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At least 289 records · Page 16

Wavelength-independent anti-interference coating for the far-infrared

The transmission and reflection of radiation at an interface between two dielectrics with a thin conducting film is analyzed under conditions appropriate to the far-infrared. When the transmission is from a more dense to a less dense optical medium it is demonstrated that the reflectivity can be made arbitrarily small for a wide range of wavelengths by selecting the appropriate sheet resistance for the conducting film. This property can be exploited to produce a coating that drastically reduces the interference fringes in a flat plane-parallel dielectric substrate or window. The condition depends only on the film resistance which can be monitored precisely during deposition. This effect is demonstrated by evaporating films of nichrome on silicon substrates, which reduce the interference fringe contrast to less than 1 percent transmittance from 10-100/cm. Near the antiinterference condition the fringe contrast is shown to be a sensitive probe of the film conductivity.

Mcknight, S. W.↗

The platinum microelectrode/Nafion interface - An electrochemical impedance spectroscopic analysis of oxygen reduction kinetics and Nafion characteristics

The objectives of this study were to use electrochemical impedance spectroscopy (EIS) to study the oxygen-reduction reaction under lower humidification conditions than previously studied. The EIS technique permits the discrimination of electrode kinetics of oxygen reduction, mass transport of O2 in the membrane, and the electrical characteristics of the membrane. Electrode-kinetic parameters for the oxygen-reduction reaction, corrosion current densities for Pt, and double-layer capacitances were calculated. The production of water due to electrochemical reduction of oxygen greatly influenced the EIS response and the electrode kinetics at the Pt/Nafion interface. From the finite-length Warburg behavior, a measure of the diffusion coefficient of oxygen in Nafion and diffusion-layer thickness was obtained. An analysis of the EIS data in the high-frequency domain yielded membrane and interfacial characteristics such as ionic conductivity of the membrane, membrane grain-boundary capacitance and resistance, and uncompensated resistance.

Parthasarathy, Arvind↗

3D Printing and Surface Engineering of Ti6Al4V Scaffolds for Enhanced Osseointegration in an In Vitro Study

Ti6Al4V superalloy is recognized as a good candidate for bone implants owing to its biocompatibility, corrosion resistance, and high strength-to-weight ratio. While dense metal implants are associated with stress shielding issues due to the difference in densities, stiffness, and modulus of elasticity compared to bone tissues, the surface of the implant/scaffold should mimic the properties of the bone of interest to assure a good integration with a strong interface. In this study, we investigated the additive manufacturing of porous Ti6Al4V scaffolds and coating modification for enhanced osteoconduction using osteoblast cells. The results showed the successful fabrication of porous Ti6Al4V scaffolds with adequate strength. Additionally, the surface treatment with NaOH and Dopamine Hydrochloride (DOPA) promoted the formation of Dopamine Hydrochloride (DOPA) coating with an optimized coating process, providing an environment that supports higher cell viability and growth compared to the uncoated Ti6Al4V scaffolds, as demonstrated by the higher proliferation ratios observed from day 1 to day 29. These findings bring valuable insights into the surface modification of 3D-printed scaffolds for improved osteoconduction through the coating process in solutions.

metal additive manufacturing↗

Sources of Uncertainty in Ultrasonic Phase-Based Assessment of Interfacial Stiffness in Adhesive Joints

