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At least 289 records · Page 16

Design of Advanced Atmospheric Water Vapor Differential Absorption Lidar (DIAL) Detection System

The measurement of atmospheric water vapor is very important for understanding the Earth's climate and water cycle. The lidar atmospheric sensing experiment (LASE) is an instrument designed and operated by the Langley Research Center for high precision water vapor measurements. The design details of a new water vapor lidar detection system that improves the measurement sensitivity of the LASE instrument by a factor of 10 are discussed. The new system consists of an advanced, very low noise, avalanche photodiode (APD) and a state-of-the-art signal processing circuit. The new low-power system is also compact and lightweight so that it would be suitable for space flight and unpiloted atmospheric vehicles (UAV) applications. The whole system is contained on one small printed circuit board (9 x 15 sq cm). The detection system is mounted at the focal plane of a lidar receiver telescope, and the digital output is read by a personal computer with a digital data acquisition card.

Refaat, Tamer F.↗

Report of the Odyssey FPGA Independent Assessment Team

An independent assessment team (IAT) was formed and met on April 2, 2001, at Lockheed Martin in Denver, Colorado, to aid in understanding a technical issue for the Mars Odyssey spacecraft scheduled for launch on April 7, 2001. An RP1280A field-programmable gate array (FPGA) from a lot of parts common to the SIRTF, Odyssey, and Genesis missions had failed on a SIRTF printed circuit board. A second FPGA from an earlier Odyssey circuit board was also known to have failed and was also included in the analysis by the IAT. Observations indicated an abnormally high failure rate for flight RP1280A devices (the first flight lot produced using this flow) at Lockheed Martin and the causes of these failures were not determined. Standard failure analysis techniques were applied to these parts, however, additional diagnostic techniques unique for devices of this class were not used, and the parts were prematurely submitted to a destructive physical analysis, making a determination of the root cause of failure difficult. Any of several potential failure scenarios may have caused these failures, including electrostatic discharge, electrical overstress, manufacturing defects, board design errors, board manufacturing errors, FPGA design errors, or programmer errors. Several of these mechanisms would have relatively benign consequences for disposition of the parts currently installed on boards in the Odyssey spacecraft if established as the root cause of failure. However, other potential failure mechanisms could have more dire consequences. As there is no simple way to determine the likely failure mechanisms with reasonable confidence before Odyssey launch, it is not possible for the IAT to recommend a disposition for the other parts on boards in the Odyssey spacecraft based on sound engineering principles.

Mayer, Donald C.↗

User's Guide for Computer Program that Routes Signal Traces

This disk contains both a FORTRAN computer program and the corresponding user's guide that facilitates both its incorporation into your system and its utility. The computer program represents an efficient algorithm that routes signal traces on layers of a printed circuit with both through-pins and surface mounts. The computer program included is an implementation of the ideas presented in the theoretical paper titled "A Formal Algorithm for Routing Signal Traces on a Printed Circuit Board", NASA TP-3639 published in 1996. The computer program in the "connects" file can be read with a FORTRAN compiler and readily integrated into software unique to each particular environment where it might be used.

Hedgley, David R., Jr.↗

Park Smart

The Parking Garage Automation System (PGAS) is based on a technology developed by a NASA-sponsored project called Robot sensorSkin(TM). Merritt Systems, Inc., of Orlando, Florida, teamed up with NASA to improve robots working with critical flight hardware at Kennedy Space Center in Florida. The system, containing smart sensor modules and flexible printed circuit board skin, help robots to steer clear of obstacles using a proximity sensing system. Advancements in the sensor designs are being applied to various commercial applications, including the PGAS. The system includes a smartSensor(TM) network installed around and within public parking garages to autonomously guide motorists to open facilities, and once within, to free parking spaces. The sensors use non-invasive reflective-ultrasonic technology for high accuracy, high reliability, and low maintenance. The system is remotely programmable: it can be tuned to site-specific requirements, has variable range capability, and allows remote configuration, monitoring, and diagnostics. The sensors are immune to interference from metallic construction materials, such as rebar and steel beams. Inside the garage, smart routing signs mounted overhead or on poles in front of each row of parking spots guide the motorist precisely to free spaces.

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Infrared Measurement

A Jet Propulsion Laboratory Technical Support Package (TSP) describing a technique for processing data from an infrared radiometer assisted a manufacturer of laminates for printed circuit boards. To reduce emissions and lower the cost of producing prepreg (a continuous glass cloth, or web, impregnated with epoxy resin and partially cured by applying heat), Norplex Oak switched to infrared treating towers. The TSP confirmed the company's computer prediction of heat flux patterns, provided information that allowed the company to modify infrared treaters for consistency, and furnished a basis for development of optimal heater placements. The treaters are now successfully operating at increased speeds with improved product consistency.

