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At least 307 records · Page 17

The Aircraft Morphing Program

In the last decade smart technologies have become enablers that cut across traditional boundaries in materials science and engineering. Here we define smart to mean embedded actuation, sensing, and control logic in a tightly coupled feedback loop. While multiple successes have been achieved in the laboratory, we have yet to see the general applicability of smart devices to real aircraft systems. The NASA Aircraft Morphing program is an attempt to couple research across a wide range of disciplines to integrate smart technologies into high payoff aircraft applications. The program bridges research in seven individual disciplines and combines the effort into activities in three primary program thrusts. System studies are used to assess the highest- payoff program objectives, and specific research activities are defined to address the technologies required for development of smart aircraft systems. In this paper we address the overall program goals and programmatic structure, and discuss the challenges associated with bringing the technologies to fruition.

Wlezien, R. W.↗

Advanced Wireless Sensor Nodes - MSFC

NASA field center Marshall Space Flight Center (Huntsville, AL), has invested in advanced wireless sensor technology development. Developments for a wireless microcontroller back-end were primarily focused on the commercial Synapse Wireless family of devices. These devices have many useful features for NASA applications, good characteristics and the ability to be programmed Over-The-Air (OTA). The effort has focused on two widely used sensor types, mechanical strain gauges and thermal sensors. Mechanical strain gauges are used extensively in NASA structural testing and even on vehicle instrumentation systems. Additionally, thermal monitoring with many types of sensors is extensively used. These thermal sensors include thermocouples of all types, resistive temperature devices (RTDs), diodes and other thermal sensor types. The wireless thermal board will accommodate all of these types of sensor inputs to an analog front end. The analog front end on each of the sensors interfaces to the Synapse wireless microcontroller, based on the Atmel Atmega128 device. Once the analog sensor output data is digitized by the onboard analog to digital converter (A/D), the data is available for analysis, computation or transmission. Various hardware features allow custom embedded software to manage battery power to enhance battery life. This technology development fits nicely into using numerous additional sensor front ends, including some of the low-cost printed circuit board capacitive moisture content sensors currently being developed at Auburn University.

Varnavas, Kosta↗

IMAPS Device Packaging Conference 2017 - Engineered Micro Systems & Devices Track

NASA field center Marshall Space Flight Center (Huntsville, AL), has invested in advanced wireless sensor technology development. Developments for a wireless microcontroller back-end were primarily focused on the commercial Synapse Wireless family of devices. These devices have many useful features for NASA applications, good characteristics and the ability to be programmed Over-The-Air (OTA). The effort has focused on two widely used sensor types, mechanical strain gauges and thermal sensors. Mechanical strain gauges are used extensively in NASA structural testing and even on vehicle instrumentation systems. Additionally, thermal monitoring with many types of sensors is extensively used. These thermal sensors include thermocouples of all types, resistive temperature devices (RTDs), diodes and other thermal sensor types. The wireless thermal board will accommodate all of these types of sensor inputs to an analog front end. The analog front end on each of the sensors interfaces to the Synapse wireless microcontroller, based on the Atmel Atmega128 device. Once the analog sensor output data is digitized by the onboard analog to digital converter (A/D), the data is available for analysis, computation or transmission. Various hardware features allow custom embedded software to manage battery power to enhance battery life. This technology development fits nicely into using numerous additional sensor front ends, including some of the low-cost printed circuit board capacitive moisture content sensors currently being developed at Auburn University.

Varnavas, Kosta↗

An embedded planar-foil capacitor material, FPGA based interposer, aimed at improving system performance and reduced board size for space based electronics

This paper presents work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuits (ASIC). FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. The developed interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry.

Cheng, Ben↗

Electronic and Geometric effects on Photochemistry of Molecules in Well-Defined Environments

Assemblies of molecular switches at surfaces are of great interest for applications in solar energy conversion, optoelectronic and optomechanical devices. Experimental studies have demonstrated that it is possible to optically probe photoactive molecules in well-defined nanoscale environments. To understand these systems, we have developed a polarizable frozen-density embedding (FDEpol) to model the optical properties of molecules adsorbed on metal clusters. We have demonstrated that the FDEpol method can describe the ground state and linear response properties of strongly coupled systems with results that are in good agreement with exact projection based embedding method.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Thermocouple Rakes for Measuring Boundary Layer Flows Extremely Close to Surface

