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At least 289 records · Page 16

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DOE OSTI2025

PtCoO 2 for Scaled Interconnects

Copper (Cu) interconnects are an increasingly important bottleneck in integrated circuits due to energy consumption and latency caused by the notable increase in Cu resistivity as dimensions decrease, primarily due to electron scattering at surfaces. Herein, the potential of a directional conductor, PtCoO 2 , which has a low bulk resistivity and a distinctive anisotropic structure that mitigates electron surface scattering is showcased. Thin films of PtCoO 2 of various thicknesses are synthesized by molecular beam epitaxy (MBE) coupled with a postdeposition annealing process and the superior quality of PtCoO 2 films is demonstrated by multiple characterization techniques. The thickness‐dependent resistivity curve illustrates that PtCoO 2 significantly outperforms effective Cu (Cu with TaN barriers) and Ru in resistivity below 20.0 nm with a more than 6x reduction compared to effective Cu below 6.0 nm, having a value of only 6.32 μΩ cm at 3.3 nm. It is determined that grain boundary scattering can still be improved for even lower resistivities in this material system through a combination of experiments and theoretical simulations. PtCoO 2 is therefore a highly promising alternative material for future interconnect technologies promising lower resistivities, better stability, and significant improvements in energy efficiency and latency for advanced integrated circuits.

Li, Yansong [Department of Electrical Engineering ↗

DOE OSTI2019

In Situ Synthesis of 3D Interconnected Graphene-Reinforced Copper Composites

Graphene shows great potential in composite applications, but the performance of traditional graphene-metal composites is poorer than desired due to the uneven dispersion of graphene in the matrix. This study provides an effective method to grow high-quality graphene on the surface of 3D porous copper using a combination of chemical vapor deposition and spark plasma sintering to obtain a dense 3D-interconnected graphene/Cu composite. Transmission electron microscopy and scanning electron microscopy showed that graphene-coated copper and Raman analysis showed high-quality graphene. The tensile strength of the 3D graphene/Cu composite was 425 MPa, which is ~ 25% higher than that of pure Cu, and the coefficient of friction (0.33) is about 45% lower than that of pure Cu (0.58). The formation of high-quality 3D graphene interconnects in the Cu matrix results in a higher mechanical strength, better friction properties and superior electrical and thermal conductivity of the composite compared to those of pure Cu.

36 MATERIALS SCIENCE↗

DOE OSTI2020

Platinum nanometal interconnection of copper–carbon nanotube hybrid electrical conductors

This study demonstrates the versatility of Joule heating driven chemical vapor deposition to deposit nanometal interconnections into porous CNT roving with application in the production of high electrical conductivity copper-carbon nanotube (Cu-CNT) hybrids. Modifications of vapor deposition parameters allow for deposited nanometal masses from less than 5% w/w to over 85% w/w and distributions that can be controlled towards either hot-spot site-specificity or overall uniformity. Here, depositions of copper, platinum, nickel, palladium, ruthenium, rhodium, and iridium are demonstrated from acetylacetonate precursors. In particular, platinum acetylacetonate [Pt(acac) 2 ] deposits nanometal seeds that adhere tightly to the CNT roving, producing improvements in resistance and specific conductivity. The properties of the platinum deposition compared to the copper deposition motivate an investigation into its use as an interfacial layer for Cu-CNT hybrids. CNT conductors with ~30% w/w platinum are electroplated with copper, densified, and annealed to produce Cu-CNT hybrid conductors with specific conductivities as high as 5772 S m 2 /kg and TCR (from 300 to 600 K) as low as 3.12 × 10 –3 K –1 , indicating good interconnection of the metal and CNT portions. Room temperature conductivities of 29.8 MS/m are achieved, comparable to metallic conductors. Thus, Pt(acac) 2 seeded Cu-CNT hybrids offer abundant promise in high conductivity applications.

