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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 289 records · Page 16
All sourcesNASA NTRSDOE OSTI
NASA NTRS2007

A Symmetrical, Planar SOFC Design for NASA's High Specific Power Density Requirements

Solid oxide fuel cell (SOFC) systems for aircraft applications require an order of magnitude increase in specific power density (1.0 kW/kg) and long life. While significant research is underway to develop anode supported cells which operate at temperatures in the range of 650-800 C, concerns about Cr-contamination from the metal interconnect may drive the operating temperature down further, to 750 C and lower. Higher temperatures, 900-1000 C, are more favorable for SOFC stacks to achieve specific power densities of 1.0 kW/kg. Since metal interconnects are not practical at these high temperatures and can account for up to 75% of the weight of the stack, NASA is pursuing a design that uses a thin, LaCrO3-based ceramic interconnect that incorporates gas channels into the electrodes. The bi-electrode supported cell (BSC) uses porous YSZ scaffolds, on either side of a 10-20 microns electrolyte. The porous support regions are fabricated with graded porosity using the freeze-tape casting process which can be tailored for fuel and air flow. Removing gas channels from the interconnect simplifies the stack design and allows the ceramic interconnect to be kept thin, on the order of 50 -100 microns. The YSZ electrode scaffolds are infiltrated with active electrode materials following the high temperature sintering step. The NASA-BSC is symmetrical and CTE matched, providing balanced stresses and favorable mechanical properties for vibration and thermal cycling.

Cable, Thomas L.↗
NASA NTRS1992

Robot Serviced Space Facility

A robot serviced space facility includes multiple modules which are identical in physical structure, but selectively differing in function. and purpose. Each module includes multiple like attachment points which are identically placed on each module so as to permit interconnection with immediately adjacent modules. Connection is made through like outwardly extending flange assemblies having identical male and female configurations for interconnecting to and locking to a complementary side of another flange. Multiple rows of interconnected modules permit force, fluid, data and power transfer to be accomplished by redundant circuit paths. Redundant modules of critical subsystems are included. Redundancy of modules and of interconnections results in a space complex with any module being removable upon demand, either for module replacement or facility reconfiguration. without eliminating any vital functions of the complex. Module replacement and facility assembly or reconfiguration are accomplished by a computer controlled articulated walker type robotic manipulator arm assembly having two identical end-effectors in the form of male configurations which are identical to those on module flanges and which interconnect to female configurations on other flanges. The robotic arm assembly moves along a connected set or modules by successively disconnecting, moving and reconnecting alternate ends of itself to a succession of flanges in a walking type maneuver. To transport a module, the robot keeps the transported module attached to one of its end-effectors and uses another flange male configuration of the attached module as a substitute end-effector during walking.

Purves, Lloyd R.↗
NASA NTRS1972

Study of the dynamics of orbital assemblies including interactions with geometrical appendages

The complete equations for the Unified Flexible Spacecraft Simulation (UFSS) program developed for the NASA/MSFC are presented. This general purpose simulation program is based on an algorithm which utilizes the digital computer to synthesize the dynamic and kinematic equations for a topological tree configuration of N interconnected bodies (the interconnected system of bodies forms no closed loops), the terminal members of which may be flexible. Necessary input quantities to the dynamic subroutine include the mass and inertia properties of each body and the flexible characteristics of each terminal member in addition to the specification, for each body, of those bodies to which it connects. This latter description involves the specification of the number of rotational degrees of freedom at each interconnection along with the associated position vectors defining these connections relative to the mass centers of the bodies involved. These position vectors can be input as time-varying functions if desired, thus affording the capability of studying the effects of time-varying hinge locations. Springs and dampers are assumed to act at each interconnection and structural damping in the flexible terminal members is included in the form of equivalent viscous damping.

