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At least 289 records · Page 16

Packaging, deployment, and panel design concepts for a truss-stiffened 7-panel precision deployable reflector with feed boom

A concept is presented for achieving a remotely deployable truss-stiffened reflector consisting of seven integrated sandwich panels that form the reflective surface, and an integrated feed boom. The concept has potential for meeting aperture size and surface precision requirements for some high-frequency microwave remote sensing applications. The packaged reflector/feed boom configuration is a self-contained unit that can be conveniently attached to a spacecraft bus. The package has a cylindrical envelope compatible with typical launch vehicle shrouds. Dynamic behavior of a deployed configuration having a 216-inch focal length and consisting of 80-inch-diameter, two-inch-thick panels is examined through finite-element analysis. Results show that the feed boom and spacecraft bus can have a large impact on the fundamental frequency of the deployed configuration. Two candidate rib-stiffened sandwich panel configurations for this application are described, and analytical results for panel mass and stiffness are presented. Results show that the addition of only a few rib stiffeners, if sufficiently deep, can efficiently improve sandwich panel stiffness.

Heard, Walter L., Jr.↗

Design and evaluation of brushless electrical generators

Ten design manuals assembled and nine computer programs are developed for evaluation of proposed designs of brushless rotating electrical generators. Design manual package provides all information required for generator design, and computer programs permit calculation of performance of specific designs including effects of materials.

Collins, F. A.↗

National Oceanic and Atmospheric Administration /NOAA/ contamination monitoring instrumentation

The JPL has designed and built a plume contamination monitoring package to be installed on a NOAA environmental services satellite. The package is designed to monitor any condensible contamination that occurs during the ignition and burn of a TE-M-364-15 apogee kick motor. The instrumentation and system interface are described, and attention is given to preflight analysis and test.

Maag, C. R.↗

OPTICON: Pro-Matlab software for large order controlled structure design

A software package for large order controlled structure design is described and demonstrated. The primary program, called OPTICAN, uses both Pro-Matlab M-file routines and selected compiled FORTRAN routines linked into the Pro-Matlab structure. The program accepts structural model information in the form of state-space matrices and performs three basic design functions on the model: (1) open loop analyses; (2) closed loop reduced order controller synthesis; and (3) closed loop stability and performance assessment. The current controller synthesis methods which were implemented in this software are based on the Generalized Linear Quadratic Gaussian theory of Bernstein. In particular, a reduced order Optimal Projection synthesis algorithm based on a homotopy solution method was successfully applied to an experimental truss structure using a 58-state dynamic model. These results are presented and discussed. Current plans to expand the practical size of the design model to several hundred states and the intention to interface Pro-Matlab to a supercomputing environment are discussed.

Peterson, Lee D.↗

Device and Container for Reheating and Sterilization

Long-duration space missions require the development of improved foods and novel packages that do not represent a significant disposal issue. In addition, it would also be desirable if rapid heating technologies could be used on Earth as well, to improve food quality during a sterilization process. For this purpose, a package equipped with electrodes was developed that will enable rapid reheating of contents via ohmic heating to serving temperature during space vehicle transit. Further, the package is designed with a resealing feature, which enables the package, once used, to contain and sterilize waste, including human waste for storage prior to jettison during a long-duration mission. Ohmic heating is a technology that has been investigated on and off for over a century. Literature indicates that foods processed by ohmic heating are of superior quality to their conventionally processed counterparts. This is due to the speed and uniformity of ohmic heating, which minimizes exposure of sensitive materials to high temperatures. In principle, the material may be heated rapidly to sterilization conditions, cooled rapidly, and stored. The ohmic heating device herein is incorporated within a package. While this by itself is not novel, a reusable feature also was developed with the intent that waste may be stored and re-sterilized within the packages. These would then serve a useful function after their use in food processing and storage. The enclosure should be designed to minimize mass (and for NASA's purposes, Equivalent System Mass, or ESM), while enabling the sterilization function. It should also be electrically insulating. For this reason, Ultem high-strength, machinable electrical insulator was used.