Of vital interest to aerodynamic researchers is precise knowledge of the flow velocity profile next to the surface. This information is needed for turbulence model development and the calculation of viscous shear force. Though many instruments can determine the flow velocity profile near the surface, none of them can make measurements closer than approximately 0.01 in. from the surface. The thermocouple boundary-layer rake can measure much closer to the surface than conventional instruments can, such as a total pressure boundary layer rake, hot wire, or hot film. By embedding the sensors (thermocouples) in the region where the velocity is equivalent to the velocity ahead of a constant thickness strut, the boundary-layer flow profile can be obtained. The present device fabricated at the NASA Glenn Research Center microsystem clean room has a heater made of platinum and thermocouples made of platinum and gold. Equal numbers of thermocouples are placed both upstream and downstream of the heater, so that the voltage generated by each pair at the same distance from the surface is indicative of the difference in temperature between the upstream and downstream thermocouple locations. This voltage differential is a function of the flow velocity, and like the conventional total pressure rake, it can provide the velocity profile. In order to measure flow extremely close to the surface, the strut is made of fused quartz with extremely low heat conductivity. A large size thermocouple boundary layer rake is shown in the following photo. The latest medium size sensors already provide smooth velocity profiles well into the boundary layer, as close as 0.0025 in. from the surface. This is about 4 times closer to the surface than the previously used total pressure rakes. This device also has the advantage of providing the flow profile of separated flow and also it is possible to measure simultaneous turbulence levels within the boundary layer.

Hwang, Danny P.↗

Practical Pocket PC Application w/Biometric Security

I work in the Flight Software Engineering Branch, where we provide design and development of embedded real-time software applications for flight and supporting ground systems to support the NASA Aeronautics and Space Programs. In addition, this branch evaluates, develops and implements new technologies for embedded real-time systems, and maintains a laboratory for applications of embedded technology. The majority of microchips that are used in modern society have been programmed using embedded technology. These small chips can be found in microwaves, calculators, home security systems, cell phones and more. My assignment this summer entails working with an iPAQ HP 5500 Pocket PC. This top-of-the-line hand-held device is one of the first mobile PC's to introduce biometric security capabilities. Biometric security, in this case a fingerprint authentication system, is on the edge of technology as far as securing information. The benefits of fingerprint authentication are enormous. The most significant of them are that it is extremely difficult to reproduce someone else's fingerprint, and it is equally difficult to lose or forget your own fingerprint as opposed to a password or pin number. One of my goals for this summer is to integrate this technology with another Pocket PC application. The second task for the summer is to develop a simple application that provides an Astronaut EVA (Extravehicular Activity) Log Book capability. The Astronaut EVA Log Book is what an astronaut would use to report the status of field missions, crew physical health, successes, future plans, etc. My goal is to develop a user interface into which these data fields can be entered and stored. The applications that I am developing are created using eMbedded Visual C++ 4.0 with the Pocket PC 2003 Software Development Kit provided by Microsoft.

Logan, Julian↗

TiN‐Au/HfO 2 ‐Au Multilayer Thin Films with Tunable Hyperbolic Optical Response

Abstract Hyperbolic metamaterials (HMM) possess significant anisotropic physical properties and tunability and thus find many applications in integrated photonic devices. HMMs consisting of metal and dielectric phases in either multilayer or vertically aligned nanocomposites (VAN) form are demonstrated with different hyperbolic properties. Herein, self‐assembled HfO 2 ‐Au/TiN‐Au multilayer thin films, combining both the multilayer and VAN designs, are demonstrated. Specifically, Au nanopillars embedded in HfO 2 and TiN layers forming the alternative layers of HfO 2 ‐Au VAN and TiN‐Au VAN. The HfO 2 and TiN layer thickness is carefully controlled by varying laser pulses during pulsed laser deposition (PLD). Interestingly, tunable anisotropic physical properties can be achieved by adjusting the bi‐layer thickness and the number of the bi‐layers. Type II optical hyperbolic dispersion can be obtained from high layer thickness structure (e.g., 20 nm), while it can be transformed into Type I optical hyperbolic dispersion by reducing the thickness to a proper value (e.g., 4 nm). This new nanoscale hybrid metamaterial structure with the three‐phase VAN design shows great potential for tailorable optical components in future integrated devices.

Chemistry↗

Quantum-well diode frequency multipliers - Varistor case

Local oscillators for heterodyne receivers at submillimeter wavelengths are typically made using a fundamental source followed by a harmonic frequency multiplier. An investigation of the required circuit embedding conditions for a possible new harmonic generator, the quantum-well resonant-tunneling diode, is summarized. A low-frequency multiplier has been tested that employs the resistive nonlinearity of the device as opposed to the reactive nonlinearity. The results show good agreement between practice and theory.