Quantitative nondestructive evaluation (NDE) of adhesive joint strength is critical for certifying fastener-free bonded aerospace structures. Unfortunately, available adhesive NDE approaches are only suitable for detecting gross defects and delamination and cannot reliably detect variations in strength in intact bonds. Intact (i.e., nominally defect free) bonds are challenging to inspect because they, by definition, contain no macroscopic defects that would produce a strong NDE signature. Even in the absence of obvious defects, however, bond strength can vary substantially due to factors such as contamination, variations in the adhesive cure processes, and environmental exposure. For ultrasonic bond inspections, the effect of interactions from an imperfect adhesive interface are subtle and may include changes in the frequency content or phase of the ultrasonic signal. The bond condition can be deduced from these subtle changes in the acoustic response using an accompanying physics-based model of adhesive joint interaction. For example, researchers have used the spring network adhesion model of Baik and Thompson [1] to determine the interfacial stiffness of the joint from its ultrasonic response (e.g., [2]). This interfacial stiffness metric describes the bonds resistance to separation between the adhesive and adherent and has shown a strong correlation with joint strength. In this study, interfacial stiffness is assessed using the ultrasonic phase change associated with bond interaction in varying bond conditions. The phase change is measured precisely using a phase-locked-loop instrument over a swept range of frequencies. The phase transition at resonance, where the bond thickness is half the acoustic wavelength, produces a unique signature with which to fit a physics-based model. Interfacial stiffness is determined by minimizing the difference between the theoretical and experimental phase response. Experimental results are presented for glass specimens bonded with aerospace adhesives and a sensitivity analysis is performed to examine the effects of parameters that may be uncertain in the industrial inspection environment – namely bond thickness, adhesive and adherent properties, and porosity. The results are a first step toward an uncertainty quantified version of the measurement technique, show correlation between interfacial stiffness and bond strength, and are another key step toward maturing this approach for use in complex materials and joint geometries. [1] Baik, J.M. and Thompson, R.B., 1984. “Ultrasonic scattering from imperfect interfaces: a quasi-static model”. Journal of Nondestructive Evaluation, 4. [2] Haldren, H.A., Perey, D.F., Yost, W.T., Cramer, K.E., and Gupta, M.C., 2019. “Swept-frequency ultrasonic phase evaluation of adhesive bonding in tri-layer structures”. Journal of the Acoustical Society of America, 145.

Matt Webster↗

Strain gauge ambiguity sensor for segmented mirror active optical system

A system is described to measure alignment between interfacing edges of mirror segments positioned to form a segmented mirror surface. It serves as a gauge having a bending beam with four piezoresistive elements coupled across the interfaces of the edges of adjacent mirror segments. The bending beam has a first position corresponding to alignment of the edges of adjacent mirror segments, and it is bendable from the first position in a direction and to a degree dependent upon the relative misalignment between the edges of adjacent mirror segments to correspondingly vary the resistance of the strain guage. A source of power and an amplifier are connected in circuit with the strain gauge whereby the output of the amplifier varies according to the misalignment of the edges of adjacent mirror segments.

Wyman, C. L.↗

Properties of TiO2 thin films and a study of the TiO2-GaAs interface

Titanium dioxide (TiO2) films prepared by chemical vapor deposition were investigated in this study for the purpose of the application in the GaAs metal-insulator-semiconductor field-effect transistor. The degree of crystallization increases with the deposition temperature. The current-voltage study, utilizing an Al-TiO2-Al MIM structure, reveals that the d-c conduction through the TiO2 film is dominated by the bulk-limited Poole-Frenkel emission mechanism. The dependence of the resistivity of the TiO2 films on the deposition environment is also shown. The results of the capacitance-voltage study indicate that an inversion layer in an n-type substrate can be achieved in the MIS capacitor if the TiO2 films are deposited at a temperature higher than 275 C. A process of low temperature deposition followed by the pattern definition and a higher temperature annealing is suggested for device fabrications. A model, based on the assumption that the surface state densities are continuously distributed in energy within the forbidden band gap, is proposed to interpret the lack of an inversion layer in the Al-TiO2-GaAs MIS structure with the TiO2 films deposited at 200 C.

Chen, C. Y.↗

Air-ground interface: Surface waves, surface impedance and acoustic-to-seismic coupling coefficient

In atmospheric acoustics, the subject of surface waves has been an area of discussion for many years. The existence of an acoustic surface wave is now well established theoretically. The mathematical solution for spherical wave propagation above an impedance boundary includes the possibility of a contribution that possesses all the standard properties for a surface wave. Surface waves exist when the surface is sufficiently porous, relative to its acoustical resistance, that it can influence the airborne particle velocity near the surface and reduce the phase velocity of sound waves in air at the surface. This traps some of the sound energy in the air to remain near the surface as it propagates. Above porous grounds, the existence of surface waves has eluded direct experimental confirmation (pulse experiments have failed to show a separate arrival expected from the reduced phase speed) and indirect evidence for its existence has appeared contradictory. The experimental evidence for the existence of an acoustical surface wave above porous boundaries is reviewed. Recent measurements including pulse experiments are also described. A few years ago the acoustic impedance of a grass-covered surface was measured in the frequency range 30 to 300 Hz. Here, further measurements on the same site are discussed. These measurements include core samples, a shallow refractive survey to determine the seismic velocities, and measurements of the acoustic-to-seismic coupling coefficient.

