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At least 289 records · Page 16
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

Anti-distortion bioinspired camera with an inhomogeneous photo-pixel array

The bioinspired camera, comprising a single lens and a curved image sensor—a photodiode array on a curved surface—, was born of flexible electronics. Its economical build lends itself well to space-constrained machine vision applications. The curved sensor, much akin to the retina, helps image focusing, but the curvature also creates a problem of image distortion, which can undermine machine vision tasks such as object recognition. Here we report an anti-distortion single-lens camera, where 4096 silicon photodiodes arrayed on a curved surface in a nonuniform pattern assimilated to the distorting optics are the key to anti-distortion engineering. That is, the photo-pixel distribution pattern itself is warped in the same manner as images are warped, which correctively reverses distortion. Acquired images feature no appreciable distortion across a 120° horizontal view, as confirmed by their neural-network recognition accuracies. This distortion correction via photo-pixel array reconfiguration is a form of in-sensor computing.

77 NANOSCIENCE AND NANOTECHNOLOGY↗
DOE OSTI2022

Robotic four-dimensional pixel assembly of van der Waals solids

Van der Waals (vdW) solids can be engineered with atomically precise vertical composition through the assembly of layered two-dimensional materials. However, the artisanal assembly of structures from micromechanically exfoliated flakes is not compatible with scalable and rapid manufacturing. Further engineering of vdW solids requires precisely designed and controlled composition over all three spatial dimensions and interlayer rotation. Here, we report a robotic four-dimensional pixel assembly method for manufacturing vdW solids with unprecedented speed, deliberate design, large area and angle control. We used the robotic assembly of prepatterned 'pixels' made from atomically thin two-dimensional components. Wafer-scale two-dimensional material films were grown, patterned through a clean, contact-free process and assembled using engineered adhesive stamps actuated by a high-vacuum robot. We fabricated vdW solids with up to 80 individual layers, consisting of 100 x 100 μm 2 areas with predesigned patterned shapes, laterally/vertically programmed composition and controlled interlayer angle. This enabled efficient optical spectroscopic assays of the vdW solids, revealing new excitonic and absorbance layer dependencies in MoS 2 . Furthermore, we fabricated twisted $N$-layer assemblies, where we observed atomic reconstruction of twisted four-layer WS 2 at high interlayer twist angles of >= 4°. In conclusion, our method enables the rapid manufacturing of atomically resolved quantum materials, which could help realize the full potential of vdW heterostructures as a platform for novel physics and advanced electronic technologies.

42 ENGINEERING↗
DOE OSTI2018

Enhancing the signal-to-noise ratio for laser ranging by adjusting the photon equivalent threshold of a multi-pixel photon counter

A photon equivalent (PE) threshold-adjusting regime for laser ranging is proposed based on a multi-pixel photon counter (MPPC), and the mechanism of PE threshold influence on the signal-to-noise ratio (SNR) is demonstrated and analysed. The unique PE threshold adjustability of an MPPC leads to interesting results for laser ranging. Experimental results show that the SNR of the laser ranging system is significantly improved by optimising the MPPC PE threshold, which is beneficial for detection and false alarm probabilities. Submillimeter laser ranging resolution is obtained with noncooperative targets placed several meters away. Nanosecond dead time single photon laser ranging without gating is obtained due to an MPPC with a small pixel area. Multiple target ranging is implemented with a single MPPC rather than an array. (laser applications and other topics in quantum electronics)

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2018

Cadmium zinc telluride pixel detectors for high-intensity x-ray imaging at free electron lasers

Here, this paper reports the first demonstration of high-intensity x-ray imaging using cadmium zinc telluride (CdZnTe) pixel detectors at a free electron laser (FEL). Prototype detectors were produced using the STFC large pixel detector (LPD) ASIC and sensors fabricated from a novel high-intensity-capable CdZnTe material produced by Redlen Technologies. Characterisation of the performance of this sensor material was completed at the Linac Coherent Light Source (LCLS) FEL. The detectors were operated at a frame rate of 1 MHz with 9.5 keV x-ray pulses delivered at a rate of 120 Hz. Measurements successfully demonstrated the linear response of the CdZnTe material to increasing numbers of x-rays up to a fluence of 8 GeV mm –2 per pulse, the limit of the dynamic range of the LPD ASIC.

