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At least 307 records · Page 17

Acousto-optic signature analysis for inspection of the orbiter thermal protection tile bonds

The goal of this research is to develop a viable NDE technique for the inspection of orbiter thermal protection system (TPS) tile bonds. Phase 2, discussed here, concentrated on developing an empirical understanding of the bonded and unbonded vibration signatures of acreage tiles. Controlled experiments in the laboratory have provided useful information on the dynamic response of TPS tiles. It has been shown that several signatures are common to all the pedigree tiles. This degree of consistency in the tile-SIP (strain isolation pad) dynamic response proves that an unbond can be detected for a known tile and establish the basis for extending the analysis capability to arbitrary tiles for which there are no historical data. The field tests of the noncontacting laser acoustic sensor system, conducted at the Kennedy Space Center (KSC), investigated the vibrational environment of the Orbiter Processing Facility (OPF) and its effect on the measurement and analysis techniques being developed. The data collected showed that for orbiter locations, such as the body flap and elevon, the data analysis scheme, and/or the sensor, will require modification to accommodate the ambient motion. Several methods were identified for accomplishing this, and a solution is seen as readily achievable. It was established that the tile response was similar to that observed in the laboratory. Of most importance, however, is that the field environment will not affect the physics of the dynamic response that is related to bond condition. All of this information is fundamental to any future design and development of a prototype system.

Rodriguez, Julio G.↗

Adhesive bond evaluation using phase sensitive detection techniques

Quadrature phase detection techniques have been used to monitor the amplitude and phase of a toneburst ultrasonic wave normally reflected from adhesively-bonded steel/rubber interface. The measured phase change values of the reflected signals were found to correlate with variations in sample preparation. It was determined that measured phase shift changes were larger for samples with weaker bonds as manifested by smaller measured values of the applied tensile loads at failure. A model calculation which incorporates the concept of interfacial strength into the usual problem of wave propagation in multi-layered isotropic elastic media was used to deduce a bond-quality parameter from an experimentally measured phase shift.

Smith, Alphonso C.↗

Bond-orientational order in liquid Si

Bond-orientational order in liquid Si via Monte Carlo simulation in conjuncation with empirical two- and three-body potentials of the form proposed by Stillinger and Weber are studied. Bond-orientational order (BOO) is described in terms of combinations of spherical harmonic functions. Liquid Si is found to have pronounced short-range BOO corresponding to l = 3, as expected for a structure with local tetrahedral order. No long-range BOO is found either in the equilibrium or the supercooled liquid. When the three-body potential is artificially removed, the tetrahedral bond-orientation order disappears and the liquid assumes a close-packed structure.

Wang, Z. Q.↗

Theoretical study of the bonding of Sc, Y, and La singly charged and dipositive ions to C2H2, C2H4, and C3H6

The interaction of the Sc and Y singly-charged and dipositive ions with C2H2, C2H4, and C3H6 is studied using electronic structure calculations that include high levels of electron correlation. These results are compared with comparable calculations performed previously for La(+) and La(2+). For C2H2 and C2H4, all three metal ions insert into the C-C pi bond, making a three-membered ring. The optimal structures for the MC3H6(+) ions all involve rearrangement to make a four-membered ring. The strength of the metal-ligand bond for the singly charged ions follows the order La greater than Sc equal to about Y. In contrast, the bonds involving the dipositive ions are electrostatic, so that the binding energy increases as the size of the ion decreases, leading to the trend Sc greater than Y greater than La.

Bauschlicher, Charles W., Jr.↗

Bond verification of space shuttle tiles using time-domain techniques

The application of a high-resolution time-domain reflectometer (TDR) to the detection of faulty bonds in space shuttle tile structures is discussed. Experimental measurements on bonded and debonded tiles are included to demonstrate the technique. Computer simulations were used to verify the experimental results. A criterion for bond verification is proposed.

Bennia, Abdelhak↗

Theoretical study of the bonding of Nb(2+) to CH2, C2H2, and C2H4

The bonding of Nb(2+) with CH2, C2H2, and C2H4 is studied by using electronic structure calculations that include high levels of electron correlation. The binding energy for NbCH2(2+) is in good agreement with the lower bound determined from the reaction with CH4 but is significantly smaller than the value determined from the binding energy and ionization potential of NbCH2(+). The calculations and a new interpretation of the experiment indicate that the larger value is in error primarily because the ionization potential of NbCH2(+) determined from bracketing charge-exchange reactions is too small. The computed binding energy of NbC2H2(2+) is in good agreement with experiment. The calculations show that the bonding is predominantly covalent in character for both NbCH2(2+) and NbC2H2(2+), whereas for NbC2H4(2+) the electronic states that are predominantly ionic and covalent are nearly degenerate. The trend in binding energies, CH2 greater than C2H2 greater than C2H4, is consistent with the energy required to prepare the ligands for bonding.