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Electrical Connectors

Betaflex connectors are sockets that connect multichip modules and high density ceramic packages to printed circuit boards. They incorporate shape memory alloy technology, developed under NASA contract. Aimed at computer, telecommunication, avionics and military markets, the connectors enable designers to gain up to 40 percent more board space and provide 100 signal lines to the inch. When the nickel titanium element in the connector is heated by a low voltage power supply, the connector's spring is opened allowing the circuit board to be inserted with zero force. This makes assembly easier and more reliable. Beta Phase was taken over by Mopex, BPS and currently manufactures these connectors.

Source record↗

Report on Project to Characterize Multi-Junction Solar Cells in the Stratosphere using Low-Cost Balloon and Communication Technologies

Balloon, control and communication technologies are under development in our laboratory for testing multi-junction solar cells in the stratosphere to achieve near AM0 conditions. One flight, Suntracker I, has been carried out reported earlier. We report on our efforts in preparation for a second flight, Suntracker II, that was aborted due to hardware problems. The package for Suntracker I system has been modified to include separate electronics and battery packs for the 70 centimeter and 2 meter systems. The collimator control system and motor gearboxes have been redesigned to address problems with the virtual stops and backlash. Surface mount technology on a printed circuit board was used in place of the through-hole prototype circuit in efforts to reduce weight and size, and improve reliability. A mobile base station has been constructed that includes a 35' tower with a two axis rotator and multi-element yagi antennas. Modifications in Suntracker I and the factors that lead to aborting Suntracker II are discussed.

Mirza, Ali↗

Aerodynamic Measurement Technology

Ohio State University developed a new spectrally filtered light-scattering apparatus based on a diode laser injected-locked titanium: sapphire laser and rubidium vapor filter at 780.2 nm. When the device was combined with a stimulated Brillouin scattering phase conjugate mirror, the realizable peak attenuation of elastic scattering interferences exceeded 105. The potential of the system was demonstrated by performing Thomson scattering measurements. Under USAF-NASA funding, West Virginia University developed a Doppler global velocimetry system using inexpensive 8-bit charged coupled device cameras and digitizers and a CW argon ion laser. It has demonstrated a precision of +/- 2.5 m/sec in a swirling jet flow. Low-noise silicon-micromachined microphones developed and incorporated in a novel two-tier, hybrid packaging scheme at the University of Florida used printed circuit board technology to realize a MEMS-based directional acoustic array. The array demonstrated excellent performance relative to conventional sensor technologies and provides scaling technologies that can reduce cost and increase speed and mobility.

Burner, Alpheus W.↗

Demonstration of Separation Control Using Glow-Discharge Plasma Actuators

Active flow control of boundary-layer separation using glow-discharge plasma actuators is studied experimentally. Separation is induced on a flat plate installed in a closed-circuit wind tunnel by a shaped insert on the opposite wall. The flow conditions represent flow over the suction surface of a modem low-pressure-turbine airfoil. The Reynolds number, based on wetted plate length and nominal exit velocity, is varied from 50,000 to 300,000, covering cruise to takeoff conditions. Low (0.2%) and high (2.5%) free-stream turbulence intensities are set using passive grids. A spanwise-oriented phased-plasma-array actuator, fabricated on a printed circuit board, is surface-flush-mounted upstream of the separation point and can provide forcing in a wide frequency range. Static surface pressure measurements and hot-wire anemometry of the base and controlled flows are performed and indicate that the glow-discharge plasma actuator is an effective device for separation control.

Hultgren, Lennart S.↗

Boundary-Layer Separation Control under Low-Pressure Turbine Airfoil Conditions using Glow-Discharge Plasma Actuators