Daigle, Gilles↗

Performance and impedance studies of thin, porous molybdenum and tungsten electrodes for the alkali metal thermoelectric converter

Columnar, porous, magnetron-sputtered molybdenum and tungsten films show optimum performance as alkali metal thermoelectric converter electrodes at thicknesses less than 1.0 micron when used with molybdenum or nickel current collector grids. Power densities of 0.40 W/sq cm for 0.5-micron molybdenum films at 1200 K and 0.35 W/sq cm for 0.5-micron tungsten films at 1180 K were obtained at electrode maturity after 40-90 h. Sheet resistances of magnetron sputter deposited films on sodium beta-double-prime-alumina solid electrolyte (BASE) substrates were found to increase very steeply as thickness is decreased below about 0.3-double-prime 0.4-micron. The ac impedance data for these electrodes have been interpreted in terms of contributions from the bulk BASE and the porous electrode/BASE interface. Voltage profiles of operating electrodes show that the total electrode area, of electrodes with thickness less than 2.0 microns, is not utilized efficiently unless a fairly fine (about 1 x 1 mm) current collector grid is employed.

Wheeler, B. L.↗

Extremely low nonalloyed and alloyed contact resistance using an InAs cap layer on InGaAs by molecular-beam epitaxy

Extremely low alloyed and nonalloyed ohmic contact resistances have been formed on n-type InAs/In(0.53)Ga(0.47)As/In(0.52)Al(0.48)As structures grown on InP(Fe) by molecular-beam epitaxy. To insure the accuracy of the small contact resistances measured, an extended transmission line model was used to extrapolate contact resistances from test patterns with multiple gap spacings varying from 1 to 20 microns. For a 150-A-thick InAs layer doped to 2 x 10 to the 18th/cu cm and a 0.1-micron-thick InGaAs layer doped to 1 x 10 to the 18th/cu cm, a specific contact resistance of 2.6 x 10 to the -8th ohm-asterisk sq cm was measured for the nonalloyed contact, while a resistance less than 1.7 x 10 to the -8th ohm-asterisk sq cm is reported for the alloyed contact. Conventional Au-Ge/Ni/Au was used for the ohmic metal contact and alloying was performed at 500 C for 50 s in flowing H2. Using a thermionic field emission model, the barrier height at the InAs/InGaAs interface was calculated to be 20 meV.

Peng, C. K.↗

Measurement of Temperature Fluctuations and Microscopic Growth Rates in a Silicon Floating Zone and Microgravity

A silicon crystal growth experiment has been accomplished using the floating-zone technique under microgravity on a sounding rocket (TEXUS 36). Measurements of temperature fluctuations in the silicon melt zone due to time dependent thermocapillary convection (Marangoni convection) and an observation of the microscopic growth rate were simultaneously performed during the experiment. Temperature fluctuations of about 0.5 - 0.7 C with a frequency range < 0.5Hz were detectable. The microscopic growth rate fluctuates considerably around the average growth rate of 1 mm/min: Growth rates up to 3 to 4mm/min, close to zero mm/min, as well as negative values (backmelting) were observed. Dopant striations are clearly visible in the Sb-doped crystal. They were characterized by Spreading Resistance measurements and Differential Interference Contrast microscopy. The frequencies of temperature fluctuations, microscopic growth rates, and the dopant inhomogeneities correspond quite well, with main frequencies between 0.1 and 0.3 Hz. 3D numerical simulations were performed to predict the optimum position of the temperature sensor, and the characteristic temperature amplitudes and frequencies. At a position 3.4mm above the interface and 1.4mm inside the melt, equivalent to the sensor tip position in the experiment, temperature fluctuations up to 1.8 C and frequencies ? 0.25Hz were found in the simulations.

Schweizer, Markus↗

Terrestrial geophysics in the SeaRISE project

Some areas of research in the SeaRISE project are briefly discussed. They are as follows: (1) Radar Sounding serves multiple purposes. The most general and obvious is mapping ice thickness and the surface and bedrock topography of the ice sheet. (2) The purpose of Seismic Shooting, in addition to water depth measurements on floating ice, is to provide information about the internal physical characteristics of the ice sheet, the rock beneath it, and the interface between the two. (3) Passive Seismic monitoring of microearthquakes can be used to study brittle fracture within the ice or the rock beneath it. Common parameters available from these studies are fault location, orientation, and displacement, as well as the size of the rupture area, stress drop, and energy released. (4) There is a large contrast in Electrical Resistivity between ice or permafrost on the one hand and liquid water or wet rock on the other hand. Thus, electrical resistivity profiles have the ability of revealing the depth to the melting point, whether it is found at the base of the ice or in the subglacial rock. (5) Gravity anomalies, especially combined with seismic measurements, are an effective tool for determining deeper crustal structure. Anomalies averaged over extensive areas are useful also for their potential to reveal isostatic imbalance, which is a measure of average glacial change over the last several hundred years.