Bauschlicher, Charles W., Jr.↗

Catalytic RNA and synthesis of the peptide bond

We are studying whether the L-19 IVS ribozyme from Tetrahymena thermophila can catalyze the formation of the peptide bond when it is supplied with synthetic aminoacyl oligonucleotides. If this reaction works, it could give us some insight into the mechanism of peptide bond formation and the origin of coded protein synthesis. Two short oligoribonucleotides, CCCCC and a protected form of CCCCU were prepared; the former was made by the controlled hydrolysis of Poly(C), and the later by multistep chemical synthesis from the protected monomers. The homopentamer was then aminocylated using C-14 labelled Boc-protected glycine imidazolide. This aminoacylated oligo-nucleotide has now been shown to enter the active site of the L-19 IVS, and aminoacyl transfer, and peptide bond formation reactions are being sought. Our synthesis of CCCCU made us aware of the inadequacy of many of the 2'- hydroxyl protecting groups that are in use today and we therefore designed a new 2'- protecting group that is presently being tested.

Usher, D. A.↗

Reaction-bonded Si3N4 and SiC matrix composites

A development status evaluation is presented for the reaction-bonded SiC- and Si3N4-matrix types of fiber-reinforced ceramic-matrix composite (FRCMC). A variety of reaction-bonding methods are being pursued for FRCMC fabrication: CVI, CVD, directed metal oxidation, and self-propagating high-temperature synthesis. Due to their high specific modulus and strength, toughness, and fabricability, reaction-bonded FRCMC are important candidate materials for such heat-engine components as combustor liners, nozzles, and turbine and stator blading. The improvement of long-term oxidative stability in these composites is a major goal of current research.

Bhatt, Ramakrishna T.↗

Bonding Diamond To Metal In Electronic Circuits

Improved technique for bonding diamond to metal evolved from older technique of soldering or brazing and more suitable for fabrication of delicate electronic circuits. Involves diffusion bonding, developed to take advantage of electrically insulating, heat-conducting properties of diamond, using small diamond bars as supports for slow-wave transmission-line structures in traveling-wave-tube microwave amplifiers. No fillets or side coats formed because metal bonding strips not melted. Technique also used to mount such devices as transistors and diodes electrically insulated from, but thermally connected to, heat sinks.

Jacquez, Andrew E.↗

Process for bonding elastomers to metals

A process for bonding elastomeric material to a metal part includes coating a heat curable adhesive on the surfaces of the metal part to be bonded. The metal part is placed in a mold, a bottom plate and an upper transfer pot of a transfer molding machine is preheated to a predetermined cure temperature. A predetermined quantity of uncured elastomeric material is loaded into the transfer pot. The mold containing the adhesive coated metal part is clamped to the bottom plate, and almost contemporaneously, the uncured elastomeric material is pressed into the mold while maintaining heat and pressure in the mold for a time sufficient to vulcanize and thereby cure the elastomeric material simultaneously with the adhesive, whereby contacting surfaces of the metal part are strongly bonded to the vulcanized elastomeric material.

Dickerson, George E.↗

Theoretical study of the bond dissociation energies of propyne (C3H4)

The C-C and C-H bond dissociation energies (BDEs) of propyne have been computed using the modified coupled-pair functional method. Due to hyperconjugation, the C-C and methyl C-H single bonds are stronger and weaker, respectively than those in ethane. The acetylenic C-H and C triple bond C BDEs are larger and smaller, respectively, than in acetylene, also as a result of the hyperconjugation. Our best estimate of 92.5 +/- 2 kcal/mol for the methyl C-H BDE in propyne is slightly larger than the experimental value. For the acetylenic C-H BDE in propyne we predict 135.9 +/- 2 kcal/mol.