Modem low-pressure turbines, in general, utilize highly loaded airfoils in an effort to improve efficiency and to lower the number of airfoils needed. Typically, the airfoil boundary layers are turbulent and fully attached at takeoff conditions, whereas a substantial fraction of the boundary layers on the airfoils may be transitional at cruise conditions due to the change of density with altitude. The strong adverse pressure gradients on the suction side of these airfoils can lead to boundary-layer separation at the latter low Reynolds number conditions. Large separation bubbles, particularly those which fail to reattach, cause a significant degradation of engine efficiency. A component efficiency drop of the order 2% may occur between takeoff and cruise conditions for large commercial transport engines and could be as large as 7% for smaller engines at higher altitude. An efficient means of of separation elimination/reduction is, therefore, crucial to improved turbine design. Because the large change in the Reynolds number from takeoff to cruise leads to a distinct change in the airfoil flow physics, a separation control strategy intended for cruise conditions will need to be carefully constructed so as to incur minimum impact/penalty at takeoff. A complicating factor, but also a potential advantage in the quest for an efficient strategy, is the intricate interplay between separation and transition for the situation at hand. Volino gives a comprehensive discussion of several recent studies on transition and separation under low-pressure-turbine conditions, among them one in the present facility. Transition may begin before or after separation, depending on the Reynolds number and other flow conditions. If the transition occurs early in the boundary layer then separation may be reduced or completely eliminated. Transition in the shear layer of a separation bubble can lead to rapid reattachment. This suggests using control mechanisms to trigger and enhance early transition. Gad-el-Hak provides a review of various techniques for flow control in general and Volino discusses recent studies on separation control under low-pressure-turbine conditions utilizing passive as well as active devices. As pointed out by Volino, passive devices optimized for separation control at low Reynolds numbers tend to increase losses at high Reynolds numbers, Active devices have the attractive feature that they can be utilized only in operational regimes where they are needed and when turned off would not affect the flow. The focus in the present paper is an experimental Separation is induced on a flat plate installed in a closed-circuit wind tunnel by a shaped insert on the opposite wall. The flow conditions represent flow over the suction surface of a modem low-pressure-turbine airfoil ('Pak-B'). The Reynolds number, based on wetted plate length and nominal exit velocity, is varied from 50,000 to 300,000, covering cruise to takeoff conditions. Low (0.2%) and high (2.5%) Gee-stream turbulence intensities are set using passive grids. A spanwise-oriented phased-plasma-array actuator, fabricated on a printed circuit board, is surface- flush-mounted upstream of the separation point and can provide forcing in a wide frequency range. Static surface pressure measurements and hot-wire anemometry of the base and controlled flows are performed and indicate that the glow-discharge plasma actuator is an effective device for separation control. of active separation control using glow discharge plasma actuators.

Hultgren, Lennart S.↗

Demonstration of Separation Delay with Glow-Discharge Plasma Actuators

Active flow control of boundary-layer separation using glow-discharge plasma actuators is studied experimentally. Separation is induced on a flat plate installed in a closed-circuit wind tunnel by a shaped insert on the opposite wall. The flow conditions represent flow over the suction surface of a modern low-pressure-turbine airfoil. The Reynolds number, based on wetted plate length and nominal exit velocity, is varied from 50,000 to 300,000, covering cruise to takeoff conditions. Low (0.2 percent) and high (2.5 percent) free-stream turbulence intensities are set using passive grids. A spanwise-oriented phased-plasma-array actuator, fabricated on a printed circuit board, is surface-flush-mounted upstream of the separation point and can provide forcing in a wide frequency range. Static surface pressure measurements and hot-wire anemometry of the base and controlled flows are performed and indicate that the glow-discharge plasma actuator is an effective device for separation control.

Hultgren, Lennart S.↗

3-D Packaging: A Technology Review

Traditional electronics are assembled as a planar arrangement of components on a printed circuit board (PCB) or other type of substrate. These planar assemblies may then be plugged into a motherboard or card cage creating a volume of electronics. This architecture is common in many military and space electronic systems as well as large computer and telecommunications systems and industrial electronics. The individual PCB assemblies can be replaced if defective or for system upgrade. Some applications are constrained by the volume or the shape of the system and are not compatible with the motherboard or card cage architecture. Examples include missiles, camcorders, and digital cameras. In these systems, planar rigid-flex substrates are folded to create complex 3-D shapes. The flex circuit serves the role of motherboard, providing interconnection between the rigid boards. An example of a planar rigid - flex assembly prior to folding is shown. In both architectures, the interconnection is effectively 2-D.