47 OTHER INSTRUMENTATION↗
DOE OSTI2021

Effects of overlapping sources on cosmic shear estimation: Statistical sensitivity and pixel-noise bias

The next generation of dark-energy imaging surveys — so called “Stage-IV” surveys, such as that of the Rubin Observatory Legacy Survey of Space and Time (LSST) — will cross a threshold in the number density of detected sources on the sky that requires qualitatively different image analysis and measurement techniques compared to the current generation of Stage-III surveys. In Stage-IV surveys, a significant amount of the cosmologically useful information is due to sources whose images overlap with those of other sources on the sky. Here, we focus on the weak gravitational lensing probe, for which we expect the largest impact since the cosmic shear signal is primarily encoded in the estimated shapes of observed galaxies and thus directly impacted by overlaps. We introduce a framework based on the Fisher formalism to analyze the effect of the overlapping sources (“blending”) on the estimation of cosmic shear. This method gives concrete predictions for the minimum loss of information due to noise and blending for any choice of “deblending” scheme and shape-measurement algorithm. Our studies account for undetected sources but do not address their full effects and biases they may introduce. We use simulated images and predict this impact of blending for three surveys: the Dark Energy Survey (DES), the Hyper-Suprime Cam Subaru Strategic Program (HSC-SSP), and the Rubin LSST. Our methodology successfully estimates the statistical sensitivity to weak lensing for DES and HSC early results. For LSST, we present the expected loss in statistical sensitivity for the ten-year survey due to blending. We find that for approximately 62% of galaxies that are likely to be detected in full-depth LSST images, at least 1% of the flux in their pixels is from overlapping sources. We also find that the statistical correlations between measures of overlapping galaxies and, to a much lesser extent (0.2%) the higher shot noise level due to their presence, decrease the effective number density of galaxies, N eff , by ~ 18%. We calculate an upper limit on N eff of 39.4 galaxies per arcmin 2 in r band. We study the impact of stars on as a function of stellar density and illustrate the diminishing returns of extending the survey into lower Galactic latitudes. We extend the simulation-based Fisher formalism to predict the expected increase in pixel-noise bias due to blending for maximum-likelihood (ML) shape estimators. We find that noise bias depends sensitively on the particular shape estimator and measure of ensemble-average shape that is used, and properties of the galaxy that include redshift-dependent quantities such as size and luminosity. The source code for these studies is available online.[The documented software developed for the catalog-level studies are available in the open-source LSST DESC github repository https://github.com/LSSTDESC/WeakLensingDeblending. The software for analyzing one or two galaxies with user-defined parameters is in the open-source github repository https://github.com/ismael-mendoza/ShapeMeasurementFisherFormalism.]

79 ASTRONOMY AND ASTROPHYSICS↗
DOE OSTI2016

Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

This paper is a review of recent progress of RD53 Collaboration. Results obtained on the study of the radiation effects on 65 nm CMOS have matured enough to define first strategies to adopt in the design of analog and digital circuits. Critical building blocks and analog very front end chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64×64 pixels with complex digital architectures have been produced, and point to address the main issues of dealing with extremely high pixel rates, while operating at very small in-time thresholds in the analog front end. Lastly, the collaboration is now proceeding at full speed towards the design of a large scale prototype, called RD53A, in 65 nm CMOS technology.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2018

Module and electronics developments for the ATLAS ITk pixel system

The ATLAS experiment is preparing for an extensive modification of its detectors in the course of the planned HL-LHC accelerator upgrade around 2025. The ATLAS upgrade includes the replacement of the entire tracking system by an all-silicon detector (Inner Tracker, ITk). The five innermost layers of ITk will be a pixel detector built of new sensor and readout electronics technologies to improve the tracking performance and cope with the severe HL-LHC environment in terms of occupancy and radiation. Here, the total area of the new pixel system could measure up to 14 m 2 , depending on the final layout choice, which is expected to take place in 2018. In this paper an overview of the ongoing R&D activities on modules and electronics for the ATLAS ITk is given including the main developments and achievements in silicon planar and 3D sensor technologies, readout and power challenges.