Sastry, Sudhir K.↗

Lessons Learned from the Flight Unit Testing of the Near Earth Asteroid Scout Flight System

The Near Earth Asteroid Scout flight mission is set to launch on the maiden voyage of the Space Launch System as a secondary payload. The spacecraft will be jettisoned in cis-lunar space and embark on an ambitious 2.5 year mission to image an asteroid. The spacecraft is uniquely equipped with an 85m2 solar sail as the main propulsion system. The monolithic sail system is designed to package within a 6U volume for launch and then deploy during flight. The NEA Scout team has presented in the past to the International Symposium on Solar Sailing topics related to the engineering development unit and design efforts to achieve flight hardware build. This paper will focus on the lessons learned from building and testing the NEA Scout flight system. Focus will be on the mechanical, software, and electrical interfaces as well as preparation for subsystem environmental tests, including thermal vacuum. Due to the unique design of the spacecraft, the solar sail subsystem was required to be located in the center of the spacecraft. This requirement lead to design challenges such as designing and accommodating critical cable harnesses to run through the center of the sail subsystem, packaging and deployment design of the sail subsystem, and integrated testing efforts through an avionics test bed to verify and validate a complete system architecture.

Lockett, Tiffany Russell↗

Packaging printed circuit boards: A production application of interactive graphics

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Perrill, W. A.↗

Packaging of electronic modules

Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.

Katzin, L.↗

Signal processing of anthropometric data

The Anthropometric Measurements Laboratory has accumulated a large body of data from a number of previous experiments. The data is very noisy, therefore it requires the application of some signal processing schemes. Moreover, it was not regarded as time series measurements but as positional information; hence, the data is stored as coordinate points as defined by the motion of the human body. The accumulated data defines two groups or classes. Some of the data was collected from an experiment designed to measure the flexibility of the limbs, referred to as radial movement. The remaining data was collected from experiments designed to determine the surface of the reach envelope. An interactive signal processing package was designed and implemented. Since the data does not include time this package does not include a time series element. Presently the results is restricted to processing data obtained from those experiments designed to measure flexibility.

Zimmermann, W. J.↗

Adjustable Support For Instrument Package

Strong, lightweight structure designed to support instrument package. Provides choice of attachment locations to accommodate variety of sizes and shapes. Composed of seven webbed metal parts. Honeycomb panels cover vertical sides of structure. Instrumentation package, such as telescope or infrared sensor, bolted to top of structure. Accompanying electronics boxes mounted on inside surfaces of panels. Weight of instrumentation carried in direct paths through webbed members to base plate. Structure used for submillimeter-wave astronomy satellite.

Sneiderman, Gary↗

RI 1170 advanced strapdown gyro

The major components of the RI 1170 gyroscope are described. A detailed functional description of the electronics including block diagrams and photographs of output waveshapes within the loop electronics are presented. An electronic data flow diagram is included. Those gyro subassemblies that were originally planned and subsequently changed or modified for one reason or another are discussed in detail. Variations to the original design included the capacitive pickoffs, torquer flexleads, magnetic suspension, gas bearings, electronic design, and packaging. The selection of components and changes from the original design and components selected are discussed. Device failures experienced throughout the program are reported and design corrections to eliminate the failure modes are noted. Major design deficiencies such as those of the MSE electronics are described in detail. Modifications made to the gas bearing parts and design improvements to the wheel are noted. Changes to the gas bearing prints are included as well as a mathematical analysis of the 1170 gas bearing wheel by computer analysis. The mean free-path effects on gas bearing performance is summarized.

Source record↗

Thermal Interface Materials Selection and Application Guidelines: In Perspective of Xilinx Virtex-5QV Thermal Management

The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.

Suh, Jong-ook↗

Thermal interface materials selection and application guidelines: in perspective of Xilinx Virtex-5QV thermal management

The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device.