Strickland, Mark↗

Mechanical Properties and Microstructure Investigation of Lead Free Solder

While the electronics industry appears to be focusing on Sn-Ag-Cu as the alloy of choice for lead free electronics assembly, ,the exact composition varies by geographic region, supplier and user. Add to that dissolved copper and silver from the printed circuit board traces and surface finish, and there can be significant variation in the final solder joint composition. A systematic study of the mechanical and microstructural properties of Sn-Ag-Cu alloys with Ag varying from 2wt% to 4wt% and Cu varying from 0.5wt% to lSwt%, was undertaken in this research study. Different sample preparation techniques (water quenched, oil quenched and water quenched followed by reflow) were explored and the resulting microstructure compared to that of a typical reflowed lead free chip scale package (CSP) solder joint. Tensile properties (modulus, 0.2% yield strength and the ultimate tensile strength) and creep behavior of selected alloy compositions (Sn-4Ag-1 X u , Sn-4Ag-OSCu, Sn- 2Ag-1 X u , Sn-2Ag-OSCu, Sn-3.5Ag-O.SCu) were determined for three conditions: as- cast; aged for 100 hours at 125OC; and aged for 250 hours at 125OC. There was no significant difference in Young's Modulus as a function of alloy composition. After an initial decrease in modulus after 100 hours at 125"C, there was an insignificant change with further aging. The distribution of 0.2% strain yield stress and ultimate tensile strength as a function of alloy composition was more significant and decreased with aging time and temperature. The microstructures of these alloys were examined using light and scanning electron microscopy (LM and SEM) respectively and SEM based energy dispersive x-ray spectroscopy (EDS). Fracture surface and cross-section analysis were performed on the specimens after creep testing. The creep testing results and the effect of high temperature aging on mechanical properties is presented for the oil quenched samples. In general the microstructure of oil quenched specimen exhibited a eutectic region of Sn with moderately dispersed Ag3Sn intermetallic, surrounded by a dendritic Sn-rich phase. The SEM images of the fracture surface indicated the presence of a tough shear surface at the initial cavity break area and a break line in the middle of specimen along the failure direction. A hyperbolic-sine creep model was adopted and used to fit the creep experiment data. The effect on the mechanical properties by adding the quaternary element bismuth to the Sn-3.5Ag-0.8Cu alloy was measured and compared with the mechanical properties of the ternary alloys. The results of this research study provide necessary data for the modeling of solder joint reliability for a range of Sn-Ag-Cu compositions and a baseline for evaluating the effects of subsequent quaternary additions.

Wang, Qing↗

Making Complex Electrically Conductive Patterns on Cloth

A method for automated fabrication of flexible, electrically conductive patterns on cloth substrates has been demonstrated. Products developed using this method, or related prior methods, are instances of a technology known as 'e-textiles,' in which electrically conductive patterns ar formed in, and on, textiles. For many applications, including high-speed digital circuits, antennas, and radio frequency (RF) circuits, an e-textile method should be capable of providing high surface conductivity, tight tolerances for control of characteristic impedances, and geometrically complex conductive patterns. Unlike prior methods, the present method satisfies all three of these criteria. Typical patterns can include such circuit structures as RF transmission lines, antennas, filters, and other conductive patterns equivalent to those of conventional printed circuits. The present method overcomes the limitations of the prior methods for forming the equivalent of printed circuits on cloth. A typical fabrication process according to the present method involves selecting the appropriate conductive and non-conductive fabric layers to build the e-textile circuit. The present method uses commercially available woven conductive cloth with established surface conductivity specifications. Dielectric constant, loss tangent, and thickness are some of the parameters to be considered for the non-conductive fabric layers. The circuit design of the conductive woven fabric is secured onto a non-conductive fabric layer using sewing, embroidery, and/or adhesive means. The portion of the conductive fabric that is not part of the circuit is next cut from the desired circuit using an automated machine such as a printed-circuit-board milling machine or a laser cutting machine. Fiducials can be used to align the circuit and the cutting machine. Multilayer circuits can be built starting with the inner layer and using conductive thread to make electrical connections between layers.

Chu, Andrew↗

Microwave Temperature Profiler Mounted in a Standard Airborne Research Canister

Many atmospheric research aircraft use a standard canister design to mount instruments, as this significantly facilitates their electrical and mechanical integration and thereby reduces cost. Based on more than 30 years of airborne science experience with the Microwave Temperature Profiler (MTP), the MTP has been repackaged with state-of-the-art electronics and other design improvements to fly in one of these standard canisters. All of the controlling electronics are integrated on a single 4 ~5-in. (.10 ~13- cm) multi-layer PCB (printed circuit board) with surface-mount hardware. Improved circuit design, including a self-calibrating RTD (resistive temperature detector) multiplexer, was implemented in order to reduce the size and mass of the electronics while providing increased capability. A new microcontroller-based temperature controller board was designed, providing better control with fewer components. Five such boards are used to provide local control of the temperature in various areas of the instrument, improving radiometric performance. The new stepper motor has an embedded controller eliminating the need for a separate controller board. The reference target is heated to avoid possible emissivity (and hence calibration) changes due to moisture contamination in humid environments, as well as avoiding issues with ambient targets during ascent and descent. The radiometer is a double-sideband heterodyne receiver tuned sequentially to individual oxygen emission lines near 60 GHz, with the line selection and intermediate frequency bandwidths chosen to accommodate the altitude range of the aircraft and mission.