47 OTHER INSTRUMENTATION↗
DOE OSTI2018

LArPix: demonstration of low-power 3D pixelated charge readout for liquid argon time projection chambers

In this work, we report the demonstration of a low-power pixelated readout system designed for three-dimensional ionization charge detection and digital readout of liquid argon time projection chambers (LArTPCs) . Unambiguous 3D charge readout was achieved using a custom-designed system-on-a-chip ASIC (LArPix) to uniquely instrument each pad in a pixelated array of charge-collection pads. The LArPix ASIC, manufactured in 180 nm bulk CMOS, provides 32 channels of charge-sensitive amplification with self-triggered digitization and multiplexed readout at temperatures from 80 K to 300 K . Using an 832-channel LArPix-based readout system with 3 mm spacing between pads, we demonstrated low-noise (0<50 e - RMS equivalent noise charge) and very low-power (<100 μW/channel) ionization signal detection and readout . The readout was used to successfully measure the three-dimensional ionization distributions of cosmic rays passing through a LArTPC, free from the ambiguities of existing projective techniques. The system design relies on standard printed circuit board manufacturing techniques, enabling scalable and low-cost production of large-area readout systems using common commercial facilities. This demonstration overcomes a critical technical obstacle for operation of LArTPCs in high-occupancy environments, such as the near detector site of the Deep Underground Neutrino Experiment (DUNE) .

47 OTHER INSTRUMENTATION↗
DOE OSTI2018

Test beam measurement of ams H35 HV-CMOS capacitively coupled pixel sensor prototypes with high-resistivity substrate

In the context of the studies of the ATLAS High Luminosity LHC programme, radiation tolerant pixel detectors in CMOS technologies are investigated. To evaluate the effects of substrate resistivity on CMOS sensor performance, the H35DEMO demonstrator, containing different diode and amplifier designs, was produced in ams H35 HV-CMOS technology using four different substrate resistivities spanning from 80 cm to 1000 cm. A glueing process using a high-precision flip-chip machine was developed in order to capacitively couple the sensors to FE-I4 Readout ASIC using a thin layer of epoxy glue with good uniformity over a large surface. The resulting assemblies were measured in beam test at the Fermilab Test Beam Facilities with 120 GeV protons and CERN SPS H8 beamline using 180 GeV pions. Furthermore, the in-time efficiency and tracking properties measured for the different sensor types are shown to be compatible with the ATLAS ITk requirements for its pixel sensors.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2023

Conceptual study of a two-layer silicon pixel detector to tag the passage of muons from cosmic sources through quantum processors

Abstract Recent studies in quantum computing have shown that quantum error correction with large numbers of physical qubits are limited by ionizing radiation from high-energy particles. Depending on the physical setup of the quantum processor, the contribution of muons from cosmic sources can constitute a significant fraction of these interactions. As most of these muons are difficult to stop, we perform a conceptual study of a two-layer silicon pixel detector to tag their hits on a solid-state quantum processor instead. With a typical dilution refrigerator geometry model, we find that efficiencies greater than 50% are most likely to be achieved if at least one of the layers is operated at the deep-cryogenic (<1 K) flanges of the refrigerator. Following this finding, we further propose a novel research program that could allow the development of silicon pixel detectors that are fast enough to provide input to quantum error correction algorithms, can operate at deep-cryogenic temperatures, and have very low power consumption.

Instruments & Instrumentation↗
DOE OSTI2025

Testing the limits of ITkPixV2: the ATLAS inner tracker pixel detector readout chip

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of 5 × 1034 cm-1 s-1, ITkPixV2 must meet significant increases in nearly all design requirements compared to the current ATLAS Inner Detector (ID), including a 10× increase in trigger rate, a 7.5× increase in hit rate, a 3× increase in radiation tolerance, and a 12.5× decrease in pixel current draw per unit area, all while maintaining a similar power per unit area as present pixel detectors. Here we present the first measurements of the ITkPixV2 chip operated at the limits of the full chip design requirements, including in particular a measurement of the activity-induced current of the chip as a function of increasing hit rate.

Le Pottier, L↗
DOE OSTI2025

High-energy X-ray imaging with a Germanium MM-PAD hybrid pixel detector

Germanium is a high-Z sensor material with excellent energy resolution and attractive properties for high-energy photon detection. Despite its advantages, the need for cryogenic operation and challenges in the fabrication of pixelated high-purity germanium have hindered the development of segmented detectors. We report on the fabrication and performance of a germanium imaging detector with 150 μm pixel pitch hybridized to the MM-PAD ASIC. The detector was capable of high-resolution radiographic imaging and has a fast temporal response. Additionally, we describe the detector's upper operating temperature limits using both the MM-PAD and MARS ASICs, achieving stable operation up to 130 K and 190 K, respectively.