Ness, D. J.↗
NASA NTRS1981

Voltage gradients in solar array cavities as possible breakdown sites in spacecraft-charging-induced discharges

A possible explanation for environmentally-induced discharges on geosynchronous satellites exists in the electric fields formed in the cavities between solar cells - the small gaps formed by the cover slides, solar cells, metallic interconnects and insulating substrate. When exposed to a substorm environment, the cover slides become less negatively charged than the spacecraft ground. If the resultant electric field becomes large enough, then the interconnect could emit electrons (probably by field emission) which could be accelerated to space by the positive voltage on the covers. An experimental study was conducted using a small solar array segment in which the interconnect potential was controlled by a power supply while the cover slides were irradiated by monoenergetic electrons. It was found that discharges could be triggered when the interconnect potential became at least 500 volts negative with respect to the cover slides. Analytical modeling of satellites exposed to substorm environments indicates that such gradients are possible. Therefore, it appears that this trigger mechanism for discharges is possible.

Stevens, N. J.↗
NASA NTRS1981

Voltage gradients in solar array cavities as possible breakdown sites in spacecraft-charging-induced discharges

A possible explanation for environmentally-induced discharges on geosynchronous satellites exists in the electric fields formed in the cavities between solar cells - the small gaps formed by the cover slides, solar cells, metallic interconnects and insulating substrate. When exposed to a substorm environment, the cover slides become less negatively charged than the spacecraft ground. Hence, it is possible for metallic surfaces (usually silver mesh) to be at a negative potential in a cavity that has a 'positive' surface above it. If the resultant electric field becomes large enough, then the interconnect could emit electrons (probably by field emission) which could be accelerated to space by the positive voltage on the covers. An experimental study was connected using a small solar array segment in which the interconnect potential was controlled by a power supply while the cover slides were irridated by monoenergetic electrons. It was found that discharges could be triggered when the interconnect potential became at least 500 volts negative with respect to the cover slides. Analytical modeling of satellites exposed to substorm environments indicates that such gradients are possible. Therefore, it appears that this trigger mechanism for discharges is possible. Details of the experiment and modeling study are presented.

Stevens, N. J.↗
NASA NTRS1990

Exploration of operator method digital optical computers for application to NASA

Digital optical computer design has been focused primarily towards parallel (single point-to-point interconnection) implementation. This architecture is compared to currently developing VHSIC systems. Using demonstrated multichannel acousto-optic devices, a figure of merit can be formulated. The focus is on a figure of merit termed Gate Interconnect Bandwidth Product (GIBP). Conventional parallel optical digital computer architecture demonstrates only marginal competitiveness at best when compared to projected semiconductor implements. Global, analog global, quasi-digital, and full digital interconnects are briefly examined as alternative to parallel digital computer architecture. Digital optical computing is becoming a very tough competitor to semiconductor technology since it can support a very high degree of three dimensional interconnect density and high degrees of Fan-In without capacitive loading effects at very low power consumption levels.

Source record↗
NASA NTRS1990

An efficient optical architecture for sparsely connected neural networks

An architecture for general-purpose optical neural network processor is presented in which the interconnections and weights are formed by directing coherent beams holographically, thereby making use of the space-bandwidth products of the recording medium for sparsely interconnected networks more efficiently that the commonly used vector-matrix multiplier, since all of the hologram area is in use. An investigation is made of the use of computer-generated holograms recorded on such updatable media as thermoplastic materials, in order to define the interconnections and weights of a neural network processor; attention is given to limits on interconnection densities, diffraction efficiencies, and weighing accuracies possible with such an updatable thin film holographic device.

Hine, Butler P., III↗
NASA NTRS1993

Climbing robot

A mobile robot for traversing any surface consisting of a number of interconnected segments, each interconnected segment having an upper 'U' frame member, a lower 'U' frame member, a compliant joint between the upper 'U' frame member and the lower 'U' frame member, a number of linear actuators between the two frame members acting to provide relative displacement between the frame members, a foot attached to the lower 'U' frame member for adherence of the segment to the surface, an inter-segment attachment attached to the upper 'U' frame member for interconnecting the segments, a power source connected to the linear actuator, and a computer/controller for independently controlling each linear actuator in each interconnected segment such that the mobile robot moves in a caterpillar like fashion.

