SEARCH · Engineering Papers
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
Analytical and experimental investigation of propellant distribution during outflow of spherical tanks for possible space vehicle application
Automata and continuous system theories and relationships between convolutional codes and zero state automata and cyclic codes and zero input automata
Automata and continuous system theories and relationships between convolutional codes and zero state automata and cyclic codes and zero input automata
Multiplicity of external ribbon leads makes possible connections to a sealed or encapsulated microassembly. The leads are integral with the internal connections on a single part that can be fabricated economically by fine-detail electroplating.
Metal strip mounting arrangement for solar cell arrays on spacecraft
Vacuum evaporated films of Au, Pt, and Au-on-Pt on glass substrates after heat treatment
The design and development of the front-end for a multi-carrier system that allows multiplex signal transmission from satellite-borne transponders is described. Detailed systems analyses provided down-converter specifications. The 12 GHz carrier down-converter uses waveguide, coaxial, and microstrip transmission line elements in its implementation. Mixing is accomplished in a single-ended coaxial mixer employing a field-replacable cartridge style diode.
Four-volume series of documents has been prepared as standard reference. Each volume may be used separately and covers wire and cable preparation as well as harness fabrication and installation. Series should be useful addition to libraries of manufactures of electrical and electronic equipment.
Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.
Explore the source record for details and available documents.
The interdiffusion of platimum and gold films, a couple utilized in beam lead microcircuits, has been studied for temperatures up to 550 C. Gold-on-platinum couples and separate platimum and gold films 80-450 nm thick, were deposited by electron beam evaporation onto oxidized (111) silicon substrates. Diffusion was monitored by means of spectral reflectance versus wavelength in the band 500-1000 nm. The separate metal films showed good adhesion and stable reflectances (after an initial change) for at least 6 h at diffusion temperatures, in contrast to the couples. Analysis of platinum diffusion through the gold films yielded an activation energy about 38 kcal/g-atom and a pre-exponential factor of the order 0.001 sq cm/sec, values close to those for volume diffusion. The pre-exponential factor especially is dependent upon film deposition conditions.
A number of efficient new algorithms for generating digital pseudonoise are presented. The algorithms are efficient because a large number of new pseudorandom bits are generated at each iteration of a computer implementation or at each clock pulse of a hardware implementation. The maximal-length shift register sequences obtained have good randomness properties. Some of the properties of p-n sequences are reviewed and the results of an extensive statistical evaluation of the pseudonoise are presented.
The present work first reviews the key elements of rotating system dynamics which are crucial to the control of lateral vibration levels for supercritical shafting of the type which is considered for use in advanced aircraft applications. Then the results of an analytical investigation of procedures for balancing flexible shafts designed for critical operation are discussed. Some of the conclusions made were: (1) even in undamped configuration, reasonably low vibration levels can be achieved through a sequential multiplane-multispeed balancing process; and (2) combination of analytical response and balancing prediction procedures yields a powerful tool for the dynamic analysis and design of advanced shaft-bearing systems.
Study findings concluded that useful bonds can be formed with silver ribbon, silver-plated copper ribbon, and aluminum ribbon. Bonds were formed at from 300 C to 400 C and with enough contact pressure to produce some deformation of ribbon.
The steady state thermodynamic cycle balance of the single preburner staged combustion engine, coupled with dynamic transient analyses, dictated in detail the location and requirements for each valve defined in this volume. Valve configuration selections were influenced by overall engine and vehicle system weight and failure mode determinations. Modulating valve actuators are external to the valve and are line replaceable. Development and satisfactory demonstration of a high pressure dynamic shaft seal has made this configuration practical. Pneumatic motor driven actuators that use engine pumped hydrogen gas as the working fluid are used. The helium control system is proposed as a module containing a cluster of solenoid actuated valves. The separable couplings and flanges are designed to assure minimum leakage with minimum coupling weight. The deflection of the seal surface in the flange is defined by finite element analysis that has been confirmed with test data. The seal design proposed has passed preliminary pressure cycling and thermal cycling tests.
Explore the source record for details and available documents.
Twenty-four solar modules, half of which were 48 cells in an all-series electrical configuration and half of a six parallel cells by eight series cells were provided. Upon delivery of environmentally tested modules, low power outputs were discovered. These low power modules were determined to have cracked cells which were thought to cause the low output power. The cracks tended to be linear or circular which were caused by different stressing mechanisms. These stressing mechanisms were fully explored. Efforts were undertaken to determine the causes of cell fracture. This resulted in module design and process modifications. The design and process changes were subsequently implemented in production.
The fabrication techniques for creation of complementary metal oxide semiconductor integrated circuits at George C. Marshall Space Flight Center are described. Examples of C-MOS integrated circuits manufactured at MSFC are presented with functional descriptions of each. Typical electrical characteristics of both p-channel metal oxide semiconductor and n-channel metal oxide semiconductor discrete devices under given conditions are provided. Procedures design, mask making, packaging, and testing are included.