The Effect of Laser Scan Strategy on Distortion and Residual Stresses of Arches made with Selective Laser Melting
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The present disclosure relates to a method of producing a product through additive manufacturing with heat treatment. The method involves using a fusing beam to melt powder particles disposed on a substrate, where the fusing beam is impressed with a two dimensional pattern containing image information from a first layer to be printed. The fused powder particles are then heat treated with a beam impressed with an additional two dimensional pattern. The additional two dimensional pattern has image information from the first layer to achieve heat treatment of the product. The heat treatment is completed prior to laying down additional new layers of material. The heat treatment is an annealing operation. The method may further involve providing a new layer of powdered material on top of the layer of fused powder particles subsequent to the heat treatment, and repeating the melting and heat treating operations in a layer-by-layer fashion using the two dimensional pattern and the additional two dimensional pattern, until the part is completed.
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The present disclosure relates to an additive manufacturing system for forming a part using a powder material. In one embodiment the system makes use of a primary heat generating subsystem to generate a fusing beam for heating and fusing at least one of select portions of a powder layer, or an entire area of a powder layer, deposited on a build plate. The system also incorporates a beam steering subsystem for steering the fusing beam over the powder layer. A supplemental heating subsystem is used to generate a wide area beam to heat a portion of the powder layer either prior to fusing, along with the fusing operation, or subsequent to fusing of the powder with the fusing beam. The wide area beam has an intensity which is insufficient to fuse the powder, and alters a microstructure of the powder layer as the powder layer is at least one of fused or as it cools, to thus relieve stress in the part.
A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.
A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.
A method of depositing a ceramic film, particularly a silicon carbide film, on a substrate is disclosed in which the residual stress, residual stress gradient, and resistivity are controlled. Also disclosed are substrates having a deposited film with these controlled properties and devices, particularly MEMS and NEMS devices, having substrates with films having these properties.