Kerley, James J.↗
NASA NTRS2005

Fiber Optic Repair and Maintainability (FORM) Program Progresses

Advanced aircraft will employ fiber-optic interconnection components to transmit information from airframe and propulsion sensors to the flight control computers. Although these optical interconnects have been rigorously tested under laboratory conditions to determine their operating and environmental limits, there is concern as to their repairability and maintainability when placed in actual service. The Fiber Optic Repair and Maintainability (FORM) flight test program will provide data to enable designers to improve these fiber-optic interconnection systems for the next generation of aircraft. FORM is identifying critical problems in installing, maintaining, testing, and repairing fiber-optic interconnection systems in an operational avionics environment. This program is a cooperative Government/industry effort to evaluate optical component acceptability and installation techniques for aircraft.

Source record↗
NASA NTRS2011

NEXUS Scalable and Distributed Next-Generation Avionics Bus for Space Missions

A paper discusses NEXUS, a common, next-generation avionics interconnect that is transparently compatible with wired, fiber-optic, and RF physical layers; provides a flexible, scalable, packet switched topology; is fault-tolerant with sub-microsecond detection/recovery latency; has scalable bandwidth from 1 Kbps to 10 Gbps; has guaranteed real-time determinism with sub-microsecond latency/jitter; has built-in testability; features low power consumption (< 100 mW per Gbps); is lightweight with about a 5,000-logic-gate footprint; and is implemented in a small Bus Interface Unit (BIU) with reconfigurable back-end providing interface to legacy subsystems. NEXUS enhances a commercial interconnect standard, Serial RapidIO, to meet avionics interconnect requirements without breaking the standard. This unified interconnect technology can be used to meet performance, power, size, and reliability requirements of all ranges of equipment, sensors, and actuators at chip-to-chip, board-to-board, or box-to-box boundary. Early results from in-house modeling activity of Serial RapidIO using VisualSim indicate that the use of a switched, high-performance avionics network will provide a quantum leap in spacecraft onboard science and autonomy capability for science and exploration missions.

He, Yutao↗
NASA NTRS2017

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗
NASA NTRS1971

A 100,000 pulse height analyzer for use in High Energy Cosmic Ray Experiments (HECRE) on high altitude balloon flights

A description is given of a wide dynamic range pulse height analyzer system developed for use on High Energy Cosmic Ray Experiment (HECRE) Balloon Flights. A wide dynamic range of 100,000 is obtained by extending the range of a basic 1024 channel analyzer through the use of multiple ranges and range selection. The system described here contains four 100,000 pulse height analyzers. Each 100,000 pulse height analyzer consists of a group of cordwood welded modules mounted and interconnected on a printed circuit card. Four of these card assemblies, the required clock drive circuitry (discrete components mounted and interconnected on a separate card) and three input-output connectors are interconnected and mounted on the system board.

Cancro, C. A.↗
NASA NTRS1974

Design guidelines for advanced LSI microcircuit packaging using thick film multilayer technology

Ceramic multilayer circuitry results from the sequential build-up of two or more layers of pre-determined conductive interconnections separated by dielectric layers and fired at an elevated temperature to form a solidly fused structure. The resultant ceramic interconnect matrix is used as a base to mount active and passive devices and provide the necessary electrical interconnection to accomplish the desired electrical circuit. Many methods are known for developing multilevel conductor mechanisms such as multilayer printed circuits, welded wire matrices, flexible copper tape conductors, and thin and thick-film ceramic multilayers. Each method can be considered as a specialized field with each possessing its own particular set of benefits and problems. This design guide restricts itself to the art of design, fabrication and assembly of ceramic multilayer circuitry and the reliability of the end product.