Batelaan, Paul D.↗

Embedded Data Processor and Portable Computer Technology testbeds

Attention is given to current activities in the Embedded Data Processor and Portable Computer Technology testbed configurations that are part of the Advanced Data Systems Architectures Testbed at the Information Sciences Division at NASA Ames Research Center. The Embedded Data Processor Testbed evaluates advanced microprocessors for potential use in mission and payload applications within the Space Station Freedom Program. The Portable Computer Technology (PCT) Testbed integrates and demonstrates advanced portable computing devices and data system architectures. The PCT Testbed uses both commercial and custom-developed devices to demonstrate the feasibility of functional expansion and networking for portable computers in flight missions.

Alena, Richard↗

Advanced Microelectronics Technologies for Future Small Satellite Systems

Future small satellite systems for both Earth observation as well as deep-space exploration are greatly enabled by the technological advances in deep sub-micron microelectronics technologies. Whereas these technological advances are being fueled by the commercial (non-space) industries, more recently there has been an exciting new synergism evolving between the two otherwise disjointed markets. In other words, both the commercial and space industries are enabled by advances in low-power, highly integrated, miniaturized (low-volume), lightweight, and reliable real-time embedded systems. Recent announcements by commercial semiconductor manufacturers to introduce Silicon On Insulator (SOI) technology into their commercial product lines is driven by the need for high-performance low-power integrated devices. Moreover, SOI has been the technology of choice for many space semiconductor manufacturers where radiation requirements are critical. This technology has inherent radiation latch-up immunity built into the process, which makes it very attractive to space applications. In this paper, we describe the advanced microelectronics and avionics technologies under development by NASA's Deep Space Systems Technology Program (also known as X2000). These technologies are of significant benefit to both the commercial satellite as well as the deep-space and Earth orbiting science missions. Such a synergistic technology roadmap may truly enable quick turn-around, low-cost, and highly capable small satellite systems for both Earth observation as well as deep-space missions.

Alkalai, Leon↗

SAFEGUARD: An Assured Safety Net Technology for UAS

As demands increase to use unmanned aircraft systems (UAS) for a broad spectrum of commercial applications, regulatory authorities are examining how to safely integrate them without loss of safety or major disruption to existing airspace operations. This work addresses the development of the Safeguard system as an assured safety net technology for UAS. The Safeguard system monitors and enforces conformance to a set of rules defined prior to flight (e.g., geospatial stay-out or stay-in regions, speed limits, altitude limits). Safeguard operates independently of the UAS autopilot and is strategically designed in a way that can be realized by a small set of verifiable functions to simplify compliance with regulatory standards for commercial aircraft. A framework is described that decouples the system from any other devices on the UAS as well as introduces complementary positioning source(s) for applications that require integrity and availability beyond what the Global Positioning System (GPS) can provide. Additionally, the high level logic embedded within the software is presented, as well as the steps being taken toward verification and validation (V&V) of proper functionality. Next, an initial prototype implementation of the described system is disclosed. Lastly, future work including development, testing, and system V&V is summarized.

Dill, Evan T.↗

Virtex-II Pro PowerPC SEE Characterization Test Methods and Results

The Xilinx Vix-11 Pro is a platform FPGA that embeds multiple microprocessors within the fabric of an SRAM-based reprogrammable FPGA. The variety and quantity of resources provided by this family of devices make them very attractive for spaceflight applications. However,these devices will be susceptible to single event effects (SEE), which must be mitigated. Observations from prior testing of the Xilinx Virtex-II Pro suggest that the PowerPC core has significant vulnerability to SEES. However, these initial tests were not designed to exclusively target the functionality of the PowerPC, therefore making it difficult to distinguish processor upsets from fabric upsets. The main focus of this paper involves detailed SEE testing of the embedded PowerPC core. Due to the complexity of the PowerPC, various custom test applications, both static and dynamic, will be designed to isolate each Unit of the processor. Collective analysis of the test results will provide insight into the exact upset mechanism of the PowerPC. With this information, mitigations schemes can be developed and tested that address the specific susceptibilities of these devices. The test bed will be the Xilinx SEE Consortium Virtex-II Pro test board, which allows for configuration scrubbing, design triplication, and ease of data collection. Testing will be performed at the Indiana University Cyclotron Facility using protons of varying energy levels and fluencies. This paper will present the detailed test approach along with the results.