Tseng, Stephen↗

Ionospheric Specifications for SAR Interferometry (ISSI)

The ISSI software package is designed to image the ionosphere from space by calibrating and processing polarimetric synthetic aperture radar (PolSAR) data collected from low Earth orbit satellites. Signals transmitted and received by a PolSAR are subject to the Faraday rotation effect as they traverse the magnetized ionosphere. The ISSI algorithms combine the horizontally and vertically polarized (with respect to the radar system) SAR signals to estimate Faraday rotation and ionospheric total electron content (TEC) with spatial resolutions of sub-kilometers to kilometers, and to derive radar system calibration parameters. The ISSI software package has been designed and developed to integrate the algorithms, process PolSAR data, and image as well as visualize the ionospheric measurements. A number of tests have been conducted using ISSI with PolSAR data collected from various latitude regions using the phase array-type L-band synthetic aperture radar (PALSAR) onboard Japan Aerospace Exploration Agency's Advanced Land Observing Satellite mission, and also with Global Positioning System data. These tests have demonstrated and validated SAR-derived ionospheric images and data correction algorithms.

Pi, Xiaoqing↗

Volatile Analyzer for Lunar Polar Missions

One of the major questions remaining for the future exploration of the Moon by humans concerns the presence of volatiles on our nearest neighbor in space. Observational studies, and investigations involving returned lunar samples and using robotic spacecraft infer the existence of volatile compounds particularly water [1]. It seems very likely that a volatile component will be concentrated at the poles in circumstances where low-temperatures exist to provide cryogenic traps. However, the full inventory of species, their concentration and their origin and sources are unknown. Of particular importance is whether abundances are sufficient to act as a resource of consumables for future lunar expeditions especially if a long-term base involving humans is to be established. To address some of these issues requires a lander designed specifically for operation at a high-lunar latitude. A vital part of the payload needs to be a volatile analyzer such as the Gas Analysis Package specifically designed for identification quantification of volatile substances and collecting information which will allow the origin of these volatiles to be identified [1]. The equipment included, particularly the gas analyzer, must be capable of operation in the extreme environmental conditions to be encountered. No accurate information yet exists regarding volatile concentration even for sites closer to the lunar equator (because of contamination). In this respect it will be important to understand (and thus limit) contamination of the lunar surface by extraneous material contributed from a variety of sources. The only data for the concentrations of volatiles at the poles comes from orbiting spacecraft and whilst the levels at high latitudes may be greater than at the equator, the volatile analyzer package under consideration will be designed to operate at the highest specifications possible and in a way that does not compromise the data.

Gibons, Everett K.↗

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

Ngo, Quoc↗

Alloy Design Workbench-Surface Modeling Package Developed

NASA Glenn Research Center's Computational Materials Group has integrated a graphical user interface with in-house-developed surface modeling capabilities, with the goal of using computationally efficient atomistic simulations to aid the development of advanced aerospace materials, through the modeling of alloy surfaces, surface alloys, and segregation. The software is also ideal for modeling nanomaterials, since surface and interfacial effects can dominate material behavior and properties at this level. Through the combination of an accurate atomistic surface modeling methodology and an efficient computational engine, it is now possible to directly model these types of surface phenomenon and metallic nanostructures without a supercomputer. Fulfilling a High Operating Temperature Propulsion Components (HOTPC) project level-I milestone, a graphical user interface was created for a suite of quantum approximate atomistic materials modeling Fortran programs developed at Glenn. The resulting "Alloy Design Workbench-Surface Modeling Package" (ADW-SMP) is the combination of proven quantum approximate Bozzolo-Ferrante-Smith (BFS) algorithms (refs. 1 and 2) with a productivity-enhancing graphical front end. Written in the portable, platform independent Java programming language, the graphical user interface calls on extensively tested Fortran programs running in the background for the detailed computational tasks. Designed to run on desktop computers, the package has been deployed on PC, Mac, and SGI computer systems. The graphical user interface integrates two modes of computational materials exploration. One mode uses Monte Carlo simulations to determine lowest energy equilibrium configurations. The second approach is an interactive "what if" comparison of atomic configuration energies, designed to provide real-time insight into the underlying drivers of alloying processes.

Abel, Phillip B.↗