Bauschlicher, Charles W., Jr.↗

Transient liquid phase diffusion bonding of Udimet 720 for Stirling power converter applications

Udimet 720 has been selected for use on Stirling power converters for space applications. Because Udimet 720 is generally considered susceptible to strain age cracking if traditional fusion welding is used, other joining methods are being considered. A process for transient liquid phase diffusion bonding of Udimet 720 has been theoretically developed in an effort to eliminate the strain age crack concern. This development has taken into account such variables as final grain size, joint homogenization, joint efficiency related to bonding aid material, bonding aid material application method, and thermal cycle.

Mittendorf, Donald L.↗

Effect of thermal cycling on interface bonding requirements in Al2O3 fiber-reinforced superalloy composites

CTE (coefficient of thermal expansion) mismatch-induced stresses as they affect the fiber-matrix bond integrity of Al2O3 fiber-reinforced superalloy composites are examined. Of the three individual stress components, only the radial stress directly affects the integrity of the fiber-matrix interface. It is noted that a compressive radial stress leads to a clamping action on the fiber and is therefore beneficial to the integrity of the fiber-matrix bond. A radial tensile stress, on the other hand, can cause debonding of the fiber from the matrix for a weak fiber-matrix bond.

Misra, Ajay K.↗

Relation between bond-length alternation and second electronic hyperpolarizability of conjugated organic molecules

The solvent dependence of the second hyperpolarizability, gamma, of a variety of unsaturated organic compounds has been measured by third harmonic generation at 1907 nanometers. It is seen that the measured gamma is a function of solvent polarity. These solvent-dependent hyperpolarizabilities are associated with changes in molecular geometry from a highly bond-length alternated, polyenelike structure for a formyl-substituted compound in nonpolar solvents, to a cyaninelike structure, with little bond-length alternation, for a dicyanovinyl-substituted compound in polar solvents. By tuning bond-length alternation, gamma can be optimized in either a positive or negative sense for polymethine dyes of a given conjugation length.

Marder, Seth R.↗

Lightning tests and analyses of tunnel bond straps and shielded cables on the Space Shuttle solid rocket booster

The purposes of the tests and analyses described in this report are as follows: (1) determine the lightning current survivability of five alternative changed designs of the bond straps which electrically bond the solid rocket booster (SRB) systems tunnel to the solid rocket motor (SRM) case; (2) determine the amount of reduction in induced voltages on operational flight (OF) tunnel cables obtained by a modified design of tunnel bond straps (both tunnel cover-to-cover and cover-to-motor case); (3) determine the contribution of coupling to the OF tunnel cables by ground electrical and instrumentation (GEI) cables which enter the systems tunnel from unshielded areas on the surfaces of the motor case; and (4) develop a model (based on test data) and calculate the voltage levels at electronic 'black boxes' connected to the OF cables that run in the systems tunnel.

Druen, William M.↗

Cleanliness inspection tool for RSRM bond surfaces

Using optically stimulated electron emission (OSEE), Thiokol has monitored bond surfaces in process for contamination on the Redesigned Solid Rocket Motor (RSRM). This technique provides process control information to help assure bond surface quality and repeatability prior to bonding. This paper will describe OSEE theory of operation and the instrumentation implemented at Thiokol Corporation since 1987. Data from process hardware will be presented.

Mattes, Robert A.↗

Thermoplastic Ribbon-Ply Bonding Model

The aim of the present work was to identify key variables in rapid weldbonding of thermoplastic tow (ribbon) and their relationship to matrix polymer properties and to ribbon microstructure. Theoretical models for viscosity, establishment of ply-ply contact, instantaneous (Velcro) bonding, molecular interdiffusion (healing), void growth suppression, and gap filling were reviewed and synthesized. Consideration of the theoretical bonding mechanisms and length scales and of the experimental weld/peel data allow the prediction of such quantities as the time and pressure required to achieve good contact between a ribbon and a flat substrate, the time dependence of bond strength, pressures needed to prevent void growth from dissolved moisture and conditions for filling gaps and smoothing overlaps.

Hinkley, Jeffrey A.↗

Global-Local Finite Element Analysis for Thermo-Mechanical Stresses in Bonded Joints

An analysis of adhesively bonded joints using conventional finite elements does not capture the singular behavior of the stress field in regions where two or three dissimilar materials form a junction with or without free edges. However, these regions are characteristic of the bonded joints and are prone to failure initiation. This study presents a method to capture the singular stress field arising from the geometric and material discontinuities in bonded composites. It is achieved by coupling the local (conventional) elements with global (special) elements whose interpolation functions are constructed from the asymptotic solution.

Shkarayev, S.↗