Bentley, C. R.↗

NASA Tech Briefs, September 2004

Topics covered include: Brazing SiC/SiC Composites to Metals; Composite-Material Tanks with Chemically Resistant Liners; Thermally Conductive Metal-Tube/Carbon-Composite Joints; Improved BN Coatings on SiC Fibers in SiC Matrices; Iterative Demodulation and Decoding of Non-Square QAM; Measuring Radiation Patterns of Reconfigurable Patch Antennas on Wafers; Low-Cutoff, High-Pass Digital Filtering of Neural Signals; Further Improvement in 3DGRAPE; Ground Support Software for Spaceborne Instrumentation; MER SPICE Interface; Simulating Operation of a Planetary Rover; Analyzing Contents of a Computer Cache; Discrepancy Reporting Management System; Silicone-Rubber Microvalves Actuated by Paraffin; Hydraulic Apparatus for Mechanical Testing of Nuts; Heat Control via Torque Control in Friction Stir Welding; Manufacturing High-Quality Carbon Nanotubes at Lower Cost; Setup for Visual Observation of Carbon-Nanotube Arc Process; Solution Preserves Nucleic Acids in Body-Fluid Specimens; Oligodeoxynucleotide Probes for Detecting Intact Cells; Microwave-Spectral Signatures Would Reveal Concealed Objects; Digital Averaging Phasemeter for Heterodyne Interferometry; Optoelectronic Instrument Monitors pH in a Culture Medium; Imaging of gamma-Irradiated Regions of a Crystal; Photodiode-Based, Passive Ultraviolet Dosimeters; Discrete Wavelength-Locked External Cavity Laser; Flexible Shields for Protecting Spacecraft Against Debris; Part 2 of a Computational Study of a Drop-Laden Mixing Layer; Controllable Curved Mirrors Made from Single-Layer EAP Films; and Demonstration of a Pyrotechnic Bolt-Retractor System.

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Chip-on-Board Technology 1996 Year-end Report (Design, Manufacturing, and Reliability Study)

The major impetus for flight qualifying Chip-On-Board (COB) packaging technology is the shift in emphasis for space missions to smaller, better, and cheaper spacecraft and satellites resulting from the NASA New Millenium initiative and similar requirements in DoD-sponsored programs. The most important benefit that can potentially be derived from miniaturizing spacecraft and satellites is the significant cost saving realizable if a smaller launch vehicle may be employed. Besides the program cost saving, there are several other advantages to building COB-based space hardware. First, once a well-controlled process is established, COB can be low cost compared to standard Multi-Chip Module (MCM) technology. This cost competitiveness is regarded as a result of the generally greater availability and lower cost of Known Good Die (KGD). Coupled with the elimination of the first level of packaging (chip package), compact, high-density circuit boards can be realized with Printed Wiring Boards (PWB) that can now be made with ever-decreasing feature size in line width and via hole. Since the COB packaging technique in this study is based mainly on populating bare dice on a suitable multi-layer laminate substrate which is not hermetically sealed, die coating for protection from the environment is required. In recent years, significant improvements have been made in die coating materials which further enhance the appeal of COB. Hysol epoxies, silicone, parylene and silicon nitride are desirable because of their compatible Thermal Coefficient of Expansion (TCE) and good moisture resistant capability. These die coating materials have all been used in the space and other industries with varying degrees of success. COB technology, specifically siliconnitride coated hardware, has been flown by Lockheed on the Polar satellite. In addition, DARPA has invested a substantial amount of resources on MCM and COB-related activities recently. With COB on the verge of becoming a dominant player in DoD programs, DARPA is increasing its support of the availability of KGDs which will help decrease their cost. Aside from the various major developments and trends in the space and defense industries that are favorable to the acceptance and widespread use of'COB packaging technology, implementing COB can be appealing in other aspects. Since the interconnection interface is usually the weak link in a system, the overall circuit or system reliability may actually be improved because of the elimination of a level of interconnect/packaging at the chip. With COB, mixing packaging technologies is possible. Because some devices are only available in commercial plastic packages, populating a multi-layer laminate substrate with both bare dice and plastic-package parts is inevitable. Another attractive feature of COB is that re-workability is possible if die coating is applied only on the die top. This method allows local replacement of individual dice that were found to be defective instead of replacing an entire board. In terms of thermal management, unpackaged devices offer a shorter thermal resistance path than their packaged counterparts thereby improving thermal sinking and heat removal from the parts.