Peckinpaugh, C. J.↗
NASA NTRS1974

ATM solar array in-flight performance analysis

The physical and electrical characteristics of the Apollo Telescope Mount (ATM) solar array are described and in-flight performance data are analyzed and compared with predicted results. Two solar cell module configurations were used. Type I module consists of 228 2 x 6 cm solar cells with two cells in parallel and 114 cells in series. Type II modules contain 684 2 x 2 cm cells with six cells in parallel and 114 cells in series. A different interconnection scheme was used for each type. Panels using type II modules with mesh interconnect system performed marginally better than those using type I module with loop interconnect system. The average degradation rate for the ATM array was 8.2% for a 271-day mission.

Thornton, J. P.↗
NASA NTRS1974

Properties criteria for components and materials used in lightweight solar arrays

The present work describes the characteristics and design criteria for components and materials used in lightweight substrate solar arrays. This includes descriptions of wraparound-electrode solar cells, cell covers, and cell interconnects. Cell cover systems briefly discussed are fused silica, cerium stabilized glass, microsheet, FEP (tape, heat laminated, and spray on), and ESB 7070 glass integral covers. The majority of solar arrays orbited have used either silver, Kovar, copper, or molybdenum as interconnect metals. Data are presented comparing the Young's modulus E, ultimate tensile strength, coefficient of expansion, thermal conductivity, and percent elongation of these and other interconnect candidate materials. Guidelines for the use of end tab wraparound cells are listed.

Lott, D. R.↗
NASA NTRS1983

Assembly of Photovoltaic Arrays

Vacuum holddown fixtures hold photovoltaic solar cells during assembly into array. Tab attachment fixture holds single cell and interconnecting tabs during heat-lamp soldering. Array-layout fixture has computer-scribed layout template and holds cells (with attached tabs) while being placed in position and transferred to array-interconnection fixture, which holds cells during final soldering step. Group of heat lamps on trolley passes slowly over interconnection fixture to heat cells to soldering temperature.

Coyle, P. J.↗
NASA NTRS1985

Beam forming network

The network, which is connected to a layer of 134 feed elements that transmit and receive microwaves, consists of a pair of circuit boards parallel to the feed element layer. One of the two boards has 87 dividers that each divide a signal to be transmitted into seven portions, and the other board has 134 combiners that each collect seven transmit signal portions and deliver the sum to one of the feed elements. A similar arrangement is used to handle received signals. The large number of interconnections are made by printed circuit conductors radiating from each of the numerous dividers and combiners, and by providing interconnection pins that interconnect the ends of pairs of conductors lying on the two boards. The printed circuit conductors extend in undulating paths that provide maximum separation of conductors to minimize crosstalk.

Cramer, P. W., Jr.↗
NASA NTRS1985

Amorphous silicon photovoltaic modules and test devices design, fabrication and testing

In July of 1984, Hughes and JPL initiated a contract for Hughes to design, fabricate and test 10 thin film Amorphous Silicon (a-Si) photovoltaic power modules. These modules were to be 1 ft x 4 ft in size. They were to be preceded by the delivery of 10 a-Si 4 in. square test devices. This effort is very timely since thin film PV development has progressed to the point where intermediate load power applications are on the horizon. It is important to know if current a-Si submodule design and manufacturing processes yield a product that is compatible with the packaging needed to meet a 20 to 30 year life span expectancy. The term submodule is assigned to an interconnected assembly of 28 a-Si cells deposited on a 1 foot square glass superstrate. These assemblies are equipped with electrical terminations, i.e., copper tabs at the four corners of the inverted submodules. It is these submodules that are to be interconnected and packaged into power modules, as opposed to the interconnected individual crystalline cells packaged into todays PV modules. A discussion of the fabrication methods and results follows.

Vanleeuwen, M.↗