Brush/Fin Thermal Interfaces
Brush/fin thermal interfaces are being developed to increase heat-transfer efficiency and thereby enhance the thermal management of orbital replaceable units (ORUs) of electronic and other equipment aboard the International Space Station. Brush/fin thermal interfaces could also be used to increase heat-transfer efficiency in terrestrial electronic and power systems. In a typical application according to conventional practice, a replaceable heat-generating unit includes a mounting surface with black-anodized metal fins that mesh with the matching fins of a heat sink or radiator on which the unit is mounted. The fins do not contact each other, but transfer heat via radiation exchange. A brush/fin interface also includes intermeshing fins, the difference being that the gaps between the fins are filled with brushes made of carbon or other fibers. The fibers span the gap between intermeshed fins, allowing heat transfer by conduction through the fibers. The fibers are attached to the metal surfaces as velvet-like coats in the manner of the carbon fiber brush heat exchangers described in the preceding article. The fiber brushes provide both mechanical compliance and thermal contact, thereby ensuring low contact thermal resistance. A certain amount of force is required to intermesh the fins due to sliding friction of the brush s fiber tips against the fins. This force increases linearly with penetration distance, reaching ~1 psi (~6.9 kPa) for full 2-in. (5.1 cm) penetration for the conventional radiant fin interface. Removal forces can be greater due to fiber buckling upon reversing the sliding direction. This buckling force can be greatly reduced by biasing the fibers at an angle perpendicularly to the sliding direction. Means of containing potentially harmful carbon fiber debris, which is electrically conductive, have been developed. Small prototype brush/fin thermal interfaces have been tested and found to exhibit temperature drops about onesixth of that of conventional meshing-fin thermal interface, when fabricated as a retrofit. In this case, conduction through the long, thin metal fins themselves becomes a thermal bottleneck. Further improvement could be made by prescribing aluminum fins to be shorter and thicker than those of the conventional meshing-fin thermal interfaces; the choice of height and thickness would be optimized to obtain greater overall thermal conductance, lower weight, and lower cost.