the project, specifically drafting the printed circuit board, and programming the on-board sensors. The Eagle Computer-Aided Drafting (CAD) software was used to draft the E-MIST circuit. This required several component libraries to be created. Coding the sensors and obtaining sensor data involved using the Arduino Uno developmental board and coding language, and properly wiring peripheral sensors to the microcontroller (the central control unit of the experiment).

Walker, Uriae M.↗
NASA NTRS2013

Integrated High-Speed Torque Control System for a Robotic Joint

A control system for achieving high-speed torque for a joint of a robot includes a printed circuit board assembly (PCBA) having a collocated joint processor and high-speed communication bus. The PCBA may also include a power inverter module (PIM) and local sensor conditioning electronics (SCE) for processing sensor data from one or more motor position sensors. Torque control of a motor of the joint is provided via the PCBA as a high-speed torque loop. Each joint processor may be embedded within or collocated with the robotic joint being controlled. Collocation of the joint processor, PIM, and high-speed bus may increase noise immunity of the control system, and the localized processing of sensor data from the joint motor at the joint level may minimize bus cabling to and from each control node. The joint processor may include a field programmable gate array (FPGA).

Davis, Donald R.↗
NASA NTRS2015

Wideband Array for C, X, and Ku-Band Applications with 5.3:1 Bandwidth

Satellite communication has largely been accomplished using reflector antennas. However, such antennas are inherently bulky, and rely on mechanical steering. For this reason, ultra-wideband (UWB) and beam forming arrays have received strong interest. These lower weight, size,and cost arrays can combine many satellite applicationsspread throughout the C–Ka bands (4–40 GHz).To this end, we seek to develop an UWB Tightly-Coupled Dipole Array (TCDA) with the following attributes: UWB band operation (3.5–18.5 GHz) with low loss; 45˚ or more scanning in all planes; Low-cost Printed Circuit Board (PCB) fabrication; Scalable to Ka-band and above.

Wideband Array↗