Le, Binh Q.↗

General Aviation Technology Conference, Hampton, VA, July 10-12, 1984, Technical Papers

The present conference on general aviation aircraft design considers the performance tradeoffs involved in two- and three-control surface aerodynamic configurations, wing design criteria for increased resistance to spins, the performance levels obtained by flight and wind tunnel tests of an 'electroimpulse' deicing system, and the chracteristics of lightning strikes experienced by the NASA F-106B research aircraft. Also considered are the application of speech recognition and synthesis systems to general aviation cockpits, control and display requirements for single-pilot Instrument Flight Rules, pilot interfacing with advanced avionics and automated cockpit systems, the feasibility of sidestick controllers for general aviation aircraft, the acoustic prediction methods incorporated by the NASA Generalized Advanced Propeller Analysis System, and the adhesively bonded structure of the Citation II business jet aircraft.

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An XPS study of the adherence of refractory carbide, silicide, and boride RF-sputtered wear-resistant coatings

Radio frequency sputtering was used to deposit refractory carbide, silicide, and boride coatings on 440-C steel substrates. Both sputter etched and pre-oxidized substrates were used and the films were deposited with and without a substrate bias. The composition of the coatings was determined as a function of depth by X-ray photoelectron spectroscopy combined with argon ion etching. Friction and wear tests were conducted to evaluate coating adherence. In the interfacial region there was evidence that bias may produce a graded interface for some compounds. Biasing, while generally improving bulk film stoichiometry, can adversely affect adherence by removing interfacial oxide layers. Oxides of all film constituents except carbon and iron were present in all cases but the iron oxide coverage was only complete on the preoxidized substrates. The film and iron oxides were mixed in the MoSi2 and Mo2C films but layered in the Mo2B5 films. In the case of mixed oxides, preoxidation enhanced film adherence. In the layered case it did not.

Brainard, W. A.↗

Rates and processes of crystal growth in the system anorthite-albite

The growth rates and interface morphologies of crystals of synthetic compositions in the anorthite (CaAl2Si2O8)-albite (NaAlSi3O8) plagioclase feldspar system are measured in an investigation of the crystallization of igneous rocks. Mixed plagioclase glasses with compositions of 75% and 50% anorthite were observed using the microscope heating technique as they crystallized at temperatures near the liquidus, and 75%, 50% and 20% anorthite crystals were treated by resistance heating and observed at greater degrees of undercooling. Growth rates were found to be independent of time and to decrease with increasing albite content, ranging from 0.5 to 2 x 10 to the -5th cm/min. The crystal morphologies for all compositions are faceted near the liquidus and become progressively skeletal, dendritic and fibrillar with increasing undercooling.

Kirkpatrick, R. J.↗

NASA Tech Briefs, June 2008

Topics covered include: Charge-Control Unit for Testing Lithium-Ion Cells; Measuring Positions of Objects Using Two or More Cameras; Lidar System for Airborne Measurement of Clouds and Aerosols; Radiation-Insensitive Inverse Majority Gates; Reduced-Order Kalman Filtering for Processing Relative Measurements; Spaceborne Processor Array; Instrumentation System Diagnoses a Thermocouple; Chromatic Modulator for a High-Resolution CCD or APS; Commercial Product Activation Using RFID; Cup Cylindrical Waveguide Antenna; Aerobraking Maneuver (ABM) Report Generator; ABM Drag_Pass Report Generator; Transformation of OODT CAS to Perform Larger Tasks; Visualization Component of Vehicle Health Decision Support System; Mars Reconnaissance Orbiter Uplink Analysis Tool; Problem Reporting System; G-Guidance Interface Design for Small Body Mission Simulation; DSN Scheduling Engine; Replacement Sequence of Events Generator; Force-Control Algorithm for Surface Sampling; Tool for Merging Proposals Into DSN Schedules; Micromachined Slits for Imaging Spectrometers; Fabricating Nanodots Using Lift-Off of a Nanopore Template; Making Complex Electrically Conductive Patterns on Cloth; Special Polymer/Carbon Composite Films for Detecting SO2; Nickel-Based Superalloy Resists Embrittlement by Hydrogen; Chemical Passivation of Li+-Conducting Solid Electrolytes; Organic/Inorganic Polymeric Composites for Heat-Transfer Reduction; Composite Cathodes for Dual-Rate Li-Ion Batteries; Improved Descent-Rate Limiting Mechanism; Alignment-Insensitive Lower-Cost Telescope Architecture; Micro-Resistojet for Small Satellites; Using Piezoelectric Devices to Transmit Power through Walls; Miniature Latching Valve; Apparatus for Sampling Surface Contamination; Novel Species of Non-Spore-Forming Bacteria; Chamber for Aerosol Deposition of Bioparticles; Hyperspectral Sun Photometer for Atmospheric Characterization and Vicarious Calibrations; Dynamic Stability and Gravitational Balancing of Multiple Extended Bodies; Simulation of Stochastic Processes by Coupled ODE-PDE; Cluster Inter-Spacecraft Communications; Genetic Algorithm Optimizes Q-LAW Control Parameters; Low-Impact Mating System for Docking Spacecraft; Non-Destructive Evaluation of Materials via Ultraviolet Spectroscopy; Gold-on-Polymer-Based Sensing Films for Detection of Organic and Inorganic Analytes in the Air; and Quantum-Inspired Maximizer.

