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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 289 records · Page 16
All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

Enhancing 300 Degree Celsius Electronic Packaging with Ceramic PCBs and Advanced Interconnection Techniques

Geothermal energy development requires downhole tools that operate reliably at temperatures up to 320 °C. While MWD tools work without thermal protection and logging tools use vacuum flasks for limited high-temperature use, Sandia National Laboratories is developing durable electronics on ceramic PCBs with protective coatings to enable long-term operation of geothermal instruments at sustained temperatures up to 300 °C.

Wright, Andrew Alexander [Sandia National Laborato↗
DOE OSTI2022

Valuing Resilience Benefits of Microgrids for an Interconnected Island Distribution System

Extreme climate-driven events such as hurricanes, floods, and wildfires are becoming more intense in areas exposed to these threats, requiring approaches to improve the resilience of the electrical infrastructure serving these communities. Long-duration outages caused by such high impact events propagate to economic, health, and social consequences for communities. As essential service providers, electric utilities are mandated to provide safe, economical and reliable electricity to their customers. The public is becoming less tolerant to these more frequent disruptions, especially in view of technological advances that are intended to improve power quality, reliability and resilience. One promising solution is state-of-the-art microgrids and the advanced controls employed therein. This paper presents and demonstrates an approach to technoeconomic analysis that can be used to value the avoided economic consequences of grid resilience investments, as applied to the islands of Vieques and Culebra in Puerto Rico. This valuation methodology can support policies to incorporate resilience value into any investment decision-making process, especially those which serve the public interest.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2026

Interconnect: Cooperative Research and Development Final Report, CRADA Number CRD-13-00507 (Project 4)

This CRADA modification involves analyses on a variety of CdTe-PV related materials, test structures, solar cells, and modules produced at FSLR and/or NLR and adds analysis related to module degradation and reliability. Materials will be provided by FSLR, NLR, and/or by interleaving FSLR and NLR layers and processes. Module reliability activities will include technical risk assessment, materials characterization, module and test structure characterization, modeling, accelerated test development, and outdoor testing.

14 SOLAR ENERGY↗
DOE OSTI2020

Credit based flow control mechanism for use in multiple link width interconnect systems

Flow control credit management is provided when converting traffic from a first parallel link width on a first link to a second parallel link width on a second link A current value is calculated for a variable flow control credit exchange rate (R) associated with the first and second links. A first flow control credit indicator is received on the second link, and a credit amount calculated based on the first flow control credit indicator and R. A second flow control credit indicator for the credit amount is then transmitted on the first link.

42 ENGINEERING↗
DOE OSTI2020

Evaluating Interconnection Schemes for Semi-Transparent Perovskite Mini-Modules

This work evaluates the critical issues surrounding P1, P2, and P3 scribing for semi-transparent perovskite module integration. We find that P1 scribing procedures are well-translated from other thin-film technologies. P2 scribing is best performed with a mechanical scribe, but remains a source of series resistance. P3 scribing is found to cause an increase in scribing dead area and a potential degradation source.

degradation↗
DOE OSTI2020

High-density fabric systems interconnected with multi-port aggregated cables

A multi-port aggregated cable includes: a plurality of duplex optical fibers, each duplex optical fiber having a first end and a second end; a first optical interface attached to each of the duplex optical fibers at the first end thereof and defining multiple ports, one for each of the duplex optical fibers, the first optical interface aggregating the duplex optical fibers at the first end thereof; and a second optical interface attached to each of the duplex optical fibers at the second end thereof and defining multiple ports, one for each of the duplex optical fibers, the second optical interface aggregating the duplex optical fibers at the second end thereof.

42 ENGINEERING↗
DOE OSTI2020

Circuit board interconnect decals

A circuit component decal comprising a transparent sheet and an opaque circuit pattern. The transparent sheet includes opposing top and bottom surfaces and a number of edges. The opaque circuit pattern includes an electronic component footprint and a number of circuit lead paths. The electronic component footprint includes a number of contact points representing the location of leads of the electronic component. The circuit lead paths extend from the contact points to the edges of the transparent sheet. The opaque circuit pattern corresponds to only a section of a complete circuit pattern and is configured to block energy from reaching a first portion of the intermediate substrate when the transparent sheet is positioned on the intermediate substrate so as to form the section of the complete circuit pattern.

42 ENGINEERING↗