36 MATERIALS SCIENCE↗
DOE OSTI2024

Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors

The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a ${15} \times {15}~\mu $ m2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of $0.15\text {e}^ - $ , demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2019

Design and Evaluation of a Pixelated PSD-capable Scintillator Detector with SiPM Readout

We present the detector response comparison between a 10x10 pixellated array of scintillator read out with Anger logic using four 2" Hamamatsu R7724-100 super bialkali photomultiplier tubes (PMT) and a custom Silicon photomultiplier (SiPM) board consisting of 100 C-series 6x6 mm SiPMs from SensL. An array of these pixellated detectors are currently used in the Neutron Coded Aperture (NCA) imaging system. The energy, timing and pulse shape discrimination response using both readout schemes are presented, along with an analysis of multiple scatter events occurring within the block. An evaluation of the impact of photodetector readout on the overall detection efficiency and imaging accuracy is presented.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2021

2021 GeoAI Workshop Report: The Trillion Pixel Challenge

The convergence of geospatial big data with advancements from artificial intelligence, cloud infrastructure, and high-performance computing continues to revolutionize mapping and analysis of Earth's surface in unprecedented detail. Rapid innovations in sensing technologies will soon collect geospatial data in even higher resolution and throughput. These developments offer the potential for breakthroughs in science, policy, and national security via end-to-end GeoAI systems that can provide fresh insights into how humans occupy and alter their environment over time. At the 2021 GeoAI Trillion Pixel workshop, international subject matter experts from government, academia, industry, and nonprofit organizations gathered virtually to discuss the Trillion Pixel GeoAI Challenge. The event focused on six major themes currently influencing scientific innovation and breakthroughs. Particular focus was paid to societal impacts. As an additional takeaway message, the gathering identified remaining application gaps and challenges that are in need of stronger community partnerships and collaborations.

58 GEOSCIENCES↗
DOE OSTI2023

A self-certifying FPGA based pixel readout chip test system for CMS ETL upgrade

A flexible self-certifying pixel readout test system for testing the Endcap Timing Read-Out Chip (ETROC) has been developed for the CMS MIP Timing Detector (MTD), part of the upgrade for the HL-LHC. The system includes an FPGA-based (Xilinx KC705) test system that can take data from an emulator or up to four ETROC boards in telescope mode. A python based DAQ system simplifies configuration, calibration, and testing of the chips. The system provides an efficient & reliable solution for testing ETROC (ETROC2 since April 2023 with 16x16 pixels, full-size, full functionality prototype) and can be extended to other readout chips with similar architecture (AIDA integration is currently being explored).

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2023

Smart Pixels: towards on-sensor inference of charged particle track parameters and uncertainties

The combinatorics of track seeding has long been a computational bottleneck for triggering and offline computing in High Energy Physics (HEP), and remains so for the HL-LHC. Next-generation pixel sensors will be sufficiently fine-grained to determine angular information of the charged particle passing through from pixel-cluster properties. This detector technology immediately improves the situation for offline tracking, but any major improvements in physics reach are unrealized since they are dominated by lowest-level hardware trigger acceptance. We will demonstrate track angle and hit position prediction, including errors, using a mixture density network within a single layer of silicon as well as the progress towards and status of implementing the neural network in hardware on both FPGAs and ASICs.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2024

Smart Pixel Sensors for the HL-LHC

Large-scale particle physics experiments produce tens of terabytes of data every second. Innovative methods to manage the data rate at the HL-LHC, which expects to operate at 10x the luminosity of what the LHC was initially designed for, are needed. AI-on the chip provides a way to intelligently filter out low momentum clusters in the pixel detector. This will open up an opportunity to use the pixel detector for the first time in the CMS Level-1 trigger, and lead to increased sensitivity to new physics measurements and searches. We have taped out our first chip, which incorporates a $p_T$ filtering algorithm on an ASIC chip. Our initial $p_T$ filtering algorithm considers clusters that are tracked by CMS. We will report on ongoing studies seeking to enhance the performance of our filter by utilizing unsupervised learning on untracked clusters, thus increasing background rejection.

43 PARTICLE ACCELERATORS↗