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NASA Tech Briefs, April 2013

Topics covered include: Fully Integrated, Miniature, High-Frequency Flow Probe Utilizing MEMS Leadless SOI Technology; Nanoscale Surface Plasmonics Sensor With Nanofluidic Control; Advanced Dispersed Fringe Sensing Algorithm for Coarse Phasing Segmented Mirror Telescopes; Neural Network Back-Propagation Algorithm for Sensing Hypergols; Bulk Moisture and Salinity Sensor; Change-Based Satellite Monitoring Using Broad Coverage and Targetable Sensing; Circularly Polarized Microwave Antenna Element with Very Low Off-Axis Cross-Polarization; Ultra-Low Heat-Leak, High-Temperature Superconducting Current Leads for Space Applications; Flash Cracking Reactor for Waste Plastic Processing; An Automated Safe-to-Mate (ASTM) Tester; Wireless Chalcogenide Nanoionic-Based Radio-Frequency Switch; Compute Element and Interface Box for the Hazard Detection System; DOT Transmit Module; Composite Aerogel Multifoil Protective Shielding; Li-Ion Electrolytes with Improved Safety and Tolerance to High-Voltage Systems; Polymer-Reinforced, Non-Brittle, Lightweight Cryogenic Insulation; Controlled, Site-Specific Functionalization of Carbon Nanotubes with Diazonium Salts; Regenerable Sorbent for CO2 Removal; Sprayable Aerogel Bead Compositions With High Shear Flow Resistance and High Thermal Insulation Value; Lexan Linear Shaped Charge Holder with Magnets and Backing Plate; Robotic Ankle for Omnidirectional Rock Anchors; Wind, Wave, and Tidal Energy Without Power Conditioning; An Active Heater Control Concept to Meet IXO Type Mirror Module Thermal-Structural Distortion Requirement; Waterless Clothes-Cleaning Machine; Integrated Electrical Wire Insulation Repair System; LVGEMS Time-of-Flight Mass Spectrometry on Satellites; Surface Inspection Tool for Optical Detection of Surface Defects; Per-Pixel, Dual-Counter Scheme for Optical Communications; Certification-Based Process Analysis; Surface Navigation Using Optimized Waypoints and Particle Swarm Optimization; Smart-Divert Powered Descent Guidance to Avoid the Backshell Landing Dispersion Ellipse; Estimating Foreign-Object-Debris Density from Photogrammetry Data; Adaptive Sampling of Spatiotemporal Phenomena with Optimization Criteria; Building a 2.5D Digital Elevation Model From 2D Imagery; Eyes on the Earth 3D; Target Trailing With Safe Navigation for Maritime Autonomous Surface Vehicles; Adams-Based Rover Terramechanics and Mobility Simulator - ARTEMIS; ISTP CDF Skeleton Editor; Uplink Summary Generator (ULSGEN) Version 1.0; Robotics On-Board Trainer (ROBoT); Software Engineering Tools for Scientific Models; Automatic Data Filter Customization Using a Genetic Algorithm; Tracker Toolkit; Towards Efficient Scientific Data Management Using Cloud Storage; On a Formal Tool for Reasoning About Flight Software Cost Analysis; A Nanostructured Composites Thermal Switch Controls Internal and External Short Circuit in Lithium Ion Batteries; Spacecraft Crew Cabin Condensation Control; and Functional Near-Infrared Spectroscopy Signals Measure Neuronal Activity in the Cortex.

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