Petrick, David↗

A test for interfacial effects and stress transfer in ceramic matrix composites

A test specimen was devised for measuring stress transfer between a high modulus fiber and a ceramic matrix. Single filaments of SiC were embedded in chemically vapor deposited SiC on a thin plate of molybdenum. The CVD overcoating which encapsulated the fiber was continuous with a coating of SiC on the molybdenum. When placed in a microtensile test device and loaded in the fiber direction, the fiber fracture characteristics provide information on the fiber/matrix adhesion and stress transfer. Problems were encountered due to the formation of a weak boundary between the SiC and the molybdenum which obviated any meaningful tensile tests. Also, the high CVD temperature used in fabricating these specimens restrict the fiber, matrix (and substrate) to materials having similar thermal coefficients of expansion in order to minimize thermal stresses.

Source record↗

High-Temperature Smart Structures for Engine Noise Reduction and Performance Enhancement

One of key NASA goals is to develop and integrate noise reduction technology to enable unrestricted air transportation service to all communities. One of the technical priorities of this activity has been to account for and reduce noise via propulsion/airframe interactions, identifying advanced concepts to be integrated with the airframe to mitigate these noise-producing mechanisms. An adaptive geometry chevron using embedded smart structures technology offers the possibility of maximizing engine performance while retaining and possibly enhancing the favorable noise characteristics of current designs. New high-temperature shape memory alloy (HTSMA) materials technology enables the devices to operate in both low-temperature (fan) and high-temperature (core) exhaust flows. Chevron-equipped engines have demonstrated reduced noise in testing and operational use. It is desirable to have the noise benefits of chevrons in takeoff/landing conditions, but have them deployed into a minimum drag position for cruise flight. The central feature of the innovation was building on rapidly maturing HTSMA technology to implement a next-generation aircraft noise mitigation system centered on adaptive chevron flow control surfaces. In general, SMA-actuated devices have the potential to enhance the demonstrated noise reduction effectiveness of chevron systems while eliminating the associated performance penalty. The use of structurally integrated smart devices will minimize the mechanical and subsystem complexity of this implementation. The central innovations of the effort entail the modification of prior chevron designs to include a small cut that relaxes structural stiffness without compromising the desired flow characteristics over the surface; the reorientation of SMA actuation devices to apply forces to deflect the chevron tip, exploiting this relaxed stiffness; and the use of high-temperature SMA (HTSMA) materials to enable operation in the demanding core chevron environment. The overall conclusion of these design studies was that the cut chevron concept is a critical enabling step in bringing the variable geometry core chevron within reach. The presence of the cut may be aerodynamically undesirable in some respects, but it is present only when the chevron is not immersed in the core jet exhaust. When deployed, the gap closes as the chevron tip enters the high-speed, high-temperature core stream. Aeroacoustic testing and flow visualization support the contention that this cut is inconsequential to chevron performance.

Quackenbush, Todd R.↗

Accelerometer Modeling in the State-Space

Generically, accelerometers are sensors that measure the accelerating force applied to an object. Their operation is based on a simple mechanical system and D’Alembert’s force principle along with Newton’s laws of motion. This device is typically mounted to the body of the test object under investigation that is subjected to an accelerating force. The displacement of the seismic or “proof” mass due to the acceleration is sensed by an embedded component from which the acceleration is determined. Interestingly enough, the resulting the resulting mathematical relations governing the dynamical motion is based on the underlying physics, sensor materials, geometry and fabrication. Mathematically, the various designs satisfy the underlying Newtonian equations of motion, but their type and performance differ significantly.

42 ENGINEERING↗

Microwave characterization and modeling of GaAs/AlGaAs heterojunction bipolar transistors

The characterization and modeling of a microwave GaAs/AlGaAs heterojunction Bipolar Transistor (HBT) are discussed. The de-embedded scattering parameters are used to derive a small signal lumped element equivalent circuit model using EEsof's Touchstone software package. Each element in the equivalent circuit model is shown to have its origin within the device. The model shows good agreement between the measured and modeled scattering parameters over a wide range of bias currents. Further, the MAG (maximum available power gain) and the h sub 21 (current gain) calculated from the measured data and those predicted by the model are also in good agreement. Consequently, the model should also be capable of predicting the f sub max and the f sub T of other HBTs.

Simons, Rainee N.↗