42 ENGINEERING↗

DOE OSTI2019

A three-dimensional interconnected polymer/ceramic composite as a thin film solid electrolyte

In this work we introduce an approach to fabricate a solid composite electrolyte film that is thin, ionically conductive, and mechanically robust with good potential for manufacturability, in the application of lithium metal batteries. First a doped-lithium aluminum titanium phosphate ceramic thin film with thickness of ~25 μm is formed by aqueous spray coating, a scalable process. The film is partially sintered to form a three-dimensionally interconnected structure with a dense backbone. It is then backfilled with a crosslinkable poly(ethylene oxide) (PEO)-based polymer electrolyte. We report the composite has very high ceramic loading of 77 wt% (61 vol%) and an ionic conductivity of 3.5 × 10 -5 S/cm at 20 °C with an activation energy of 0.43 eV. The main ion transport pathway is through the ceramic network, predicted by modelling and verified by experiments. Owing to the interconnected structure of the ceramic, the composite electrolyte exhibits much improved mechanical strength.

25 ENERGY STORAGE↗

DOE OSTI2019

A method to identify weak points of interconnection of renewable energy resources

The increasing penetration of renewable energy resources (RERs) is challenging power grid planning and operation in maintaining grid reliability. Potential power grid reliability and stability issues may arise when large-scale RERs are connected to a weak power grid. These issues may become more significant due to the mutual interactions among RERs that are interconnected electrically close through a power network. Weakness analysis based on grid strength assessment is useful for identifying the potential weak grid issues. However, when taking into account the impact of the interactions among RERs, the weakness analysis becomes computationally challenging. Different combinations of points of interconnections (POIs) of RERs may have different impacts on grid strength at each POI. Due to the combination nature, such weakness analysis may be time-consuming when identifying the weakest combination of POIs from a large number of potential candidates in realistic power grids. To address this concern, the impact of the power network structure on grid strength is analyzed in this paper. It is found that the impact mainly depends on the impedance ratios at POIs. The findings can be summarized as two criteria to develop a recursive method for fast identification of the weakest combination in this paper. The efficacy of the proposed method is demonstrated through case studies on the IEEE 39-bus system and a realistic power grid.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2020

3D Nanomagnetism in Low Density Interconnected Nanowire Networks

Free-standing, interconnected metallic nanowire networks with densities as low as 40 mg/cm 3 have been achieved over centimeter-scale areas, using electrodeposition into polycarbonate membranes that have been ion-tracked at multiple angles. Networks of interconnected magnetic nanowires further provide an exciting platform to explore 3-dimensional nanomagnetism, where their structure, topology, and frustration may be used as additional degrees of freedom to tailor the materials properties. New magnetization reversal mechanisms in cobalt networks are captured by the first-order reversal curve method, which demonstrate the evolution from strong demagnetizing dipolar interactions to intersection-mediated domain wall pinning and propagation, and eventually to shape-anisotropy dominated magnetization reversal. These findings open up new possibilities for 3-dimensional integrated magnetic devices for memory, complex computation, and neuromorphics.

36 MATERIALS SCIENCE↗

DOE OSTI2025

Monthly hydropower generation data for Western Canada to support Western-US interconnect power system studies

Hydroelectric power generation in Western Canada significantly contributes to power grid operations of the North American Western Interconnection through substantial generation, some of which is exported to the United States (U.S.). However, the lack of publicly available hydropower generation datasets poses challenges for future market projections and resource adequacy evaluations. We present a simulation-based monthly power system model-ready hydropower generation dataset for 110 facilities in British Columbia and Alberta from 1981 to 2019. These monthly hydropower generation estimates are developed from integrated hydrologic model simulations of runoff and reservoir-operated streamflow, followed by scaling that considers diversion inflow constraints based on hydropower water license information. To address the lack of comparable hydropower generation records, we conduct step-by-step evaluations for simulated runoff, regulated streamflow, and hydropower generation using available observations or estimates. The presented hydropower dataset aims to enhance the representation of hydropower resources in Western Canada, supporting power grid system studies for the Western Interconnection of the U.S. and Canada.

13 HYDRO ENERGY↗

DOE OSTI2014

In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

In-situ electromigration tests have been performed inside a scanning electron microscope on 30 nm wide single damascene interconnects without vias, where a good resolution was obtained and drift velocities during void growth could be measured at 300 °C. These tests showed direct evidence that the cathode end of the line, where a polycrystalline grain cluster encounters a bigger grain, can act as a flux divergent point of Cu diffusion. Moreover, it was found that a thicker barrier suppresses barrier/interface diffusivity of Cu atoms, thereby slowing down electromigration-induced void growth. It was also demonstrated that Cobalt based metal caps are beneficial to electromigration for advanced interconnects where thinner barriers are required.