Mahoney, Michael J.↗

Ethernet-Enabled Power and Communication Module for Embedded Processors

The power and communications module is a printed circuit board (PCB) that has the capability of providing power to an embedded processor and converting Ethernet packets into serial data to transfer to the processor. The purpose of the new design is to address the shortcomings of previous designs, including limited bandwidth and program memory, lack of control over packet processing, and lack of support for timing synchronization. The new design of the module creates a robust serial-to-Ethernet conversion that is powered using the existing Ethernet cable. This innovation has a small form factor that allows it to power processors and transducers with minimal space requirements.

Perotti, Jose↗

MCM Polarimetric Radiometers for Planar Arrays

A polarimetric radiometer that operates at a frequency of 40 GHz has been designed and built as a prototype of multiple identical units that could be arranged in a planar array for scientific measurements. Such an array is planned for use in studying the cosmic microwave background (CMB). All of the subsystems and components of this polarimetric radiometer are integrated into a single multi-chip module (MCM) of substantially planar geometry. In comparison with traditional designs of polarimetric radiometers, the MCM design is expected to greatly reduce the cost per unit in an array of many such units. The design of the unit is dictated partly by a requirement, in the planned CMB application, to measure the Stokes parameters I, Q, and U of the CMB radiation with high sensitivity. (A complete definition of the Stokes parameters would exceed the scope of this article. In necessarily oversimplified terms, I is a measure of total intensity of radiation, while Q and U are measures of the relationships between the horizontally and vertically polarized components of radiation.) Because the sensitivity of a single polarimeter cannot be increased significantly, the only way to satisfy the high-sensitivity requirement is to make a large array of polarimeters that operate in parallel. The MCM includes contact pins that can be plugged into receptacles on a standard printed-circuit board (PCB). All of the required microwave functionality is implemented within the MCM; any required supporting non-microwave ("back-end") electronic functionality, including the provision of DC bias and control signals, can be implemented by standard PCB techniques. On the way from a microwave antenna to the MCM, the incoming microwave signal passes through an orthomode transducer (OMT), which splits the radiation into an h + i(nu) beam and an h - i(nu) beam (where, using complex-number notation, h denotes the horizontal component, nu denotes the vertical component, and +/-i denotes a +/-90deg phase shift). Each of these beams enters the MCM through one of two WR-22 waveguide input terminals in the lid of the MCM. The h + i(nu0 and h - i(nu) signals are amplified, then fed to a phase-discriminator hybrid designed specifically to fit the predominantly planar character of the MCM geometry and to enable determination of Q and U. The phase-discriminator hybrid generates four outputs, which are detected and used to calculate I, Q, and U.

Kangaslahti, Pekka↗

Modular, Microprocessor-Controlled Flash Lighting System

A microprocessor-controlled lighting system generates brief, precisely timed, high-intensity flashes of light for scientific imaging at frame rates up to about 1 kHz. The system includes an array of light-emitting diodes (LEDs) that are driven in synchronism with an externally generated timing signal (for example, a timing signal generated by a video camera). The light output can be varied in peak intensity, pulse duration, pulse delay, and pulse rate, all depending on the timing signal and associated externally generated control signals. The array of LEDs comprises as many as 16 LED panels that can be attached together. Each LED panel is a module consisting of a rectangular subarray of 10 by 20 LEDs of advanced design on a printed-circuit board in a mounting frame with a power/control connector. The LED panels are controlled by an LED control module that contains an AC-to-DC power supply, a control board, and 8 LED-panel driver boards. In prior LED panels, the LEDs are packaged at less than maximum areal densities in bulky metal housings that reduce effective active areas. In contrast, in the present LED panels, the LEDs are packed at maximum areal density so as to afford 100-percent active area and so that when panels are joined side by side to form the array, there are no visible seams between them and the proportion of active area is still 100 percent. Each panel produces an illuminance of .5 x 10( exp 4) lux at a distance of 5.8 in. (approx.1.6 cm). The LEDs are driven according to a pulse-width-modulation control scheme that makes it safe to drive the LEDs beyond their rated steady-state currents in order to generate additional light during short periods. The drive current and the pulse-width modulation for each LED panel can be controlled independently of those of the other 15 panels. The maximum allowable duration of each pulse of drive current is a function of the amount of overdrive, the total time to be spent in overdrive operation, and the limitations of the LEDs. The system is configured to limit the overdrive according to values specific to each type of LED in the array. These values are coded into firmware to prevent inadvertent damage to the LED panels.

Kiefer, Dwayne↗